AD EVAL-ADM1063LFEB Multisupply supervisor/sequencer with adc and temperature monitoring Datasheet

Multisupply Supervisor/Sequencer
with ADC and Temperature Monitoring
ADM1063
FEATURES
FUNCTIONAL BLOCK DIAGRAM
D1P D1N D2P D2N
REFIN REFOUT REFGND SDA SCL A1
TEMP
SENSOR
VREF
INTERNAL
DIODE
A0
SMBus
INTERFACE
ADM1063
MUX
12-BIT
SAR ADC
EEPROM
CLOSED-LOOP
MARGINING SYSTEM
VX1
VX2
VX3
VX4
VX5
CONFIGURABLE
OUTPUT
DRIVERS
DUALFUNCTION
INPUTS
PDO1
PDO2
PDO3
(LOGIC INPUTS
OR
SFDs)
(HV CAPABLE
OF DRIVING
GATES OF
N-CHANNEL FET)
PDO4
CONFIGURABLE
OUTPUT
DRIVERS
PDO7
(LV CAPABLE
OF DRIVING
LOGIC SIGNALS)
PDO9
PDO5
PDO6
SEQUENCING
ENGINE
VP1
VP2
VP3
VP4
PROGRAMMABLE
RESET
GENERATORS
(SFDs)
VH
AGND
PDO8
PDO10
PDOGND
VDD
ARBITRATOR
VDDCAP
VCCP GND
04632-001
Complete supervisory and sequencing solution for up to
10 supplies
10 supply fault detectors enable supervision of supplies to
better than 1% accuracy
5 selectable input attenuators allow supervision of
supplies up to
14.4 V on VH
6 V on VP1 to VP4
5 dual-function inputs, VX1 to VX5
High impedance input to supply fault detector with
thresholds between 0.573 V and 1.375 V
General-purpose logic input
10 programmable output drivers, PDO1 to PDO10
Open collector with external pull-up
Push/pull output, driven to VDDCAP or VPn
Open collector with weak pull-up to VDDCAP or VPn
Internally charge-pumped high drive for use with external
N-FET (PDO1 to PDO6 only)
Sequencing engine (SE) implements state machine control of
PDO outputs
State changes conditional on input events
Enables complex control of boards
Power-up and power-down sequence control
Fault event handling
Interrupt generation on warnings
Watchdog function can be integrated in SE
Program software control of sequencing through SMBus
Complete voltage margining solution for 6 voltage rails
6 voltage output, 8-bit DACs (0.300 V to 1.551 V) allow voltage
adjustment via dc-to-dc converter trim/feedback node
12-bit ADC for readback of all supervised voltages
1 internal and 2 external temperature sensors
Reference input, REFIN, has 2 input options
Driven directly from 2.048 V (±0.25%) REFOUT pin
More accurate external reference for improved
ADC performance
Device powered by the highest of VP1 to VP4, VH for
improved redundancy
User EEPROM: 256 bytes
Industry-standard, 2-wire bus interface (SMBus)
Guaranteed PDO low with VH, VPn = 1.2 V
40-lead, 6 mm × 6 mm LFCSP and
48-lead, 7 mm × 7 mm TQFP packages
Figure 1.
APPLICATIONS
Central office systems
Servers/routers
Multivoltage system line cards
DSP/FPGA supply sequencing
In-circuit testing of margined supplies
GENERAL DESCRIPTION
The ADM1063 is a configurable supervisory/sequencing device
that offers a single-chip solution for supply monitoring and
sequencing in multiple supply systems. In addition to these
functions, the ADM1063 integrates a 12-bit ADC and six 8-bit
voltage output DACs. These circuits can be used to implement a
closed-loop margining system, which enables supply adjustment
by altering either the feedback node or reference of a dc-to-dc
converter using the DAC outputs.
(continued on Page 3)
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
© 2005 Analog Devices, Inc. All rights reserved.
ADM1063
TABLE OF CONTENTS
General Description ......................................................................... 3
Fault Reporting........................................................................... 19
Specifications..................................................................................... 4
Voltage Readback............................................................................ 20
Pin Configurations and Function Descriptions ........................... 7
Supply Supervision with the ADC ........................................... 20
Absolute Maximum Ratings............................................................ 8
Supply Margining ........................................................................... 21
Thermal Characteristics .............................................................. 8
Overview ..................................................................................... 21
ESD Caution.................................................................................. 8
Open-Loop Margining .............................................................. 21
Typical Performance Characteristics ............................................. 9
Closed-Loop Supply Margining ............................................... 21
Powering the ADM1063 ................................................................ 12
Writing to the DACs .................................................................. 22
Inputs................................................................................................ 13
Choosing the Size of the Attenuation Resistor....................... 22
Supply Supervision..................................................................... 13
DAC Limiting and Other Safety Features ............................... 22
Programming the Supply Fault Detectors............................... 13
Temperature Measurement System.............................................. 23
Input Comparator Hysteresis.................................................... 14
Remote Temperature Measurement ........................................ 23
Input Glitch Filtering ................................................................. 14
Applications Diagram .................................................................... 25
Supply Supervision with VXn Inputs ...................................... 14
Communicating with the ADM1063........................................... 26
VXn Pins as Digital Inputs........................................................ 15
Configuration Download at Power-Up................................... 26
Outputs ............................................................................................ 16
Updating the Configuration ..................................................... 26
Supply Sequencing Through Configurable
Output Drivers............................................................................ 16
Updating the Sequencing Engine............................................. 27
Sequencing Engine ......................................................................... 17
Overview...................................................................................... 17
Warnings...................................................................................... 17
SMBus Jump (Unconditional Jump)........................................ 17
Sequencing Engine Application Example ............................... 18
Sequence Detector...................................................................... 19
Monitoring Fault Detector ........................................................ 19
Internal Registers........................................................................ 27
EEPROM ..................................................................................... 27
Serial Bus Interface..................................................................... 27
SMBus Protocols for RAM and EEPROM.............................. 29
Write Operations ........................................................................ 29
Read Operations......................................................................... 31
Outline Dimensions ....................................................................... 33
Ordering Guide .......................................................................... 34
Timeout Detector ....................................................................... 19
REVISION HISTORY
4/05—Revision 0: Initial Version
Rev. 0 | Page 2 of 36
ADM1063
GENERAL DESCRIPTION
(continued from Page 1)
Supply margining can be performed with a minimum of
external components. The margining loop can be used for
in-circuit testing of a board during production (for example, to
verify the board’s functionality at −5% of nominal supplies),
or it can be used dynamically to accurately control the output
voltage of a dc-to-dc converter.
Temperature measurement is possible with the ADM1063. The
device contains one internal temperature sensor and two pairs
of differential inputs for remote thermal diodes. These are
measured by the 12-bit ADC.
The logical core of the device is a sequencing engine. This statemachine-based construction provides up to 63 different states.
This design enables very flexible sequencing of the outputs,
based on the condition of the inputs.
The device also provides up to 10 programmable inputs for
monitoring under, over, or out-of-window faults on up to 10
supplies. In addition, 10 programmable outputs can be used as
logic enables. Six of these programmable outputs can provide
up to a 12 V output for driving the gate of an N-channel FET,
which can be placed in the path of a supply.
D1P D1N D2P D2N
The device is controlled via configuration data that can be
programmed into an EEPROM. The entire configuration can
be programmed using an intuitive GUI-based software package
provided by ADI.
REFIN REFOUT REFGND SDA SCL A1
A0
ADM1063
TEMP
SENSOR
INTERNAL
DIODE
VREF
SMBus
INTERFACE
OSC
12-BIT
SAR ADC
DEVICE
CONTROLLER
EEPROM
GPI SIGNAL
CONDITIONING
VX1
CONFIGURABLE
O/P DRIVER
(HV)
SFD
PDO1
PDO2
VX2
PDO3
VX3
PDO4
VX4
PDO5
GPI SIGNAL
CONDITIONING
SEQUENCING
ENGINE
VX5
VP1
CONFIGURABLE
O/P DRIVER
(HV)
PDO6
CONFIGURABLE
O/P DRIVER
(LV)
PDO7
SFD
SELECTABLE
ATTENUATOR
SFD
VP2
VP3
PDO8
VP4
PDO9
VH
SELECTABLE
ATTENUATOR
SFD
PDO10
PDOGND
AGND
REG 5.25V
CHARGE PUMP
VDD
ARBITRATOR
GND
04632-002
VDDCAP
CONFIGURABLE
O/P DRIVER
(LV)
VCCP
Figure 2. Detailed Block Diagram
Rev. 0 | Page 3 of 36
ADM1063
SPECIFICATIONS
VH = 3.0 V to 14.4 V1, VPn = 3.0 V to 6.0 V1, TA = −40°C to +85°C, unless otherwise noted.
Table 1.
Parameter
POWER SUPPLY ARBITRATION
VH, VPn
VP
VH
VDDCAP
CVDDCAP
POWER SUPPLY
Supply Current, IVH, IVPn
Min
Typ
Max
Unit
Test Conditions/Comments
4.75
6.0
14.4
5.4
V
V
V
V
µF
Minimum supply required on one of VH, VPn.
Maximum VDDCAP = 5.1 V, typical.
VDDCAP = 4.75 V.
Regulated LDO output.
Minimum recommended decoupling capacitance.
4.2
6
mA
VDDCAP = 4.75 V, PDO1 to PDO10 off, DACs off,
ADC off.
mA
3.0
2.7
10
Additional Currents
All PDO FET Drivers On
1
2.2
1
10
mA
mA
mA
VDDCAP = 4.75 V, PDO1 to PDO6 loaded with 1 µA
each, PDO7 to PDO10 off.
Maximum additional load that can be drawn from
all PDO pull-ups to VDDCAP.
Six DACs on with 100 µA maximum load on each.
Running round-robin loop.
1 ms duration only, VDDCAP = 3 V.
±0.05
%
Midrange and high range.
Current Available from VDDCAP
DACs Supply Current
ADC Supply Current
EEPROM Erase Current
SUPPLY FAULT DETECTORS
VH Pin
Input Attenuator Error
Detection Ranges
High Range
Midrange
VPn Pins
Input Attenuator Error
Detection Ranges
Midrange
Low Range
Ultralow Range
VXn Pins
Input Impedance
Detection Range
Ultralow Range
Absolute Accuracy
2
6
2.5
±0.05
2.5
1.25
0.573
Input Reference Voltage on REFIN Pin, VREFIN
Resolution
INL
Gain Error
6
3
1.375
1
V
V
%
Low range and midrange.
V
V
V
No input attenuation error.
MΩ
0.573
Threshold Resolution
Digital Glitch Filter
ANALOG-TO-DIGITAL CONVERTER
Signal Range
14.4
6
mA
1.375
±1
8
0
100
0
V
%
Bits
µs
µs
VREFIN
V
±2.5
±0.05
V
Bits
LSB
%
2.048
12
Rev. 0 | Page 4 of 36
No input attenuation error.
VREF error + DAC nonlinearity + comparator offset
error + input attenuation error.
Minimum programmable filter length.
Maximum programmable filter length.
The ADC can convert signals presented to the VH,
VPn, and VXn pins. VPn and VH input signals are
attenuated depending on selected range. A signal
at the pin corresponding to the selected range is
from 0.573 V to 1.375 V at the ADC input.
Endpoint corrected, VREFIN = 2.048 V.
VREFIN = 2.048 V.
