Rohm BA2115FVM-TR Low noise operational amplifier Datasheet

Datasheet
Operational Amplifiers
Low Noise Operational Amplifiers
BA2107G
BA2115xxx
General Description
Key Specification
The BA2107/BA2115 are single and dual operational
amplifier with high gain and high slew rate(4v/µs).
The BA2107/BA2115 have good performance of input
referred noise voltage(7 nV/ Hz ) and total harmonic
distortion(0.008%). These are suitable for Audio
applications.
 Wide Operating Supply Voltage
(split supply):
 Operating Temperature Range:
 Slew Rate:
 Total Harmonic Distortion :
 Input Referred Noise Voltage :
Features




Packages
High Voltage Gain
Low Input Referred Noise Voltage
Low Total Harmonic Distortion
Wide Operating Supply Voltage
SSOP5
SOP8
SOP-J8
MSOP8
±1.0V to ±7.0V
-40°C to +85°C
4V/µs(Typ)
0.008%(Typ)
7 nV/ Hz (Typ)
W(Typ)xD(Typ) xH(Max)
2.90mm x 2.80mm x 1.25mm
5.00mm x 6.20mm x 1.71mm
4.90mm x 6.00mm x 1.65mm
2.90mm x 4.00mm x 0.90mm
Application
 Audio Application
 Potable Equipment
 Consumer Electronics
Simplified Schematic
VCC
VCC
-IN
-IN
VOUT
OUT
+IN
+IN
VEE
VEE
Figure 1. Simplified Schematic
○Product structure:Silicon monolithic integrated circuit
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BA2107G
BA2115xxx
Datasheet
Pin Configuration
SSOP5
+IN
1
VEE
2
-IN
3
5 VCC
Pin No.
Pin Name
1
+IN1
2
VEE
3
-IN1
4
OUT
5
VCC
Pin No.
Pin Name
1
OUT1
2
-IN1
3
+IN1
4
VEE
5
+IN2
6
-IN2
7
OUT2
8
VCC
+
-
4 OUT
SOP8, SOP-J8, MSOP8
OUT1
1
-IN1
2
+IN1
3
VEE
4
8 VCC
7 OUT2
CH1
- +
6 -IN2
CH2
+ -
5 +IN2
Package
SSOP5
SOP8
SOP-J8
MSOP8
BA2107G
BA2115F
BA2115FJ
BA2115FVM
Ordering Information
B
A
2
1
x
x
Part Number
BA2107G
BA2115xxx
x
x
x
-
Package
G
: SSOP5
F
: SOP8
FJ : SOP-J8
FVM : MSOP8
xx
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/SOP-J8)
TR: Embossed tape and reel
(SSOP5/MSOP8)
Line-up
Operating
Temperature
Range
-40°C to +85°C
Operating Supply
Voltage
(split supply)
±1.0V to ±7.0V
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Supply
Current
(Typ)
3.5mA
Slew
Rate
(Typ)
4V/µs
2/31
Orderable
Part Number
Package
SSOP5
Reel of 3000
BA2107G-TR
SOP8
Reel of 2500
BA2115F-E2
SOP-J8
Reel of 2500
BA2115FJ-E2
MSOP8
Reel of 3000
BA2115FVM-TR
TSZ02201-0RAR0G200090-1-2
11.Nov.2014 Rev.002
BA2107G
BA2115xxx
Datasheet
Absolute Maximum Ratings (TA=25℃)
○BA2107, BA2115
Parameter
Symbol
Supply Voltage
VCC-VEE
Power Dissipation
Differential Input Voltage
PD
(Note 5)
Ratings
Unit
+14
V
SSOP5
0.67
(Note 1,4)
SOP8
0.78
(Note 2,4)
SOP-J8
0.67
(Note 1,4)
MSOP8
0.59
(Note 3,4)
W
C
+14
V
VICM
(VEE-0.3) to (VEE+14)
V
II
-10
mA
Operating Supply Voltage
Vopr
2 to 14(±1 to ±7)
V
Operating Temperature
Topr
-40 to +85
℃
Tstg
-55 to 150
℃
TJmax
+150
℃
Input Common-mode Voltage Range
(Note 6)
Input Current
Storage Temperature
Maximum Junction Temperature
(Note 1)
(Note 2)
(Note 3)
(Note 4)
(Note 5)
To use at temperature above TA=25℃ reduce 5.4mW/℃
To use at temperature above TA=25℃ reduce 6.2mW/℃
To use at temperature above TA=25℃ reduce 4.8mW/℃
Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (copper foil area less than 3%).
