TB6581H/HG TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP) TB6581H/HG 3-Phase Full-Wave Sine-Wave PWM Brushless Motor Controller The TB6581H/HG is a high-voltage PWM BLDC motor driver. The product integrates the TB6551F/FG sine-wave controller and the TPD4103AK high-voltage driver in a single package (“2-in-1”). It is designed to change the speed of a BLDC directly motor by using a speed control signal (analog) from a microcontroller. Features • A sine wave PWM drive controller and a high-voltage driver integrated in a single package. • IGBTs arranged in three half-bridge units • Triangle wave generator (carrier frequency = fosc/254 (Hz)) • Dead-time insertion (1.9 µs) • High-side bootstrap supply • Bootstrap diode • Overcurrent protection, thermal shutdown, and undervoltage lockout • On-chip regulator (Vreg = 7 V (typ.), 30 mA (max), Vrefout = 5 V (typ.), 30 mA (max)) • Operating power supply voltage range: VCC = 13.5~16.5 V • Motor power supply operating voltage range: VB = 50~400 V Weight: HZIP25-P-1.00K: 7.7 g (typ.) TB6581HG: TB6581HG is a Pb-free product. The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature = 230˚C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245˚C *dipping time = 5 seconds *the number of times = once *use of R-type flux 1 2006-03-02 TB6581H/HG Pin Description Pin No. Symbol Description Function 1 PGND Grounding pin 2 VREG Reference voltage output Connected to pin 5. 7 V (typ.), 30 mA (max) Power ground 3 IS IGBT emitter pin For connecting a current sensing resistor to ground. 4 NC Not connected This pin is left open and can be used as a jumper on a PCB. 5 VCC7 Signal control power supply pin Connected to pin 2. The control stage operating voltage: VCC = 6 to 10 V 6 Vrefout Reference voltage output 5 V (typ.), 30 mA (max) For connecting a bypass capacitor for internal VDD. 7 Idc Current limit input DC link input Reference potential of 0.5 V. This pin has a filter ( ∼ − 1 µs). 8 SGND Grounding pin Signal ground 9 Xin Clock input 10 Xout Clock output 11 Ve Voltage command input 12 HU U-phase position sensing input 13 HV V-phase position sensing If the position sensing inputs are all HIGH or LOW, the outputs are turned off. This pin has a pull-up resistor. input 14 HW W-phase position sensing input 15 LA Lead angle control input 0 to 58° in 32 steps 16 FG FG signal output This pin drives three pulses per rotation. 17 REV Reverse rotation signal For reverse rotation detection. 18 BSU Bootstrap supply (phase U) For connecting a bootstrap capacitor to the U-phase output. 19 U These pins have a feedback resistor. For connecting to a crystal oscillator. This pin has a pull-down resistor. ⎯ U-phase output pin Bootstrap supply (phase V) For connecting a bootstrap capacitor to the V-phase output. 20 BSV 21 V 22 BSW 23 W W-phase output pin 24 VB High-voltage power supply pin Power supply pin for driving a motor. 25 VCC15 Power supply pin for the power stage Power stage operating range: VCC = 15 V ⎯ V-phase output pin Bootstrap supply (phase W) For connecting a bootstrap capacitor to the W-phase output. ⎯ 2 2006-03-02 TB6581H/HG Pin Assignment 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 PGND IS Xin U V W VCC15 VCC7 Idc Ve HV LA REV VREG Vrefout SGND Xout BSU BSV BSW VB NC HU HW FG Absolute Maximum Ratings (Ta = 25°C) Characteristics Power supply voltage Symbol Rating VCC7 12 VCC15 18 VB 500 Unit V Vin (1) −0.3 to VCC1 (Note 1) Vin (2) −0.3 to 5.5 (Note 2) IOUT 2 (Note 3) A Power dissipation PD 40 (Note 4) W Operating temperature Topr −30 to 115 (Note 5) °C Storage temperature Tstg −50 to 150 °C Input voltage PWM output current V Note 1: Vin (1) pin: Ve, LA Note 2: Vin (2) pin: Idc, HU, HV, HW Note 3: Apply pulse Note 4: Package thermal resistance (θ j-c = 1°C/W) with an infinite heat sink at Ta = 25°C Note 5: The operating temperature range is determined according to the PD MAX − Ta characteristics. 