ADM1063
Parameter
Conversion Time
Min
Offset Error
Input Noise
TEMPERATURE SENSOR2
Local Sensor Accuracy
Local Sensor Supply Voltage Coefficient
Remote Sensor Accuracy
Remote Sensor Supply Voltage Coefficient
Remote Sensor Current Source
Minimum Load Capacitance
Load Regulation
PSRR
PROGRAMMABLE DRIVER OUTPUTS
High Voltage (Charge-Pump) Mode
(PDO1 to PDO6)
Output Impedance
VOH
IOUTAVG
0.25
Unit
ms
ms
LSB
LSBrms
Test Conditions/Comments
One conversion on one channel
All 12 channels selected, 16x averaging enabled
VREFIN = 2.048 V
Direct input (no attenuator)
±3
−1.7
±3
−3
200
12
0
128
0.125
°C
°C/V
°C
°C
µA
µA
°C
°C
°C
VDDCAP = 4.75 V
8
Bits
VDDCAP = 4.75 V
High level
Low level
VDDCAP = 4.75 V
VDDCAP = 4.75 V
Six DACs are individually selectable for centering
on one of four output voltage ranges
0.592
0.796
0.996
1.246
0.6
0.8
1
1.25
601.25
2.36
0.603
0.803
1.003
1.253
±0.75
±0.4
1
−4
2
Maximum Load Capacitance
Settling Time to 50 pF Load
Load Regulation
PSRR
REFERENCE OUTPUT
Reference Output Voltage
Load Regulation
Max
±2
Temperature for Code 0x800
Temperature for Code 0xC00
Temperature Resolution per Code
BUFFERED VOLTAGE OUTPUT DACs
Resolution
Code 0x80 Output Voltage
Range 1
Range 2
Range 3
Range 4
Output Voltage Range
LSB Step Size
INL
DNL
Gain Error
Load Regulation
Typ
0.44
84
50
2
2.5
60
40
2.043
2.048
−0.25
0.25
2.053
1
2
60
11
10.5
500
12.5
12
20
14
13.5
V
V
V
V
mV
mV
LSB
LSB
%
mV
mV
pF
µs
mV
dB
dB
Same range, independent of center point
Endpoint corrected
Sourcing current, IREFOUTMAX = −200 µA
Sinking current, IREFOUTMAX = 100 µA
Per mA
DC
100 mV step in 20 ns with 50 pF load
V
mV
mV
µF
mV
dB
No load
Sourcing current, IDACnMAX = −100 µA
Sinking current, IDACnMAX = 100 µA
Capacitor required for decoupling, stability
Per 100 µA
DC
kΩ
V
V
µA
IOH = 0
IOH = 1 µA
2 V < VOH < 7 V
Rev. 0 | Page 5 of 36
ADM1063
Parameter
Standard (Digital Output) Mode
(PDO1 to PDO10)
VOH
Min
Typ
Max
Unit
Test Conditions/Comments
2
V
V
V
V
mA
mA
kΩ
mA
10
110
µA
kHz
VPU (pull-up to VDDCAP or VPn) = 2.7 V, IOH = 0.5 mA
VPU to VPn = 6.0 V, IOH = 0 mA
VPU ≤ 2.7 V, IOH = 0.5 mA
IOL = 20 mA
Maximum sink current per PDO pin
Maximum total sink for all PDO pins
Internal pull-up
Current load on any VPn pull-ups, that is, total
source current available through any number of
PDO pull-up switches configured onto any one
VPDO = 14.4 V
All on-chip time delays derived from this clock
2.4
4.5
VOL
IOL3
ISINK3
RPULL-UP
ISOURCE (VPn)3
Three-State Output Leakage Current
Oscillator Frequency
DIGITAL INPUTS (VXn, A0, A1)
Input High Voltage, VIH
Input Low Voltage, VIL
Input High Current, IIH
Input Low Current, IIL
Input Capacitance
Programmable Pull-Down Current,
IPULL-DOWN
SERIAL BUS DIGITAL INPUTS (SDA, SCL)
Input High Voltage, VIH
Input Low Voltage, VIL
Output Low Voltage, VOL3
SERIAL BUS TIMING
Clock Frequency, fSCLK
Bus Free Time, tBUF
Start Setup Time, tSU;STA
Start Hold Time, tHD;STA
SCL Low Time, tLOW
SCL High Time, tHIGH
SCL, SDA Rise Time, tr
SCL, SDA Fall Time, tf
Data Setup Time, tSU;DAT
Data Hold Time, tHD;DAT
Input Low Current, IIL
SEQUENCING ENGINE TIMING
State Change Time
VPU − 0.3
0
0.50
20
60
20
90
100
2.0
0.8
−1
1
5
20
2.0
0.8
0.4
400
4.7
4.7
4
4.7
4
1000
300
250
5
1
10
V
V
µA
µA
pF
µA
Maximum VIN = 5.5 V
Maximum VIN = 5.5 V
VIN = 5.5 V
VIN = 0
VDDCAP = 4.75, TA = 25°C if known logic state is
required
V
V
V
IOUT = −3.0 mA
kHz
µs
µs
µs
µs
µs
µs
µs
ns
ns
µA
VIN = 0
µs
1
At least one of the VH, VP1 to VP4 pins must be ≥3.0 V to maintain the device supply on VDDCAP.
All temperature sensor measurements are taken with round-robin loop enabled and at least one other voltage input being measured.
3
Specification is not production tested, but is supported by characterization data at initial product release.
2
Rev. 0 | Page 6 of 36
ADM1063
NC
48
47
46
45
44
43
42
41
40
39
38
37
NC 1
36 NC
PIN 1
INDICATOR
VX1 2
35 PDO1
30
PDO1
29
PDO2
VX3 3
28
PDO3
VX4 4
27
PDO4
26
PDO5
25
PDO6
VP2 8
29 PDO7
VP2 7
24
PDO7
VP3 9
28 PDO8
VP3 8
23
PDO8
VP4 10
27 PDO9
VP4 9
22
PDO9
VH 11
26 PDO10
VH 10
21
PDO10
NC 12
25 NC
NC
NC
SCL
SDA
NC
NC
14
15
16
17
18
19
20
21
22
23
24
04632-004
REFOUT
13
NC
20
NC
19
NC
18
SDA
17
30 PDO6
SCL
16
TOP VIEW
(Not to Scale)
NC
15
31 PDO5
VP1 7
NC
14
ADM1063
REFOUT
13
32 PDO4
VX5 6
REFIN
12
33 PDO3
VX4 5
REFGND
11
REFIN
VP1 6
TOP VIEW
(Not to Scale)
AGND
ADM1063
REFGND
VX5 5
34 PDO2
VX3 4
NC
VX2 2
VX2 3
AGND
PIN 1
INDICATOR
04632-003
VX1 1
PDOGND
31
VCCP
PDOGND
32
A0
VCCP
33
A1
A0
34
D2N
A1
35
D2P
D2N
36
D1N
D2P
37
D1P
D1N
38
VDDCAP
D1P
39
GND
VDDCAP
40
NC
GND
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
NC = NO CONNECT
Figure 3. LFCSP Pin Configuration
Figure 4. TQFP Pin Configuration
Table 2. Pin Function Descriptions
Pin No.
LFCSP
TQFP
15, 16,
1, 12, 13,
19, 20
18, 19, 22
to 25, 36,
37, 48
1 to 5
2 to 6
Mnemonic
NC
Description
No Connection.
VX1 to VX5
6 to 9
7 to 10
VP1 to VP4
10
11
VH
11
12
13
14
17
18
21 to 30
31
32
33
34
35
36
37
38
39
14
15
16
17
20
21
26 to 35
38
39
40
41
42
43
44
45
46
AGND
REFGND
REFIN
REFOUT
SCL
SDA
PDO10 to PDO1
PDOGND
VCCP
A0
A1
D2N
D2P
D1N
D1P
VDDCAP
40
47
GND
High Impedance Inputs to Supply Fault Detectors. Fault thresholds can be set from 0.573 V to 1.375 V.
Alternatively, these pins can be used as general-purpose digital inputs.
Low Voltage Inputs to Supply Fault Detectors. Three input ranges can be set by altering the input
attenuation on a potential divider connected to these pins, the output of which connects to a supply fault
detector. These pins allow thresholds from 2.5 V to 6.0 V, 1.25 V to 3.00 V, and 0.573 V to 1.375 V.
High Voltage Input to Supply Fault Detectors. Two input ranges can be set by altering the input
attenuation on a potential divider connected to this pin, the output of which connects to a supply fault
detector. This pin allows thresholds from 6.0 V to 14.4 V and 2.5 V to 6.0 V.
Ground Return for Input Attenuators.
Ground Return for On-Chip Reference Circuits.
Reference Input for ADC. Nominally, 2.048 V.
Reference Output, 2.048 V.
SMBus Clock Pin. Open-drain output requires external resistive pull-up.
SMBus Data I/O Pin. Open-drain output requires external resistive pull-up.
Programmable Output Drivers.
Ground Return for Output Drivers.
Central Charge-Pump Voltage of 5.25 V. A reservoir capacitor must be connected between this pin and GND.
Logic Input. This pin sets the seventh bit of the SMBus interface address.
Logic Input. This pin sets the sixth bit of the SMBus interface address.
External Temperature Sensor 1 Cathode Connection.
External Temperature Sensor 1 Anode Connection.
External Temperature Sensor 1 Cathode Connection.
External Temperature Sensor 1 Anode Connection.
Device Supply Voltage. Linearly regulated from the highest voltage on the VP1 to VP4 and VH pins to a
typical voltage of 4.75 V.
Ground Supply.
Rev. 0 | Page 7 of 36
ADM1063
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Voltage on VH Pin
Voltage on VP Pins
Voltage on VX Pins
Voltage on DxN, DxP, and REFIN Pins
Input Current at Any Pin
Package Input Current
Maximum Junction Temperature (TJ max)
Storage Temperature Range
Lead Temperature, Soldering
Vapor Phase, 60 sec
ESD Rating, All Pins
Rating
16 V
7V
−0.3 V to +6.5 V
−0.3 V to +5 V
±5 mA
±20 mA
150°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
215°C
2000 V
40-lead LFCSP package: θJA = 25°C/W.