The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
(Note 6) An excessive input current will flow when input voltages of more than VCC+0.6V or less than VEE-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as
short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is
operated in a special mode exceeding the absolute maximum ratings.
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Electrical Characteristics
○BA2107 (Unless otherwise specified
Parameter
Input Offset Voltage
(Note 7)
VCC=+2.5V, VEE=-2.5V, TA=25℃)
Limits
Symbol
Unit
Min
Typ
Max
Condition
VIO
-
1
6
mV
VOUT=0V, VICM=0V
IIO
-
2
200
nA
VOUT=0V, VICM=0V
IB
-
150
400
nA
VOUT=0V, VICM=0V
ICC
-
1.8
3.0
mA
Av=0dB, RL=∞, +IN=0V
4.5
4.8
-
-
11.6
-
-
15.5
-
0.5
0.2
-
-
0.4
-
-
0.5
-
ISOURCE
-
1.4
-
mA
ISINK
-
90
-
mA
Av
60
80
-
dB
VICM
±1.5
-
-
V
RL≧10kΩ, VOUT=2.5±2V
VICM=2.5V
(VEE+1.0V) - (VCC-1.0V)
Common-mode Rejection Ratio
CMRR
60
74
-
dB
VICM=-1.5V to +1.5V
Power Supply Rejection Ratio
PSRR
60
80
-
dB
VEE=0V, VCC=2V to 16V
SR
-
4
-
V/μs
Av=0dB, +IN=2VP-P
Input Offset Current
Input Bias Current
(Note 7)
(Note 8)
Supply Current
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
Output Source Current
Output Sink Current
Large Signal Voltage Gain
Input Common-mode Voltage Range
Slew Rate
Gain Bandwidth Product
VOH
VOL
V
V
RL≧2.5kΩ, VOHmin=VCC-0.5V
RL≧10kΩ, VCC=12V, VEE=0V
VRL=6V, VOH=VCC-0.4V
RL≧10kΩ, VCC=16V, VEE=0V
VRL=8V, VOH=VCC-0.5V
RL≧2.5kΩ, VOLmin=VEE+0.5V
RL≧10kΩ, VCC=12V, VEE=0V
VRL=6V, VOL=VEE+0.4V
RL≧10kΩ, VCC=16V, VEE=0V
VRL=8V, VOL=VEE+0.5V
-
GBW
-
12
-
MHz
f=10kHz
Unity Gain Frequency
fT
-
3.4
-
MHz
0dB cross frequency
Input Referred Noise Voltage
VN
-
7
-
nV/ Hz RS=600Ω, DIN-AUDIO
-
0.9
-
μVrms RS=600Ω, DIN-AUDIO
-
0.008
-
Total Harmonic Distortion
THD+N
%
Av=20dB, f=1kHz, DIN-AUDIO
(Note 7) Absolute value
(Note 8) Current direction: Since first input stage is composed with PNP transistor, input bias current flows out from IC.
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BA2107G
BA2115xxx
○BA2115 (Unless otherwise specified
Parameter
Datasheet
VCC=+2.5V, VEE=-2.5V, TA=25℃)
Limits
Symbol
Min
Typ
Max
Unit
Condition
Input Offset Voltage
(Note 9)
VIO
-
1
6
mV
VOUT=0V, VICM=0V
Input Offset Current
(Note 9)
IIO
-
2
200
nA
VOUT=0V, VICM=0V
IB
-
150
400
nA
ICC
-
3.5
5
mA
4.5
4.8
-
-
11.6
-
-
15.5
-
0.5
0.2
-
-
0.4
-
-
0.5
-
ISOURCE
-
1.4
-
mA
VOUT=0V, VICM=0V
Av=0dB, RL=∞, All Op-Amps
+IN=0V
RL≧2.5kΩ, VOHmin=VCC-0.5V
RL≧10kΩ, VCC=12V, VEE=0V
VRL=6V, VOH=VCC-0.4V
RL≧10kΩ, VCC=16V, VEE=0V
VRL=8V, VOH=VCC-0.5V
RL≧2.5kΩ, VOLmin=VEE+0.5V
RL≧10kΩ, VCC=12V, VEE=0V
VRL=6V, VOL=VEE+0.4V
RL≧10kΩ, VCC=16V, VEE=0V
VRL=8V, VOL=VEE+0.5V
-
ISINK
-
90
-
mA
AV
60
80
-
dB
Input Bias Current
(Note 10)
Supply Current
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
Output Source Current
Output Sink Current
VOH
VOL
V
V
VICM
±1.5
-
-
V
RL≧10kΩ, VOUT=±2V
VICM=0V
(VEE+1.0V) - (VCC-1.0V)
Common-mode Rejection Ratio
CMRR
60
74
-
dB
VICM=-1.5V to +1.5V
Power Supply Rejection Ratio
PSRR
60
80
-
dB
VEE=0V, VCC=2V to 14V
Large Signal Voltage Gain
Input Common-mode Voltage Range
Slew Rate
Gain Bandwidth Product
Unity Gain Frequency
Input Referred Noise Voltage
Total Harmonic Distortion
Channel Separation
SR
-
4
-
V/μs
Av=0dB, +IN=2VPP
GBW
-
12
-
MHz
f=10kHz
fT
-
3.4
-
MHz
0dB cross frequency
-
7
-
nV/ Hz
RS=600Ω, DIN-AUDIO
-
0.9
-
μVrms
RS=600Ω, DIN-AUDIO
THD+N
-
0.008
-
%
Av=20dB, f=1kHz, DIN-AUDIO
CS
-
100
-
dB
Av=40dB
VN
(Note 9) Absolute value
(Note 10) Current direction: Since first input stage is composed with PNP transistor, input bias current flows out from IC.