3 2006-03-02 TB6581H/HG Recommended operating conditions (Ta = 25°C) Characteristics Power supply voltage Symbol Min Typ. Max VCC7 6 7 10 VCC15 13.5 15 16.5 Unit V Crystal oscillator frequency Xin 2 4 5 MHz Motor power supply voltage VB 50 280 400 V Output current Iout ⎯ 1 2 A PD Max – Ta 80 PD max 60 Power dissipation (W) (1) INFINITE HEAT SINK Rθj-c = 1°C/W 40 (2) HEAT SINK (RθHS = 3.5°C/W) Rθj-c + RθHS = 4.5°C/W (3) NO HEAT SINK Rθj-a = 39°C/W (1) 20 (2) (3) 0 0 25 50 75 Ambient temperature 4 100 Ta 125 150 (°C) 2006-03-02 TB6581H/HG Electrical Characteristics (Ta = 25°C) Characteristics Symbol IB ICC15 Current dissipation Input current Test Condition Min Typ. Max VB = 400 V ⎯ 0.1 0.5 Vreg = OPEN, VCC = 15 V ⎯ 1.1 3 ICC7 Vrefout = OPEN, VCC = 7 V ⎯ 3 6 IBS (ON) VBS = 15 V, high-side ON ⎯ 260 410 IBS (OFF) VBS = 15 V, high-side OFF ⎯ 230 370 Iin (LA) Vin = 5 V, LA ⎯ 25 50 Iin (Ve) Vin = 5 V, Ve ⎯ 35 70 Iin (Hall) Vin = 0 V, HU, HV, HW −50 −25 ⎯ Vrefout −1 ⎯ Vrefout HIGH Vin HU, HV, HW (Hall) LOW Input voltage Vin (Ve) ⎯ ⎯ 0.8 HIGH PWM Duty 100% 5.1 5.4 5.7 Middle Refresh → Start motor operation 1.8 2.1 2.4 0.7 1.0 1.3 ⎯ 0.3 ⎯ LOW Input hysteresis voltage Input delay time Output saturation voltage Output voltage FRD forward voltage BSD forward voltage Current detection Turned-off → Refresh VH HU, HV, HW (Note 6) VDT HU, HV, HW Xin = 4.19 MHz ⎯ 4.0 ⎯ VDC Idc Xin = 4.19 MHz ⎯ 4.0 ⎯ VCEsatH VCC = 15 V, IC = 0.5 A ⎯ 2.4 3 VCEsatL VCC = 15 V, IC = 0.5 A ⎯ 2.4 3 VFG (H) IOUT = 1 mA VFG (L) IOUT = −1 mA FG ⎯ 0.2 1.0 Vrefout IOUT = 30 mA Vrefout 4.5 5.0 5.5 Vreg IOUT = 30 mA 6.5 7 7.5 Vrefout Vrefout − 1.0 − 0.2 FG Output turn-on/-off delay time Dead time FRD reverse recovery time µA V V µs V ⎯ V IF = 0.5 A, high-side ⎯ 1.3 2.0 IF = 0.5 A, low-side ⎯ 1.3 2.0 IF = 500 µA ⎯ 0.9 1.2 V 0.47 0.5 0.53 V 150 165 200 ⎯ 20 ⎯ VF (BSD) Vdc Idc TSD VCC7 undervoltage protection for controller µA VFL (Note 7) TSDhys VBS undervoltage protection for driver mA VFH Thermal shutdown protection VCC15 undervoltage protection for driver Unit V °C VCC15 (H) Undervoltage positive-going threshold 10.5 11.5 12.5 VCC15 (L) Undervoltage negative-going threshold 10 11 12 VBS (H) Undervoltage positive-going threshold 8.5 9.5 10.5 VBS (L) Undervoltage negative-going threshold 8 9 10 VCC7 (H) Undervoltage positive-going threshold 4.2 4.5 4.8 VCC7 (L) Undervoltage negative-going threshold 3.7 4.0 4.3 ton VBB = 280 V, VCC = 15 V, IC = 0.5 A ⎯ 1.5 3 toff VBB = 280 V, VCC = 15 V, IC = 0.5 A ⎯ 1.2 3 Xin = 4.19 MHz 1.5 1.8 ⎯ µs VBB = 280 V, VCC = 15 V, IC = 0.5 A ⎯ 200 ⎯ ns tdead trr V V V µs Note 6 and Note 7: Toshiba does not implement testing before shipping. 5 2006-03-02 TB6581H/HG Functional Description 1. Basic operation The motor is driven by the square-wave turn-on signal based on a positional signal. When the positional signal reaches number of rotations f = 5 Hz or higher, the rotor position is estimated according to the positional signal and a modulation wave is generated. The modulation wave and the triangular wave are compared; then the sine-wave PWM signal is generated and the motor is driven. From start to 5 Hz: When driven by square wave (120° turn-on) f = fosc/(212 × 32 × 6) 5 Hz~: When driven by sine-wave PWM (180° turn-on); when fosc = 4 MHz, approx. 5 Hz 2. Ve voltage command input and bootstrap power supply (1) (2) (3) Voltage command input: When Ve < = 1.0 V U, V and W signals are stopped to protect IGBTs Voltage command input: When 1.0 V < Ve < = 2.1 V The low-side IGBTs are turned on at a fixed frequency (carrier frequency) (duty cycle: 8%). Voltage command input: When Ve > 2.1 V The U, V and W signals are driven out during sine wave drive. The low-side IGBTs are forced to on at fixed frequency (carrier frequency) during square-wave drive (duty cycle: 8%). Note 1: At startup, the low-side IGBTs must be turned on for a fixed period at 