48-lead TQFP package: θJA = 14.8°C/W.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 8 of 36
ADM1063
TYPICAL PERFORMANCE CHARACTERISTICS
6
180
160
5
140
120
IVP1 (µA)
VVDDCAP (V)
4
3
100
80
60
2
40
0
0
1
2
3
4
5
04632-053
04632-050
1
20
0
0
6
1
2
3
VVP1 (V)
4
5
6
VVP1 (V)
Figure 5. VVDDCAP vs. VVP1
Figure 8. IVP1 vs. VVP1 (VP1 Not as Supply)
5.0
6
4.5
5
4.0
3.5
3.0
IVH (mA)
3
2
2.5
2.0
1.5
1.0
04632-051
1
0
0
2
4
6
8
10
12
14
04632-054
VVDDCAP (V)
4
0.5
0
0
16
2
4
6
8
10
12
14
16
VVH (V)
VVH (V)
Figure 9. IVH vs. VVH (VH as Supply)
Figure 6. VVDDCAP vs. VVH
5.0
350
4.5
300
4.0
250
IVH (µA)
3.0
2.5
2.0
1.5
200
150
100
1.0
0.5
0
0
1
2
3
4
5
04632-055
50
04632-052
IVP1 (mA)
3.5
0
6
0
VVP1 (V)
1
2
3
4
VVH (V)
Figure 7. IVP1 vs. VVP1 (VP1 as Supply)
Figure 10. IVH vs. VVH (VH Not as Supply)
Rev. 0 | Page 9 of 36
5
6
ADM1063
14
1.0
0.8
0.6
10
0.4
0.2
DNL (LSB)
8
6
0
–0.2
–0.4
4
–0.6
04632-056
2
0
0
2.5
5.0
7.5
10.0
12.5
04632-066
CHARGE-PUMPED VPDO1 (V)
12
–0.8
–1.0
15.0
0
1000
ILOAD (µA)
0.8
4.0
0.6
3.5
0.4
VP1 = 5V
2.5
VP1 = 3V
2.0
0.2
0
–0.2
1.5
–0.4
1.0
–0.6
0.5
0
3
4
5
04632-063
INL (LSB)
3.0
04632-057
VPDO1 (V)
1.0
4.5
2
4000
Figure 14. DNL for ADC
5.0
1
3000
CODE
Figure 11. Charge-Pumped VPDO1 (FET Drive Mode) vs. ILOAD
0
2000
–0.8
–1.0
6
0
1000
ILOAD (mA)
2000
3000
4000
CODE
Figure 12. VPDO1 (Strong Pull-Up to VP) vs. ILOAD
Figure 15. INL for ADC
4.5
12000
4.0
9894
10000
3.5
VP1 = 5V
HITS PER CODE
2.5
VP1 = 3V
2.0
1.5
8000
6000
4000
1.0
0.5
0
0
10
20
30
40
50
25
81
0
60
2047
ILOAD (µA)
2048
2049
CODE
Figure 16. ADC Noise, Midcode Input, 10,000 Reads
Figure 13. VPDO1 (Weak Pull-Up to VP) vs. ILOAD
Rev. 0 | Page 10 of 36
04632-064
2000
04632-058
VPDO1 (V)
3.0
ADM1063
1.005
1.004
1.003
DAC 20kΩ
BUFFER
OUTPUT
47pF
PROBE
POINT
DAC OUTPUT
1.002
1.001
VP1 = 3.0V
1.000
VP1 = 4.75V
0.999
0.998
04632-065
0.997
0.996
04632-059
1
CH1 200mV
M1.00µs
CH1
0.995
–40
–20
0
20
40
60
80
100
80
100
TEMPERATURE (°C)
756mV
Figure 17. Transient Response of DAC Code Change into Typical Load
Figure 19. DAC Output vs. Temperature
2.058
1V
PROBE
POINT
CH1 200mV
M1.00µs
CH1
VP1 = 4.75V
2.043
04632-060
1
VP1 = 3.0V
2.048
944mV
2.038
–40
04632-061
DAC 100kΩ
BUFFER
OUTPUT
REFOUT (V)
2.053
–20
0
20
40
60
TEMPERATURE (°C)
Figure 18. Transient Response of DAC to Turn-On from HI-Z State
Figure 20. REFOUT vs. Temperature
Rev. 0 | Page 11 of 36
ADM1063
POWERING THE ADM1063
VDDCAP
VP1
IN
OUT
4.75V
LDO
EN
VP2
IN
OUT
4.75V
LDO
EN
VP3
IN
OUT
4.75V
LDO
EN
VP4
IN
OUT
4.75V
LDO
EN
VH
An external capacitor to GND is required to decouple the on-chip
supply from noise. This capacitor should be connected to the
VDDCAP pin, as shown in Figure 21. The capacitor has another
use during brownouts (momentary loss of power). Under these
conditions, when the input supply (VPn or VH) dips transiently
below VDD, the synchronous rectifier switch immediately turns
off so that it does not pull VDD down. The VDDCAP can then
act as a reservoir to keep the device active until the next highest
supply takes over the powering of the device. For this
reservoir/decoupling function, 10 µF is recommended.
Note that when two or more supplies are within 100 mV of each
other, the supply that takes control of VDD first keeps control.
For example, if VP1 is connected to a 3.3 V supply, then VDD
powers up to approximately 3.1 V through VP1. If VP2 is then
connected to another 3.3 V supply, VP1 still powers the device,
unless VP2 goes 100 mV higher than VP1.
Rev. 0 | Page 12 of 36
IN
OUT
4.75V
LDO
INTERNAL
DEVICE
SUPPLY
EN
SUPPLY
COMPARATOR
04632-022
The ADM1063 is powered from the highest voltage input on
either the positive-only supply inputs (VPn) or the high voltage
supply input (VH). This technique offers improved redundancy,
because the device is not dependent on any particular voltage
rail to keep it operational. The same pins are used for supply
fault detection (discussed in the Programming the Supply Fault
Detectors section). A VDD arbitrator on the device chooses
which supply to use. The arbitrator can be considered an OR’ing
of five LDOs together. A supply comparator determines which
of the inputs is highest and selects it to provide the on-chip
supply. There is minimal switching loss with this architecture
(~0.2 V), resulting in the ability to power the ADM1063 from a
supply as low as 3.0 V. Note that the supply on the VXn pins
cannot be used to power the device.
Figure 21. VDD Arbitrator Operation
ADM1063
INPUTS
SUPPLY SUPERVISION
The resolution is given by
The ADM1063 has 10 programmable inputs. Five of these are
dedicated supply fault detectors (SFDs). These dedicated inputs
are called VH and VP1 to VP4 by default. The other five inputs
are labeled VX1 to VX5 and have dual functionality. They can
be used as either SFDs with similar functionality to VH and
VP1 to VP4, or CMOS-/TTL-compatible logic inputs to the
devices. Therefore, the ADM1063 can have up to 10 analog
inputs, a minimum of five analog inputs and five digital inputs,
or a combination. If an input is used as an analog input, it
cannot be used as a digital input. Therefore, a configuration
requiring 10 analog inputs has no digital inputs available.
Table 5 shows the details of each of the inputs.
RANGE
SELECT
ULTRA
LOW
+
VPn
VREF
OV
COMPARATOR
–
GLITCH
FILTER
FAULT
OUTPUT
Step Size = Threshold Range/255
Therefore, if the high range is selected on VH, the step size can
be calculated as follows:
(14.4 V − 4.8 V)/255 = 37.6 mV
Table 4 lists the upper and lower limits of each available range,
the bottom of each range (VB), and the range itself (VR).
Table 4. Voltage Range Limits
Voltage Range (V)
0.573 to 1.375
1.25 to 3.00
2.5 to 6.0
4.8 to 14.4
VT = (VR × N)/255 + VB
LOW
–
VR (V)
0.802
1.75
3.5
9.6
The threshold value required is given by
+
UV
FAULT TYPE
COMPARATOR
SELECT
04632-023
MID
VB (V)
0.573
1.25
2.5
4.8
Figure 22. Supply Fault Detector Block
PROGRAMMING THE SUPPLY FAULT DETECTORS
The ADM1063 can have up to 10 SFDs on its 10 input
channels. These highly programmable reset generators enable
the supervision of up to 10 supply voltages. The supplies can be
as low as 0.573 V and as high as 14.4 V. The inputs can be
configured to detect an undervoltage fault (the input voltage
drops below a preprogrammed value), an overvoltage fault (the
input voltage rises above a preprogrammed value), or an out-ofwindow fault (an undervoltage or overvoltage). The thresholds
can be programmed to an 8-bit resolution in registers provided
in the ADM1063. This translates to a voltage resolution that is
dependent on the range selected.
where:
VT is the desired threshold voltage (UV or OV).
VR is the voltage range.
N is the decimal value of the 8-bit code.
VB is the bottom of the range.
Reversing the equation, the code for a desired threshold is given by
N = 255 × (VT − VB)/VR
For example, if the user wants to set a 5 V OV threshold on
VP1, the code to be programmed in the PS1OVTH register
(discussed in the AN-698 application note) is given by
N = 255 × (5 − 2.5)/3.5
Therefore, N = 182 (1011 0110 or 0xB6).
Table 5. Input Functions, Thresholds, and Ranges
Input
VH
Function
High V analog input
VPn
Positive analog input
VXn
High Z analog input
Digital input
Voltage Range (V)
2.5 to 6.0
4.8 to 14.4
0.573 to 1.375
1.25 to 3.00
2.5 to 6.0
0.573 to 1.375
0 to 5
Maximum Hysteresis
425 mV
1.16 V
97.5 mV
212 mV
425 mV
97.5 mV
N/A
Rev. 0 | Page 13 of 36
Voltage Resolution (mV)
13.7
37.6
3.14
6.8
13.7
3.14
N/A
Glitch Filter (µs)
0 to 100
0 to 100
0 to 100
0 to 100
0 to 100
0 to 100
0 to 100
ADM1063
The UV and OV comparators shown in Figure 22 are always
looking at VPn. To avoid chattering (multiple transitions when
the input is very close to the set threshold level), these comparators have digitally programmable hysteresis. The hysteresis can
be programmed up to the values shown in Table 5.
The hysteresis is added after a supply voltage goes out of
tolerance. Therefore, the user can program the amount above
the UV threshold that the input must rise to before a UV fault is
deasserted. Similarly, the user can program the amount below
the OV threshold that an input must fall to before an OV fault
is deasserted.
The hysteresis figure is given by
INPUT PULSE SHORTER
THAN GLITCH FILTER TIMEOUT
INPUT PULSE LONGER
THAN GLITCH FILTER TIMEOUT
PROGRAMMED
TIMEOUT
PROGRAMMED
TIMEOUT
INPUT
INPUT
T0
TGF
T0
TGF
OUTPUT
OUTPUT
T0
VHYST = VR × NTHRESH/255
TGF
T0
TGF
04632-024
INPUT COMPARATOR HYSTERESIS
Figure 23. Input Glitch Filter Function
SUPPLY SUPERVISION WITH VXn INPUTS
where:
VHYST is the desired hysteresis voltage.
NTHRESH is the decimal value of the 5-bit hysteresis code.
Note that NTHRESH has a maximum value of 31. The maximum
hysteresis for the ranges are listed in Table 5.
INPUT GLITCH FILTERING
The final stage of the SFDs is a glitch filter. This block provides
time-domain filtering on the output of the SFD comparators.
This allows the user to remove any spurious transitions, such as
supply bounce at turn-on. The glitch filter function is additional
to the digitally programmable hysteresis of the SFD comparators.
The glitch filter timeout is programmable up to 100 µs.
For example, when the glitch filter timeout is 100 µs, any pulse
appearing on the input of the glitch filter block that is less than
100 µs in duration is prevented from appearing on the output of
the glitch filter block. Any input pulse that is longer than 100 µs
does appear on the output of the glitch filter block. The output
is delayed with respect to the input by 100 µs. The filtering
process is shown in Figure 23.
The VXn inputs have two functions. They can be used as either
supply fault detectors or digital logic inputs. When selected as an
analog (SFD) input, the VXn pins function similarly to the VH
and VPn pins. The primary difference is that the VXn pins have
only one input range: 0.573 V to 1.375 V. Therefore, these inputs
can directly supervise only the very low supplies. However, the
input impedance of the VXn pins is high, allowing an external
resistor divide network to be connected to the pin. Thus,
potentially any supply can be divided down into the input range
of the VXn pin and supervised. This enables the ADM1063 to
monitor other supplies such as +24 V, +48 V, and −5 V.
An additional supply supervision function is available when the
VXn pins are selected as digital inputs. In this case, the analog
function is available as a second detector on each of the dedicated analog inputs, VP1 to VP4 and VH. The analog function
of VX1 is mapped to VP1, VX2 is mapped to VP2, and so on;
VX5 is mapped to VH. In this case, these SFDs can be viewed as
a secondary or warning SFD.
