AD ADP3333ARM-5 High accuracy ultralow iq, 300 ma, anycap low dropout regulator Datasheet

a
High Accuracy Ultralow IQ, 300 mA,
anyCAP® Low Dropout Regulator
ADP3333
FEATURES
High Accuracy Over Line and Load: 0.8% @ 25C,
1.8% Over Temperature
Ultralow Dropout Voltage: 230 mV (Max) @ 300 mA
Requires Only CO = 1.0 F for Stability
anyCAP = Stable with Any Type of Capacitor
(Including MLCC)
Current and Thermal Limiting
Low Noise
Low Shutdown Current: < 1 A
2.6 V to 12 V Supply Range
–40C to +85C Ambient Temperature Range
Ultrasmall 8-Lead MSOP Package
FUNCTIONAL BLOCK DIAGRAM
Q1
IN
OUT
ADP3333
THERMAL
PROTECTION
R1
CC
gm
DRIVER
R2
SD
BANDGAP
REF
GND
APPLICATIONS
Cellular Phones
PCMCIA Cards
Personal Digital Assistants (PDAs)
DSP/ASIC Supplies
GENERAL DESCRIPTION
ADP3333 is a member of the ADP333x family of precision low
dropout anyCAP voltage regulators. Pin-compatible with the
MAX8860, the ADP3333 operates with a wider input voltage
range of 2.6 V to 12 V and delivers a load current up to 300 mA.
ADP3333 stands out from other conventional LDOs with a
novel architecture and an enhanced process that enables it to
offer performance advantages over its competition. Its patented
design requires only a 1.0 µF output capacitor for stability. This
device is insensitive to output capacitor Equivalent Series Resistance (ESR), and is stable with any good quality capacitor,
including ceramic (MLCC) types for space-restricted applications. ADP3333 achieves exceptional accuracy of ± 0.8% at
room temperature and ± 1.8% over temperature, line and load
variations. The dropout voltage of ADP3333 is only 140 mV
(typical) at 300 mA. This device also includes a safety current
limit, thermal overload protection and a shutdown feature. In
shutdown mode, the ground current is reduced to less than
1 µA. The ADP3333 has ultralow quiescent current, 70 µA (typ)
in light load situations.
ADP3333
NC
VIN
IN
VOUT
OUT
CIN
1F
SD
GND
COUT
1F
OFF
ON
NC = NO CONNECT
Figure 1. Typical Application Circuit
anyCAP is a registered trademark of Analog Devices, Inc.
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 2001
ADP3333–SPECIFICATIONS1 (V
IN
= 6.0 V, CIN = COUT = 1.0 F, TJ = –40C to +125C, unless otherwise noted)
Parameter
Symbol
Condition
Min
OUTPUT
Voltage Accuracy2
VOUT
VIN = VOUTNOM 0.3 V to 12 V
IL = 0.1 mA to 300 mA
TJ = 25°C
VIN = VOUTNOM 0.3 V to 12 V
IL = 0.1 mA to 300 mA
VIN = VOUTNOM 0.3 V to 12 V
TJ = 25°C
IL = 0.1 mA to 300 mA
TJ = 25°C
VOUT = 98% of VOUTNOM
IL = 300 mA
IL = 200 mA
IL = 0.1 mA
VIN = VOUTNOM + 1 V
f = 10 Hz–100 kHz, CL = 10 µF
IL = 300 mA
Line Regulation2
Load Regulation
Dropout Voltage
Peak Load Current
Output Noise
GROUND CURRENT
In Regulation
In Dropout
In Shutdown
SHUTDOWN
Threshold Voltage
VDROP
ILDPK
VNOISE
IGND
IGND
IGNDSD
VTHSD
SD Input Current
ISD
Output Current In Shutdown
IOSD
Max
Unit
0.8
0.8
%
–1.8
+1.8
%
IL = 300 mA
IL = 300 mA, TJ = 25°C
IL = 300 mA, TJ = 85°C
IL = 200 mA
IL = 10 mA
IL = 0.1 mA
VIN = VOUTNOM – 100 mV
IL = 0.1 mA,
VIN = VOUTNOM – 100 mV
IL = 0.1 mA, TJ = 0°C to 125°C
SD = 0 V, VIN = 12 V
ON
OFF
0 ≤ SD ≤ 12 V
0 ≤ SD ≤ 5 V
TJ = 25°C VIN = 12 V
TJ = 125°C VIN = 12 V
Typ
0.04
mV/V
0.04
mV/mA
140
105
30
600
45
230
185
mV
mV
mV
mA
µV rms
2.0
2.0
1.5
1.4
200
70
70
5.5
4.3
3.3
275
100
190
mA
mA
mA
mA
µA
µA
µA
70
160
µA
0.01
1
µA
0.85
0.8
0.01
0.01
0.4
7
4.5
1
1
V
V
µA
µA
µA
µA
2.0
NOTES
1
Application stable with no load.
