TD62386,387,388APG/AFG TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62386APG,TD62386AFG,TD62387APG TD62387AFG,TD62388APG,TD62388AFG 8 Ch Low Input Active Darlington Sink Driver The TD62386APG, TD62386AFG, TD62387APG, TD62387AFG and TD62388APG, TD62388AFG are non−inverting transistor arrays, which are comprised of eight NPN darlington output stages and PNP input stages. All units feature integral clamp diodes for switching inductive loads. These devices are Low Level input active drivers and are suitable for operations with TTL, 5 V CMOS and 5 V Microprocessor which have sink current output drivers. Applications include relay, hammer, lamp and LED driver. TD62386AFG TD62387AFG TD62388AFG Features • Output current (single output) 500 mA (Max) • High sustaining voltage 50 V (Min) • Output clamp diodes • Low level active input • Standard supply voltage • Inputs compatible with TTL and 5 V CMOS • Package type−APG: DIP−20 pin • Package type−AFG: SOP−20 pin TYPE VIN (ON) TD62386APG, TD62386AFG −20 V to VCC − 2.8 V TD62387APG, TD62387AFG TD62388APG, TD62388AFG TD62386APG TD62387APG TD62388APG Weight DIP20−P−300−2.54A : 2.25 g (Typ.) SOP20−P−300−1.27 : 0.25 g (Typ.) 0 V to VCC − 3.7 V Pin Connection (top view) 1 2007-07-03 TD62386,387,388APG/AFG Schematics (each driver) TD62386APG, TD62386AFG TD62387APG, TD62387AFG TD62388APG, TD62388AFG Note: The output parasitic diode cannot be used as clamp diodes. Absolute Maximum Ratings Characteristic Symbol Rating Unit VCC −0.5 to 7.0 V VCE (SUS) −0.5 to 50 V IOUT 500 mA/ch VIN (Note 1) −22 to VCC + 0.5 V VIN (Note 2) −0.5 to 7 Input Current IIN −10 mA Clamp Diode Reverse Voltage VR 50 V Clamp Diode Forward Current IF 500 mA Supply Voltage Output Sustaining Voltage Output Current Input Voltage Power Dissipation APG AFG PD (Note 3) 1.38 1.0 (Note 4) W Operating Temperature Topr −40 to 85 °C Storage Temperature Tstg −55 to 150 °C Note 1: Note 2: Note 3: Note 4: TD62386APG, TD62386AFG only TD62387APG, TD62387AFG, TD62388APG, TD62388AFGonly Delated above 25°C in the proportion of 11.7 mW/°C (APG−Type), 7.7 mW/°C (AFG−Type). On PCB (50 × 50 × 1.6 mm Cu 40% Glass Epoxy) 2 2007-07-03 TD62386,387,388APG/AFG Operating Conditions (Ta = −40~85°C) Characteristic Supply Voltage Output Sustaining Voltage Output Current Symbol Condition Min Typ. Max Unit VCC ⎯ 4.5 5.0 5.5 V VCE (SUS) ⎯ 0 ⎯ 50 V 0 ⎯ 270 mA/ ch ⎯ −20 ⎯ VCC ⎯ 0 ⎯ 5.5 ⎯ ⎯ ⎯ 50 V mA IOUT Tpw = 25 ms, Duty = 10% 8 Circuits TD62386 Input Voltage TD62387 TD62388 VIN Clamp Diode Reverse Voltage VR Clamp Diode Forward Current IF APG Power Dissipation AFG PD V ⎯ ⎯ ⎯ 400 ⎯ ⎯ ⎯ 0.52 ⎯ ⎯ 0.4 Min Typ. Max Unit (Note 1) W Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 40%) Electrical Characteristics (Ta = 25°C) Characteristic Output Leakage Current Output Saturation Voltage Input Current Output On Output Off Input Voltage (Output on) TD62387 TD62388 Symbol Test Cir− cuit ICEX 1 VCC = 5.5 V, IIN = 0 VOUT = 50 V, Ta = 85°C ⎯ ⎯ 100 µA VCE (sat) 2 VCC = 4.5 V, VIN = VIN (ON) MAX. IOUT = 350 mA ⎯ 1.4 2.0 V IIN (ON) 3 VCC = 5.5 V, VIN = 0.4 V ⎯ −0.32 −0.45 VCC = 5.5 V, VIN = −20 V ⎯ ⎯ −2.6 ⎯ ⎯ ⎯ −4.0 ⎯ ⎯ ⎯ VCC − 2.8 ⎯ ⎯ ⎯ VCC − 3.7 VR = 50 V, Ta = 25°C ⎯ ⎯ 50 VR = 50 V, Ta = 85°C ⎯ ⎯ 100 IF = 350 mA ⎯ ⎯ 2.0 IF = 280 mA ⎯ ⎯ 1.8 TD62386 Common to all devices IIN (OFF) 4 TD62386 TD62387 TD62388 VIN (ON) 5 Clamp Diode Reverse Current IR 6 Clamp Diode Forward Voltage VF 7 Supply Current Test Condition ICC (ON) ICC (OFF) Turn−On Delay tON Turn−Off Delay tOFF 8 9 mA µA V µA V VCC = 5.5 V, VIN = 0 ⎯ 17 22 mA VCC = 5.5 V, VIN = VCC ⎯ ⎯ 100 µA VCC = 5 V, VOUT = 50 V RL = 125 Ω, CL = 15 pF ⎯ 0.1 ⎯ ⎯ 3 ⎯ 3 µs 2007-07-03 TD62386,387,388APG/AFG Test Circuit 1. ICEX 2. VCE (sat) 3. IIN (ON) 4. IIN (OFF) 5. VIN (ON) 6. IR 7. VF 8. ICC 9. tON, tOFF Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns Note 2: CL includes probe and jig capacitance. Precautions for Using This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC, COMMON and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. 4 2007-07-03 TD62386,387,388APG/AFG TD62386-388APG 5 2007-07-03 TD62386,387,388APG/AFG TD62386-388AFG TD62386-388AFG 6 2007-07-03 TD62386,387,388APG/AFG Package Dimensions DIP20−P−300−2.54A Unit: mm Weight: 2.25 g (Typ.) 7 2007-07-03 TD62386,387,388APG/AFG Package Dimensions SOP20−P−300−1.27 Unit: mm Weight: 0.25 g (Typ.) 8 2007-07-03 TD62386,387,388APG/AFG Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. 9 2007-07-03 TD62386,387,388APG/AFG Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 10 2007-07-03 TD62386,387,388APG/AFG About solderability, following conditions were confirmed • Solderability (1) Use of Sn-37Pb solder Bath · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux RESTRICTIONS ON PRODUCT USE 070122EBA_R6 • The information contained herein is subject to change without notice. 021023_D • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. 070122_C • Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 060819_AF • The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E 11 2007-07-03