The secondary SFDs are fixed to the same input range as the
primary SFD. They are used to indicate warning levels rather
than failure levels. This allows faults and warnings to be generated on a single supply using only one pin. For example, if VP1
is set to output a fault when a 3.3 V supply drops to 3.0 V, VX1
can be set to output a warning at 3.1 V. Warning outputs are
available for readback from the status registers. They are also
OR’ed together and fed into the SE, allowing warnings to generate
interrupts on the PDOs. Therefore, in the previous example, if
the supply drops to 3.1 V, a warning is generated and remedial
action can be taken before the supply drops out of tolerance.
Rev. 0 | Page 14 of 36
ADM1063
As discussed in the Supply Supervision with VXn Inputs, the
VXn input pins on the ADM1063 have dual functionality. The
second function is as a digital input to the device. Therefore, the
ADM1063 can be configured for up to five digital inputs. These
inputs are TTL-/CMOS-compatible. Standard logic signals
can be applied to the pins: RESET from reset generators,
POWER_GOOD signals, fault flags, manual resets, and so on.
These signals are available as inputs to the SE and, therefore,
can be used to control the status of the PDOs. The inputs can
be configured to detect either a change in level or an edge.
The digital blocks feature the same glitch filter function that is
available on the SFDs. This enables the user to ignore spurious
transitions on the inputs. For example, the filter can be used to
debounce a manual reset switch.
When configured as digital inputs, each of the VXn pins has a
weak (10 µA) pull-down current source available for placing the
input into a known condition, even if left floating. The current
source, if selected, weakly pulls the input to GND.
VXn
(DIGITAL INPUT)
+
DETECTOR
When configured for level detection, the output of the digital
block is a buffered version of the input. When configured for
edge detection, a pulse of programmable width is output from
the digital block once the logic transition is detected. The width
is programmable from 0 µs to 100 µs.
Rev. 0 | Page 15 of 36
GLITCH
FILTER
TO
SEQUENCING
ENGINE
–
VREF = 1.4V
Figure 24. VXn Digital Input Function
04632-027
VXn PINS AS DIGITAL INPUTS
ADM1063
OUTPUTS
external N-channel FET, which is used to isolate, for example, a
card-side voltage from a backplane supply (a PDO can sustain
greater than 10.5 V into a 1 µA load). The pull-down switches
can also be used to drive status LEDs directly.
SUPPLY SEQUENCING THROUGH
CONFIGURABLE OUTPUT DRIVERS
Supply sequencing is achieved with the ADM1063 using the
programmable driver outputs (PDOs) on the device as control
signals for supplies. The output drivers can be used as logic
enables or as FET drivers.
The data driving each of the PDOs can come from one of three
sources. The source can be enabled in the PDOnCFG configuration register (see the AN-698 application note for details).
The sequence in which the PDOs are asserted (and, therefore,
the supplies are turned on) is controlled by the sequencing
engine (SE). The SE determines what action is taken with the
PDOs based on the condition of the inputs of the ADM1063.
Therefore, the PDOs can be set up to assert when the SFDs are
in tolerance, the correct input signals are received on the VXn
digital pins, no warnings are received from any of the inputs of
the device, and so on. The PDOs can be used for a variety of
functions. The primary function is to provide enable signals for
LDOs or dc-to-dc converters, which generate supplies locally on
a board. The PDOs can also be used to provide a POWER_GOOD
signal when all the SFDs are in tolerance, or a RESET output if
one of the SFDs goes out of specification (this can be used as a
status signal for a DSP, FPGA, or other microcontroller).
The data sources are as follows:
Open-drain (allowing the user to connect an external
pull-up resistor)
•
Open-drain with weak pull-up to VDD
•
Push/pull to VDD
•
Open-drain with weak pull-up to VPn
•
Push/pull to VPn
•
Strong pull-down to GND
•
Internally charge-pumped high drive (12 V, PDO1 to
PDO6 only)
Output from the SE.
•
Directly from the SMBus. A PDO can be configured so that
the SMBus has direct control over it. This enables software
control of the PDOs. Therefore, a microcontroller can be
used to initiate a software power-up/power-down sequence.
•
On-Chip Clock. A 100 kHz clock is generated on the
device. This clock can be made available on any of the
PDOs. It can be used, for example, to clock an external
device such as an LED.
By default, the PDOs are pulled to GND by a weak (20 kΩ) onchip, pull-down resistor. This is the case upon power-up until
the configuration is downloaded from EEPROM and the
programmed setup is latched. The outputs are actively pulled
low once a supply of 1 V or greater is on VPn or VH. The outputs
remain high impedance prior to 1 V appearing on VPn or VH.
This provides a known condition for the PDOs during powerup. The internal pull-down can be overdriven with an external
pull-up of suitable value tied from the PDO pin to the required
pull-up voltage. The 20 kΩ resistor must be accounted for in
calculating a suitable value. For example, if PDOn must be pulled
up to 3.3 V and 5 V is available as an external supply, the pull-up
resistor value is given by
The PDOs can be programmed to pull up to a number of
different options. The outputs can be programmed as follows:
•
•
3.3 V = 5 V × 20 kΩ/(RUP + 20 kΩ)
Therefore,
The last option (available only on PDO1 to PDO6) allows the
user to directly drive a voltage high enough to fully enhance an
RUP = (100 kΩ − 66 kΩ)/3.3 = 10 kΩ
VFET (PDO1 TO PDO6 ONLY)
VDD
VP4
10Ω
20kΩ
10Ω
10Ω
20kΩ
VP1
SEL
20kΩ
CFG4 CFG5 CFG6
SE DATA
PDO
SMBus DATA
Figure 25. Programmable Driver Output
Rev. 0 | Page 16 of 36
04632-028
20kΩ
CLK DATA
ADM1063
SEQUENCING ENGINE
OVERVIEW
The SE state machine comprises 63 state cells. Each state has the
following attributes:
•
Monitors signals indicating the status of the 10 input pins,
VP1 to VP4, VH, and VX1 to VX5.
•
Can be entered from any other state.
•
Three exit routes move the state machine onto a next state:
sequence detection, fault monitoring, and timeout.
•
Delay timers for the sequence and timeout blocks can be
programmed independently and changed with each state
change. The range of timeouts is from 0 ms to 400 ms.
•
Output condition of the 10 PDO pins is defined and fixed
within a state.
MONITOR
FAULT
STATE
TIMEOUT
SEQUENCE
04632-029
The ADM1063 sequencing engine (SE) provides the user with
powerful and flexible control of sequencing. The SE implements
a state machine control of the PDO outputs, with state changes
conditional on input events. SE programs can enable complex
control of boards such as power-up and power-down sequence
control, fault event handling, interrupt generation on warnings,
and so on. A watchdog function that verifies the continued
operation of a processor clock can be integrated into the SE
program. The SE can also be controlled via the SMBus, giving
software or firmware control of the board sequencing.
Figure 26. State Cell
The ADM1063 offers up to 63 state definitions. The signals
monitored to indicate the status of the input pins are the
outputs of the SFDs.
WARNINGS
The SE also monitors warnings. These warnings can be
generated when the ADC readings violate their limit register
value or when the secondary voltage monitors detect a warning
on VP1 to VP4 and VH. The warnings are OR’ed together and
available as a single warning input to each of the three blocks
that enable exiting a state.
SMBus JUMP (UNCONDITIONAL JUMP)
The SE can be forced to advance to the next state unconditionally. This enables the user to force the SE to advance. Examples
of where this might be used include moving to a margining
state or debugging a sequence. The SMBus jump or go-to
command can be seen as another input to sequence and
timeout blocks, which provide an exit from each state.
• Transition from one state to the next is made in less than
20 µs, which is the time needed to download a state definition
from EEPROM to the SE.
Table 6. Sample Sequence State Entries
State
IDLE1
IDLE2
EN3V3
Sequence
If VX1 is low , go to state IDLE2.
If VP1 is okay, go to state EN3V3.
If VP2 is okay, go to state EN2V5.
DIS3V3
EN2V5
If VX1 is high, go to state IDLE1.
If VP3 is okay, go to state PWRGD.
DIS2V5
FSEL1
FSEL2
PWRGD
If VX1 is high, go to state IDLE1.
If VP3 is not okay, go to state DIS2V5.
If VP2 is not okay, go to state DIS3V3.
If VX1 is high, go to state DIS2V5.
Timeout
Monitor
If VP2 is not okay after 10 ms, go to
state DIS3V3.
If VP1 is not okay, go to state IDLE1.
If VP3 is not okay after 20 ms, go to
state DIS2V5.
If VP1 or VP2 is not okay, go to state FSEL2.
If VP1 or VP2 is not okay, go to state FSEL2.
If VP1 is not okay, go to state IDLE1.
If VP1, VP2, or VP3 is not okay, go to state
FSEL1.
Rev. 0 | Page 17 of 36
ADM1063
SEQUENCE
STATES
SEQUENCING ENGINE APPLICATION EXAMPLE
The application in this section demonstrates the operation of
the SE. Figure 27 shows how the simple building block of a
single SE state can be used to build a power-up sequence for a
3-supply system.
IDLE1
VX1 = 0
Table 7 lists the PDO outputs for each state in the same SE
implementation. In this system, the triggers required to start a
power-up sequence are the presence of a good 5 V supply on VP1
and the VX1 pin held low. The sequence intends to turn on the
3.3 V supply next, then the 2.5 V supply (assuming successful
turn-on of the 3.3 V supply). Once all three supplies are good,
the POWER_GOOD state is entered, where the SE remains until
a fault occurs on one of the three supplies, or until it is instructed
to go through a power-down sequence by VX1 going high.
IDLE2
VP1 = 1
MONITOR FAULT
STATES
TIMEOUT
STATES
EN3V3
10ms
VP1 = 0
VP2 = 1
EN2V5
Faults are dealt with throughout the power-up sequence on a
case-by-case basis. The following sections, which describe the
individual blocks, use this sample application to demonstrate
the state machine’s actions.
DIS3V3
20ms
(VP1 + VP2) = 0
VX1 = 1
VP3 = 1
PWRGD
DIS2V5
VP2 = 0
(VP1 + VP2 + VP3) = 0
VX1 = 1
FSEL1
VX1 = 1
(VP1 +
VP2) = 0
VP3 = 0
FSEL2
VP1 = 0
04632-030
VP2 = 0
Figure 27. Sample Application Flow Diagram
Table 7. PDO Outputs for Each State
PDO Outputs
PDO1 = 3V3ON
PDO2 = 2V5ON
PDO3 = FAULT
IDLE1
0
0
0
IDLE2
0
0
0
EN3V3
1
0
0
EN2V5
1
1
0
DIS3V3
0
1
1
Rev. 0 | Page 18 of 36
DIS2V5
1
0
1
PWRGD
1
1
0
FSEL1
1
1
1
FSEL2
1
1
1
ADM1063
MONITORING FAULT
DETECTOR
SEQUENCE DETECTOR
The sequence detector block is used to detect when a step in a
sequence has been completed. It looks for one of the inputs to
the SE to change state and is most often used as the gate for
successful progress through a power-up or power-down sequence.
A timer block is included in this detector, which can insert delays
into a power-up or power-down sequence if required. Timer
delays can be set from 10 µs to 400 ms. Figure 28 is a block
diagram of the sequence detector.
