Rohm BD5324 Free delay time setting cmos voltage detector ic sery Datasheet

Voltage Detector IC Series
Free Delay Time Setting
CMOS Voltage Detector IC Series
No.09006EBT03
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
 Description
ROHM’s BD52□□G/FVE and BD53□□G/FVE series are highly accurate, low current consumption reset IC series with a
built-in delay circuit. The lineup was established with tow output types (Nch open drain and CMOS output) and detection
voltages range from 2.3V to 6.0V in increments of 0.1V, so that the series may be selected according the application at
hand.
 Features
1) Detection voltage: 2.3V to 6.0V (Typ.), 0.1V steps
2) High accuracy detection voltage: ±1.0%
3) Ultra-low current consumption: 0.8µA (Typ.)
4) Nch open drain output (BD52□□G/FVE), CMOS output (BD53□□G/FVE)
5) Compact packages VSOF5: BD52□□FVE, BD53□□FVE
SSOP5: BD52□□G, BD53□□G
 Applications
All electronic devices that use micro controllers and logic circuits
 Selection Guide
No.
1
Part Number : BD5
1
2
3
Specifications
Output Circuit Format
2
Detection Voltage
3
Package
Description
2:Open Drain Output, 3:CMOS Output
Example: Displays VS over a 2.3V to 6.0V range in
0.1V increments.
G:SSOP5 / FVE:VSOF5
 Lineup
Marking
Detection
Part
Voltage
Number
Marking
Detection
Part
Voltage
Number
Marking
Detection
Part
Voltage
Number
Marking
Detection
Part
Voltage
Number
PW
6.0V
BD5260
PB
4.1V
BD5241
RW
6.0V
BD5360
RB
4.1V
BD5341
PV
5.9V
BD5259
PA
4.0V
BD5240
RV
5.9V
BD5359
RA
4.0V
BD5340
PU
5.8V
BD5258
MV
3.9V
BD5239
RU
5.8V
BD5358
QV
3.9V
BD5339
PT
5.7V
BD5257
MU
3.8V
BD5238
RT
5.7V
BD5357
QU
3.8V
BD5338
PS
5.6V
BD5256
MT
3.7V
BD5237
RS
5.6V
BD5356
QT
3.7V
BD5337
PR
5.5V
BD5255
MS
3.6V
BD5236
RR
5.5V
BD5355
QS
3.6V
BD5336
PQ
5.4V
BD5254
MR
3.5V
BD5235
RQ
5.4V
BD5354
QR
3.5V
BD5335
PP
5.3V
BD5253
MQ
3.4V
BD5234
RP
5.3V
BD5353
QQ
3.4V
BD5334
BD5333
PN
5.2V
BD5252
MP
3.3V
BD5233
RN
5.2V
BD5352
QP
3.3V
PM
5.1V
BD5251
MN
3.2V
BD5232
RM
5.1V
BD5351
QN
3.2V
BD5332
PL
5.0V
BD5250
MM
3.1V
BD5231
RL
5.0V
BD5350
QM
3.1V
BD5331
PK
4.9V
BD5249
ML
3.0V
BD5230
RK
4.9V
BD5349
QL
3.0V
BD5330
PJ
4.8V
BD5248
MK
2.9V
BD5229
RJ
4.8V
BD5348
QK
2.9V
BD5329
PH
4.7V
BD5247
MJ
2.8V
BD5228
RH
4.7V
BD5347
QJ
2.8V
BD5328
PG
4.6V
BD5246
MH
2.7V
BD5227
RG
4.6V
BD5346
QH
2.7V
BD5327
PF
4.5V
BD5245
MG
2.6V
BD5226
RF
4.5V
BD5345
QG
2.6V
BD5326
PE
4.4V
BD5244
MF
2.5V
BD5225
RE
4.4V
BD5344
QF
2.5V
BD5325
PD
4.3V
BD5243
ME
2.4V
BD5224
RD
4.3V
BD5343
QE
2.4V
BD5324
PC
4.2V
BD5242
MD
2.3V
BD5223
RC
4.2V
BD5342
QD
2.3V
BD5323
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© 2009 ROHM Co., Ltd. All rights reserved.