2
VIN = 2.6 V for models with VOUTNOM ≤ 2.3 V.
Specifications subject to change without notice.
–2–
REV. 0
ADP3333
PIN FUNCTION DESCRIPTIONS
ABSOLUTE MAXIMUM RATINGS*
Input Supply Voltage . . . . . . . . . . . . . . . . . . . –0.3 V to +16 V
Shutdown Input Voltage . . . . . . . . . . . . . . . . –0.3 V to +16 V
Power Dissipation . . . . . . . . . . . . . . . . . . . Internally Limited
Operating Ambient Temperature Range . . . . –40°C to +85°C
Operating Junction Temperature Range . . . –40°C to +125°C
␪JA (4-layer) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158°C/W
␪JA (2-layer) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C/W
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . 300°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Pin
Mnemonic Function
1
OUT
2
IN
3
GND
4–6, 8 NC
7
SD
*This is a stress rating only; operation beyond these limits can cause the device to
be permanently damaged.
Output of the Regulator. Bypass to ground
with a 1.0 µF or larger capacitor.
Input pin. Bypass to ground with a 1.0 µF
or larger capacitor.
Ground Pin
No Connect
Active Low Shutdown Pin. Connect to
ground to disable the regulator output.
When shutdown is not used, his pin should
be connected to the input pin
ORDERING GUIDE
Model
Output
Voltage
Package
Option
Branding
Information
ADP3333ARM-1.5
1.5 V
RM-8
(MSOP-8)
RM-8
(MSOP-8)
RM-8
(MSOP-8)
RM-8
(MSOP-8)
RM-8
(MSOP-8)
RM-8
(MSOP-8)
RM-8
(MSOP-8)
RM-8
(MSOP-8)
LKA
ADP3333ARM-1.8
1.8 V
ADP3333ARM-2.5
2.5 V
ADP3333ARM-2.77
2.77 V
ADP3333ARM-3
3V
ADP3333ARM-3.15
3.15 V
ADP3333ARM-3.3
3.3 V
ADP3333ARM-5
5V
PIN CONFIGURATION
OUT 1
IN 2
8
NC
7
SD
TOP VIEW
GND 3 (Not to Scale) 6 NC
LKB
NC* 4
5
LKC
NC
NC = NO CONNECT
LKD
*CAN BE CONNECTED
TO ANY OTHER PIN.
LKE
LKF
LKG
LKH
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADP3333 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
REV. 0
ADP3333
–3–
WARNING!
ESD SENSITIVE DEVICE
ADP3333 –Typical Performance Characteristics
2.502
2.502
VOUT = 2.5V
0mA
2.498
100mA
2.496
2.494
200mA
2.492
2.498
2.496
2.494
2.492
4
5
6
8
7
9 10
INPUT VOLTAGE – V
OUTPUT CHANGE – %
GROUND CURRENT – mA
2.0
1.0
0.5
0
100
150
200
OUTPUT LOAD – mA
250
0
2
4
6
8
10
INPUT VOLTAGE – Volts
12
TPC 3. Ground Current vs. Supply
Voltage
3.5
0
VIN = 6V
3.0
200mA
0.4
0.3
0.2
300mA
0.1
0.0
–0.1
–0.4
–50
300
TPC 4. Ground Current vs.