1-BIT FAULT
DETECTOR
VP1
MASK
SENSE
1-BIT FAULT
DETECTOR
VX5
VP1
VX5
SUPPLY FAULT
DETECTION
FAULT
SUPPLY FAULT
DETECTION
FAULT
LOGIC INPUT CHANGE
OR FAULT DETECTION
MASK
SENSE
SEQUENCE
DETECTOR
1-BIT FAULT
DETECTOR
LOGIC INPUT CHANGE
OR FAULT DETECTION
TIMER
FAULT
WARNINGS
INVERT
MASK
SELECT
04632-032
FORCE FLOW
(UNCONDITIONAL JUMP)
Figure 28. Sequence Detector Block Diagram
The sequence detector can also help to identify monitoring
faults. In the sample application shown in Figure 27, the FSEL1
and FSEL2 states identify which of the VP1,VP2, or VP3 pins
has faulted, and then they take the appropriate action.
MONITORING FAULT DETECTOR
The monitoring fault detector block is used to detect a failure
on an input. The logical function implementing this is a wide
OR gate, which can detect when an input deviates from its
expected condition. The clearest demonstration of the use of
this block is in the POWER_GOOD state, where the monitor
block indicates that a failure on one or more of the VP1, VP2,
or VP3 inputs has occurred.
No programmable delay is available in this block, because the
triggering of a fault condition is likely to be caused when a supply
falls out of tolerance. In this situation, the user should react as
quickly as possible. Some latency occurs when moving out of
this state, because it takes a finite amount of time (~20 µs) for the
state configuration to download from EEPROM into the SE.
Figure 29 is a block diagram of the monitoring fault detector.
04632-033
WARNINGS
Figure 29. Monitoring Fault Detector Block Diagram
TIMEOUT DETECTOR
The timeout detector allows the user to trap a failure and,
thus ensuring proper progress through a power-up or powerdown sequence.
In the sample application shown in Figure 27, the timeout nextstate transition is from the EN3V3 and EN2V5 states. For the
EN3V3 state, the signal 3V3ON is asserted on the PDO1 output
pin upon entry to this state to turn on a 3.3 V supply. This supply
rail is connected to the VP2 pin, and the sequence detector looks
for the VP2 pin to go above its UV threshold, which is set in the
supply fault detector (SFD) attached to that pin.
The power-up sequence progresses when this change is detected.
If, however, the supply fails (perhaps due to a short circuit overloading this supply), the timeout block traps the problem. In this
example, if the 3.3 V supply fails within 10 ms, the SE moves to
the DIS3V3 state and turns off this supply by bringing PDO1
low. It also indicates that a fault has occurred by taking PDO3
high. Timeout delays of 100 µs to 400 ms can be programmed.
FAULT REPORTING
The ADM1063 has a fault latch for recording faults. Two registers
are set aside for this purpose. A single bit is assigned to each
input of the device, and a fault on that input sets the relevant
bit. The contents of the fault register can be read out over the
SMBus to determine which input(s) faulted. The fault register
can be enabled/disabled in each state. This ensures that only
real faults are captured and not, for example, undervoltage
trips when the SE is executing a power-down sequence.
Rev. 0 | Page 19 of 36
ADM1063
VOLTAGE READBACK
The ADM1063 has an on-board, 12-bit, accurate ADC for
voltage readback over the SMBus. The ADC has a 12-channel
analog mux on the front end. The 12 channels consist of the
10 SFD inputs (VH, VP1 to VP4, and VX1 to VX5) plus two
channels for temperature readback (discussed in the Remote
Temperature Measurement section). Any or all of these inputs
can be selected to be read, in turn, by the ADC. The circuit
controlling this operation is called the round-robin circuit. The
round-robin circuit can be selected to run through its loop of
conversions once or continuously. Averaging is also provided
for each channel. In this case, the round-robin circuit runs
through its loop of conversions 16 times before returning a
result for each channel. At the end of this cycle, the results are
written to the output registers.
The ADC samples single-sided inputs with respect to the AGND
pin. A 0 V input gives out Code 0, and an input equal to the
voltage on REFIN gives out full code (4095 decimal).
The inputs to the ADC come directly from the VXn pins and
from the back of the input attenuators on the VPn and VH pins,
as shown in Figure 30 and Figure 31.
DIGITIZED
VOLTAGE
READING
NO ATTENUATION
12-BIT
ADC
2.048V VREF
Figure 30. ADC Reading on VXn Pins
ATTENUATION NETWORK
(DEPENDS ON RANGE SELECTED)
VPn/VH
DIGITIZED
VOLTAGE
READING
Figure 31. ADC Reading on VPn/VH Pins
The voltage at the input pin can be derived from the
following equation:
V=
ADC Code
4095
× Attenuation Factor × 2.048 V
The ADC input voltage ranges for the SFD input ranges
are listed in Table 8.
04632-026
12-BIT
ADC
2.048V VREF
SFD Input
Range (V)
0.573 to 1.375
1.25 to 3
2.5 to 6
4.8 to 14.4
1
Attenuation Factor
1
2.181
4.363
10.472
ADC Input Voltage
Range (V)
0 to 2.048
0 to 4.46
0 to 6.01
0 to 14.41
The upper limit is the absolute maximum allowed voltage on these pins.
The normal way to supply the reference to the ADC on the
REFIN pin is to simply connect the REFOUT pin to the
REFIN pin. REFOUT provides a 2.048 V reference. As such,
the supervising range covers less than half of the normal ADC
range. It is possible, however, to provide the ADC with a more
accurate external reference for improved readback accuracy.
Supplies can also be connected to the input pins purely for ADC
readback, even though they might go above the expected supervisory range limits (as long as they are not above 6 V, because
this violates the absolute maximum ratings on these pins). For
instance, a 1.5 V supply connected to the VX1 pin can be correctly
read out as an ADC code of approximately 3/4 full scale, but it
always sits above any supervisory limits that can be set on that
pin. The maximum setting for the REFIN pin is 2.048 V.
SUPPLY SUPERVISION WITH THE ADC
04632-025
VXn
Table 8. ADC Input Voltage Ranges
In addition to the readback capability, a further level of supervision is provided by the on-chip, 12-bit ADC. The ADM1063 has
limit registers on which the user can program a maximum or
minimum allowable threshold. Exceeding the threshold generates
a warning that can either be read back from the status registers
or input into the SE to determine what sequencing action the
ADM1063 should take. Only one register is provided for each
input channel; therefore, either a UV or OV threshold (but not
both) can be set for a given channel. The round-robin circuit
can be enabled via an SMBus write, or it can be programmed to
turn on in any state in the SE program. For example, it can be
set to start once a power-up sequence is complete and all
supplies are known to be within expected tolerance limits.
Note that a latency is built into this supervision, dictated by
the conversion time of the ADC. With all 12 channels selected,
the total time for the round-robin operation (averaging off) is
approximately 6 ms (500 µs per channel selected). Supervision
using the ADC, therefore, does not provide the same real time
response as the SFDs.
Rev. 0 | Page 20 of 36
ADM1063
SUPPLY MARGINING
OVERVIEW
CLOSED-LOOP SUPPLY MARGINING
It is often necessary for the system designer to adjust supplies,
either to optimize their level or force them away from nominal
values to characterize the system performance under these
conditions. This is a function typically performed during an
in-circuit test (ICT), such as when the manufacturer wants to
guarantee that a product under test functions correctly at
nominal supplies −10%.
A much more accurate and comprehensive method of margining
is to implement a closed-loop system. With this technique, the
voltage of a rail is read back so that it can be accurately margined
to the target voltage. The ADM1063 incorporates all the circuits
required to do this, with the 12-bit successive approximation
ADC used to read back the level of the supervised voltages, and
the six voltage output DACs, implemented as described in the
Open-Loop Margining section, used to adjust supply levels.
These circuits can be used along with other intelligence such as
a microcontroller to implement a closed-loop margining system
that allows any dc-to-dc or LDO supply to be set to any voltage,
accurary to within ±0.5% of the target.
OPEN-LOOP MARGINING
The simplest method of margining a supply is to implement an
open-loop technique. A popular method for this is to switch extra
resistors into the feedback node of a power module, such as a
dc-to-dc converter or low dropout regulator (LDO). The extra
resistor alters the voltage at the feedback or trim node and forces
the output voltage to margin up or down by a certain amount.
µCONTROLLER
VIN
ADM1063
VIN
GND
DACOUTn
DAC
PCB
TRACE NOISE
DECOUPLING
CAPACITOR
04632-067
FEEDBACK
Figure 32. Open-Loop Margining System Using the ADM1063
The ADM1063 can be commanded to margin a supply up or
down over the SMBus by updating the values on the relevant
DAC output.
DACOUTn
R2
GND
DAC
DEVICE
CONTROLLER
(SMBus)
PCB
TRACE NOISE
DECOUPLING
CAPACITOR
Figure 33. Closed-Loop Margining System Using the ADM1063
To implement closed-loop margining:
1.
Disable the six DACn outputs.
2.
Set the DAC output voltage equal to the voltage on the
feedback node.
3.
Enable the DAC.
4.
Read the voltage at the dc-to-dc output, which is connected
to one of the VP1 to VP4, VH, or VX1 to VX5 pins.
5.
If necessary, modify the DACn output code up or down to
adjust the dc-to-dc output voltage; otherwise, stop because
the target voltage has been reached.
6.
Set the DAC output voltage to a value that alters the supply
output by the required amount (for example, ±5%).
7.
Repeat from Step 4.
DEVICE
CONTROLLER
(SMBus)
ATTENUATION
RESISTOR
ADC
R1
FEEDBACK
ADM1063
OUTPUT
DC/DC
CONVERTER
MUX
ATTENUATION
RESISTOR, R3
OUTPUT
µCONTROLLER
VOUT
VH/VPn/VXn
DC/DC
CONVERTER
04632-034
The ADM1063 can perform open-loop margining for up to six
supplies. The six on-board voltage DACs (DAC1 to DAC6) can
drive into the feedback pins of the power modules to be margined.
The simplest circuit to implement this function is an attenuation resistor, which connects the DACn pin to the feedback node
of a dc-to-dc converter. When the DACn output voltage is set
equal to the feedback voltage, no current flows in the attenuation resistor, and the dc-to-dc output voltage does not change.
Taking DACn above the feedback voltage forces current into the
feedback node, and the output of the dc-to-dc converter is forced
to fall to compensate for this. The dc-to-dc output can be forced
high by setting the DACn output voltage lower than the feedback
node voltage. The series resistor can be split in two, and the node
between them decoupled with a capacitor to ground. This can help
to decouple any noise picked up from the board. Decoupling to a
ground local to the dc-to-dc converter is recommended.
Step 1 to Step 3 ensure that when the DACn output buffer is
turned on, it has little effect on the dc-to-dc output. The DAC
output buffer is designed to power up without glitching by first
powering up the buffer to follow the pin voltage. It does not
drive out onto the pin at this time. Once the output buffer is
properly enabled, the buffer input is switched over to the DAC
and the output stage of the buffer is turned on. Output glitching
is negligible.
Rev. 0 | Page 21 of 36
ADM1063
WRITING TO THE DACs
Four DAC ranges are offered. They can be placed with midcode
(Code 0x7F) at 0.6 V, 0.8 V, 1.0 V, and 1.25 V. These voltages are
placed to correspond to the most common feedback voltages.
Centering the DAC outputs in this way provides the best use of
the DAC resolution. For most supplies, it is possible to place the
DAC midcode at the point where the dc-to-dc output is not
modified, thereby giving half of the DAC range to margin up
and the other half to margin down.
