STMicroelectronics BAT30KFILM Small signal schotky diode Datasheet

BAT30 Series
Small signal Schotky diodes
Main product characteristics
IF
BAT30JFILM
(Single)
300 mA
VRRM
30 V
C (typ)
14 pF
Tj (max)
150° C
SOD-323
BAT30KFILM
(Single)
Features and benefits
SOD-523
■
Very low conduction losses
■
Negligible switching losses
■
Low forward and reverse recovery times
■
Extremely fast switching
■
Surface mount device
■
Low capacitance diode
BAT30FILM
(Single)
SOT-23
BAT30AFILM
(Common anode)
BAT30SFILM
(Series)
Description
BAT30CFILM
(Common cathode)
The BAT30 series uses 30 V Schotky barrier
diodes encapsulated in a wide range of packages
such as SOD-323, SOD-523, SOT-23, SOT-323,
or SOT-666. This device is specially suited for
switching mode applications needing low forward
voltage drop diodes.
BAT30WFILM
(Single)
Order codes
Part Number
Marking
BAT30FILM
B30
BAT30SFILM
S30
BAT30CFILM
C30
BAT30AFILM
A30
BAT30WFILM
B30
BAT30SWFILM
S30
BAT30CWFILM
C30
BAT30AWFILM
A30
BAT30JFILM
30
BAT30KFILM
30
BAT30-07P6FILM
P3
BAT30-09P6FILM
Q3
July 2006
SOT-323
BAT30CWFILM
(Common cathode)
BAT30AWFILM
(Common anode)
BAT30SWFILM
(Series)
BAT30-07P6FILM
(2 parallel diodes)
SOT-666
BAT30-09P6FILM
(2 opposite diodes)
Configurations in top view
Rev 1
1/12
www.st.com
Characteristics
BAT30 Series
1
Characteristics
Table 1.
Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Symbol
VRRM
IF
Parameter
Value
Unit
Repetitive peak reverse voltage
30
V
Continuous forward current
300
mA
1
A
-65 to +150
°C
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
tp = 10 ms Sinusoidal
(1)
Tj
Maximum operating junction temperature
150
°C
TL
Maximum soldering temperature
260
°C
Value
Unit
1. Pulse test: tp = 5 ms, δ < 2 %
Table 2.
Thermal parameters
Symbol
Rth(j-a)
Parameter
Junction to
ambient(1)
SOT-23
500
SOT-323, SOD-323,
550
SOD-523, SOT-666
600
° C/W
1. On epoxy printed circuit board with recommended pad layout
Table 3.
Symbol
Static electrical characteristics
Parameter
Test conditions
Tj = 25° C
IR(1)
Reverse leakage current
Tj = 85° C
VF
Forward voltage drop
Tj = 25° C
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
Max.
VR = 5 V
0.5
VR = 10 V
1
VR = 25 V
VR = 10 V
0.65
Unit
3
µA
5
7
20
18
50
IF = 0.1 mA
240
IF = 1 mA
300
IF = 10 mA
375
IF = 30 mA
430
IF = 100 mA
500
IF = 200 mA
580
IF = 300 mA
2/12
Typ
VR = 30 V
Tj = 70° C
(2)
Min.
530
mV
BAT30 Series
Characteristics
Table 4.
Dynamic characteristics
Symbol
Parameter
C
Test conditions
Diode capacitance
Figure 1.
Min.
Typ
VR = 0 V, F = 1 MHz
22
VR = 1 V, F = 1 MHz
14
VR = 10 V, F = 1 MHz
6
Power dissipation versus average
forward current
Figure 2.
Max.
Unit
pF
Average forward current versus
ambient temperature (δ = 1)
IF(AV) (A)
P (W)
0.35
0.175
δ=0.05
δ=0.2
δ=1
δ=0.5
δ=0.1
0.150
0.30
0.125
0.25
0.100
0.20
0.15
0.075
T
0.050
0.025
IF(AV) (A)
δ=tp/T
T
0.10
0.05
tp
δ=tp/T
tp
Tamb (° C)
0.00
0.000
0.00
0.05
Figure 3.
0.10
0.15
0.20
0.25
0.30
0.35
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOT-23)
0
25
Figure 4.
