STMicroelectronics BAT54AZFILM Small signal schottky diode Datasheet

BAT54 Series
Small signal Schottky diodes
Main product characteristics
IF
300 mA
VRRM
40 V
C (typ)
7 pF
Tj (max)
150° C
BAT54ZFILM
(Single)
SOD-123
BAT54JFILM
(Single)
SOD-323
Features and benefits
■
Low conduction and reverse losses
■
Negligible switching losses
■
Low forward and reverse recovery times
■
Extremely fast switching
■
Surface mount device
■
Low capacitance diode
BAT54KFILM
(Single)
SOD-523
BAT54FILM
(Single)
SOT-23
BAT54AFILM
(Common anode)
BAT54SFILM
(Series)
Description
The BAT54 series uses 40 V Schottky barrier
diodes packaged in SOD- 23, SOD-323,
SOD-523, SOT-23, SOT-323, or SOT-666.
BAT54CFILM
(Common cathode)
Order codes
BAT54WFILM
(Single)
Part Number
Marking
BAT54FILM
D86
BAT54SFILM
D88
BAT54CFILM
D87
BAT54AFILM
D84
BAT54WFILM
D73
BAT54SWFILM
D78
BAT54CWFILM
D77
BAT54AWFILM
D74
BAT54JFILM
86
BAT54KFILM
86
BAT54-07P6FILM
P4
BAT54-09P6FILM
Q4
BAT54ZFILM
D72
July 2006
SOT-323
BAT54CWFILM
(Common cathode)
BAT54AWFILM
(Common anode)
BAT54SWFILM
(Series)
BAT54-07P6FILM
(2 parallel diodes)
SOT-666
BAT54-09P6FILM
(2 opposite diodes)
Configurations in top view
Rev 9
1/13
www.st.com
Characteristics
BAT54 Series
1
Characteristics
Table 1.
Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Symbol
VRRM
IF
Parameter
Value
Unit
Repetitive peak reverse voltage
40
V
Continuous forward current
300
mA
1
A
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
-65 to +150
°C
Tj
Operating junction temperature range
-40 to +150
°C
TL
Maximum soldering temperature
260
°C
Value
Unit
Table 2.
Thermal parameters
Symbol
Rth(j-a)
tp = 10 ms Sinusoidal
Parameter
SOT-23, SOD-123
500
SOT-323, SOD-323,
550
SOD-523, SOT-666
600
°C/W
Junction to ambient(1)
1. Epoxy printed circuit board with recommended pad layout
Table 3.
Symbol
IR(1)
VF(2)
Static electrical characteristics
Parameter
Reverse leakage current
Test conditions
Tj = 25° C
Tj = 100° C
Forward voltage drop
Tj = 25° C
Min.
Typ
Max.
Unit
1
VR = 30 V
µA
100
IF = 0.1 mA
240
IF = 1 mA
320
IF = 10 mA
400
IF = 30 mA
500
IF = 100 mA
900
mV
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
Table 4.
Dynamic characteristics
Symbol
Parameter
Test conditions
C
Diode capacitance
VR = 1 V, F = 1 MHz
trr
Reverse recovery time
IF = 10 mA, IR = 10 mA, Tj = 25° C
Irr = 1 mA, RL = 100 Ω
2/13
Min.
Typ
Max.
Unit
7
10
pF
5
ns
BAT54 Series
Figure 1.
0.35
Characteristics
Average forward power dissipation Figure 2.
versus average forward current
P(W)
0.35
δ=0.05
δ=0.2
0.30
0.30
0.25
0.25
0.20
0.20
0.15
0.15
T
0.10
0.05
δ=tp/T
IF(AV)(A)
T
0.10
0.05
δ=tp/T
tp
tp
T amb (°C)
0.00
0.00
0.00
0.05
Figure 3.
1.E+02
IF(AV)(A)
δ=1
δ=0.5
δ=0.1
Average forward current versus
ambient temperature (δ = 1)
0.10
0.15
0.20
0.25
0.30
0.35
Reverse leakage current versus
reverse applied voltage (typical
values)
0
25
Figure 4.
50
75
100
125
150
Reverse leakage current versus
junction temperature
IR[T j] / IR[T j=25°C]
IR(µA)
1.E+04
VR=3V
Tj=100°C
1.E+03
1.E+01
1.E+02
Tj=50°C
1.E+00
1.E+01
Tj=25°C
1.E-01
1.E+00
T j(°C)
VR(V)
1.E-02
0
Figure 5.
10
1.E-01
5
10
15
20
25
30
Junction capacitance versus
reverse applied voltage (typical
values)
C(pF)
0
Figure 6.