The DAC output voltage is set by the code written to the DACn
register. The voltage is linear with the unsigned binary number
in this register. Code 0x7F is placed at the midcode voltage, as
described previously. The output voltage is given by the
following equation:
DAC Output = (DACn − 0x7F)/255 × 0.6015 + VOFF
where VOFF is one of the four offset voltages.
There are 256 DAC settings available. The midcode value is
located at DAC Code 0x7F, as close as possible to the middle
of the 256 code range. The full output swing of the DACs is
+302 mV (+128 codes) and −300 mV (−127 codes) around the
selected midcode voltage. The voltage range for each midcode
voltage is shown in Table 9.
Table 9. Ranges for Midcode Voltages
Midcode
Voltage (V)
0.6
0.8
1.0
1.25
Minimum Voltage
Output (V)
0.300
0.500
0.700
0.950
means that the current flowing through R1 is the same as the
current flowing through R3. Therefore, a direct relationship
exists between the extra voltage drop across R1 during margining
and the voltage drop across R3.
This relationship is given by the following equation:
∂VOUT =
R1
(VFB − VDACOUT)
R3
where:
∂VOUT is the change in VOUT.
VFB is the voltage at the feedback node of the dc-to-dc converter.
VDACOUT is the voltage output of the margining DAC.
This equation demonstrates that if the user wants the output
voltage to change by ±300 mV, then R1 = R3. If the user wants the
output voltage to change by ±600 mV, then R1 = 2 × R3, and so on.
It is best to use the full DAC output range to margin a supply.
Choosing the attenuation resistor in this way provides the most
resolution from the DAC. In other words, with one DAC code
change, the smallest effect on the dc-to-dc output voltage is
induced. If the resistor is sized up to use a code such as 27 (dec)
to 227 (dec) to move the dc-to-dc output by ±5%, then it takes
100 codes to move 5% (each code moves the output by 0.05%).
This is beyond the readback accuracy of the ADC, but should not
prevent the user from building a circuit to use the most resolution.
DAC LIMITING AND OTHER SAFETY FEATURES
Maximum Voltage
Output (V)
0.902
1.102
1.302
1.552
Limit registers (called DPLIMn and DNLIMn) on the device
offer the user some protection from firmware bugs, which can
cause catastrophic board problems by forcing supplies beyond
their allowable output ranges. Essentially, the DAC code written
into the DACn register is clipped such that the code used to set
the DAC voltage is actually given by
DAC Code
= DACn, DACn ≥ DNLIMn and DACn ≤ DPLIMn
= DNLIMn, DACn < DNLIMn
= DPLIMn, DACn > DPLIMn
CHOOSING THE SIZE OF THE ATTENUATION
RESISTOR
The degree to which the DAC voltage swing affects the output
voltage of the dc-to-dc converter that is being margined is
determined by the size of the attenuation resistor, R3 (see
Figure 33).
Because the voltage at the feedback pin remains constant,
the current flowing from the feedback node to GND via R2 is
constant. Also, the feedback node itself is high impedance. This
In addition, the DAC output buffer is three-stated if DNLIMn >
DPLIMn. By programming the limit registers in this way, the
user can make it very difficult for the DAC output buffers to be
turned on during normal system operation (these are among
the registers downloaded from EEPROM at startup).
Rev. 0 | Page 22 of 36
ADM1063
TEMPERATURE MEASUREMENT SYSTEM
The ADM1063 contains an on-chip, band gap temperature
sensor, whose output is digitized by the on-chip, 12-bit ADC.
Theoretically, the temperature sensor and ADC can measure
temperatures from −128°C to +127°C with a resolution of
0.125°C. Because this exceeds the operating temperature range
of the device, local temperature measurements outside this
range are not possible. Temperature measurements from
−128°C to +127°C are possible using a remote sensor. The
output code is in offset binary format, with −128°C given by
Code 0x400, 0°C given by Code 0x800, and +127°C given by
Code 0xC00.
If a discrete transistor is used, the collector is not grounded and
should be linked to the base. If a PNP transistor is used, the base
is connected to the DxN input and the emitter is connected to the
DxP input. If an NPN transistor is used, the emitter is connected
to the DxN input and the base is connected to the DxP input.
Figure 35 and Figure 36 show how to connect the ADM1063
to an NPN or PNP transistor for temperature measurement. To
prevent ground noise from interfering with the measurement,
the more negative terminal of the sensor is not referenced to
ground, but is biased above ground by an internal diode at the
DxN input.
As with the other analog inputs to the ADC, a limit register is
provided for each of the temperature input channels. Therefore,
a temperature limit can be set such that if it is exceeded, a warning
is generated and available as an input to the sequencing engine.
This enables users to control their sequence or monitor functions
based on an overtemperature or undertemperature event.
To measure ∆Vbe, the sensor is switched between operating
currents of I and N × I. The resulting waveform is passed
through a 65 kHz low-pass filter to remove noise and through
a chopper-stabilized amplifier that amplifies and rectifies the
waveform to produce a dc voltage proportional to ∆Vbe. This
voltage is measured by the ADC to produce a temperature
output in 12-bit offset binary. To further reduce the effects of
noise, digital filtering is performed by averaging the results of
16 measurement cycles. A remote temperature measurement
takes nominally 600 ms. The results of remote temperature
measurements are stored in 12-bit, offset binary format, as
shown in Table 10. This provides temperature readings
with a resolution of 0.125°C.
REMOTE TEMPERATURE MEASUREMENT
The ADM1063 can measure the temperature of two remote
diode sensors or diode-connected transistors connected to the
DxN and DxP pins.
The forward voltage of a diode or diode-connected transistor
operated at a constant current exhibits a negative temperature
coefficient of about −2 mV/°C. Unfortunately, the absolute value
of Vbe varies from device to device, and individual calibration
is required to null this, making the technique unsuitable for
mass production. The technique used in the ADM1063 is to
measure the change in Vbe when the device is operated at two
different currents.
This is given by
∆Vbe = kT/q × ln(N)
where:
k is Boltzmann’s constant.
q is charge on the carrier.
T is absolute temperature in Kelvin.
N is ratio of the two currents.
Figure 34 shows the input signal conditioning used to measure the
output of a remote temperature sensor. This figure shows the
external sensor as a substrate transistor provided for temperature
monitoring on some microprocessors, but it could equally be a
discrete transistor such as a 2N3904 or 2N3906.
Table 10. Temperature Data Format
Temperature
−128 °C
−125 °C
−100 °C
−75 °C
−50 °C
−25 °C
−10 °C
0 °C
+10.25 °C
+25.5 °C
+50.75 °C
+75 °C
+100 °C
+125 °C
+128 °C
Rev. 0 | Page 23 of 36
Digital Output (Hex)
400
418
4E0
5A8
600
670
7B0
800
852
8CC
996
A58
B48
BE8
C00
Digital Output (Bin)
010000000000
010000011000
010011100000
010110101000
011000000000
011001110000
011110110000
100000000000
100001010010
100011001100
100110010110
101001011000
101101001000
101111101000
110000000000
ADM1063
VDD
I
REMOTE
SENSING
TRANSISTOR
THERM DA
DxP
THERM DC
DxN
N×I
IBIAS
VOUT+
TO ADC
BIAS
DIODE
VOUT–
LOW-PASS FILTER
fC = 65kHz
04632-069
CPU
Figure 34. Signal Conditioning for Remote Diode Temperature Sensors
ADM1063
ADM1063
DxP
DxN
2N3906
PNP
Figure 35. Measuring Temperature Using an NPN Transistor
DxN
04632-071
DxP
04632-070
2N3904
NPN
Figure 36. Measuring Temperature Using a PNP Transistor
Rev. 0 | Page 24 of 36
ADM1063
APPLICATIONS DIAGRAM
12V IN
12V OUT
5V IN
5V OUT
3V IN
3V OUT
IN
DC-DC1
VH
5V OUT
3V OUT
3.3V OUT
2.5V OUT
1.8V OUT
1.2V OUT
0.9V OUT
EN
OUT
3.3V OUT
ADM1063
VP1
VP2
VP3
VP4
VX1
VX2
VX3
PDO1
PDO2
VX4
PDO6
IN
DC-DC2
PDO3
PDO4
PDO5
EN
OUT
2.5V OUT
POWER_GOOD
POWER_ON
SIGNAL_VALID
RESET_L
PDO7
IN
SYSTEM RESET
VX5
DC-DC3
PDO8
EN
PDO9
PDO10
OUT
1.8V OUT
3.3V OUT
REFOUT
D1P
IN
D1N
D2P
LDO
D2N
REFIN VCCP VDDCAP GND
EN
OUT
0.9V OUT
3.3V OUT
IN
10µF
10µF
10µF
EN
TEMPERATURE
DIODE
3.3V OUT
OUT
1.2V OUT
DC-DC4
µP
2.5V OUT
TEMPERATURE
DIODE
3.3V OUT
µP
04632-068
2.5V OUT
Figure 37. Applications Diagram
Rev. 0 | Page 25 of 36
ADM1063
COMMUNICATING WITH THE ADM1063
CONFIGURATION DOWNLOAD AT POWER-UP
The configuration of the ADM1063 (UV/OV thresholds, glitch
filter timeouts, PDO configurations, and so on) is dictated by
the contents of RAM. The RAM is comprised of digital latches
that are local to each of the functions on the device. The latches
are double-buffered and have two identical latches, Latch A and
Latch B. Therefore, when an update to a function occurs, the
contents of Latch A are updated first, and then the contents of
Latch B are updated with identical data. The advantages of this
architecture are explained in detail in the Updating the
Configuration section.
The latches are volatile memory and lose their contents at
power-down. Therefore, the configuration in the RAM must
be restored at power-up by downloading the contents of the
EEPROM (nonvolatile memory) to the local latches. This
download occurs in steps, as follows:
1.
With no power applied to the device, the PDOs are all
high impedance.
2.
When 1 V appears on any of the inputs connected to the
VDD arbitrator (VH or VPn), the PDOs are all weakly
pulled to GND with a 20 kΩ impedance.
3.
When the supply rises above the undervoltage lockout of
the device (UVLO is 2.5 V), the EEPROM starts to
download to the RAM.
4.
The EEPROM downloads its contents to all Latch As.
5.
Once the contents of the EEPROM are completely downloaded to the Latch As, the device controller signals all
Latch As to download to all Latch Bs simultaneously,
completing the configuration download.
6.
At 0.5 ms after the configuration download completes, the
first state definition is downloaded from EEPROM into
the SE.
Note that any attempt to communicate with the device prior to
the completion of the download causes the ADM1063 to issue
a no acknowledge (NACK).
UPDATING THE CONFIGURATION
After power-up, with all the configuration settings loaded from
EEPROM into the RAM registers, the user might need to alter
the configuration of functions on the ADM1063, such as changing the UV or OV limit of an SFD, changing the fault output of
an SFD, or adjusting the rise time delay of one of the PDOs.
The ADM1063 provides several options that allow the user to
update the configuration over the SMBus interface. The
following options are controlled in the UPDCFG register:
1.
Update the configuration in real time. The user writes
to RAM across the SMBus and the configuration is
updated immediately.
2.
Update the Latch As without updating the Latch Bs. With
this method, the configuration of the ADM1063 remains
unchanged and continues to operate in the original setup
until the instruction is given to update the Latch Bs.
3.
