Rohm BD4935FVE Standard cmos voltage detector ic Datasheet

Voltage Detector IC Series
Standard CMOS
Voltage Detector IC
No.09006EAT04
BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series
 Description
ROHM’s BD48□□G/FVE and BD49□□G/FVE series are highly accurate, low current consumption reset IC series. The lineup
was established with tow output types (Nch open drain and CMOS output) and detection voltages range from 2.3V to 6.0V
in increments of 0.1V, so that the series may be selected according the application at hand.
 Features
1) Detection voltage: 2.3V to 6.0V (Typ.), 0.1V steps
2) High accuracy detection voltage: ±1.0%
3) Ultra-low current consumption: 0.8μA (Typ.)
4) Nch open drain output (BD48□□G/FVE), CMOS output (BD49□□G/FVE)
5) Compact packages VSOF5: BD48□□FVE, BD49□□FVE
SSOP5: BD48□□G, BD49□□G
 Applications
All electronic devices that use microcontrollers and logic circuits
 Selection Guide
No.
1
Part Number : BD4
1
2
3
Specifications
Output Circuit Format
2
Detection Voltage
3
Package
Description
8:Open Drain Output, 9:CMOS Output
Example: Displays VS over a 2.3V to 6.0V range in
0.1V increments. (2.9V is marked as “29”)
G:SSOP5 / FVE:VSOF5
 Lineup
Marking
EW
EV
EU
ET
ES
ER
EQ
EP
EN
EM
EL
EK
EJ
EH
EG
EF
EE
ED
EC
Detection
Voltage
6.0V
5.9V
5.8V
5.7V
5.6V
5.5V
5.4V
5.3V
5.2V
5.1V
5.0V
4.9V
4.8V
4.7V
4.6V
4.5V
4.4V
4.3V
4.2V
Part
Number
BD4860
BD4859
BD4858
BD4857
BD4856
BD4855
BD4854
BD4853
BD4852
BD4851
BD4850
BD4849
BD4848
BD4847
BD4846
BD4845
BD4844
BD4843
BD4842
Marking
EB
EA
DV
DU
DT
DS
DR
DQ
DP
DN
DM
DL
DK
DJ
DH
DG
DF
DE
DD
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© 2009 ROHM Co., Ltd. All rights reserved.
Detection
Voltage
4.1V
4.0V
3.9V
3.8V
3.7V
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
Part
Number
BD4841
BD4840
BD4839
BD4838
BD4837
BD4836
BD4835
BD4834
BD4833
BD4832
BD4831
BD4830
BD4829
BD4828
BD4827
BD4826
BD4825
BD4824
BD4823
Marking
GW
GV
GU
GT
GS
GR
GQ
GP
GN
GM
GL
GK
GJ
GH
GG
GF
GE
GD
GC
1/9
Detection
Voltage
6.0V
5.9V
5.8V
5.7V
5.6V
5.5V
5.4V
5.3V
5.2V
5.1V
5.0V
4.9V
4.8V
4.7V
4.6V
4.5V
4.4V
4.3V
4.2V
Part
Number
BD4960
BD4959
BD4958
BD4957
BD4956
BD4955
BD4954
BD4953
BD4952
BD4951
BD4950
BD4949
BD4948
BD4947
BD4946
BD4945
BD4944
BD4943
BD4942
Marking
GB
GA
FV
FU
FT
FS
FR
FQ
FP
FN
FM
FL
FK
FJ
FH
FG
FF
FE
FD
Detection
Voltage
4.1V
4.0V
3.9V
3.8V
3.7V
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
Part
Number
BD4941
BD4940
BD4939
BD4998
BD4937
BD4936
BD4935
BD4934
BD4933
BD4932
BD4931
BD4930
BD4929
BD4928
BD4927
BD4926
BD4925
BD4924
BD4923
2009.04 - Rev.A
Technical Note
BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series
 Absolute maximum ratings (Ta=25°C)
Parameter
Power Supply Voltage
Nch Open Drain Output
Output Voltage
CMOS Output
*1*3
SSOP5
Power
*2*3
Dissipation
VSOF5
Operating Temperature
Ambient Storage Temperature
Symbol
VDD-GND
Limits
-0.3 ~ +10
GND-0.3 ~ +10
GND-0.3 ~ VDD+0.3
540
210
-40 ~ +105
-55 ~ +125
VOUT
Pd
Topr
Tstg
Unit
V
V
mW
°C
°C
*1 Use above Ta=25°C results in a 5.4mW loss per degree.
*2 Use above Ta=25°C results in a 2.1mW loss per degree.
*3 When a ROHM standard circuit board (70mm×70mm×1.6mm glass epoxy board) is mounted.
 Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)
Parameter
Detection Voltage
Output Delay Time “LH”
Symbol
VS
tPLH
Circuit Current when ON
ICC1
Circuit Current when OFF
ICC2
Minimum Operating Voltage
VOPL
‘Low’Output Current (Nch)
IOL
‘High’Output Current (Pch)
(BD49□□G/FVE)
IOH
Leak Current when OFF
(BD48□□G/FVE)
Detection Voltage
Temperature coefficient
Hysteresis Voltage
Ileak
VS/∆T
Condition
RL=470kΩ, VDD=HL
CL=100pF RL=100kΩ
Vout=GND50%
VS=2.3-3.1V
VS=3.2-4.2V
VDD=VS-0.2V *1
VS=4.3-5.2V
VS=5.3-6.0V
VS=2.3-3.1V
VS=3.2-4.2V
VDD=VS+2.0V *1
VS=4.3-5.2V
VS=5.3-6.0V
VOL≤0.4V, Ta=25~105°C, RL=470kΩ
VOL≤0.4V, Ta=-40~25°C, RL=470kΩ
VDS=0.5V, VDD=1.5V, VS=2.3-6.0V
VDS=0.5V, VDD=2.4V, VS=2.7-6.0V
VDS=0.5V, VDD=4.8V, VS=2.3-4.2V
VDS=0.5V, VDD=6.0V, VS=4.3-5.2V
VDS=0.5V, VDD=8.0V, VS=5.3-6.0V
Ta=-40°C to 105°C
(Designed Guarantee)
VDD=LHL
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2/9
VS(T)
Max.
VS(T)
×1.01
Unit
V
*2
*1
VDD=VDS=10V
∆VS
VS(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
CL: Capacitor to be connected between VOUT and GND.
Designed Guarantee. (Outgoing inspection is not done on all products.)
*1 Guarantee is Ta=25°C.
*2 tPLH:VDD=(Vs typ.-0.5V)(Vs typ.+0.5V)
© 2009 ROHM Co., Ltd. All rights reserved.
*1
Min.
VS(T)
×0.99
Limit
Typ.
-
-
100
0.95
1.20
0.4
2.0
0.7
0.9
1.1
0.51
0.56
0.60
0.66
0.75
0.80
0.85
0.90
1.0
4.0
1.4
1.8
2.2
1.53
1.68
1.80
1.98
2.25
2.40
2.55
2.70
-
-
-
0.1
µA
-
±100
±360
ppm/°C
VS×0.03 VS×0.05 VS×0.08
µs
µA
µA
V
mA
mA
V
2009.04 - Rev.A
Technical Note
BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series
 Block Diagrams
BD48□□G/FVE
BD49□□G/FVE
VDD
VDD
VOUT
VOUT
Vref
Vref
GND
GND
Fig.1
Fig.2
TOP VIEW
TOP VIEW
SSOP5
VSOF5
PIN No.
Symbol
Function
PIN No.
Symbol
Function
1
VOUT
Reset Output
1
VOUT
Reset Output
2
VDD
Power Supply Voltage
2
SUB
Substrate*
3
GND
GND
3
N.C.
Unconnected Terminal
4
N.C.
Unconnected Terminal
4
GND
GND
5
N.C.
Unconnected Terminal
5
VDD
Power Supply Voltage
*Connect the substrate to GND.