1.E+00
25
50
75
100
125
150
Forward voltage drop versus
forward current (typical values)
IFM(A)
Tj=100°C
F=1MHz
VOSC=30mVRMS
Tj=25°C
1.E-01
1.E-02
Tj=50°C
Tj=25°C
1.E-03
VR(V)
VFM(V)
1
1
10
Tj=-40 °C
100
1.E-04
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3
3/13
Characteristics
Figure 7.
600
BAT54 Series
Thermal resistance junction to
ambient versus copper surface
under each lead - epoxy FR4 with
recommended pad layout,
eCU = 35 µm (SOD-323)
Rth(j-a) (°C/W)
Figure 8.
1.E+00
Relative variation of thermal
impedance junction to ambient
versus pulse duration - epoxy FR4
with recommended pad layout,
eCU = 35 µm (SOD-323)
Zth(j-a) /Rth(j-a)
Single pulse
SOD323
Epoxy FR4
eCU=35 µm
500
1.E-01
400
1.E-02
300
SCU(mm²)
tP(s)
200
0
5
Figure 9.
1.E+00
10
15
20
25
Epoxy FR4
SCU=2.25 mm²
eCU=35 µm
30
35
40
45
50
Relative variation of thermal
impedance junction to ambient
versus pulse duration aluminium oxide substrate
10 mm x 8 mm x 0.5 mm (SOT-23)
Zth(j-a) /Rth(j-a)
1.E-03
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration - epoxy FR4
with recommended pad layout,
eCU = 35 µm (SOD-523)
1.E+00
Single pulse
SOT23
Zth(j-a) /Rth(j-a)
Single pulse
SOD523
1.E-01
1.E-01
1.E-02
Alumine substrate
10 x 8 x 0.5 mm
tP(s)
1.E-02
1.E-03
1.E-02
1.E-01
tP(s)
1.E+00
1.E+01
1.E+02
Figure 11. Relative variation of thermal
impedance junction to ambient
versus pulse duration - epoxy FR4
with recommended pad layout,
eCU = 35 µm (SOT-666)
1.E+00
Zth(j-a) /Rth(j-a)
Single pulse
SOT666
1.E-01
tP(s)
1.E-02
1.E-03
4/13
1.E-02
1.E-01
Epoxy FR4
eCU=35 µm
1.E+00
1.E+01
1.E-03
1.E-03
1.E-02
1.E-01
Epoxy FR4
eCU=35 µm
1.E+00
1.E+01
BAT54 Series
2
Ordering information scheme
Ordering information scheme
BAT54
xx
xx FILM
Signal Schottky diodes
VRRM = 40 V
Configuration
No letter = Single diode
A = Common anode
C = Common cathode
S = Series diodes
07 = Parallel diodes
09 = Opposite diodes
Package
Blank = SOT-23
J = SOD-323
W = SOT-323
K = SOD-523
P6 = SOT-666
Z = SOD-123
Packing
FILM = Tape and reel
5/13
Package information
3
BAT54 Series
Package information
Epoxy meets UL94, V0
Table 5.
SOD-123 dimensions
Dimensions
Ref.
H
Millimeters
Inches
A2
A1
b
Min.
A
E
D
A
c
Max.
Min.
1.45
Max.
0.057
A1
0
0.1
0
0.004
A2
0.85
1.35
0.033
0.053
b
0.55 Typ.
0.022 Typ.
c
0.15 Typ.
0.039 Typ.
D
2.55
2.85
0.1
0.112
E
1.4
1.7
0.055
0.067
G
0.25
H
3.55
G
0.01
3.95
Figure 12. SOD-123 footprint (dimensions in mm)
4.45
0.65
0.97
6/13
2.51
0.97
0.14
0.156
BAT54 Series
Package information
Table 6.
SOD-323 dimensions
Dimensions
Ref.
H
Millimeters
Inches
A1
Min.
b
A
E
A
D
c
Q1
L
Max.
Min.
1.17
Max.
0.046
A1
0
0.1
0
0.004
b
0.25
0.44
0.01
0.017
c
0.1
0.25
0.004
0.01
D
1.52
1.8
0.06
0.071
E
1.11
1.45
0.044
0.057
H
2.3
2.7
0.09
0.106
L
0.1
0.46
0.004
0.02
Q1
0.1
0.41
0.004
0.016
Figure 13. SOD-323 footprint (dimensions in mm)
3.20
0.54
1.06
1.08
1.06
7/13
Package information
Table 7.
BAT54 Series
SOD-523 dimensions
Dimensions
E
Ref.
