CALMIRCO CM1451-06 Lcd & camera emi filter array with esd protection Datasheet

PRELIMINARY
CM1451
LCD & Camera EMI Filter Array with ESD Protection
Features
Product Description
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•
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The CM1451 is an inductor-capacitor (L-C) based EMI
filter array with integrated ESD protection in CSP form
factor. The CM1451-06 is configured in a 6 channel
format. Each EMI filter channel of the CM1451 is
implemented as a 5-pole L-C filter where the component values are 10pF-17nH-10pF-17nF-10pF. The
CM1451's roll-off frequency at -10dB attenuation is
400MHz and can be used in applications where the
data rates are as high as 120Mbps while providing
greater than 35dB over the 800MHz to 2.7GHz frequency range. The parts integrate ESD protection
diodes on every pin, which provide a very high level of
protection for sensitive electronic components that may
be subjected to electrostatic discharge (ESD). The
ESD protection diodes connected to the filter ports are
designed and characterized to safely dissipate ESD
strikes of ±15kV, beyond the Level 4 requirement of
the IEC61000-4-2 international standard. Using the
MIL-STD-883 (Method 3015) specification for Human
Body Model (HBM) ESD, the pins are protected for
contact discharges at greater than ±30kV.
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•
•
•
•
•
•
High bandwidth, high RF rejection filter array
Six channels of EMI filtering
Utilizes Praetorian™ inductor-based design technology for true L-C filter implementation
OptiGuard™ coating for improved reliability
±15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
±30kV ESD protection on each channel (HBM)
Better than 40dB of attenuation at 1GHz
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
15-bump, 3.006mm x 1.376mm footprint
Chip Scale Package (CM1451-06CS/CP)
Lead-free version available
Applications
•
•
•
•
•
•
LCD and Camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs, etc.
EMI filtering for data phones in cell phones, PDAs
or notebook computersWireless handsets / cell
phones
Wireless Handsets
Handheld PCs/PDAs
LCD and camera modules
This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs) because of its
small package format and easy-to-use pin assignments. In particular, the CM1451 is ideal for EMI filtering and protecting data and control lines for the LCD
display and camera interface in wireless handsets.
The CM1451 incorporates OptiGuard™ which results in
improved reliability at assembly. The CM1451 is available in a space saving, low profile Chip Scale Package
with optional lead-free finishing.
.
Electrical Schematic
L1
L2
FILTERn*
FILTERn*
C
C
C
GND
(Pins B1-Bn)
1 of 6 EMI Filtering + ESD Channels
* See Package/Pinout Diagram
for expanded pin information.
© 2005 California Micro Devices Corp. All rights reserved.
01/29/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
1
PRELIMINARY
CM1451
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
TOP VIEW
(Bumps Up View)
(Bumps Down View)
Orientation
Marking
(see note 2)
1
2
3
4
5
6
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
C1
C2
C3
C4
C5
C6
A
GND
B
N516
GND
B1
Orientation
Marking
C
GND
B2
B3
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
A1
A2
A3
A4
A5
A6
A1
CM1451-06CS/CP 15-Bump CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
PIN(s)
NAME
DESCRIPTION
A1
FILTER1
Filter Channel 1
C1
FILTER1
Filter Channel 1
A2
FILTER2
Filter Channel 2
C2
FILTER2
Filter Channel 2
A3
FILTER3
Filter Channel 3
C3
FILTER3
Filter Channel 3
A4
FILTER4
Filter Channel 4
C4
FILTER4
Filter Channel 4
A5
FILTER5
Filter Channel 5
C5
FILTER5
Filter Channel 5
A6
FILTER6
Filter Channel 6
C6
FILTER6
Filter Channel 6
B1-B3
GND
Device Ground
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
Bumps
Package
Ordering Part
Number1
Part Marking
Ordering Part
Number1
Part Marking
15
CSP
CM1451-06CS
N516
CM1451-06CP
N516
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2005 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
01/29/05
PRELIMINARY
CM1451
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
LTOT
Total Channel Inductance (L1 + L2)
34
nH
L1, L2
Inductance
17
nH
CTOT
Total Channel Capacitance (C1+ C2 + C3 )
C1, C2, C3 Capacitance
At 2.5V DC, 1MHz,
30mV AC
24
30
36
pF
At 2.5V DC, 1MHz,
30mV AC
8
10
12
pF
fC
Cut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
200
MHz
fC
Roll-off Frequency at -10dB Attenuation
ZSOURCE=50Ω, ZLOAD=50Ω
400
MHz
VDIODE
Diode Standoff Voltage
IDIODE=10µA
ILEAK
Diode Leakage Current (reverse bias)
VDIODE=+3.3V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2,4 and 5
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
VCL
5.5
V
100
5.6
-1.5
6.8
-0.8
nA
9.0
-0.4
V
V
±30
kV
±15
kV
+12
-7
V
V
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
© 2005 California Micro Devices Corp. All rights reserved.
01/29/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
3
PRELIMINARY
CM1451
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1)
Figure 2. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
© 2005 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
01/29/05
PRELIMINARY
CM1451
Performance Information (cont’d)
AC Characteristics
Figure 3. 2ns Rise and Fall Times of Signals Clocked at 75MHz
through CM1451 Filter Array (Simulation)
Figure 4. 2ns Rise and Fall Times of Signals Clocked at 50MHz
through CM1451 Filter Array (Simulation)
© 2005 California Micro Devices Corp. All rights reserved.
01/29/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
5
PRELIMINARY
CM1451
Performance Information (cont’d)
AC Characteristics
Figure 5. 2ns Rise and Fall Times of Signals Clocked at 25MHz
through CM1451 Filter Array (Simulation)
© 2005 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
01/29/05
PRELIMINARY
CM1451
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50µm
Solder Ball Side Coplanarity
+20µm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Soldering Maximum Temperature
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 6. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 7. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 8. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
01/29/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
7
PRELIMINARY
CM1451
Mechanical Details
CM1450-06CS/CP CSP Mechanical Specifications
Mechanical Package Diagrams
CM1451-06CS/CP devices are packaged in a custom
Chip Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging,
see the California Micro Devices CSP Package Information document.
BOTTOM VIEW
C1
C
B
Bumps
15
A
Millimeters
Nom
Inches
Max
Min
Nom
1
Max
A1
2.915 2.960 3.005 0.1148 0.1165 0.1183
A2
1.285 1.330 1.375 0.0506 0.0524 0.0541
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.180 0.230 0.280 0.0071 0.0091 0.0110
C2
0.180 0.230 0.280 0.0071 0.0091 0.0110
D1
0.600 0.670 0.739 0.0236 0.0264 0.0291
D2
0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
A2
Custom CSP
C2
Package
Min
B2
B1
B4
B3
PACKAGE DIMENSIONS
Dim
OptiGuardTM
Coating
A1
2
3
4
5
6
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1451CS/CP Chip Scale Package
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B 0 X A0 X K0
CM1451-06
2.96 X 1.33 X 0.6
3.10 X 1.45 X 0.74
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
8mm
178mm (7")
3500
4mm
4mm
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Po
Top
Cover
Tape
Ao
W
Bo
Ko
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
Center Lines
of Cavity
P1
User Direction of Feed
Figure 9. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
01/29/05
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