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Datasheet
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (VCC / VEE)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power
supply terminal without deterioration or destruction of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25℃
(normal temperature). As for package product, Pd is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
(2) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
(3) Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
(4) Supply Current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
(5) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL)
Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output
voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output
voltage low indicates the lower limit.
(6) Output Source Current/ Output Sink Current (Isource / Isink)
The maximum current that can be output from the IC under specific output conditions. The output source current
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
(7) Large Signal Voltage Gain (Av)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage) / (Differential Input voltage)
(8) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range where IC normally operates.
(9) Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
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(10) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR= (Change of power supply voltage)/(Input offset fluctuation)
(11) Slew Rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
(12) Gain Bandwidth (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.
(13) Unity gain frequency (fT)
Indicates a frequency where the voltage gain of operational amplifier is 1.
(14) Input Referred Noise Voltage (VN)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
(15) Total harmonic distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
(16) Channel Separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
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Datasheet
Typical Performance Curves
○BA2107
1.0
.
4
SUPPLY CURRENT [mA]
POWER DISSIPATION [W]
0.8
BA2107G
0.6
0.4
0.2
0.0
0
25
50
75
85
3
-40℃
25℃
2
85℃
1
0
100
125
0
AMBIENT TEMPERATURE [℃]
Figure 2.
Derating Curve
5
10
SUPPLY VOLTAGE [V]
Figure 3.
Supply Current - Supply Voltage
3
4
2
3
OUTPUT VOLTAGE [V]
SUPPLY CURRENT [mA]
15
5.0V
14.0V
2
2.0V
1
VOH
1
0
-1
VOL
-2
0
-3
-50
-25
0
25
50
75
100
0.1
AMBIENT TEMPERATURE [℃]
1
10
100
1000
LOAD
LOADRESISTANCE
RESISTANCE[kΩ]
[kΩ]
10000
Figure 5.
Output Voltage - Load Resistance
(VCC/VEE=+2.5V/-2.5V)
Figure 4.
Supply Current - Ambient Temperature
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Datasheet
○BA2107
10
10
6
VOH
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
6
2
-2
VOL
-6
-10
VOH
2
-2
VOL
-6
-10
±1
±2
±3
±4
±5
±6
±7
SUPPLY VOLTAGE [V]
±8
-50
3.0
0
2.5
-0.5
2.0
VOH
1.5
1.0
100
Figure 7.
Output Voltage - Ambient Temperature
(VCC/VEE=+7.0V/-7.0V, RL=10kΩ)
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
Figure 6.
Output Voltage - Supply Voltage
(RL=10kΩ)
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
-1
-1.5
VOL
-2
-2.5
0.5
-3
0.0
0.0
0
0.4
0.8
1.2
1.6
2.0
OUTPUT SOURCE CURRENT [mA]
2
4
6
8
OUTPUT SINK CURRENT [mA]
10
Figure 9.
Output Voltage - Output Sink Current
(VCC/VEE=+2.5V/-2.5V)
Figure 8.