1.0 V < Ve < = 2.1 V to charge the high-side IGBT power supply. PWM duty cycle 100% (1) 0 to 1.0 V: Reset state (All outputs are off.) (2) Ve = 1.0 to 2.1 V: Startup operation (duty cycle of 8% for the low-side IGBTs) (3) Ve = 2.1 to 5.4 V: Running state (5.4 V or higher: PWM duty cycle = 100%) (1) (2) 1.0 V (3) 2.1 V 5.4 V Ve 3. Dead time function: upper/lower transistor output off-time When the motor is driven by sine-wave PWM, dead time is digitally generated inside the IC to prevent short circuit caused by the simultaneously turning on of upper and lower external power devices. When a square wave is generated in full-duty cycle mode, the dead time function is turned on to prevent a short circuit. Internal Counter TOFF 8/fosc 1.9 µs TOFF values above are obtained when fosc = 4.19 MHz. fosc = reference clock (crystal oscillation) 4. Correcting the lead angle The lead angle can be corrected in the turn-on signal range from 0 to 58° in relation to the induced voltage. Analog input from LA pin (0 V to 5 V divided by 32) 0 V = 0° 5 V = 58° (when more than 5 V is input, 58°) 6 2006-03-02 TB6581H/HG 5. Setting the carrier frequency This function sets the triangular wave cycle (carrier cycle) necessary for generating the PWM signal. (The triangular wave is used for forcibly turning on the lower transistor when the motor is driven by square wave.) Carrier cycle = fosc/252 (Hz) fosc = reference clock (crystal oscillation) 6. Outputting the reverse rotation detection signal This function detects the motor rotation direction every electrical angle of 360°. This function judges whether the actual direction of a rotating motor coincides with that of the internal reference voltage. Actual Motor Rotating Direction REV Pin Drive Mode CW (forward) HIGH Square waveform (120° turn-on mode) CCW (reverse) LOW Sine-wave waveform (180° turn-on mode) *: CW or CCW of the motor is determined by the direction of the Hall signal, which is specified in the timing chart on page 9. *: When the REV pin is set to LOW, and the Hall signal is higher than 5 Hz, sine-wave drive mode is turned on. 7. Protecting input pin (1) Overcurrent protection (Pin Idc) When the DC-link-current exceeds the internal reference voltage, gate block protection is performed. Overcurrent protection is released for each carrier frequency. Reference voltage = 0.5 V (typ.) (2) Positional signal abnormality protection Output is turned off when the positional signal is HHH or LLL; otherwise, it is restarted. (3) Monitor protection for VCC7/ VCC15 low supply voltage For power supply on/off outside the operating voltage range, the U, V and W drive outputs are turned off and the motor is stopped when there is a power supply fault. < VCC7> VCC7 Power supply voltage 4.5 V (typ.) 4.0 V (typ.) GND VB Turn-on drive output Turn-off drive output Output Turn-off drive output < VCC15> VCC15 Power supply voltage 11.5 V (typ.) 11.0 V (typ.) GND VB Turn-on drive output Turn-off drive output Output 7 Turn-off drive output 2006-03-02 TB6581H/HG (4) Monitor protection for VBS Bootstrap power supply When VBS power supply is lowered, the high-side IGBT is turned off. VBS (Output -BS) 9.5 V (typ.) 9.0 V (typ.) High-side IGBT Turn-off high-side IGBT (5) Output Turn-off high-side IGBT Overheat protection The overheat protection circuit will operate and all IGBTs will be turned off if the chip temperature becomes abnormally high due to internal or external heat generation. TSD = 165°C (typ.) TSDhys = 20°C (typ.) After the overheat protection circuit is turned on, the return temperature is 145°C (typ.). 