0.15 M C A B
E1
B
D
2xb
0.20 M C A B
A
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.50
0.60
0.70
0.020
0.024
0.028
E
1.50
1.60
1.70
0.059
0.063
0.067
E1
1.10
1.20
1.30
0.043
0.047
0.051
D
0.70
0.80
0.90
0.028
0.031
0.035
b
0.25
0.35
0.010
0.014
c
0.07
0.20
0.003
0.008
L
0.15
0.25
0.006
L1
0.10
0.20
0.004
8°
R0.1
A
c
SEATING PLANE
C
7°
L
L1
Figure 14. SOD-523 footprint (dimensions in mm)
0.7
0.3
2
8/13
0.20
0.008
0.010
0.008
BAT54 Series
Table 8.
Package information
SOT-23 dimensions
Dimensions
Ref.
Millimeters
A
Inches
Min.
Max.
Min.
Max.
A
0.89
1.4
0.035
0.055
A1
0
0.1
0
0.004
B
0.3
0.51
0.012
0.02
c
0.085
0.18
0.003
0.007
D
2.75
3.04
0.108
0.12
e
0.85
1.05
0.033
0.041
e1
1.7
2.1
0.067
0.083
E
1.2
1.6
0.047
0.063
H
2.1
2.75
0.083
0.108
E
e
B
D
e1
S
A1
L
c
H
L
0.6 typ.
S
0.35
0.65
0.024 typ.
0.014
0.026
Figure 15. SOT-23 footprint (dimensions in mm)
0.95
0.61
1.26
0.73
3.25
9/13
Package information
BAT54 Series
Table 9.
SOT-323 dimensions
Dimensions
Ref.
A
E
Millimeters
Min.
e
Typ.
Inches
Max.
Min.
Typ.
Max.
A
0.8
1.1
0.031
0.043
A1
0.0
0.1
0.0
0.004
b
0.25
0.4
0.010
0.016
c
0.1
0.26
0.004
0.010
D
1.8
2.0
2.2
0.071
0.079
0.086
E
1.15
1.25
1.35
0.045
0.049
0.053
D
b
A1
e
c
θ
L
0.65
0.026
H
1.8
2.1
2.4
0.071
0.083
0.094
L
0.1
0.2
0.3
0.004
0.008
0.012
q
0
30°
0
H
Figure 16. SOT-323 footprint (dimensions in mm)
0.95
1.0
0.8
10/13
0.50
2.9
30°
BAT54 Series
Package information
Table 10.
SOT-666 dimensions
Dimensions
b1
Ref.
Millimeters
Inches
L1
Min.
L3
Typ.
Max.
Min.
Typ.
Max.
A
0.45
0.60 0.018
0.024
A3
0.08
0.18 0.003
0.007
b
0.17
0.34 0.007
0.013
b1
0.19
D
1.50
1.70 0.059
0.067
E
1.50
1.70 0.059
0.067
E1
1.10
1.30 0.043
0.051
b
D
E1
0.27
0.34 0.007 0.011 0.013
A
L2
E
A3
e
0.50
0.020
L1
0.19
0.007
L2
0.10
0.30 0.004
0.012
e
L3
0.10
0.004
Figure 17. SOT-666 footprint (dimensions in mm)
0.50
0.62
2.60
0.99
0.30
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
11/13
Ordering information
4
5
12/13
BAT54 Series
Ordering information
Part Number
Marking
Package
Weight
Base qty
Delivery mode
BAT54FILM
D86
SOT-23 Single
10 mg
3000
Tape and reel
BAT54SFILM
D88
SOT-23 Serial
10 mg
3000
Tape and reel
BAT54CFILM
D87
SOT-23
Common cathode
10 mg
3000
Tape and reel
BAT54AFILM
D84
SOT-23
Common anode
10 mg
3000
Tape and reel
BAT54WFILM
D73
SOT-323 Single
6 mg
3000
Tape and reel
BAT54SWFILM
D78
SOT-323 Serial
6 mg
3000
Tape and reel
BAT54CWFILM
D77
SOT-323
Common cathode
6 mg
3000
Tape and reel
BAT54AWFILM
D74
SOT-323
Common anode
6 mg
3000
Tape and reel
BAT54JFILM
86
SOD-323
5 mg
3000
Tape and reel
BAT54KFILM
86
SOD-523
1.4 mg
3000
Tape and reel
BAT54-07P6FILM
P4
SOT-666 Parallel
2.9 mg
3000
Tape and reel
BAT54-09P6FILM
Q4
SOT-666 Opposite
2.9 mg
3000
Tape and reel
BAT54ZFILM
D72
SOD-123
10 mg
3000
Tape and reel
Revision history
Date
Revision
Description of Changes
Jun-1999
8
Last update.
24-Jul-2006
9
BAT54, A, C, S and BAT54J / W / AW / CW /SW
datasheets merged. ECOPACK statement added. SOD123, SOD-523 and SOT-666 packages added.
BAT54 Series
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13/13
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