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3/9
2009.04 - Rev.A
Technical Note
BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series
1.5
1.0
0.5
0.0
0
1
2
3
4
5
6
7
8
9 10
20
【BD4842G/FVE】
15
10
VDD =1.2V
0
0.0
0.5
1.0
1.5
2.0
45
【BD4942G/FVE】
40
35
30
25
20
VDD =8.0V
15
VDD =6.0V
10
2.5
5
VDD =4.8V
0
0
DRAIN-SOURCE VOLTAGE : VDS[V]
2
3
4
5
6
Fig.5 “High” Output Current
1.0
7
【BD4842G/FVE】
OUTPUT VOLTAGE : VOUT[V]
【BD4842G/FVE】
8
5.4
0.8
6
4
Ta=25℃
2
4.2
Ta=25℃
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
3.4
3.0
0.0
0
VDD SUPPLY VOLTAGE :VDD [V]
High to Low(VS)
3.8
0.2
1
Low to High(VS+ΔVS)
4.6
0.4
3
【BD4842G/FVE】
5.0
0.6
5
0
0.5
1
1.5
2
~
~
-40
2.5
1.0
0.5
0.0
-40 -20
0
20
40
60
80 100
40
80
Fig.8 Detection Voltage
Release Voltage
1.5
1.5
【BD4842G/FVE】
1.0
0.5
0.0
-40 -20
0
20
40
60
80 100
MINIMUM OPERATION VOLTAGE : VOPL[V]
【BD4842G/FVE】
Fig.7 Operating Limit Voltage
CIRCUIT CURRENT WHEN OFF : I DD2[μA]
1.5
0
TEMPERATURE : Ta[℃]
SUPPLY VOLTAGE : [V]
Fig.6 I/O Characteristics
CIRCUIT CURRENT WHEN ON : IDD1[μA]
1
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.4 “Low” Output Current
Fig.3 Circuit Current
OUTPUT VOLTAGE: VOUT [V]
VDD =2.4V
5
VDD SUPPLY VOLTAGE :VDD [V]
9
"HIGH" OUTPUT CURRENT : IOH [mA]
【BD4842G/FVE】
DETECTION VOLTAGE : VS[V]
CIRCUIT CURRENT : IDD [μA]
2.0
"LOW" OUTPUT CURRENT : IOL [mA]
 Reference Data (Unless specified otherwise, Ta=25°C)
【BD4842G/FVE】
1.0
0.5
0.0
-40 -20
0
20
40
60
80 100
TEMPERATURE : Ta[℃]
TEMPERATURE : Ta[℃]
TEMPERATURE : Ta[℃]
Fig.9 Circuit Current when ON
Fig.10 Circuit Current when OFF
Fig.11 Operating Limit Voltage
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4/9
2009.04 - Rev.A
Technical Note
BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series
 Reference Data
Examples of Leading (TPLH) and Falling (TPHL) Output
Part Number
TPLH (μs)
TPHL (μs)
BD4845G/FVE
39.5
87.8
BD4945G/FVE
32.4
52.4
VDD=4.3V5.1V
VDD=5.1V4.3V
*This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
 Explanation of Operation
For both the open drain type (Fig.12) and the CMOS output type (Fig.13), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD48□□G/FVE series uses an open drain
output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in
this case becomes VDD or the voltage of the other power supply].
VDD
VDD
R1
R1
RL
Vref
Vref
Q2
VOUT
R2
VOUT
R2
Q1
Q1
R3
R3
GND
GND
Fig.12 (BD48□□ Type Internal Block Diagram)
Fig.13 (BD49□□ Type Internal Block Diagram)
 Timing Waveform
Example: the following shows the relationship between the input voltages VDD and the output voltage VOUT when the
input power supply voltage VDD is made to sweep up and sweep down (the circuits are those in Fig.12 and 13).
1
VDD
VDET+ΔVDET
VDET
⑤
VOPL
0V
VOUT
VOH
TPHL
TPLH
TPLH
TPHL
VOL
①
②
③
Fig.14
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④
When the power supply is turned on, the output is unsettled from
after over the operating limit voltage (VOPL) until TPHL. There fore it
is possible that the reset signal is not outputted when the rise time of
VDD is faster than TPHL.
2 When VDD is greater than VOPL but less than the reset release
voltage (VS + ∆VS), the output voltages will switch to Low.
3 If VDD exceeds the reset release voltage (VS + ∆VS), then
VOUT switches from L to H.
4 If VDD drops below the detection voltage (VS) when the power
supply is powered down or when there is a power supply fluctuation,
VOUT switches to L (with a delay of TPHL).
5 The potential difference between the detection voltage and the
release voltage is known as the hysteresis width (∆VS). The system
is designed such that the output does not flip-flop with power supply
fluctuations within this hysteresis width, preventing malfunctions due
to noise.
5/9
2009.04 - Rev.A
Technical Note
BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series
 Circuit Applications
1) Examples of a common power supply detection reset circuit.
VDD1
VDD2
RL
Microcontroller
BD48□□□
CL
(Noise-filtering
Capacitor)
GND
Application examples of BD48□□G/FVE series (Open
Drain output type) and BD49□□G/FVE series (CMOS
output type) are shown below.
CASE1: the power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection
(VDD1).
Use the open drain output type (BD48□□G/FVE) attached
a load resistance (RL) between the output and VDD2. (As
shown Fig.15)
Fig.15 Open Collector Output Type
CASE2: the power supply of the microcontroller (VDD1) is
same as the power supply of the reset detection (VDD1).
Use CMOS output type (BD49□□G/FVE) or open drain
output type (BD48□□G/FVE) attached a load resistance
(RL) between the output and Vdd1. (As shown Fig.16)
VDD1
Microcontroller
BD49□□□
CL
When a capacitance CL for noise filtering is connected to
the VOUT pin (the reset signal input terminal of the
microcontroller), please take into account the waveform of
the rise and fall of the output voltage (VOUT).
(Noise-filtering
Capacitor)
GND
Fig.16 CMOS Output Type
2) The following is an example of a circuit application in which an OR connection between two types of detection voltages
resets the microcontroller.
