Infineon BA592 Silicon rf switching diode Datasheet

BA592/BA892...
Silicon RF Switching Diode
• For band switching in TV/VTR tuners
and mobile applications
• Very low forward resistance (typ. 0.45 Ω @ 3 mA)
• Small capacitance
• Pb-free (RoHS compliant) package 1)
• Qualified according AEC Q101
BA592
BA892/-02L
BA892-02V
Type
BA592
BA892
BA892-02L
BA892-02V
Package
SOD323
SCD80
TSLP-2-1
SC79
Configuration
single
single
single, leadless
single
Maximum Ratings at TA = 25°C, unless otherwise specified
Symbol
Parameter
LS(nH)
1.8
0.6
0.4
0.6
Value
Marking
blue S
AA
AA
A
Unit
Diode reverse voltage
VR
35
V
Forward current
IF
100
mA
Junction temperature
Tj
150
°C
Operating temperature range
Top
-55 ... 125
Storage temperature
Tstg
-55 ... 150
1Pb-containing
package may be available upon special request
1
2007-04-19
BA592/BA892...
Thermal Resistance
Parameter
Symbol
Junction - soldering point1)
RthJS
Value
Unit
K/W
BA592
≤ 135
BA892, BA892-02V
≤ 120
BA892-02L
≤ 70
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
IR
-
-
20
nA
VF
-
-
1
V
DC Characteristics
Reverse current
VR = 20 V
Forward voltage
IF = 100 mA
1For
calculation of RthJA please refer to Application Note Thermal Resistance
2
2007-04-19
BA592/BA892...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Symbol
Parameter
Values
min.
typ.
Unit
max.
AC Characteristics
Diode capacitance
pF
CT
VR = 1 V, f = 1 MHz
0.65
0.92
1.4
VR = 3 V, f = 1 MHz
0.6
0.85
1.1
-
1
-
-
100
-
VR = 0 V, f = 100 MHz
Reverse parallel resistance
RP
kΩ
VR = 0 V, f = 100 MHz
Forward resistance
Ω
rf
I F = 3 mA, f = 100 MHz
-
0.45
0.7
I F = 10 mA, f = 100 MHz
-
0.36
0.5
τ rr
-
120
-
ns
I-region width
WI
-
3
-
µm
Insertion loss1)
IL
Charge carrier life time
I F = 10 mA, IR = 6 mA, measured at IR = 3mA,
RL = 100 Ω
dB
I F = 0.1 mA, f = 1.8 GHz
-
0.1
-
I F = 3 mA, f = 1.8 GHz
-
0.5
-
I F = 10 mA, f = 1.8 GHz
-
0.4
-
VR = 0 V, f = 100 MHz
-
23.5
-
VR = 0 V, f = 470 MHz
-
10.5
-
VR = 0 V, f = 1 GHz
-
5.5
-
Isolation1)
1BA892-02L
ISO
in series configuration, Z = 50Ω
3
2007-04-19
BA592/BA892...
Diode capacitance CT = ƒ (VR)
Reverse parallel resistance RP = ƒ(V R)
f = Parameter
f = Parameter
10 3
2
KOhm
100 MHz
pF
Rp
CT
10 2
1.2
10 1
1 GHz
1 MHz ... 1 GHz
0.8
10 0
0.4
0
0
5
10
15
V
20
10 -1
0
30
5
10
15
20
V
30
VR
VR
Forward resistance rf = ƒ (IF )
Forward current IF = ƒ (VF)
f = 100MHz
TA = Parameter
10 2
10 0
A
Ohm
10 -1
10 1
rf
IF
10 -2
10 -3
10
0
10
-40 °C
25 °C
85 °C
125 °C
-4
10 -5
10 -1 -2
10
10
-1
10
0
10
1
10 -6
0
mA 10 2
0.2
0.4
0.6
0.8
V
1.2
VF
IF
4
2007-04-19
BA592/BA892...