Output Voltage - Output Source Current
(VCC/VEE=+2.5V/-2.5V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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BA2115xxx
Datasheet
6
3
4
2
INPUT OFFSET VOLTAGE [mV]
INPUT OFFSET VOLTAGE [mV]
○BA2107
2
0
-2
-4
±7.0V
±2.5V
1
0
±1.0V
-1
-2
-3
-6
±1
±2
±3
±4
±5
±6
±7
SUPPLY VOLTAGE [V]
-50
±8
Figure 10.
Input Offset Voltage - Supply Voltage
(VICM=0V, VOUT=0V)
-25
0
25
50
75
AMBIENT TEMPERATURE [°C]
100
Figure 11.
Input Offset Voltage - Ambient Temperature
(VICM=0V, VOUT=0V)
250
25℃
200
INPUT BIAS CURRENT [nA]
INPUT BIAS CURRENT [nA]
.
250
-40℃
150
85℃
100
50
±1.0V
200
±2.5V
150
±7.0V
100
50
0
0
±1
±2
±3
±4
±5
±6
±7
SUPPLY VOLTAGE [V]
Figure 12.
Input Bias Current - Supply Voltage
(VICM=0V, VOUT=0V)
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
Figure 13.
Input Bias Current - Ambient Temperature
(VICM=0V, VOUT=0V)
±8
(*)The above data is measurement value of typical sample, it is not guaranteed.
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BA2115xxx
Datasheet
40
40
30
30
INPUT OFFSET CURRENT [nA]
INPUT OFFSET CURRENT [nA]
.
○BA2107
20
25℃
-40℃
10
0
85℃
-10
-20
-30
-40
20
10
0
±2.5V
±7.0V
-10
-20
-30
-40
±1
±2
±3
±4
±5
±6
±7
SUPPLY VOLTAGE [V]
±8
-50
Figure 14.
Input Offset Current - Supply Voltage
(VICM=0V, VOUT=0V)
25℃
85℃
0
-2
-4
LARGE SIGNAL VOLTAGE GAIN [dB] .
-40℃
-6
-2.5
100
150
4
2
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
Figure 15.
Input Offset Current - Ambient Temperature
(VICM=0V, VOUT=0V)
6
INPUT OFFSET VOLTAGE [mV]
±1.0V
-1.5
-0.5
0.5
1.5
2.5
COMMON MODE INPUT VOLTAGE [V]
125
100
75
50
25
0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [°C]
100
Figure 17.
Large Signal Voltage Gain
- Ambient Temperature
(VCC/VEE=+2.5V/-2.5V)
Figure 16.
Input Offset Voltage
- Common Mode Input Voltage
(VCC/VEE=+2.5V/-2.5V, VOUT=0V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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BA2115xxx
Datasheet
○BA2107
125
100
75
50
25
0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [°C]
150
125
100
.
COMMON MODE REJECTION RATIO [dB]
.
POWER SUPPLY REJECTION RATIO[dB]
150
75
50
25
0
100
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [°C]
Figure 19.
Power Supply Rejection Ratio
- Ambient Temperature
(VCC/VEE=+2.5V/-2.5V)
7
7
6
6
SLEW RATE H-L [V/μs]
SLEW RATE L-H [V/μs]
Figure 18.
Common Mode Rejection Ratio
- Ambient Temperature
(VCC/VEE=+2.5V/-2.5V)
5
-40℃
4
25℃
3
100
85℃
2
1
5
25℃
-40℃
4
85℃
3
2
1
0
0
±1
±2
±3
±4
±5
±6
SUPPLY VOLTAGE[V]
±7
±8
±1
±2
±3
±4
±5
±6
SUPPLY VOLTAGE [V]
±7
±8
Figure 21.
Slew Rate H-L - Supply Voltage
Figure 20.
Slew Rate L-H - Supply Voltage
(*)The above data is measurement value of typical sample, it is not guaranteed.
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INPUT REFFERD NOISE VOLTAGE [nV/√Hz]
○BA2107
TOTAL HARMONIC DISTORTION [%]
1
0.1
20kHz
0.01
1kHz
20Hz
0.001
0.01
0.1
1
OUTPUT VOLTAGE [Vrms]
10
Phase
20
10
0
10
100
1000
FREQUENCY [Hz]
10000
Figure 23.
Equivalent Input Noise Voltage - Frequency
(VCC/VEE=2.5V/-2.5V)
0
Gain
-60
30
-90
20
-120
10
PHASE [deg] .
-30
40
GAIN [dB] .
30
1
Figure 22.
Total Harmonic Distortion - Output Voltage
(VCC/VEE=2.5V/-2.5V, RL=2kΩ
80kHz-LPF, TA=25℃)
50
40
-150
0
-180
2
3
4
5
6
7
10
10
10
10
10
10
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
1.E+07
FREQUENCY [Hz]
Figure 24.
