TDK C5750X7R2E105K230KA Multilayer ceramic chip capacitor Datasheet

1 of 3
Creation Date : March 17, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C5750X7R2E105K230KA
TDK item description C5750X7R2E105KT****
Commercial Grade
Applications
Please refer to Part No. CGA9N3X7R2E105K230KA for Automotive use.
Feature
Mid Mid Voltage (100 to 630V)
Series
C5750 [EIA 2220]
Status
Production
Size
Length(L)
5.70mm ±0.40mm
Width(W)
5.00mm ±0.40mm
Thickness(T)
2.30mm ±0.20mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
Recommended Land Pattern (PA)
4.10mm to 4.80mm
Recommended Land Pattern (PB)
1.20mm to 1.40mm
Recommended Land Pattern (PC)
4.00mm to 5.00mm
Electrical Characteristics
Capacitance
1μF ±10%
Rated Voltage
250VDC
Temperature Characteristic
X7R(±15%)
Dissipation Factor (Max.)
3%
Insulation Resistance (Min.)
500MΩ
Other
Soldering Method
Reflow
AEC-Q200
No
Packing
Blister (Plastic)Taping [180mm Reel]
Package Quantity
500pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : March 17, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C5750X7R2E105K230KA
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
C5750X7R2E105K230KA
ESR
C5750X7R2E105K230KA
Capacitance
C5750X7R2E105K230KA
C5750X7R2E105K230KA
Temperature Characteristic
C5750X7R2E105K230KA(No Bias)
DC Bias Characteristic
C5750X7R2E105K230KA(DC Bias =
125V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Ripple Temperature Rising
C5750X7R2E105K230KA(100kHz)
C5750X7R2E105K230KA(500kHz)
C5750X7R2E105K230KA(1MHz)
Multilayer Ceramic Chip Capacitors
C5750X7R2E105K230KA
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : March 17, 2017 (GMT)
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