1/9
2009.06 - Rev.B
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
 Absolute maximum ratings (Ta=25°C)
Parameter
Power Supply Voltage
Nch Open Drain Output
Output Voltage
CMOS Output
*1*3
SSOP5
Power
*2*3
Dissipation
VSOF5
Operating Temperature
Ambient Storage Temperature
Symbol
VDD-GND
Limits
-0.3 ~ +10
GND-0.3 ~ +10
GND-0.3 ~ VDD+0.3
540
210
-40 ~ +105
-55 ~ +125
VOUT
Pd
Topr
Tstg
Unit
V
V
mW
°C
°C
*1 Use above Ta=25°C results in a 5.4mW loss per degree.
*2 Use above Ta=25°C results in a 2.1mW loss per degree.
*3 When a ROHM standard circuit board (70mm×70mm×1.6mm glass epoxy board) is mounted.
 Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)
Parameter
Detection Voltage
Symbol
VDET
Circuit Current when ON
IDD1
Circuit Current when OFF
IDD2
Operating Voltage Range
VOPL
‘Low’ Output Current (Nch)
IOL
‘High’ Output Current (Pch)
IOH
Leak Current when OFF
Ileak
Limit
Typ.
Condition
*1
VDD=HL, RL=470kΩ
VDET =2.3-3.1V
VDET =3.2-4.2V
VDD=VDET-0.2V
VDET =4.3-5.2V
VDET =5.3-6.0V
VDET =2.3-3.1V
VDET =3.2-4.2V
VDD=VDET+2.0V
VDET =4.3-5.2V
VDET =5.3-6.0V
VOL≤0.4V, Ta=25~105°C, RL=470kΩ
VOL≤0.4V, Ta=-40~25°C, RL=470kΩ
VDS=0.5V VDD=1.2V
VDS=0.5V VDD=2.4V
VDS=0.5V VDD=4.8V VDET=2.3-4.2V
VDS=0.5V VDD=6.0V VDET=4.3-5.2V
VDS=0.5V VDD=8.0V VDET=5.3-6.0V
VDD=VDS=10V
*1
VDD=VDET×1.1, VDET=2.3-2.6V, RL=470kΩ
VDD=VDET×1.1, VDET=2.7-4.2V, RL=470kΩ
CT pin Threshold Voltage
VCTH
VDD=VDET×1.1, VDET=4.3-5.2V, RL=470kΩ
VDD=VDET×1.1, VDET=5.3-6.0V, RL=470kΩ
Output Delay Resistance
CT pin Output Current
Detection Voltage
Temperature coefficient
Hysteresis Voltage
RCT
ICT
VDD=VDET×1.1 VCT=0.5V
VCT=0.1V VDD=0.95V
VCT=0.5V VDD=1.5V
VDET/∆T Ta=-40°C to 105°C
∆VS
VDD=LHL, RL=470kΩ
*1
*1
Min.
Max.
VDET(T)
VDET(T)
VDET(T)
×0.99
×1.01
0.80
2.40
0.85
2.55
0.90
2.70
0.95
2.85
0.75
2.25
0.80
2.40
0.85
2.55
0.90
2.70
0.95
1.20
0.4
1.2
2.0
5.0
0.7
1.4
0.9
1.8
1.1
2.2
0.1
VDD
VDD
VDD
×0.30
×0.40
×0.60
VDD
VDD
VDD
×0.30
×0.45
×0.60
VDD
VDD
VDD
×0.35
×0.50
×0.60
VDD
VDD
VDD
×0.40
×0.50
×0.60
5.5
9
12.5
15
40
150
240
-
Unit
V
µA
µA
V
mA
mA
µA
V
MΩ
µA
-
±100
±360
ppm/°C
VDET
×0.03
VDET
×0.05
VDET
×0.08
V
VS(T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
Designed Guarantee. (Outgoing inspection is not done on all products.)
*1 Guarantee is Ta=25°C.
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© 2009 ROHM Co., Ltd. All rights reserved.
2/9
2009.06 - Rev.B
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
 Block Diagrams
BD52□□G/FVE
BD53□□G/FVE
VDD
VDD
VOUT
VOUT
Vref
Vref
CT
GND
CT
GND
Fig.1
Fig.2
TOP VIEW
TOP VIEW
SSOP5
VSOF5
PIN No.
Symbol
Function
PIN No.
Symbol
Function
1
VOUT
Reset Output
1
VOUT
Reset Output
2
VDD
Power Supply Voltage
2
SUB
3
GND
GND
4
N.C.