Voltage Gain - Frequency
(VCC/VEE=2.5V/-2.5V, Av=40dB, RL=10kΩ)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves
7
6
BA2115F
0.8
-40℃
SUPPLY CURRENT [mA].
POWER DISSIPATION [W]
.
○BA2115
1.0
BA2115FJ
0.6
0.4
BA2115FVM
0.2
0.0
0
85
25
50
75
100
AMBIENT TEMPERATURE [℃]
5
25℃
4
85℃
3
2
1
0
0
125
15
Figure 26.
Supply Current - Supply Voltage
Figure 25.
Derating Curve
7
3
6
2
VOH
14.0V
5
OUTPUT VOLTAGE [V]
SUPPLY CURRENT [mA]
5
10
SUPPLY VOLTAGE [V]
4
3
5.0V
3.0V
2
1
0
-1
VOL
-2
1
-3
0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
0.1
100
1
10
100
1000
LOAD RESISTANCE [kΩ]
10000
Figure 28.
Output Voltage - Load Resistance
(VCC/VEE=+2.5V/-2.5V)
Figure 27.
Supply Current - Ambient Temperature
(*)The above data is measurement value of typical sample, it is not guaranteed.
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○BA2115
10
10
8
8
VOH
6
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
6
4
2
0
-2
-4
VOL
-6
2
0
-2
-4
-8
-10
-10
±2
±3
±4
±5
±6
SUPPLY VOLTAGE [V]
±7
VOL
-6
-8
±1
VOH
4
-50
±8
0.0
2.5
-0.5
1.5
1.0
0.5
SUPPLY CURRENT [mA].
OUTPUT VOLTAGE [V]
3.0
VOH
100
Figure 30.
Maximum Output Voltage
- Ambient Temperature
(VCC/VEE=+7V/-7V, RL=10kΩ)
Figure 29.
Maximum Output Voltage
- Supply Voltage
(RL=10kΩ)
2.0
-25
0
25
50
75
AMBIENT TEMPERATURE [℃]
0.0
-1.0
-1.5
VOL
-2.0
-2.5
-3.0
0.0
0.4
0.8
1.2
1.6
2.0
OUTPUT SOURCE CURRENT [mA]
0
2
4
6
8
SUPPLY VOLTAGE [V]
10
Figure 32.
Maximum Output Voltage
- Output Sink Current
(VCC/VEE=+2.5V/-2.5V)
Figure 31.
Maximum Output Voltage
- Output Source Current
(VCC/VEE=+2.5V/-2.5V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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6
3
4
2
INPUT OFFSET VOLTAGE [mV]
INPUT OFFSET VOLTAGE [mV]
○BA2115
2
0
-2
-4
±7.0V
0
-1
±1.5V
±2.5V
-2
-3
-6
±1
±2
±3
±4
±5
±6
±7
-50
±8
-25
0
25
50
75
100
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [°C]
Figure 33.
Input Offset Voltage - Supply Voltage
(VICM=0V, VOUT=0V)
Figure 34.
Input Offset Voltage - Ambient Temperature
(VICM=0V, VOUT=0V)
250
.
..
250
±1.5V
25℃
200
INPUT BIAS CURRENT [nA]
INPUT BIAS CURRENT [nA]
1
-40℃
150
85℃
100
50
0
200
±2.5V
150
±7.0V
100
50
0
±1
±2
±3
±4
±5
±6
SUPPLY VOLTAGE [V]
±7
±8
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
Figure 36.
Input Bias Current - Ambient Temperature
(VICM=0V, VOUT=0V)
Figure 35.
Input Bias Current - Supply Voltage
(VICM=0V, VOUT=0V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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40
40
30
30
INPUT OFFSET CURRENT [nA]
INPUT OFFSET CURRENT [nA]
.
○BA2115
20
-40℃
10
25℃
0
85℃
-10
-20
-30
20
±1.5V
10
0
-10
±1
-20
-30
±2
±3
±4
±5
±6
SUPPLY VOLTAGE [V]
±7
-50
±8
0
25
50
75
100
Figure 38.
Input Offset Current - Ambient Temperature
(VICM=0V, VOUT=0V)
150
LARGE SIGNAL VOLTAGE GAIN [dB] .
20
INPUT OFFSET VOLTAGE [mV]
-25
AMBIENT TEMPERATURE [℃]
Figure 37.