VDD1
VDD3
VDD2
RL
BD48□□□
BD48□□□
Microcontroller
RST
GND
Fig.17
When there are many power supplies of the system, power supplies VDD1 and VDD2 are being monitored separately, and
it is necessary to reset the microcomputer, it is possible to use an OR connection on the open drain output type
BD48□□G/FVE series to pull-up to the desired voltage (VDD3) as shown in Fig.17 and make the output “High” voltage
matches the power supply voltage VDD3 of the microcontroller.
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6/9
2009.04 - Rev.A
Technical Note
BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series
Examples of the power supply with resistor dividers
In applications where the power supply input terminal (VDD) of an IC with resistor dividers, it is possible that a through
current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output
oscillatory state).
(Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level
switches from “High” to “Low” or vice versa.)
V1
R2
I1
VDD
BD48□□□
BD49□□□
R1
CIN
VOUT
CL
GND
Fig.18
A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and the input voltage to
descends, when the output switches from “Low” to “High”. When the input voltage decreases and falls below the detection
voltage, the output voltage switches from “High” to “Low”. At this time, the through-current stops flowing through output
“Low”, and the voltage drop is eliminated. As a result, the output switches from “Low” to “High”, which again causes the
through current to flow and the voltage drop. This process is repeated, resulting in oscillation.
IDD
Through Current
0
VDD
VDET
Fig.19 Current Consumption vs. Power Supply Voltage
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7/9
2009.04 - Rev.A
BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series
Technical Note
 Operation Notes
1 . Absolute maximum range
Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the
failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given
when a specific mode to be beyond absolute maximum ratings is considered.
2 . GND potential
GND terminal should be a lowest voltage potential every state.
Please make sure all pins, which are over ground even if, include transient feature.
3 . Electrical Characteristics
Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature,
supply voltage, and external circuit.
4 . Bypass Capacitor for Noise Rejection
Please put into the capacitor of 1μF or more between VDD pin and GND, and the capacitor of about 1000pF between VOUT
pin and GND, to reject noise. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently
for the point.
5 . Short Circuit between Terminal and Soldering
Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the
IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is
mistaken the IC may be destroyed.
6 . Electromagnetic Field
Mal-function may happen when the device is used in the strong electromagnetic field.
7.
The VDD line inpedance might cause oscillation because of the detection current.
8.
A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9.
Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition.
10. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause
unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed
between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak
resistance.
11. External parameters
The recommended parameter range for RL is 10kΩ~1MΩ. There are many factors (board layout, etc) that can affect
characteristics. Please verify and confirm using practical applications.
12. Power on reset operation
Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation.
13. Precautions for board inspection
Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be
certain to use proper discharge procedure before each process of the test operation.
To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any
equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer
and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is
OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup.
14. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic
unsettled, the couple capacitance, GND pattern of width and leading line must be considered.
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8/9
2009.04 - Rev.A
Technical Note
BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series
 Part Number Selection
B
D
4
8
2
3
G
-
T
R
Standard CMOS Reset IC
Reset Voltage Value
Package
Taping Specifications
BD48: Open Drain Type
23: 2.3V to (0.1V step)
G: SSOP5
Embossed Taping
BD49: CMOS Output Type
60: 6.0V
FVE: VSOF5
SSOP5
<Dimension>
(Unit:mm)
+6°
4° −4°
2.9±0.2
1
2
0.2Min.
+0.2
4
1.6 −0.1
2.8±0.2
5
3
0.05±0.05
1.25Max.
1.1±0.05
0.13
<Tape and Reel information> SSOP5
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR (The direction is the 1pin of product is at the upper left
when you hold reel on the left hand and you pull out the tape
on the right hand)
+0.05
−0.03
0.42 +0.05
−0.04
0.95
X X X
X X X
0.1
X X X
X X X
X X X
X X X
X X X
X X X
X X X
X X X
Direction of feed
1Pin
Reel
* When you order, please order in times the amount of package quantity.
VSOF5
<Dimension>
0.6Max.
1.6±0.05
1.2±0.05
1.0±0.05
1.6±0.05
5 4
1 2 3
0.5
0.2Max.
(Unit:mm)
<Tape and Reel information> VSOF5
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR (The direction is the 1pin of product is at the upper left
when you hold reel on the left hand and you pull out the tape
on the right hand)
0.13±0.05
0.22±0.05
X X X
X X X
0.08 M
X X X
X X X
X X X
X X X
1Pin
X X X
X X X
X X X
X X X
Direction of feed
Reel
*When you order, please order in times the amount of package quantity.
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9/9
2009.04 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com
© 2009 ROHM Co., Ltd. All rights reserved.
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