Change EEPROM register contents without changing the
RAM contents, and then download the revised EEPROM
contents to the RAM registers. With this method, the
configuration of the ADM1063 remains unchanged and
continues to operate in the original setup until the
instruction is given to update the RAM.
The instruction to download from the EEPROM in Option 3 is
also a useful way to restore the original EEPROM contents, if
revisions to the configuration are unsatisfactory. For example, if
the user needs to alter an OV threshold, this can be done by
updating the RAM register as described in Option 1. However,
if the user is not satisfied with the change and wants to revert to
the original programmed value, then the device controller can
issue a command to download the EEPROM contents to the
RAM again, as described in Option 3, restoring the ADM1063
to its original configuration.
The topology of the ADM1063 makes this type of operation
possible. The local, volatile registers (RAM) are all doublebuffered latches. Setting Bit 0 of the UPDCFG register to 1 leaves
the double-buffered latches open at all times. If Bit 0 is set to 0,
then, when a RAM write occurs across the SMBus, only the first
side of the double-buffered latch is written to. The user must then
write a 1 to Bit 1 of the UPDCFG register. This generates a pulse
to update all the second latches at once. EEPROM writes occur
in a similar way.
The final bit in this register can enable or disable EEPROM
page erasure. If this bit is set high, the contents of an EEPROM
page can all be set to 1. If low, then the contents of a page
cannot be erased, even if the command code for page erasure is
programmed across the SMBus. The bit map for the UPDCFG
register is shown in the AN-698 application note. A flow diagram
for download at power-up and subsequent configuration updates
is shown in Figure 38.
Rev. 0 | Page 26 of 36
ADM1063
SMBus
E
E
P
R
O
M
L
D
DEVICE
CONTROLLER
R
A
M
L
D
D
A
T
A
U
P
D
LATCH A
LATCH B
EEPROM
FUNCTION
(OV THRESHOLD
ON VP1)
04632-035
POWER-UP
(VCC > 2.5V)
Figure 38. Configuration Update Flow Diagram
UPDATING THE SEQUENCING ENGINE
Sequencing engine (SE) functions are not updated in the
same way as regular configuration latches. The SE has its
own dedicated 512-byte EEPROM for storing state definitions,
providing 63 individual states, each with a 64-bit word (one
state is reserved). At power-up, the first state is loaded from the
SE EEPROM into the engine itself. When the conditions of this
state are met, the next state is loaded from EEPROM into the
engine, and so on. The loading of each new state takes approximately 10 µs.
The major differences between the EEPROM and other
registers are as follows:
•
An EEPROM location must be blank before it can be
written to. If it contains data, it must first be erased.
•
Writing to EEPROM is slower than writing to RAM.
•
Writing to the EEPROM should be restricted, because it has
a limited write/cycle life of typically 10,000 write operations
due to the usual EEPROM wear-out mechanisms.
INTERNAL REGISTERS
The first EEPROM is split into 16 (0 to 15) pages of 32 bytes each.
Pages 0 to 6, starting at Address 0xF800, hold the configuration
data for the applications on the ADM1063 (the SFDs, PDOs,
and so on). These EEPROM addresses are the same as the RAM
register addresses, prefixed by F8. Page 7 is reserved. Page 8 to
Page 15 are for customer use.
The ADM1063 contains a large number of data registers. The
principal registers are the address pointer register and the
configuration registers.
Data can be downloaded from EEPROM to RAM in one of the
following ways:
Address Pointer Register
•
At power-up when Page 0 to Page 6 are downloaded.
This register contains the address that selects one of the other
internal registers. When writing to the ADM1063, the first byte
of data is always a register address, which is written to the
address pointer register.
•
By setting Bit 0 of the UDOWNLD register (0xD8), which
performs a user download of Page 0 to Page 6.
Configuration Registers
The ADM1063 is controlled via the serial system management
bus (SMBus). The ADM1063 is connected to this bus as a slave
device, under the control of a master device. It takes approximately 1 ms after power-up for the ADM1063 to download
from its EEPROM. Therefore, access to the ADM1063 is
restricted until the download is completed.
To alter a state, the required changes must be made directly to
EEPROM. RAM for each state does not exist. The relevant
alterations must be made to the 64-bit word, which is then
uploaded directly to EEPROM.
These registers provide control and configuration for various
operating parameters of the ADM1063.
EEPROM
The ADM1063 has two 512-byte cells of nonvolatile, electrically
erasable, programmable, read-only memory (EEPROM) from
Register Address 0xF800 to Register Address 0xFBFF. The
EEPROM is used for permanent storage of data that is not lost
when the ADM1063 is powered down. One EEPROM cell
contains the configuration data of the device; the other contains
the state definitions for the SE. Although referred to as read-only
memory, the EEPROM can be written to, as well as read from,
via the serial bus in exactly the same way as the other registers.
SERIAL BUS INTERFACE
Identifying the ADM1063 on the SMBus
The ADM1060 has a 7-bit serial bus slave address. The device is
powered up with a default serial bus address. The 5 MSBs of the
address are set to 01101, and the 2 LSBs are determined by the
logical states of Pin A1 and Pin A0. This allows the connection
of four ADM1063s to one SMBus.
Rev. 0 | Page 27 of 36
ADM1063
The device also has several identification registers (read-only),
which can be read across the SMBus. Table 11 lists these registers
with their values and functions.
All other devices on the bus remain idle while the selected
device waits for data to be read from or written to it. If the
R/W bit is a 0, the master writes to the slave device. If the
R/W bit is a 1, the master reads from the slave device.
Table 11. Identification Register Values and Functions
Name
MANID
Address
0xF4
Value
0x41
REVID
MARK1
MARK2
0xF5
0xF6
0xF7
0x02
0x00
0x00
Function
Manufacturer ID for Analog
Devices
Silicon revision
Software brand
Software brand
2.
Data is sent over the serial bus in sequences of nine clock
pulses—eight bits of data followed by an acknowledge bit
from the slave device. Data transitions on the data line
must occur during the low period of the clock signal and
remain stable during the high period, because a low-tohigh transition when the clock is high might be interpreted
as a stop signal. If the operation is a write operation, the
first data byte after the slave address is a command byte.
This tells the slave device what to expect next. It might be
an instruction telling the slave device to expect a block
write, or it might simply be a register address that tells the
slave where subsequent data is to be written. Because data
can flow in only one direction, as defined by the R/W bit,
sending a command to a slave device during a read operation
is not possible. Before a read operation, it might be necessary
to perform a write operation to tell the slave what sort of read
operation to expect and/or from which address to read data.
3.
When all data bytes have been read or written, stop conditions are established. In write mode, the master pulls the
data line high during the 10th clock pulse to assert a stop
condition. In read mode, the master device releases the
SDA line during the low period before the ninth clock
pulse, but the slave device does not pull it low. This is
known as a no acknowledge. The master then takes the
data line low during the low period before the 10th clock
pulse, then high during the 10th clock pulse to assert a
stop condition.
General SMBus Timing
Figure 39 to Figure 41 are timing diagrams for general read and
write operations using the SMBus. The SMBus specification
defines specific conditions for different types of read and write
operations, which are discussed in the Write Operations and
Read Operations sections.
The general SMBus protocol operates as follows:
The master initiates data transfer by establishing a start
condition, defined as a high-to-low transition on the serial
data-line SDA while the serial clock-line SCL remains high.
This indicates that a data stream follows. All slave peripherals
connected to the serial bus respond to the start condition
and shift in the next eight bits, consisting of a 7-bit slave
address (MSB first) plus an R/W bit. This bit determines
the direction of the data transfer, that is, whether data is
written to or read from the slave device (0 = write, 1 = read).
The peripheral whose address corresponds to the transmitted address responds by pulling the data line low during
the low period before the ninth clock pulse, known as the
acknowledge bit, and holding it low during the high period
of this clock pulse.
1
9
1
9
SCL
0
SDA
1
1
0
1
A1
A0
R/W
D7
D6
D5
D4
D3
D2
D1
ACK. BY
SLAVE
START BY
MASTER
D0
ACK. BY
SLAVE
FRAME 1
SLAVE ADDRESS
FRAME 2
COMMAND CODE
1
9
1
9
SCL
(CONTINUED)
SDA
(CONTINUED)
D7
D6
D5
D4
D3
D2
FRAME 3
DATA BYTE
D1
D0
D7
ACK. BY
SLAVE
D6
D5
D4
D2
FRAME N
DATA BYTE
Figure 39. General SMBus Write Timing Diagram
Rev. 0 | Page 28 of 36
D3
D1
D0
ACK. BY
SLAVE
STOP
BY
MASTER
04632-036
1.
ADM1063
1
9
1
9
SCL
0
SDA
1
1
0
1
A1
A0 R/W
D7
D6
D5
D4
D3
D2
D1
ACK. BY
SLAVE
START BY
MASTER
1
D0
ACK. BY
MASTER
FRAME 1
SLAVE ADDRESS
9
1
FRAME 2
DATA BYTE
9
SCL
(CONTINUED)
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
ACK. BY
MASTER
FRAME 3
DATA BYTE
D3
D2
D1
D0
NO ACK.
FRAME N
DATA BYTE
STOP
BY
MASTER
04632-037
SDA
(CONTINUED)
Figure 40. General SMBus Read Timing Diagram
tR
tF
t HD; STA
t LO W
SCL
t HI G H
t HD; STA
t HD; DAT
t SU; STA
t SU; STO
t SU; DAT
t BUF
P
S
S
P
04632-038
SDA
Figure 41. Serial Bus Timing Diagram
SMBus PROTOCOLS FOR RAM AND EEPROM
The ADM1063 uses the following SMBus write protocols.
The ADM1063 contains volatile registers (RAM) and nonvolatile registers (EEPROM). User RAM occupies address locations
from 0x00 to 0xDF; EEPROM occupies addresses from 0xF800
to 0xFBFF.
Send Byte
In a send byte operation, the master device sends a single
command byte to a slave device, as follows:
1.
The master device asserts a start condition on SDA.
2.
The master sends the 7-bit slave address followed by the
write bit (low).
3.
The addressed slave device asserts ACK on SDA.
4.
The master sends a command code.
Page erasure is enabled by setting Bit 2 in the UPDCFG register
(Address 0x90) to 1. If this bit is not set, page erasure cannot
occur, even if the command byte (0xFE) is programmed across
the SMBus.
5.
The slave asserts ACK on SDA.
6.
The master asserts a stop condition on SDA, and the
transaction ends.
WRITE OPERATIONS
In the ADM1063, the send byte protocol is used for two purposes:
The SMBus specification defines several protocols for different
types of read and write operations. The following abbreviations
are used in the diagrams:
•
S =
P =
R=
W=
A=
A=
Start
Stop
Read
Write
Acknowledge
No acknowledge
To write a register address to RAM for a subsequent single
byte read from the same address, or for a block read or a
block write starting at that address, as shown in Figure 42.
1
2
S
SLAVE
ADDRESS
W
3
4
5
6
A
RAM
ADDRESS
(0x00 TO 0xDF)
A
P
04609-039
Data can be written to and read from both RAM and EEPROM
as single data bytes. Data can be written only to unprogrammed
EEPROM locations. To write new data to a programmed location,
the location’s contents must first be erased. EEPROM erasure
cannot be done at the byte level. The EEPROM is arranged as
32 pages of 32 bytes each, and an entire page must be erased.
