PHILIPS BGY2016 Uhf amplifier module Datasheet

DISCRETE SEMICONDUCTORS
DATA SHEET
handbook, halfpage
M3D167
BGY2016
UHF amplifier module
Product specification
Supersedes data of 1999 Nov 24
2000 Jan 04
Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
FEATURES
PINNING - SOT365A
• 26 V nominal supply voltage
PIN
• 16 W output power into a load of 50 Ω with an RF drive
power of ≤20 mW.
APPLICATIONS
• Base station transmitting equipment operating in the
1805 to 1990 MHz frequency band.
DESCRIPTION
1
RF input
2
VS1
3
VS2
4
RF output
Flange
ground
DESCRIPTION
The BGY2016 is a three-stage UHF amplifier module in a
SOT365A package with a plastic cap. It consists of three
NPN silicon planar transistor dies mounted together with
matching and bias circuit components on a metallized
ceramic AlN substrate.
handbook, halfpage
1
2
3
4
MSA447
Fig.1 Simplified outline.
QUICK REFERENCE DATA
RF performance at Tmb = 25 °C.
f
(MHz)
VS1
(V)
VS2
(V)
PL
(W)
Gp
(dB)
η
(%)
ZS; ZL
(Ω)
1805 to 1990
5
26
≥16
≥28
≥30
50
MIN.
MAX.
UNIT
MODE OF OPERATION
CW
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
VS1
DC supply voltage
4.5
5.5
V
VS2
DC supply voltage
−
28
V
PD
input drive power
−
120
mW
PL
load power
−
20
W
Tstg
storage temperature
−30
+100
°C
Tmb
operating mounting base temperature
−10
+90
°C
2000 Jan 04
Tmb = 25 °C
2
Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
CHARACTERISTICS
Tmb = 25 °C; VS1 = 5 V; VS2 = 26 V; PL = 16 W; ZS = ZL = 50 Ω unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
f
frequency
1805
−
1990
MHz
IS1
supply current
−
80
−
mA
IS2
supply current
PD < −60 dBm
−
430
−
mA
PL
load power
PD < 20 mW
Gp
power gain
∆Gp
in band gain variation
f = 1930 to 1990 MHz; PL = 5 W
−
−
2
dB
Gp1 - Gp2
gain expansion
Gp1 at PL = 160 mW;
Gp2 at PL = 5 mW
−
−
±1
dB
η
efficiency
PL = 16 W
30
−
−
%
H2
second harmonic
PL = 16 W
−
−
−35
dBc
H3
third harmonic
PL = 16 W
−
−
−40
dBc
VSWRin
input VSWR
−
−
2:1
B
2000 Jan 04
f = 1805 to 1880 MHz; PL = 5 W
16
−
−
W
28
−
35
dB
−
−
2
dB
stability
VSWR ≤ 2 : 1 through all phases;
PL ≤ 16 W; VS2 = 25 to 27 V
−
−
−60
dBc
reverse intermodulation
Pcarrier = 16 W; Preverse = −40 dBc;
fi = fc ±200 kHz
−
−
−53
dBc
AM bandwidth
corner frequency = 3 dB;
Pcarrier = 16 W; modulation = 20%
2
−
−
MHz
ruggedness
VSWR ≤ 5 : 1 through all phases
3
no degradation
Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
APPLICATION INFORMATION
handbook, full pagewidth
Z1
C7
C8
C5
C6
R1
L1
R2
C3
C4
C1
C2
50 Ω
input
VS1
Z2
L2
50 Ω
output
VS2
MGM861
Fig.2 Test circuit.
List of components (See Figs 2 and 3)
COMPONENT
DESCRIPTION
VALUE
CATALOGUE NO.
C1, C2
electrolytic capacitor
10 µF; 35 V
−
C3, C4
multilayer ceramic chip capacitor
10 nF; 50 V
−
C5, C6
multilayer ceramic chip capacitor
100 pF; 50 V
−
C7, C8
multilayer ceramic chip capacitor
10 pF; 50 V
−
L1, L2
Grade 4S2 Ferroxcube bead
−
4330 030 36300
R1, R2
metal film resistor
10 Ω; 0.4 W
2322 195 13109
Z1, Z2
stripline; note 1
50 Ω
−
Note
1. The striplines are on a double copper-clad printed-circuit board with epoxy dielectric (εr = 4.5); thickness = 1 mm.
2000 Jan 04
4
Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
90
handbook, full pagewidth
42
C7
C8
C6
C5
R1
Z2
L1
L2
C3
C4
C1
C2
output VS1
R2
Z1
VS2 input
Dimensions in mm.
Fig.3 Printed-circuit board component layout.
2000 Jan 04
5
MGM862
Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
MOUNTING RECOMMENDATIONS
To ensure a good thermal contact and to prevent mechanical stress when bolted down, the flatness of the mounting base
is designed to be typically better than 0.1 mm. The mounting area of the heatsink should be flat and free from burrs and
loose particles. The heatsink should be rigid and not prone to bowing under thermal cycling conditions. The thickness of
a solid heatsink should be not less than 5 mm to ensure a rigid assembly.
A thin, even layer of thermal compound should be applied between the mounting base and the heatsink to achieve the
best possible thermal contact resistance. Excessive use of thermal compound will result in an increase in thermal
resistance and possible bowing of the mounting base; too little will also result in poor thermal conduction.
The module should be mounted to the heatsink using 3 mm bolts with flat washers. The bolts should first be tightened to
“finger tight” and then further tightened in alternating steps to a maximum torque of 0.4 to 0.6 Nm.
Once mounted on the heatsink, the module leads can be soldered to the printed-circuit board. A soldering iron may be
used up to a temperature of 250 °C for a maximum of 10 seconds at a distance of 2 mm from the plastic cap.
ESD precautions must be taken to protect the device from electrostatic damage.
2000 Jan 04
6
Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
PACKAGE OUTLINE
Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads
SOT365A
D
A
F
y
U
q
A
U2
p
E
U1
L
1
2
3
4
bp
e1
e
w M
e
c
v A
Z
0
Q
10
20 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
bp
c
D
E
mm
9.5
9.0
0.56
0.46
0.3
0.2
30.1
29.9
18.6
18.4
OUTLINE
VERSION
e
e1
2.54 17.78
F
L
p
Q
3.25
3.15
6.5
6.1
4.1
3.9
4.0
3.8
REFERENCES
IEC
JEDEC
EIAJ
SOT365A
2000 Jan 04
q
U
40.74 48.0
40.54 48.4
U1
U2
v
w
y
Z
15.4
15.2
7.75
7.55
0.3
0.25
0.1
12.8
12.6
EUROPEAN
PROJECTION
ISSUE DATE
99-02-06
7
Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
DEFINITIONS
Data Sheet Status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2000 Jan 04
8
Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
NOTES
2000 Jan 04
9
Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
NOTES
2000 Jan 04
10
Philips Semiconductors
Product specification
UHF amplifier module
BGY2016
NOTES
2000 Jan 04
11
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SCA 69
© Philips Electronics N.V. 2000
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Printed in The Netherlands
125002/03/pp12
Date of release: 2000
Jan 04
Document order number:
9397 750 06658
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