50
75
100
125
150
Relative variation of thermal
impedance junction to ambient
versus pulse duration
(SOT-323 / SOD-323)
Zth(j-a) /Rth(j-a)
Zth(j-a) /Rth(j-a)
1.E+00
1.E+00
Single pulse
SOT-23
Single pulse
SOT-323/SOD-323
1.E-01
1.E-01
1.E-02
Alumine substrate
10 x 8 x 0.5 mm
1.E-02
1.E-03
tP(s)
1.E-02
1.E-01
Epoxy FR4
SCU=2.25 mm²
eCU=35 µm
tP(s)
1.E+00
1.E+01
1.E+02
1.E-03
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
3/12
Characteristics
Figure 5.
BAT30 Series
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOT-666)
Figure 6.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOD-523)
Zth(j-a) /Rth(j-a)
Zth(j-a) /Rth(j-a)
1.E+00
1.E+00
Single pulse
SOD-523
Single pulse
SOT-666
1.E-01
1.E-01
1.E-02
Epoxy FR4
eCU=35 µm
tP(s)
1.E-02
1.E-03
Epoxy FR4
eCU=35 µm
tP(s)
1.E-03
1.E-02
Figure 7.
1.E-01
1.E+00
1.E+01
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOD-323)
Rth(j-a) (°C/W)
1.E-03
Figure 8.
1.E-02
600
1.E-02
1.E-01
1.E+00
1.E+01
Leakage current versus reverse
applied voltage (typical values)
IR (A)
Epoxy FR4
eCU=35 µm
Tj=150°C
1.E-03
500
Tj=125°C
1.E-04
Tj=85°C
400
1.E-05
300
1.E-06
Tj=25°C
SCU(mm²)
200
VR (V)
1.E-07
0
5
Figure 9.
10
15
20
25
30
35
40
45
50
Relative variation of reverse
leakage current versus junction
temperature (typical values)
0
5
10
15
20
25
30
Figure 10. Junction capacitance versus
reverse applied voltage (typical
values)
IR[T j] / IR[T j=25°C]
C(pF)
100
1.E+04
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
VR=30 V
1.E+03
1.E+02
10
1.E+01
1.E+00
1.E-01
VR(V)
Tj(°C)
1
1.E-02
-40
4/12
-20
0
20
40
60
80
100
120
140
160
1
10
100
BAT30 Series
Ordering information scheme
Figure 11. Forward voltage drop versus
forward current (typical values)
Figure 12. Forward voltage drop versus
forward current (typical values)
IFM(A)
IFM(A)
1.E+01
1.E+01
1.E+00
1.E+00
Tj=150 °C
1.E-01
1.E-01
Tj=125 °C
Tj=85 °C
1.E-02
1.E-02
Tj=25 °C
Tj=-40 °C
1.E-03
VFM(V)
1.E-04
0.0
2
1.E-03
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
VFM(V)
1.E-04
0.9
1.0
1.1
1.2
1.3
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
Ordering information scheme
BAT30
xx
xx
FILM
Signal Schotky diodes
VRRM = 30 V
Configuration
Blank = Single diode
A = Common anode
C = Common cathode
S = Series diodes
07 = Parallel diodes
09 = Opposite diodes
Package
Blank = SOT-23
J = SOD-323
W = SOT-323
K = SOD-523
P6 = SOT-666
Packing
FILM = Tape and reel
5/12
Package information
3
BAT30 Series
Package information
Epoxy meets UL94, V0
Table 5.
SOD-323 dimensions
Dimensions
Ref.
H
Millimeters
Min.
b
A
E
A
D
c
Q1
L
1.06
Max.
0.046
0
0.1
0
0.004
b
0.25
0.44
0.01
0.017
c
0.1
0.25
0.004
0.01
D
1.52
1.8
0.06
0.071
E
1.11
1.45
0.044
0.057
H
2.3
2.7
0.09
0.106
L
0.1
0.46
0.004
0.02
Q1
0.1
0.41
0.004
0.016
0.30
1.08
Min.
A1
3.20
1.06
Max.
1.17
Figure 13. SOD-323 footprint (dimensions in mm)
6/12
Inches
A1
BAT30 Series
Package information
Table 6.
SOD-523 dimensions
Dimensions
E
Ref.
