TOSHIBA Original CMOS 8-Bit Microcontroller TLCS-870 Series TMP87C408MG, TMP87C408NG TMP87C808MG, TMP87C808NG TMP87C408LMG, TMP87C408LNG TMP87C808LMG, TMP87C808LNG TMP87C408DMG Semiconductor Company TMP87C408/808/408L/808L Document Change Notification The purpose of this notification is to inform customers about the launch of the Pb-free version of the device. The introduction of a Pb-free replacement affects the datasheet. Please understand that this notification is intended as a temporary substitute for a revision of the datasheet. Changes to the datasheet may include the following, though not all of them may apply to this particular device. 1. Part number Example: TMPxxxxxxF → TMPxxxxxxFG All references to the previous part number were left unchanged in body text. The new part number is indicated on the prelims pages (cover page and this notification). 2. Package code and package dimensions Example: LQFP100-P-1414-0.50C → LQFP100-P-1414-0.50F All references to the previous package code and package dimensions were left unchanged in body text. The new ones are indicated on the prelims pages. 3. Addition of notes on lead solderability Now that the device is Pb-free, notes on lead solderability have been added. 4. RESTRICTIONS ON PRODUCT USE The previous (obsolete) provision might be left unchanged on page 1 of body text. A new replacement is included on the next page. 5. Publication date of the datasheet The publication date at the lower right corner of the prelims pages applies to the new device. I 2008-03-06 TMP87C408/808/408L/808L 1. Part number 2. Package code and dimensions Previous Part Number Previous Package Code New Part Number (in Body Text) (in Body Text) New Package Code OTP TMP87C408M SOP28_P_450_1.27 TMP87C408MG SOP28-P-450-1.27B TMP87P808MG TMP87C408N SDIP28_P_400_1.78 TMP87C408NG SDIP28-P-400-1.78 TMP87P808NG TMP87C408DM SSOP30_P_56_0.65 TMP87C408DMG SSOP30-P-56-0.65 — TMP87C808M SOP28_P_450_1.27 TMP87C808MG SOP28-P-450-1.27B TMP87P808MG TMP87C808N SDIP28_P_400_1.78 TMP87C808NG SDIP28-P-400-1.78 TMP87P808NG TMP87C408LM SOP28_P_450_1.27 TMP87C408LMG SOP28-P-450-1.27B TMP87P808LMG TMP87C408LN SDIP28_P_400_1.78 TMP87C408LNG SDIP28-P-400-1.78 TMP87P808LNG TMP87C808LM SOP28_P_450_1.27 TMP87C808LMG SOP28-P-450-1.27B TMP87P808LMG TMP87C808LN SDIP28_P_400_1.78 TMP87C808LNG SDIP28-P-400-1.78 TMP87P808LNG *: For the dimensions of the new package, see the attached Package Dimensions diagram. 3. Addition of notes on lead solderability The following solderability test is conducted on the new device. Lead solderability of Pb-free devices (with the G suffix) Test Solderability Test Conditions (1) Use of Lead (Pb) ·solder bath temperature = 230°C ·dipping time = 5 seconds ·the number of times = once ·use of R-type flux (2) Use of Lead (Pb)-Free ·solder bath temperature = 245°C ·dipping time = 5 seconds ·the number of times = once ·use of R-type flux Remark Leads with over 95% solder coverage till lead forming are acceptable. II 2008-03-06 TMP87C408/808/408L/808L 4. RESTRICTIONS ON PRODUCT USE The following replaces the “RESTRICTIONS ON PRODUCT USE” on page 1 of body text. RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. • For a discussion of how the reliability of microcontrollers can be predicted, please refer to Section 1.3 of the chapter entitled Quality and Reliability Assurance/Handling Precautions. 5. Publication date of the datasheet The publication date of this datasheet is printed at the lower right corner of this notification. III 2008-03-06 TMP87C408/808/408L/808L (Annex) Package Dimensions SOP28-P-450-1.27B Unit: mm (450mil) 11.43 11.8 0.2 0.2 8.8 0.995TYP 0.1 +0.1 -0.05 1 0.2 15 28 14 0.43 +0.1 -0.06 1.27 0.2 M 19.0MAX 0.2 2.7MAX 0.10 2.4 +0.08 0.15 -0.04 18.5 0.8 0.2 Note: Palladium plated IV 2008-03-06 TMP87C408/808/408L/808L SDIP28-P-400-1.78 Unit: mm Note: Palladium plated V 2008-03-06 TMP87C408/808/408L/808L SSOP30-P-56-0.65 Unit: mm VI 2008-03-06