Input Offset Current - Supply Voltage
(VICM=0V, VOUT=0V)
15
10
5
0
85℃
-10
±7.0V
-40
-40
-5
±2.5V
25℃
-40℃
-15
125
100
75
50
25
0
-20
-2.5 -2 -1.5 -1 -0.5
0
0.5
1
1.5
2
-50
2.5
COMMON MODE INPUT VOLTAGE [V]
-25
0
25
50
75
AMBIENT TEMPERATURE [°C]
100
Figure 40.
Large Signal Voltage Gain
- Ambient Temperature
(VCC/VEE=+2.5V/-2.5V)
Figure 39.
Input Offset Voltage
- Common Mode Input Voltage
(VCC/VEE=+2.5V/-2.5V, VOUT=0V)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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150
POWER SUPPLY REJECTION RATIO [dB] .
COMMON MODE REJECTION RATIO [dB] .
○BA2115
125
100
75
50
25
0
-50
-25
0
25
50
75
AMBIENT TEMPERATURE [°C]
150
125
100
75
50
25
0
100
-50
7
6
6
SLEW RATE H-L [V/μs]
SLEW RATE L-H [V/μs]
25
50
75
100
Figure 42.
Power Supply Rejection Ratio
- Ambient Temperature
(VCC/VEE=+2.5V/-2.5V)
7
5
-40℃
4
85℃
0
AMBIENT TEMPERATURE [°C]
Figure 41.
Common Mode Rejection Ratio
- Ambient Temperature
(VCC/VEE=+2.5V/-2.5V)
3
-25
25℃
2
-40℃
5
25℃
4
85℃
3
2
1
1
0
0
±1
±2
±3
±4
±5
±6
SUPPLY VOLTAGE[V]
±7
±1
±8
±2
±3
±4
±5
±6
SUPPLY VOLTAGE [V]
±7
±8
Figure 44.
Slew Rate H-L - Supply Voltage
Figure 43.
Slew Rate L-H - Supply Voltage
(*)The above data is measurement value of typical sample, it is not guaranteed.
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○BA2115
INPUT REFFERD NOISE VOLTAGE [nV/√Hz]
TOTAL HARMONIC DISTORTION [%]
1
0.1
20kHz
0.01
1kHz
20Hz
0.001
0.01
0.1
1
OUTPUT VOLTAGE [Vrms]
Phase
20
10
0
10
100
1000
10000
FREQUENCY [Hz]
Figure 46.
Equivalent Input Noise Voltage - Frequency
(VCC/VEE=2.5V/-2.5V)
0
Gain
-60
30
-90
20
-120
10
PHASE [deg] .
-30
40
GAIN [dB] .
30
1
10
Figure 45.
Total Harmonic Distortion - Output Voltage
(VCC/VEE=2.5V/-2.5V, RL=3kΩ
80kHz-LPF, TA=25℃)
50
40
-150
0
-180
2
3
4
5
6 1.E+07
7
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
10
10
10
10
10
10
FREQUENCY [Hz]
Figure 47.
Voltage Gain - Frequency
(VCC/VEE=2.5V/-2.5V, Av=40dB, RL=10kΩ)
(*)The above data is measurement value of typical sample, it is not guaranteed.
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Application Information
NULL method condition for Test Circuit 1
VCC, VEE, EK, VICM Unit: V
Parameter
VF
S1
S2
S3
VCC
VEE
EK
VICM
calculation
Input Offset Voltage
VF1
ON
ON
OFF
2.5
-2.5
0
0
1
Input Offset Current
VF2
OFF
OFF
OFF
2.5
-2.5
0
0
2
VF3
OFF
ON
VF4
ON
OFF
OFF
2.5
-2.5
0
0
3
ON
ON
ON
2.5
-2.5
-1.0
0
1.5
-2.5
1.0
0
ON
ON
OFF
1.5
-3.5
-1.0
0
3.5
-1.5
1.0
0
ON
ON
OFF
0.75
-1.25
0
0
7.0
-7.0
0
0
Input Bias Current
VF5
Large Signal Voltage Gain
VF6
VF7
Common-mode Rejection Ratio
(Input common-mode Voltage Range)
VF8
VF9
Power Supply
Rejection Ratio
VF10
-Calculation1. Input Offset Voltage (Vio)
VIO =
2. Input Offset Current (Iio)
IIO =
3. Input Bias Current (Ib)
IB =
4. Large Signal Voltage Gain (Av)
AV = 20Log ΔEK × (1+RF/RS)
|VF5-VF6|
5. Common-mode Rejection Ration (CMRR)
6. Power Supply Rejection Ratio (PSRR)
|VF1|
1+RF/RS
4
5
6
[V]
|VF2-VF1|
[A]
RI ×(1+RF/RS)
|VF4-VF3|
2 × RI ×(1+RF/RS)
[A]
[dB]
CMRR = 20Log ΔVICM × (1+RF/RS) [dB]
|VF8-VF7|
PSRR = 20Log ΔVCC × (1+ RF/RS) [dB]
|VF10 – VF9|
0.1µF
RF=50kΩ
SW1
+15V
EK
RS=50Ω
0.1µF
500kΩ
VCC
RI=10kΩ
500kΩ
DUT
NULL
SW3
RS=50Ω
1000pF
RI=10kΩ
VF
RL
VICM
50kΩ
SW2
-15V
VEE
Figure 48. Test circuit1 (one channel only)
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Switch Condition for Test Circuit 2
SW No.
