CALMIRCO CM1240 Dual-voltage esd protection array for usb port Datasheet

CM1240
Dual-Voltage ESD Protection Array for USB Port
Features
•
•
•
•
•
•
•
•
channel of the CM1240 is a high voltage (HV) diode
which has a capacitance of 25pF enabling it to protect
power supply inputs or OLED power rails, etc.
4 channels of ESD Protection
8kV ESD protection (IEC 61000-4-2, contact
discharge)
16kV ESD protection (HBM)
SOT-563
TDFN-8, 1.70mm x 1.35mm, 0.4mm pitch
TDFN-8, 2mm x 2mm, 0.5mm pitch
Lead free
16V clamp on Vcc
The parts integrate avalanche-type ESD diodes, which
provide a very high level of protection for sensitive
electronic components that may be subjected to
electrostatic discharge (ESD). The ESD protection
diodes are designed and characterized to safely
dissipate ESD strikes of 8kV, the maximum
requirement of the IEC61000-4-2 international
standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
pins are protected for contact discharges of greater
than 16kV.
Applications
•
•
•
USB and Mini-USB applications
I/O port protection for mobile handsets
Wireless handsets
Product Description
California Micro Devices’ CM1240 is a four channel
ESD protection array. Three channels of the CM1240
are low voltage (LV) diodes, which have a capacitance
of 7pF enabling them to protect high speed I/O ports
while providing robust ESD protection. The other
This device is particularly well suited for portable
electronics (e.g. wireless handsets, PDAs, notebook
computers) because of its small package format and
easy-to-use pin assignments. In particular, the
CM1240 is ideal for protecting USB or mini USB ports
operating at full speed (12Mbps).
The CM1240 is available in a space saving, low profile,
lead-free TDFN-8 or SOT-563 package.
PACKAGE / PINOUT DIAGRAMS
TDFN-8
SOT-563
D1 1
D1
1
6 GND
D2 2
5 D3
VCC 3
4
2
NC
DAP 6
D3 3
7 NC
VCC 4
8 NC
D2
GND
5 NC
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish
Leads
Package
Ordering Part Number
Part Marking
6
SOT-563
CM1240-F4SE
L40
8
TDFN-0.5mm
CM1240-04DE
L40 4E
8
TDFN-0.4mm
CM1240-04D4
L4
PIN DESCRIPTIONS
© 2007 California Micro Devices Corp. All rights reserved.
5/16/07
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
l
Tel: 408.263.3214
l
Fax: 408.263.7846
l
www.cmd.com
1
CM1240
Specifications
SOT-563
PIN#
TDFN
PIN#
NAME
1
1
D1
Cathode connection for Low Voltage ESD diode
2
2
D2
Cathode connection for Low Voltage ESD diode
5
3
D3
Cathode connection for Low Voltage ESD diode
3
4
Vcc
Cathode connection for High Voltage ESD diode
–
5
NC
No connect
–
6
NC
No connect
–
7
NC
No connect
No connect
DESCRIPTION
–
8
NC
4
DAP
GND
Anode-side connection for all ESD diodes
6
–
GND
Anode-side connection for all ESD diodes
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
±16
kV
[GND - 0.3] to +13
[GND - 0.3] to +5.5
V
V
–65 to +150
°C
300
°C
RATING
UNITS
–40 to +85
°C
ESD Protection (HBM)
Pin Voltages
Vcc to GND
All other pins to GND
Storage Temperature Range
Lead Temperature (soldering, 10sec)
STANDARD OPERATING CONDITIONS
PARAMETER
Operating temperature range
© 2007 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
l
Tel: 408.263.3214
l
Fax: 408.263.7846
l
www.cmd.com
5/16/07
CM1240
Specifications
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
CLV
LV diode Capacitance at 3Vdc; 1MHz, 30mVac
6
pF
CHV
HV diode Capacitance at 3Vdc; 1MHz, 30mVac
25
pF
ILV
LV Diode Leakage at +3.3V reverse bias voltage
0.01
0.4
μA
IHV
HV Diode Leakage at +11V reverse bias voltage
0.01
0.4
μA
VCL(LV)
LV Diode Signal Clamp Voltage:
Positive Clamp, 10mA
Negative Clamp, –10mA
5.6
–1.5
6.8
–0.8
9
–0.4
V
V
VCL(HV)
HV Diode Signal Clamp Voltage:
Positive Clamp, 10mA
Negative Clamp, –10mA
13
–1.5
16
–0.8
19
–0.4
V
V
VESD
In-system ESD withstand voltage:
Human Body Model (MIL-STD-883, method 3015)
IEC 61000-4-2, contact discharge method
Note 2
±25
±12
kV
kV
RDYN(LV)
LV Diode Dynamic Resistance:
Positive
Negative
2.8
1.2
Ω
Ω
RDYN(HV)
HV Diode Dynamic Resistance:
Positive
Negative
1
0.7
Ω
Ω
Note 1: Guaranteed at 25°C only
Note 2: ESD applied to input/output pins with respect to GND, one at a time. These parameters are guaranteed by design.
© 2007 California Micro Devices Corp. All rights reserved.
