TI DRV2667RGPT Piezo haptic driver with boost, digital front end, and internal waveform memory Datasheet

DRV2667
www.ti.com
SLOS807 – JANUARY 2013
Piezo Haptic Driver with Boost, Digital Front End, and Internal Waveform Memory
Check for Samples: DRV2667
FEATURES
DESCRIPTION
•
The DRV2667 is a piezo haptic driver with integrated
105 V boost switch, integrated power diode,
integrated fully-differential amplifier, and integrated
digital front end. This versatile device is capable of
driving both high-voltage and low-voltage piezo haptic
actuators. The input signal can be driven over the I2C
port or the analog inputs.
1
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•
•
•
•
Integrated Digital Front End
– I2C Bus Control up to 400 kHz
– Advanced Waveform Synthesizer
– 2 kB Internal Waveform Memory
– Internal 100 Byte FIFO Interface
– Immersion TS5000 Compliant
– Optional Analog Inputs
High Voltage Piezo-Haptic Driver
– Drives up to 100 nF at 200 VPP and 300 Hz
– Drives up to 150 nF at 150 VPP and 300 Hz
– Drives up to 330 nF at 100 VPP and 300 Hz
– Drives up to 680 nF at 50 VPP and 300 Hz
– Differential Output
Integrated 105 V Boost Converter
– Adjustable Boost Voltage
– Adjustable Boost Current Limit
– Integrated Power FET and Diode
– No Transformer Required
Fast Start Up Time of 2 ms (typical)
Wide Supply Voltage Range of 3 V to 5.5 V
1.8 V Compatible, VDD Tolerant Digital Pins
Available in a 4 mm × 4 mm × 0.9 mm QFN
package (RGP)
Pin-Similar with DRV8662 and Pin-Compatible
with DRV2665
The DRV2667 digital interface is available via an I2C
compatible bus. A digital interface relieves the costly
processor burden of PWM generation or additional
analog channel requirements in the host system. Any
writes to the internal FIFO will automatically wake up
the device and begin playing the waveform after the 2
ms internal startup procedure. When the data flow
stops or the FIFO under-runs, the DRV2667 will
automatically enter a pop-less shutdown procedure.
The DRV2667 also includes deep volatile waveform
memory to store and recall waveforms with minimal
latency as well as an advanced waveform synthesizer
to construct complex haptic waveforms with minimal
memory usage. This provide a means of hardware
acceleration, relieving the host processor of haptic
generation duties as well as minimizing bus traffic
over the haptic interface.
The boost voltage is set using two external resistors,
and the boost current limit is programmable via the
REXT resistor. A typical start-up time of 2 ms makes
the DRV2667 an ideal piezo driver for fast haptic
responses. Thermal overload protection prevents the
device from being damaged when overdriven.
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APPLICATIONS
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Mobile Phones
Tablets
Portable Computers
Keyboards and Mice
Electronic Gaming
Touch Enabled Devices
L1
3 V to 5.5 V
DRV2667
CVDD
SW
VDD
VBST
VREG
R1
RPU
FB
SDA
I2C
CVBST
PVDD
CVREG
RPU
R2
SCL
Analog
Input
CPUMP
IN+
OUT+
IN-
OUT-
VPUMP
REXT
Piezo
Actuator
REXT
GND
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
22-Mar-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
DRV2667RGPR
ACTIVE
QFN
RGP
20
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
-40 to 85
2667
DRV2667RGPT
ACTIVE
QFN
RGP
20
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
-40 to 85
2667
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
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Addendum-Page 1
Samples
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