Insertion loss IL = -|S21|2 = ƒ(f)
Isolation ISO = -|S21| 2 = ƒ(f)
IF = Parameter
VR = Paramter
BA892-02L in series configuration, Z = 50Ω
BA892-02L in series configuration, Z = 50Ω
0
0
dB
|S 21| 2
|S 21| 2
dB
10 mA
3 mA
1 mA
0.1 mA
-0.2
-10
0V
1V
10 V
-15
-20
-0.3
-25
-0.4
0
0.5
1
1.5
2
GHz
-30
0
3
f
0.5
1
1.5
2
GHz
3
f
5
2007-04-19
Package SC79
BA592/BA892...
Package Outline
0.2
M
A
+0.05
0.13 -0.03
0.8 ±0.1
0.2 ±0.05
10˚MAX.
1.6 ±0.1
1
0.3 ±0.05
Cathode
marking
10˚MAX.
1.2 ±0.1
A
2
0.55 ±0.04
0.35
1.35
Foot Print
0.35
Marking Layout (Example)
2005, June
Date code
BAR63-02V
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
Cathode
marking
0.4
0.93
0.2
8
1.96
Reel with 2 mm Pitch
2
1.33
Standard
4
Cathode
marking
6
0.66
2007-04-19
Package SCD80
BA592/BA892...
Package Outline
0.2
M
A
+0.05
0.13 -0.03
0.8 ±0.1
0.2 ±0.05
10˚MAX.
1.7 ±0.1
1
0.3 ±0.05
Cathode
marking
7˚ ±1.5˚
1.3 ±0.1
A
2
0.7 ±0.1
0.35
1.45
Foot Print
0.35
Marking Layout (Example)
2005, June
Date code
BAR63-02W
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
Reel with 2 mm Pitch
2
0.2
2.5
8
1.45
Standard
4
Cathode
marking
0.4
0.9
Cathode
marking
7
0.7
2007-04-19
BA592/BA892...
Date Code marking for discrete packages with
one digit (SCD80, SC79, SC75 1) ) CES-Code
Month 2 0 03
2 0 04
2005
2006
2 0 07
2008
2009
2010
2011
2012
2 0 13
2014
01
a
p
A
P
a
p
A
P
a
p
A
P
02
b
q
B
Q
b
q
B
Q
b
q
B
Q
03
c
r
C
R
c
r
C
R
c
r
C
R
04
d
s
D
S
d
s
D
S
d
s
D
S
05
e
t
E
T
e
t
E
T
e
t
E
T
06
f
u
F
U
f
u
F
U
f
u
F
U
07
g
v
G
V
g
v
G
V
g
v
G
V
08
h
x
H
X
h
x
H
X
h
x
H
X
09
j
y
J
Y
j
y
J
Y
j
y
J
Y
10
k
z
K
Z
k
z
K
Z
k
z
K
Z
11
l
2
L
4
l
2
L
4
l
2
L
4
12
n
3
N
5
n
3
N
5
n
3
N
5
1) New Marking Layout for SC75, implemented at October 2005.
.
8
2007-04-19
Package SOD323
BA592/BA892...
Package Outline
0.9 +0.2
-0.1
+0.2
1.25 -0.1
0 ±0.05
A
1.7 +0.2
-0.1
Cathode
marking
0.45 ±0.15
2.5 ±0.2
2
1
0.3 +0.1
-0.05
+0.05
0.3 -0.2
0.15 +0.1
-0.06
0.25 M A
0.8
1.7
0.8
Foot Print
0.6
Marking Layout (Example)
BAR63-03W
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.2
2
2.9
8
4
Cathode
marking
0.65
1.35
9
1
2007-04-19
Package TSLP-2-1
BA592/BA892...
Package Outline
Top view
Bottom view
0.4 +0.1
0.6 ±0.05
0.05 MAX.
1
1)
1)
0.5 ±0.035
Cathode
marking
0.25 ±0.035
2
1
1 ±0.05
0.65±0.05
2
1) Dimension applies to plated terminal
Foot Print
0.6
0.275
For board assembly information please refer to Infineon website "Packages"
Copper
Solder mask
0.375
0.275
0.35
1
0.3
0.925
0.35
0.45
Stencil apertures
Marking Layout (Example)
BAS16-02L
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
0.5
1.16
Cathode
marking
8
4
0.76
10
2007-04-19
BA592/BA892...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
11
2007-04-19
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