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW13 SW14
Supply Current
OFF
OFF OFF
ON
OFF
ON
OFF
OFF
OFF OFF
OFF OFF
OFF
OFF
Maximum Output Voltage(High)
OFF
OFF
ON
OFF OFF
ON
OFF
Maximum Output Voltage(Low)
OFF
OFF
ON
OFF OFF
ON
OFF
OFF
ON
OFF
OFF OFF
ON
OFF
OFF
OFF OFF
OFF OFF
ON
OFF
Output Source Current
OFF
OFF
ON
OFF OFF
ON
Output Sink Current
OFF
OFF
ON
OFF OFF
ON
OFF
OFF
OFF OFF
OFF OFF
OFF
ON
OFF
OFF
OFF OFF
OFF OFF
OFF
ON
Slew Rate
OFF
OFF OFF
ON
OFF
Gain Bandwidth Product
OFF
ON
OFF
OFF
ON
OFF OFF
ON
ON
ON
OFF OFF
OFF
OFF
ON
OFF
OFF
ON
ON
OFF OFF
OFF
Equivalent Input Noise Voltage
ON
OFF OFF
OFF
ON
OFF
ON
OFF
OFF
OFF OFF
ON
OFF
OFF
Input voltage
SW4
R2
SW5
●
VH
VCC
-
SW1
SW2
VL
SW3
RS
SW7
SW9
SW8
SW10
SW11
SW12 SW13
SW14
Output voltage
R1
VIN-
90% SR=ΔV/Δt
VH
VEE
C
RL
VIN+
ΔV
CL
10%
VOUT
VRL
VL
Δt
Output wave
t
Figure 50. Slew Rate Input Waveform
Figure 49. Test Circuit 2 (each Op-Amp)
R2=100kΩ
R2=100kΩ
VCC
R1=1kΩ
t
Input wave
+
SW6
OFF
VCC
R1=1kΩ
OTHER
CH
V
VIN
R1//R2
VEE
OUT1
=0.5Vrms
V
R1//R2
OUT2
VEE
CS=20×log
100×OUT1
OUT2
Figure 51. Test circuit 3(Channel Separation)
(VCC=+2.5V, VEE=-2.5V)
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Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at TA=25℃(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θJA℃/W.The temperature of IC inside the package can be estimated by this
thermal resistance. Figure 52. (a) shows the model of thermal resistance of the package. Thermal resistance θJA, ambient
temperature TA, maximum junction temperature TJMAX, and power dissipation Pd can be calculated by the equation below:
θJA = (TJMAX-TA) / PD
℃/W
・・・・・ (Ⅰ)
Derating curve in Figure 52. (b) indicates power that can be consumed by IC with reference to ambient temperature. Power
that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate
at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θJA depends on
chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 53. (c),(d)
show a derating curve for an example of BA2107,BA2115.
Power Dissipation of LSI [W]
PD(max)
θJA=(TJmax-TA)/ PD
°C/W
P2
Ambient Temperature TA [ °C ]
θJA2 < θJA1
θ’JA2
P1
θJA2
TJ’max
θ’JA1
0
Chip Surface Temperature TJ [ °C ]
25
50
TJmax
θJA1
75
100
125
150
Ambient Temperature TA [ °C ]
(b) Derating Curve
(a) Thermal Resistance
Figure 52. Thermal Resistance and Derating Curve
1.0
POWER DISSIPATION [W]
.