Unconnected Terminal
5
CT
Substrate*
Capacitor connection terminal for
3
CT
Capacitor connection terminal for
4
GND
GND
output delay time
5
VDD
Power Supply Voltage
output delay time
*Connect the substrate to GND.
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© 2009 ROHM Co., Ltd. All rights reserved.
3/9
2009.06 - Rev.B
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
"LOW" OUTPUT CURRENT : IOL [mA]
【BD5242G/FVE】
1.5
1.0
0.5
0.0
0
1
2
3
4
5
6
7
8
9 10
18
【BD5242G/FVE】
15
12
9
6
3
1.0
1.5
2.0
6
5
4
Ta=25℃
2
1
30
25
20
VDD =8.0V
15
VDD =6.0V
10
5
VDD =4.8V
0
0
Ta=25℃
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
2
3
4
5
6
Fig.5 “High” Output Current
450
【BD5242G/FVE】
0.8
0.6
0.4
0.2
0.0
0.0
1
DRAIN-SOURCE VOLTAGE : VDS[V]
CT OUTPUT CURRENT : ICT [μA]
OUTPUT VOLTAGE: VOUT [V]
7
3
35
2.5
1.0
【BD5242G/FVE】
8
【BD5342G/FVE】
40
Fig.4 “Low” Output Current
9
【BD5242G/FVE】
400
350
300
250
200
150
100
50
0
0.5
1.0
1.5
2.0
2.5
0
1
2
3
4
5
VDD SUPPLY VOLTAGE :VDD [V]
VDD SUPPLY VOLTAGE : VDD [V]
VDD SUPPLY VOLTAGE : VDD [V]
Fig.6 I/O Characteristics
Fig.7 Operating Limit Voltage
Fig.8 CT Terminal Current
CIRCUIT CURRENT WHEN ON : IDD1 [μA]
5.4
【BD5242G/FVE】
5.0
Low to high(VDET+ΔVDET)
4.6
4.2
High to low(VDET)
3.8
3.4
~
~
3.0
-40
0
40
80
TEMPERATURE : Ta[℃]
RESISTANCE OF CT : RCT [MΩ]
【BD5242G/FVE】
1.0
0.5
20
40
60
80
1.0
0.5
0.0
-40 -20
0
20
40
60
80
【BD5242G/FVE】
1.0
0.5
0.0
-40 -20
100
100
13
12
11
10
9
8
7
6
5
4
3
2
1
0
-40 -20
0
20
40
60
80
100
TEMPERATURE : Ta[℃]
Fig.10 Circuit Current when ON
1.5
0
1.5
【BD5242G/FVE】
TEMPERATURE : Ta[℃]
Fig.9 Detection Voltage
Release Voltage
0.0
-40 -20
1.5
CIRCUIT CURRENT WHEN OFF : I DD2 [μA]
OUTPUT VOLTAGE: VOUT [V]
0.5
45
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.3 Circuit Current
DETECTION VOLTAGE: VDET[V]
VDD =1.2V
0
0.0
VDD SUPPLY VOLTAGE :VDD [V]
MINIMUM OPERATING VOLTAGE : V OPL[V]
VDD =2.4V
Fig.11 Circuit Current when OFF
10000
【BD5242G/FVE】
0
20
40
60
80
【BD5242G/FVE】
1000
DELAY TIME : TPLH [ms]
CIRCUIT CURRENT : IDD [μA]
2.0
"HIGH" OUTPUT CURRENT : IOH [mA]
 Reference Data (Unless specified otherwise, Ta=25°C)
100
100
10
1
0.1
0.01
0.001
0.0001
0.001
0.01
0.1
TEMPERATURE : Ta[℃]
TEMPERATURE : Ta[℃]
CAPACITANCE OF CT : CCT[μF]
Fig.12 Operating Limit Voltage
Fig.13 Ct Terminal Circuit Resistance
Fig.14 Delay Time (TPLH) and
CT Terminal External Capacitance
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© 2009 ROHM Co., Ltd. All rights reserved.
4/9
2009.06 - Rev.B
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
 Setting of Detector Delay Time
This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal.
Delay time at the rise of VDD TPLH:Time until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release
voltage(VDET+∆VDET)
VDD-VCTH
TPLH = -CCT×RCT×ln
VDD
CCT:
VCTH:
CT pin Externally Attached Capacitance
CT pin Threshold Voltage(P.2 VCTH refer.)