5/16/07
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
l
Tel: 408.263.3214
l
Fax: 408.263.7846
l
www.cmd.com
3
CM1240
Mechanical Details
SOT-563 Mechanical Specifications
MechanicalPackage
PackageDiagrams
Diagrams
Mechanical
The CM1240 is supplied in a 6-pin SOT-563 package.
Dimensions are presented below.
TOP VIEW
PACKAGE DIMENSIONS
Package
SOT-563
D
Leads
6
e1
Dim.
A
Millimeters
Max
Min
Nom
Max
0.50
0.55
0.60
0.020
0.022
0.024
0.17
c
0.08
D
0.22
0.27
0.007
0.18
0.003
1.60 BSC
1.50
1.60
0.009
0.011
0.059
E
0.20
CD
1
Pin 1
Marking
2
3
e
0.20
b
c
2X
0.067
E1
1.20 BSC
0.047 BSC
e
0.50 BSC
0.020 BSC
e1
1.00 BSC
0.040 BSC
L
0.20 BSC
0.008 BSC
# per
tape and
reel
E1
0.007
0.063
4
2X
0.063 BSC
1.70
C A-B 2X
D
5
6
Nom
b
E
Inches
Min
0.20
SIDE VIEW
5000 pieces
A
0.10 C
SEATING
PLANE
C
Controlling dimension: millimeters
END VIEW
c
L
* For best results, both grounds should be connected
Package Dimensions for SOT-563.
© 2007 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
l
Tel: 408.263.3214
l
Fax: 408.263.7846
l
www.cmd.com
5/16/07
CM1240
Mechanical Details (cont’d)
TDFN-08 Mechanical Specifications
The CM1240 is supplied in an 8-lead 0.5mm TDFN
package. Dimensions are presented below.
Mechanical Package Diagrams
For complete information on the TDFN-08, see the
California Micro Devices TDFN Package Information
document.
D
8 7 6 5
Package
TDFN
JEDEC
No.
MO-229 (Var. VCCD-3)*
Leads
8
Dim.
A
E
PACKAGE DIMENSIONS
Pin 1
Marking
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
0.70
0.75
0.80
0.028
0.030
0.031
A3
0.20 REF
b
0.20
0.25
0.30
0.008
0.010
0.012
D
1.90
2.00
2.10
0.075
0.079
0.083
D2
1.50
1.60
1.70
0.059
0.063
0.067
E
1.90
2.00
2.10
0.075
0.079
0.083
E2
0.80
0.90
1.00
0.031
0.035
0.039
e
0.50 BSC
K
0.20
L
0.20
# per
tape and
reel
1 2 3 4
0.008 REF
TOP VIEW
0.10 C
0.020 BSC
0.008
0.30
0.40
0.008
0.012
A
SIDE VIEW
A3
0.016
3000 pieces
1 2 3 4
Controlling dimension: millimeters
D2
GND PAD
E2
*This package is compliant with JEDEC standard MO-229, variation
VCCD-3 with exception of the D2 and E2 dimensions as called out in
the table above and the r1 dimension which is not specified in the
MO-229 standard.
C0.25
L
R
8 7 6 5
K
b
e
8X
BOTTOM VIEW
0.10
M
CAB
Package Dimensions for 8-Lead, 0.5mm pitch
TDFN package
© 2007 California Micro Devices Corp. All rights reserved.
5/16/07
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
l
Tel: 408.263.3214
l
Fax: 408.263.7846
l
www.cmd.com
5
CM1240
Mechanical Details (cont’d)
TDFN-08 Mechanical Specifications
Mechanical Package Diagrams
Dimensions for the CM1240 supplied in a 8-lead,
0.4mm pitch TDFN package are presented below.
PACKAGE DIMENSIONS
8 7 6 5
TDFN
JEDEC
No.
MO-229C*
Leads
8
Pin 1
Marking
E
Package
Dim.
D
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
1 2 3 4
A
0.70
0.75
0.80
0.028
0.030
0.031
TOP VIEW
A1
0.00
0.02
0.05
0.000
0.001
0.002
A3
0.200 REF
0.008 REF
b
0.15
0.20
0.25
0.006
0.008
0.010
D
1.60
1.70
1.80
0.063
0.067
0.071
D2
1.10
1.20
1.30
0.043
0.047
0.051
E
1.25
1.35
1.45
0.049
0.053
0.057
E2
0.30
e
0.40
0.50
0.012
0.40 BSC
K
0.20
L
0.15
0.016
0.10 C
0.08 C
A1
A
0.020
0.016 BSC
8X
0.008
0.25
0.35
# per
tape and
reel
0.006
0.10
0.010
A3
SIDE VIEW
0.014
M
CAB
b
e
3000 pieces
Pin 1
Locator
Controlling dimension: millimeters
K
*This package is compliant with JEDEC standard MO-229C with the
exception of the D, D2, E, E2, K and L dimensions as called out in
the table above.
1
2
3
C0.2
GND
PAD
7
6
8
E2
4
5
D2
L
BOTTOM VIEW
Recommend PCB Land Pattern
Dimensions for 8-Lead, 0.4mm pitch
TDFN package
0.30
0.70
0.25
0.55
1.66
0.40
Note: Dimensions in millimeters. Drawing not to scale.
© 2007 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
l
Tel: 408.263.3214
l
Fax: 408.263.7846
l
www.cmd.com
5/16/07
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