0.15 M C A B
E1
B
D
2xb
0.20 M C A B
A
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.50
0.60
0.70
0.020
0.024
0.028
E
1.50
1.60
1.70
0.059
0.063
0.067
E1
1.10
1.20
1.30
0.043
0.047
0.051
D
0.70
0.80
0.90
0.028
0.031
0.035
b
0.25
0.35
0.010
0.014
c
0.07
0.20
0.003
0.008
L
0.15
0.25
0.006
L1
0.10
0.20
0.004
8°
R0.1
A
c
SEATING PLANE
C
7°
L
L1
0.20
0.008
0.010
0.008
Figure 14. SOD-523 footprint (dimensions in mm)
0.7
0.3
2
7/12
Package information
Table 7.
BAT30 Series
SOT-23 dimensions
Dimensions
Ref.
Millimeters
A
Inches
Min.
Max.
Min.
Max.
A
0.89
1.4
0.035
0.055
A1
0
0.1
0
0.004
B
0.3
0.51
0.012
0.02
c
0.085
0.18
0.003
0.007
D
2.75
3.04
0.108
0.12
e
0.85
1.05
0.033
0.041
e1
1.7
2.1
0.067
0.083
E
1.2
1.6
0.047
0.063
H
2.1
2.75
0.083
0.108
E
e
B
D
e1
S
A1
L
c
H
L
0.6 typ.
S
0.35
0.65
Figure 15. SOT-23 footprint (dimensions in mm)
0.95
0.61
1.26
0.73
8/12
3.25
0.024 typ.
0.014
0.026
BAT30 Series
Package information
Table 8.
SOT-323 dimensions
Dimensions
Ref.
A
E
Millimeters
Min.
e
Typ.
Inches
Max.
Min.
Typ.
Max.
A
0.8
1.1
0.031
0.043
A1
0.0
0.1
0.0
0.004
b
0.25
0.4
0.010
0.016
c
0.1
0.26
0.004
0.010
D
1.8
2.0
2.2
0.071
0.079
0.086
E
1.15
1.25
1.35
0.045
0.049
0.053
D
b
A1
e
c
θ
L
0.65
0.026
H
1.8
2.1
2.4
0.071
0.083
0.094
L
0.1
0.2
0.3
0.004
0.008
0.012
q
0
30°
0
H
30°
Figure 16. SOT-323 footprint (dimensions in mm)
0.95
1.0
0.8
2.9
0.50
9/12
Package information
BAT30 Series
Table 9.
SOT-666 dimensions
Dimensions
b1
Ref.
Millimeters
Inches
L1
Min.
L3
Typ.
Max.
Min.
Typ.
Max.
A
0.45
0.60 0.018
0.024
A3
0.08
0.18 0.003
0.007
b
0.17
0.34 0.007
0.013
b1
0.19
D
1.50
1.70 0.059
0.067
E
1.50
1.70 0.059
0.067
E1
1.10
1.30 0.043
0.051
b
D
E1
0.27
0.34 0.007 0.011 0.013
A
L2
E
A3
e
0.50
0.020
L1
0.19
0.007
L2
0.10
0.30 0.004
0.012
e
L3
0.10
0.004
Figure 17. SOT-666 footprint (dimensions in mm)
0.50
0.62
2.60
0.99
0.30
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
10/12
BAT30 Series
4
5
Ordering information
Ordering information
Part Number
Marking
Package
Weight
Base qty
Delivery mode
BAT30FILM
B30
SOT-23 Single
10 mg
3000
Tape and reel
BAT30SFILM
S30
SOT-23 Serial
10 mg
3000
Tape and reel
BAT30CFILM
C30
SOT-23
Common cathode
10 mg
3000
Tape and reel
BAT30AFILM
A30
SOT-23
Common anode
10 mg
3000
Tape and reel
BAT30WFILM
B30
SOT-323 Single
6 mg
3000
Tape and reel
BAT30SWFILM
S30
SOT-323 Serial
6 mg
3000
Tape and reel
BAT30CWFILM
C30
SOT-323
Common cathode
6 mg
3000
Tape and reel
BAT30AWFILM
A30
SOT-323
Common anode
6 mg
3000
Tape and reel
BAT30JFILM
30
SOD-323
5 mg
3000
Tape and reel
BAT30KFILM
30
SOD-523
1.4 mg
3000
Tape and reel
BAT30-07P6FILM
P3
SOT-666 Parallel
2.9 mg
5000
Tape and reel
BAT30-09P6FILM
Q3
SOT-666 Opposite
2.9 mg
5000
Tape and reel
Revision history
Date
Revision
24-Jul-2006
1
Description of Changes
First issue
11/12
BAT30 Series
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