Figure 42. Setting a RAM Address for Subsequent Read
Rev. 0 | Page 29 of 36
ADM1063
S
2
SLAVE
ADDRESS
W
3
4
5
6
A
COMMAND
BYTE
(0xFE)
A
P
To write a single byte of data to RAM. In this case, the
command byte is the RAM addresses from 0x00 to 0xDF
and the only data byte is the actual data, as shown in
Figure 44.
1
3
4
5
6
7 8
RAM
ADDRESS
A DATA A P
(0x00 TO 0xDF)
Figure 44. Single Byte Write to RAM
•
To set up a 2-byte EEPROM address for a subsequent
read, write, block read, block write, or page erase. In this
case, the command byte is the high byte of the EEPROM
addresses from 0xF8 to 0xFB. The only data byte is the low
byte of the EEPROM address, as shown in Figure 45.
Figure 43. EEPROM Page Erasure
1
2
3
4
5
6
7 8
EEPROM
EEPROM
SLAVE
ADDRESS
ADDRESS
S
W A
A
A P
ADDRESS
HIGH BYTE
LOW BYTE
(0xF8 TO 0xFB)
(0x00 TO 0xFF)
As soon as the ADM1063 receives the command byte,
page erasure begins. The master device can send a stop
command as soon as it sends the command byte. Page
erasure takes approximately 20 ms. If the ADM1063 is
accessed before erasure is complete, it responds with a
no acknowledge (NACK).
Figure 45. Setting an EEPROM Address
Note that for page erasure, because a page consists of
32 bytes, only the 3 MSBs of the address low byte are
important. The lower five bits of the EEPROM address
low byte specify the addresses within a page and are
ignored during an erase operation.
Write Byte/Word
In a write byte/word operation, the master device sends a
command byte and one or two data bytes to the slave device,
as follows:
1.
The master device asserts a start condition on SDA.
2.
The master sends the 7-bit slave address followed by the
write bit (low).
3.
The addressed slave device asserts ACK on SDA.
4.
The master sends a command code.
5.
The slave asserts ACK on SDA.
•
To write a single byte of data to EEPROM. In this case, the
command byte is the high byte of the EEPROM addresses
from 0xF8 to 0xFB. The first data byte is the low byte of the
EEPROM address, and the second data byte is the actual
data, as shown in Figure 46.
1
2
3
4
5
6
7
8
9 10
EEPROM
EEPROM
SLAVE
ADDRESS
ADDRESS
S
W A
A
A DATA A P
ADDRESS
HIGH BYTE
LOW BYTE
(0xF8 TO 0xFB)
(0x00 TO 0xFF)
Figure 46. Single Byte Write to EEPROM
Block Write
6.
The master sends a data byte.
7.
The slave asserts ACK on SDA.
8.
The master sends a data byte or asserts a stop condition.
9.
The slave asserts ACK on SDA.
10. The master asserts a stop condition on SDA to end
the transaction.
2
SLAVE
S ADDRESS W A
04632-043
1
•
04632-040
The master sends a command code that tells the slave device
to erase the page. The ADM1063 command code for a page
erasure is 0xFE (1111 1110). Note that, for a page erasure
to take place, the page address must be given in the previous
write word transaction (see the Write Byte/Word section).
Also, Bit 2 in the UPDCFG register (Address 0x90) must
be set to 1.
In the ADM1063, the write byte/word protocol is used for
three purposes:
04632-041
To erase a page of EEPROM memory. EEPROM memory
can be written to only if it is unprogrammed. Before writing
to one or more EEPROM memory locations that are already
programmed, the page(s) containing those locations must
first be erased. EEPROM memory is erased by writing a
command byte.
04632-042
•
In a block write operation, the master device writes a block of
data to a slave device. The start address for a block write must
have been set previously. In the ADM1063, a send byte operation sets a RAM address, and a write byte/word operation sets
an EEPROM address, as follows:
1.
The master device asserts a start condition on SDA.
2.
The master sends the 7-bit slave address followed by
the write bit (low).
3.
The addressed slave device asserts ACK on SDA.
Rev. 0 | Page 30 of 36
ADM1063
The master sends a command code that tells the slave
device to expect a block write. The ADM1063 command
code for a block write is 0xFC (1111 1100).
5.
The slave asserts ACK on SDA.
6.
The master sends a data byte that tells the slave device how
many data bytes are being sent. The SMBus specification
allows a maximum of 32 data bytes in a block write.
7.
The slave asserts ACK on SDA.
8.
The master sends N data bytes.
9.
The slave asserts ACK on SDA after each data byte.
3
4
5
6
7
8
9
10
BYTE
SLAVE
COMMAND 0xFC
DATA
DATA
DATA
A
A
A P
S ADDRESS W A (BLOCK WRITE) A COUNT A
1
2
N
Figure 47. Block Write to EEPROM or RAM
Unlike some EEPROM devices that limit block writes to within
a page boundary, there is no limitation on the start address
when performing a block write to EEPROM, except
•
•
6.
The master asserts a stop condition on SDA, and the
transaction ends.
In the ADM1063, the receive byte protocol is used to read a
single byte of data from a RAM or EEPROM location whose
address has previously been set by a send byte or write
byte/word operation, as shown in Figure 48.
1
2
S
SLAVE
ADDRESS
R
3
4
5
6
A
DATA
A
P
Block Read
04632-044
2
The master asserts a no acknowledge on SDA.
Figure 48. Single Byte Read from EEPROM or RAM
10. The master asserts a stop condition on SDA to end
the transaction.
1
5.
04632-045
4.
There must be at least N locations from the start address to
the highest EEPROM address (0xFBFF) to avoid writing to
invalid addresses.
If the addresses cross a page boundary, both pages must be
erased before programming.
Note that the ADM1063 features a clock extend function for
writes to EEPROM. Programming an EEPROM byte takes
approximately 250 µs, which would limit the SMBus clock for
repeated or block write operations. The ADM1063 pulls SCL
low and extends the clock pulse when it cannot accept any
more data.
READ OPERATIONS
In a block read operation, the master device reads a block of
data from a slave device. The start address for a block read must
have been set previously. In the ADM1063, this is done by a
send byte operation to set a RAM address, or a write byte/word
operation to set an EEPROM address. The block read operation
itself consists of a send byte operation that sends a block read
command to the slave, immediately followed by a repeated start
and a read operation that reads out multiple data bytes, as follows:
1.
The master device asserts a start condition on SDA.
2.
The master sends the 7-bit slave address followed by the
write bit (low).
3.
The addressed slave device asserts ACK on SDA.
4.
The master sends a command code that tells the slave
device to expect a block read. The ADM1063 command
code for a block read is 0xFD (1111 1101).
5.
The slave asserts ACK on SDA.
6.
The master asserts a repeat start condition on SDA.
7.
The master sends the 7-bit slave address followed by the
read bit (high).
8.
The slave asserts ACK on SDA.
9.
The ADM1063 sends a byte-count data byte that tells the
master how many data bytes to expect. The ADM1063
always returns 32 data bytes (0x20), which is the maximum
allowed by the SMBus 1.1 specification.
The ADM1063 uses the following SMBus read protocols.
Receive Byte
In a receive byte operation, the master device receives a single
byte from a slave device, as follows:
1.
The master device asserts a start condition on SDA.
10. The master asserts ACK on SDA.
2.
The master sends the 7-bit slave address followed by the
read bit (high).
11. The master receives 32 data bytes.
3.
The addressed slave device asserts ACK on SDA.
4.
The master receives a data byte.
12. The master asserts ACK on SDA after each data byte.
13. The master asserts a stop condition on SDA to end
the transaction.
Rev. 0 | Page 31 of 36
ADM1063
1
2
3
4
5 6
7
8
9
10
11
12
Note that the PEC byte is calculated using CRC-8. The frame
check sequence (FCS) conforms to CRC-8 by the polynomial
S SLAVE
W A COMMAND 0xFD A S SLAVE R A BYTE A DATA A
ADDRESS
(BLOCK READ)
ADDRESS
COUNT
1
C(x) = x8 + x2 + x1 + 1
P
Figure 49. Block Read from EEPROM or RAM
Error Correction
See the SMBus 1.1 specification for details.
An example of a block read with the optional PEC byte is shown
in Figure 50.
1
The ADM1063 provides the option of issuing a packet error
correction (PEC) byte after a write to RAM, a write to EEPROM,
a block write to RAM/EEPROM, or a block read from RAM/
EEPROM. This enables the user to verify that the data received
by or sent from the ADM1063 is correct. The PEC byte is an
optional byte sent after that last data byte has been written to or
read from the ADM1063. The protocol is as follows:
1.
The ADM1063 issues a PEC byte to the master. The master
checks the PEC byte and issues another block read if the
PEC byte is incorrect.
2.
A no acknowledge (NACK) is generated after the PEC byte
to signal the end of the read.
2
3
4
5 6
7
8
9
10
11
12
S SLAVE
W A COMMAND 0xFD A S SLAVE R A BYTE A DATA A
ADDRESS
(BLOCK READ)
ADDRESS
COUNT
1
Rev. 0 | Page 32 of 36
13 14 15
DATA
32
A PEC A P
Figure 50. Block Read from EEPROM or RAM with PEC
04632-047
DATA A
32
04632-046
13 14
ADM1063
OUTLINE DIMENSIONS
6.00
BSC SQ
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
31
30
PIN 1
INDICATOR
TOP
VIEW
0.50
BSC
5.75
BCS SQ
1.00
0.85
0.80
4.25
4.10 SQ
3.95
EXPOSED
PAD
(BOTTOM VIEW)
0.50
0.40
0.30
12° MAX
40
1
21
20
10
11
0.25 MIN
4.50
REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.30
0.23
0.18
SEATING
PLANE
0.20 REF
COPLANARITY
0.08
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
Figure 51. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6 × 6 mm Body, Very Thin Quad
(CP-40)
Dimensions shown in millimeters
0.75
0.60
0.45
1.20
MAX
9.00
BSC SQ
37
36
48
1
PIN 1
0.15
0.05
SEATING
PLANE
0.20
0.09
7°
3.5°
0°
0.08 MAX
COPLANARITY
7.00
BSC SQ
TOP VIEW
0° MIN
1.05
1.00
0.95
(PINS DOWN)
12
13
VIEW A
VIEW A
0.50
0.27
BSC
0.22
LEAD PITCH
0.17
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026ABC
Figure 52. 48-Lead Thin Plastic Quad Flat Package [TQFP]
(SU-48)
Dimensions shown in millimeters
Rev. 0 | Page 33 of 36
25
24
ADM1063
ORDERING GUIDE
Model
ADM1063ACP
ADM1063ACP-REEL7
ADM1063ACPZ1
ADM1063ACPZ-REEL71
ADM1063ASU
ADM1063ASU-REEL7
ADM1063ASUZ1
ADM1063ASUZ-REEL71
EVAL-ADM1063LFEB
EVAL-ADM1063TQEB
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
40-Lead LFCSP_VQ
40-Lead LFCSP_VQ
40-Lead LFCSP_VQ
40-Lead LFCSP_VQ
48-Lead TQFP
48-Lead TQFP
48-Lead TQFP
48-Lead TQFP
ADM1063 Evaluation Kit (LFCSP Version)
ADM1063 Evaluation Kit (TQFP Version)
Z = Pb-free part.
Rev. 0 | Page 34 of 36
Package Option
CP-40
CP-40
CP-40
CP-40
SU-48
SU-48
SU-48
SU-48
ADM1063
NOTES
Rev. 0 | Page 35 of 36
ADM1063
NOTES
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04632–0–4/05(0)
Rev. 0 | Page 36 of 36
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