Load Current
300
0.6
0.5
–0.2
–0.3
50
150
250
200
100
OUTPUT LOAD – mA
1.0
0.9
0.8
0.7
VIN = 6V
0
50
TPC 2. Output Voltage vs. Load
Current
2.5
1.5
40
0
0
TPC 1. Line Regulation Output
Voltage vs. Supply Voltage
IL = 0
60
2.488
12
11
GROUND CURRENT – mA
3
80
20
2.490
2.488
VOUT = 2.5V
100
300mA
2.490
IL = 100A
120
GROUND CURRENT – A
2.500
OUTPUT VOLTAGE – V
OUTPUT VOLTAGE – V
2.500
140
VIN = 6V
VOUT = 2.5V
IL = 300mA
2.5
IL = 200mA
IL = 100mA
2.0
1.5
1.0
0.5
IL = 0mA
0
–25
0
25
50
75
100
JUNCTION TEMPERATURE – C
0
–50
125
–25
0
25
50
75
100
125
JUNCTION TEMPERATURE – C
TPC 6. Ground Current vs.
Junction Temperature
TPC 5. Output Voltage Variation % vs.
Junction Temperature
0.10
0.08
0.06
0.04
0.02
0
0
50
100
150
200
OUTPUT LOAD – mA
250
TPC 7. Dropout Voltage vs.
Output Current
300
VOUT = 2.5V
SD = VIN
RL = 8.3
3.0
2.5
2.0
3
COUT = 1F
2
COUT = 10F
1
0
1.5
VIN – V
0.12
VOUT – V
0.14
INPUT/OUTPUT VOLTAGE – V
INPUT/OUTPUT VOLTAGE – mV
0.16
1.0
0.5
4
2
VOUT = 2.5V
SD = VIN
RL = 8.3
0
0
1
2
3
TIME – Sec
4
TPC 8. Power-Up/Power-Down
–4–
200
400
600
TIME – s
800
TPC 9. Power-Up Response
REV. 0
ADP3333
2.50
3.00
40
80
140
TIME – s
2.5
2.49
2.4
mA
10
80
140
TIME – s
180
200
TPC 11. Line Transient Response
400
600
TIME – s
800
TPC 12. Load Transient Response
3 1F
Volts
2.6
3.00
40
VIN = 4V
VOUT = 2.5V
CL = 10F
2.7
3.50
180
TPC 10. Line Transient Response
Volts
2.6
2.50
300
3.50
VIN – V
VIN – V
2.49
Volts
2.51
VIN = 4V
VOUT = 2.5V
CL = 1F
2.7
2.5
2.5
2.4
0
1
10F
0
3
1F
VIN = 6V
2
A
300
10F
2
VOUT
VOUT – V
2.51
VOUT = 2.5V
RL = 8.3
CL = 10F
2.52
VOUT – V
VOUT = 2.5V
RL = 8.3
CL = 1F
2.52
2
VSD
mA
1
10
0
VIN = 6V
VOUT = 2.5V
RL = 8.3
0
VIN = 6V
200
400
TIME – s
600
800
200
TPC 13. Load Transient Response
100
–40
100
CL = 1F
IL = 50A
–50
–60
VOLTAGE NOISE SPECTRAL
DENSITY – V/ Hz
CL = 1F
IL = 500mA
CL = 10F
IL = 500mA
80
60
300mA
40
–70
0mA
20
0
–90
10
100
1k
10k
100k
FREQUENCY – Hz
1M
10M
TPC 16. Power Supply Ripple
Rejection
REV. 0
800
VOUT = 2.5V
IL = 1mA
CL = 10F
10
CL = 1F
1
0.1
0.01
CL = 10F
IL = 50A
–80
400
600
TIME – s
TPC 15. Turn ON-Turn OFF
Response
120
VOUT = 2.2V
–30
RIPPLE REJECTION – dB
200
800
TPC 14. Short Circuit Current
RMS NOISE – V
–20
400
600
TIME – s
0
10
20
30
CL – F
40
TPC 17. RMS Noise vs. CL
(10 Hz–100 kHz)
–5–
50
0.001
10
100
1k
10k
100k
FREQUENCY – Hz
1M
TPC 18. Output Noise Density
ADP3333
designing with LDOs more difficult because of their unclear
specifications and extreme variations over temperature.