RCT : CT pin Internal Impedance (P.2 RCT refer.)
Ln : Natural Logarithm
 Reference Data of Falling Time (TPHL) Output
Examples of Falling Time (TPHL) Output
Part Number
tPHL[µs] -40°C
tPHL[µs] ,+25°C
tPHL[µs],+105°C
BD5227G
30.8
30
28.8
BD5327G
26.8
26
24.8
*This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
 Explanation of Operation
For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD52□□G/FVE series uses an open drain
output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in
this case becomes VDD or the voltage of the other power supply].
VDD
VDD
VDD
RL
R1
Q2
R1
RESET
Vref
VDD
Vref
RESET
VOUT
R2
R2
Q1
Q3
VOUT
Q1
Q3
R3
R3
GND
GND
CT
CT
Fig.15 (BD52□□Type Internal Block Diagram)
Fig.16 (BD53□□Type Internal Block Diagram)
 Timing Waveforms
Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output
voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in
Fig.15 and 16).
1 When the power supply is turned on, the output is unsettled from
VDD
after over the operating limit voltage (VOPL) until TPHL. There fore it is
possible that the reset signal is not outputted when the rise time of
VDET+ΔVDET
⑤
VDET
VDD is faster than TPHL.
2 When VDD is greater than VOPL but less than the reset release
VOPL
0V
voltage (VDET+∆VDET), the CT terminal (VCT) and output (VOUT)
voltages will switch to L.
VCT
3 If VDD exceeds the reset release voltage (VDET+∆VDET), then
1/2 VDD
VOUT switches from L to H (with a delay to the CT terminal).
4 If VDD drops below the detection voltage (VDET) when the power
supply is powered down or when there is a power supply fluctuation,
VOUT switches to L (with a delay of TPHL).
VOUT
PLH
T
TPHL
TPLH
5 The potential difference between the detection voltage and the
TPHL
release voltage is known as the hysteresis width (∆VDET). The
system is designed such that the output does not flip-flop with power
① ②
③ ④
supply fluctuations within this hysteresis width, preventing
malfunctions due to noise.
Fig.17
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© 2009 ROHM Co., Ltd. All rights reserved.
5/9
2009.06 - Rev.B
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
 Circuit Applications
1) Examples of a common power supply detection reset circuit
VDD1
VDD2
RL
BD52□□□
Application examples of BD52□□G/FVE series (Open
Drain output type) and BD53□□G/FVE series (CMOS
output type) are shown below.
Microcontroller
CT
CL
(Noise-filtering
Capacitor)
)
GND
Fig.18 Open Collector Output Type
CASE1: the power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection
(VDD1).
Use the open drain output type (BD52□□G/FVE) attached
a load resistance (RL) between the output and VDD2. (As
shown Fig.15)
CASE2: the power supply of the microcontroller (VDD1) is
same as the power supply of the reset detection (VDD1).
Use CMOS output type (BD53□□G/FVE) or open drain
output type (BD52□□G/FVE) attached a load resistance
(RL) between the output and Vdd1. (As shown Fig.16)
VDD1
BD53□□□
Microcontroller
CT
CL
When a capacitance CL for noise filtering is connected to
the VOUT pin (the reset signal input terminal of the
microcontroller), please take into account the waveform of
the rise and fall of the output voltage (VOUT).
(Noise-filtering
Capacitor)
GND
Fig.19 CMOS Output Type
2) The following is an example of a circuit application in which an OR connection between two types of detection voltages
resets the microcontroller.
VDD1
VDD3
VDD2
RL
BD52□□□
NO.1
BD52□□□
NO.2
RST
microcontroller
CT
CT
GND
Fig.20
When there are many power supplies of the system, power supplies VDD1 and VDD2 are being monitored separately, and it is
necessary to reset the microcomputer, it is possible to use an OR connection on the open drain output type BD52□□G/FVE
series to pull-up to the desired voltage (VDD3) as shown in Fig.17 and make the output “High” voltage matches the power
supply voltage VDD3 of the microcontroller.
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6/9
2009.06 - Rev.B
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
3) Examples of the power supply with resistor dividers
In applications where the power supply input terminal (VDD) of an IC with resistor dividers, it is possible that a through
current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output
oscillatory state).
(Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level
switches from “High” to “Low” or vice versa.)
V1
IDD
R2
I1
R1
Through
Current
VDD
BD52□□
BD53□□
CIN
VOUT
CL
GND
VDD
VDET
0
Fig.21
A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and the input voltage to
descends, when the output switches from “Low” to “High”. When the input voltage decreases and falls below the detection
voltage, the output voltage switches from “High” to “Low”. At this time, the through-current stops flowing through output
“Low”, and the voltage drop is eliminated. As a result, the output switches from “Low” to “High”, which again causes the
through current to flow and the voltage drop. This process is repeated, resulting in oscillation.
VDD - IDD Peak Current Ta=25°C
10
0.1
0.01
0.001
3
4
5
6
7
VDD[V]
8
9
10
VDD3V
VDD5V
VDD7V
VDD10V
0.4
IDD peak current [mA]
1
IDD-peak[mA]
Temp - IDD(BD52xx)
BU43xx
BU42xx
BD52xx
BD53xx
0.3
0.2
0.1
0
-50
-30
-10
10
30
50
Temp[°C]
70
90
110
Fig.22 Current Consumption vs. Power Supply Voltage
*This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
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7/9
2009.06 - Rev.B
130
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
Technical Note
 Operation Notes
1 . Absolute maximum range
Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the
failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given
when a specific mode to be beyond absolute maximum ratings is considered.
2 . GND potential
GND terminal should be a lowest voltage potential every state.
Please make sure all pins, which are over ground even if, include transient feature.
3 . Electrical Characteristics
Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature,
supply voltage, and external circuit.
4 . Bypass Capacitor for Noise Rejection
Please put into the capacitor of 1µF or more between VDD pin and GND, and the capacitor of about 1000pF between VOUT
pin and GND, to reject noise. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently
for the point.
5 . Short Circuit between Terminal and Soldering
Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the
IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is
mistaken the IC may be destroyed.
6 . Electromagnetic Field
Mal-function may happen when the device is used in the strong electromagnetic field.
7.
The VDD line inpedance might cause oscillation because of the detection current.
8.
A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9.
Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition.
10.
This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause
unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed
between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak
resistance. If 10MΩ leakage is assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT
terminal and the VDD terminal would be recommended. The value of RCT depends on the external resistor that is
connected to CT terminal, so please consider the delay time that is decided by τ×RCT×CCT changes.
11. External parameters
The recommended parameter range for CT is 100pF~0.1µF and RL is 50kΩ~1MΩ. There are many factors (board layout,
etc) that can affect characteristics. Please verify and confirm using practical applications.
12. Power on reset operation
Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation.
13. Precautions for board inspection
Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be
certain to use proper discharge procedure before each process of the test operation.
To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any
equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer
and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is
OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup.
14. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic
unsettled, the couple capacitance, GND pattern of width and leading line must be considered.
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8/9
2009.06 - Rev.B
Technical Note
BD52□□G, BD52□□FVE, BD53□□G, BD53□□FVE series
 Part Number Selection
B
D
5
2
2
BD52: Adjustable Delay Time
3
-
G
T
R
Reset Voltage Value
Package
Taping Specifications
CMOS Reset IC
23: 2.3V to (0.1V step)
G: SSOP5
Embossed Taping
Open Drain Type
60: 6.0V
FVE: VSOF5
BD53: Adjustable Delay Time
CMOS Reset IC
CMOS Output Type
SSOP5
5
4
1
2
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6°
4° −4°
2.9±0.2
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.13 −0.03
+0.05
0.42 −0.04
0.05±0.05
1.1±0.05
1.25Max.
)
0.95
0.1
Direction of feed
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
VSOF5
<Tape and Reel information>
1.2 ± 0.05
4
(MAX 1.28 include BURR)
1.6 ± 0.05
5
0.2MAX
1.6±0.05
1.0±0.05
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1pin
1
2
3
0.6MAX
0.13±0.05
0.5
Direction of feed
0.22±0.05
(Unit : mm)
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© 2009 ROHM Co., Ltd. All rights reserved.
Reel
9/9
∗ Order quantity needs to be multiple of the minimum quantity.
2009.06 - Rev.B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
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Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2009 ROHM Co., Ltd. All rights reserved.
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