8 2006-03-02 TB6581H/HG Timing Chart • CW (forward) mode (CW mode means that the Hall signal is input in the order shown below.) Hall signal (input) Hu Hv Hw FG signal (output) FG REV signal (output) REV (HIGH ) U Turn-on signal V when driven W by square wave X (inside the IC) Y Z Vuv Motor drive output waveform (line voltage) Vvw Vwu * The waveform of actual operation is the PWM • CCW (reverse) mode (CCW mode means that the Hall signal is input in the order shown below.) Hall signal (input) Hu Hv Hw FG signal (output) FG REV signal (output) REV (LO W) Su Modulation waveform when driven by sine Sv wave (inside of IC) Sw Motor drive output waveform (line voltage) Vuv Vvw Vwu * The waveform of actual operation is the PWM 9 2006-03-02 TB6581H/HG Example of Application Circuit Vrefout C6 C7 C9 2 VREG 15 LA C8 Power supply for motor 15 V 25 VCC15 24 VB X1 Xin Xout R1 Hall IC input R2 C1 HU R3 C2 HV C3 HW Ve VCC7 9 System clock generator 10 12 18 Phase U 22 4 bit 20 14 11 Regula tor Comparator Counter Position detector 13 5 Triangular wave generator 6-bit 5-bit AD Internal Phase reference matchin voltage Output waveform generator Selecting Phase V data Comparator Phase W Comparator 120°/180° S-GND MCU C4 Vrefout FG REV 8 Charger 6 Rotating direction FG Power-on reset 16 17 Protection ST/SP & BRK (CHG) reset ERR Comparator PWM HU HV HW 120°turn-on matrix 7-V Regulator Undervoltage protection Switching 120°/180° & gate block protection on/off U HU X Setting dead time V HV Y LV Z LW BSW High-side level shift driver C10 C11 C12 19 Thermal shutdown Input control 23 LU W BSV UnderUnderUndervoltage voltage voltage protection protection protection 21 HW BSU U V Motor W Low-side driver GB (Controller) 7 Idc (Driver) 1 P-GND 3 IS R4 C5 R5 10 2006-03-02 TB6581H/HG External Parts Symbol Purpose Recommended value X1 Internal clock generation 4.19 MHz C1, C2, C3 (Note 2) 10 kΩ Vrefout oscillation protection C5 Noise absorber 10 V/0.1 µF~1.0 µF 10 V/1000pF R4 C7 C8 C9 (Note 3) (Note 2) 5.1 kΩ R5 C6 (Note 1) 10 V/1000 pF Noise absorber R1, R2, R3 C4 Note Overcurrent detection VREG power supply stability VCC15 power supply stability C10, C11, C12 Bootstrap capacitor 0.62 Ω ± 1% (1 W) 16 V/1.0 µF~10 µF (Note 4) (Note 3) 10 V/1000 pF 25 V/0.1 µF 25 V/10 µF 25 V/2.2 µF (Note 3) (Note 5) Note 1: For carrier frequency and dead time, connect a 4.19 MHz ceramic resonator. Note 2: These parts are used as a low-pass filter for noise absorption. Test to confirm noise filtering, then set the filter time-constant. Note 3: This part is used as a capacitor for power supply stability. Adjust the part to the application environment as required. When mounting, place it as close as possible to the base of the leads of this product to improve the noise elimination. Note 4: This part is used to set the value for overcurrent detection. Iout (max) = Vdc ÷ R5 (Vdc = 0.5 V (typ.)) Note 5: The required bootstrap capacitance value varies according to the motor drive conditions. The voltage stress for the capacitor is the value of VCC15. Other Precautions Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins. In turning on the power, first supply Vcc15 and confirm its stability; then apply Vcc7 and the driving input signal. Vcc15 and VB may be turned on in either order. In turning off the power, take care not to cut off the VB line by relay while the motor is spinning. Doing so may cause the IC to break down by cutting the current-producing route for VB. The TB6581H/HG is sensitive to electrostatic discharge. Handle with care. The product should be mounted by the solder-flow method. The preheating time is from 60 to 120 seconds at 150˚C. The maximum heat is 260˚C, to be applied within 10 seconds and as far as the lead stopper. 11 2006-03-02 TB6581H/HG Package Dimensions Weight: 7.7 g (typ.) 12 2006-03-02 TB6581H/HG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 13 2006-03-02 TB6581H/HG Points to remember on handling of ICs (1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. (2) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (3) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (4) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 14 2006-03-02 TB6581H/HG 15 2006-03-02