THEORY OF OPERATION
The new anyCAP LDO ADP3333 uses a single control loop for
regulation and reference functions see (Figure 2). The output
voltage is sensed by a resistive voltage divider consisting of R1
and R2 which is varied to provide the available output voltage
option. Feedback is taken from this network by way of a series
diode (D1) and a second resistor divider (R3 and R4) to the
input of an amplifier.
With the ADP3333 anyCAP LDO, this is no longer true. It can be
used with virtually any good quality capacitor, with no constraint
on the minimum ESR. This innovative design allows the circuit to
be stable with just a small 1 µF capacitor on the output. Additional
advantages of the pole splitting scheme include superior line noise
rejection and very high regulator gain which leads to excellent line
and load regulation. An impressive ±1.8% accuracy is guaranteed
over line, load and temperature.
OUTPUT
INPUT
ATTENUATION
(VBANDGAP /V OUT)
Q1
COMPENSATION
CAPACITOR
NONINVERTING
WIDEBAND
DRIVER
gm
R3
PTAT
VOS
CLOAD
D1
FB
R4
ADP3333
Additional features of the circuit include current limit and thermal shutdown.
R1
(a)
PTAT
CURRENT
APPLICATION INFORMATION
RLOAD
Capacitor Selection
Output Capacitor
R2
The stability and transient response of the LDO is a function of
the output capacitor. The ADP3333 is stable with a wide range
of capacitor values, types and ESR (anyCAP). A capacitor as
low as 1.0 µF is all that is needed for stability; larger capacitors
can be used if high current surges on the output are anticipated.
The ADP3333 is stable with extremely low ESR capacitors
(ESR » 0), such as Multilayer Ceramic Capacitors (MLCC) or
OSCON. Note that the effective capacitance of some capacitor
types fall below the minimum over temperature or with dc voltage.
Ensure that the capacitor provides at least 1.0 µF of capacitance
over temperature and dc bias.
GND
Figure 2. Functional Block Diagram
A very high gain error amplifier is used to control this loop. The
amplifier is constructed in such a way that at equilibrium it produces a large, temperature-proportional input “offset voltage” that
is repeatable and very well controlled. The temperature proportional offset voltage is combined with the complementary diode
voltage to form a “virtual bandgap” voltage, implicit in the network,
although it never appears explicitly in the circuit. Ultimately, this
patented design makes it possible to control the loop with only one
amplifier. This technique also improves the noise characteristics
of the amplifier by providing more flexibility on the trade-off of
noise sources that leads to a low noise design.
Input Bypass Capacitor
An input bypass capacitor is not strictly required but it is recommended in any application involving long input wires or high
source impedance. Connecting a 1.0 µF capacitor from the input
to ground reduces the circuit's sensitivity to PC board layout and
input transients. If a larger output capacitor is necessary then a
larger value input capacitor is also recommended.
The R1, R2 divider is chosen in the same ratio as the bandgap
voltage to the output voltage. Although the R1, R2 resistor divider
is loaded by the diode D1 and a second divider consisting of R3
and R4, the values can be chosen to produce a temperature stable
output. This unique arrangement specifically corrects for the loading of the divider so that the error resulting from base current
loading in conventional circuits is avoided.
Output Current Limit
The ADP3333 is short circuit protected by limiting the pass
transistor’s base drive current. The maximum output current is
limited to about 1 A. See TPC 14.