POWER DISSIPATION [W]
1.0
0.8
BA2107G(Note 11)
0.6
0.4
0.2
BA2115F(Note 12)
BA2115FJ(Note 11)
0.6
0.4
BA2115FVM(Note 13)
0.2
0.0
0.0
0
0
25
50
75 100 125
AMBIENT TEMPERATURE [℃]
(Note 12)
6.2
(Note 13)
4.8
25
50
75 100 125
AMBIENT TEMPERATURE [℃]
(d)BA2115
(c)BA2107
(Note 11)
5.4
0.8
Unit
mW/℃
When using the unit above TA=25℃, subtract the value above per ℃. Permissible dissipation is the value.
Permissible dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted.
Figure 53. Derating Curve
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Application Example
○Voltage Follower
Voltage gain is 0 dB.
This circuit controls output voltage (OUT) equal input
voltage (IN), and keeps OUT with stable because of
high input impedance and low output impedance.
OUT is shown next expression.
OUT=IN
VCC
OUT
IN
VEE
Figure 54. Voltage Follower Circuit
○Inverting Amplifier
R2
For inverting amplifier, Vi(b) Derating curve voltage
gain decided R1 and R2, and phase reversed voltage
is output.
OUT is shown next expression.
OUT=-(R2/R1)・IN
Input impedance is R1.
VCC
IN
R1
OUT
R1//R2
VEE
Figure 55. Inverting Amplifier Circuit
○Non-inverting Amplifier
R1
R2
VCC
OUT
For non-inverting amplifier, IN is amplified by voltage
gain decided R1 and R2, and phase is same with IN.
OUT is shown next expression.
OUT=(1 + R2/R1)・IN
This circuit performs high input impedance because
Input impedance is operational amplifier’s input
Impedance.
IN
VEE
Figure 56. Non-inverting Amplifier Circuit
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the PD rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
GND
Parasitic
Elements
GND
GND
N Region
close-by
GND
Figure 57. Example of monolithic IC structure
12. Unused Circuits
It is recommended to apply the connection (see Figure 58.) and set the
non-inverting input terminal at a potential within the Input Common-mode
Voltage Range (VICM) for any unused circuit.
Keep this potential
in VICM
13. Input Voltage
Applying VEE +36V to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, regardless of
the supply voltage. However, this does not ensure normal circuit operation.
Please note that the circuit operates normally only when the input voltage
is within the common mode input voltage range of the electric
characteristics.
VCC
VICM
VEE
Figure 58. Example of Application Circuit
for Unused Op-amp
14. Power Supply(single/dual)
The operational amplifier operates when the voltage supplied is between VCC and VEE. Therefore, the single supply
operational amplifier can be used as dual supply operational amplifier as well.
15. IC Handling
When pressure is applied to the IC through warp on the printed circuit board, the characteristics may fluctuate due to
the piezo effect. Be careful with the warp on the printed circuit board.
16. The IC Destruction Caused by Capacitive Load
The IC may be damaged when VCC terminal and VEE terminal is shorted with the charged output terminal capacitor.
When IC is used as an operational amplifier or as an application circuit where oscillation is not activated by an output
capacitor, output capacitor must be kept below 0.1μF in order to prevent the damage mentioned above.
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Physical Dimension, Tape and Reel Information
Package Name
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SSOP5
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Physical Dimension Tape and Reel Information – continued
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
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Physical Dimension, Tape and Reel Information
Package Name
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SOP-J8
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Physical Dimension, Tape and Reel Information
Package Name
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MSOP8
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Marking Diagrams
SSOP5(TOP VIEW)
SOP8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
1PIN MARK
LOT Number
SOP-J8(TOP VIEW)
MSOP8(TOP VIEW)
Product Name
BA2107
BA2115
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
Package Type
G
SSOP5
F
SOP8
FJ
SOP-J8
FVM
MSOP8
Marking
J0
2115
Land pattern data
all dimensions in mm
Land length
Land width
≧ℓ 2
b2
PKG
Land pitch
e
Land space
MIE
SSOP5
0.95
2.4
1.0
0.6
SOP8
1.27
4.60
1.10
0.76
SOP-J8
1.27
3.90
1.35
0.76
MSOP8
0.65
2.62
0.99
0.35
SOP8, SOP-J8, MSOP8
SSOP5
0.95
MIE
b
2
1.0
2.4
e
0.95
0.6
ℓ 2
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Revision History
Date
Revision
31.Oct.2012
11.Nov.2014
001
002
Changes
New Release
Change in format.
Addtition of Input Current item of Absolute Maximum Ratings. (Page3)
Correction of Derating Curbe of Figure 2. (Page8)
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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Datasheet
BA2107G - Web Page
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Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BA2107G
SSOP5
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3000
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