Thermal Overload Protection
The patented amplifier controls a new and unique noninverting
driver that drives the pass transistor, Q1. The use of this special
noninverting driver enables the frequency compensation to include
the load capacitor in a pole splitting arrangement to achieve
reduced sensitivity to the value, type and ESR of the load
capacitance.
The ADP3333 is protected against damage due to excessive power
dissipation by its thermal overload protection circuit. Thermal
protection limits the die temperature to a maximum of 165°C.
Under extreme conditions (i.e., high ambient temperature and
power dissipation) where the die temperature starts to rise above
165°C, the output current will be reduced until the die temperature has dropped to a safe level.
Most LDOs place very strict requirements on the range of ESR
values for the output capacitor because they are difficult to stabilize
due to the uncertainty of load capacitance and resistance. Moreover,
the ESR value, required to keep conventional LDOs stable, changes
depending on load and temperature. These ESR limitations make
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For normal
operation, the device's power dissipation should be externally
limited so that the junction temperature will not exceed 125°C.
–6–
REV. 0
ADP3333
Calculating Junction Temperature
Printed Circuit Board Layout Considerations
Device power dissipation is calculated as follows:
Use the following general guidelines when designing printed
circuit boards:
1. Keep the output capacitor as close to the output and ground
pins as possible.
2. Keep the input capacitor as close to the input and ground
pins as possible.
3. PC board traces with larger cross sectional areas will remove
more heat from the ADP3333. For optimum heat transfer,
specify thick copper and use wide traces.
4. Connect the NC pins (Pins 5, 6, and 8) to ground for better
thermal performance.
5. The thermal resistance can be decreased by approximately
10% by adding a few square centimeters of copper area to
the lands connected to the pins of the LDO.
6. Use additional copper layers or planes to reduce the thermal
resistance. Again, connecting the other layers to the ground and
NC pins of the ADP3333 is best, but not necessary. When
connecting the ground pad to other layers use multiple vias.
PD = (VIN − VOUT ) I LOAD + (VIN ) IGND
Where ILOAD and IGND are load current and ground current, VIN
and VOUT are the input and output voltages respectively.
Assuming the worst-case operating conditions are ILOAD =
300 mA, IGND = 2.6 mA, VIN = 4.0 V and VOUT = 3.0 V, the
device power dissipation is:
PD = (4.0 V − 3.0 V ) 300 mA + (4.2 V ) 2.0 mA = 308 mW
The package used on the ADP3333 has a thermal resistance of
158°C/W for 4-layer boards. The junction temperature rise
above ambient will be approximately equal to:
T JA = 0.308 W × 158°C / W = 48.7°C
So, to limit the junction temperature to 125°C, the maximum
allowable ambient temperature is:
T A( MAX ) = 125°C − 48.7°C = 76.3°C
Shutdown Mode
Applying a high signal to the shutdown pin, or connecting it to
the input pin, will turn the output ON. Pulling the shutdown
pin to 0.3 V or below, or connecting it to ground, will turn the
output OFF. In shutdown mode, the quiescent current is reduced
to less than 1 µA.
REV. 0
–7–
ADP3333
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
C02615–1.5–7/01(0)
8-Lead Mini/micro SOIC Package [Mini_SO]
(RM-8)
0.122 (3.10)
0.114 (2.90)
8
5
0.199 (5.05)
0.187 (4.75)
0.122 (3.10)
0.114 (2.90)
1
4
PIN 1
0.0256 (0.65) BSC
0.120 (3.05)
0.112 (2.84)
0.120 (3.05)
0.112 (2.84)
0.018 (0.46)
SEATING 0.008 (0.20)
PLANE
0.043 (1.09)
0.037 (0.94)
0.011 (0.28)
0.003 (0.08)
33
27
0.028 (0.71)
0.016 (0.41)
PRINTED IN U.S.A.
0.006 (0.15)
0.002 (0.05)
–8–
REV. 0
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