NXP BCP69-16/IN 20 v, 1 a pnp medium power transistor Datasheet

BCP69
20 V, 1 A PNP medium power transistor
Rev. 06 — 2 December 2008
Product data sheet
1. Product profile
1.1 General description
PNP medium power transistor in a Surface-Mounted Device (SMD) plastic package.
Table 1.
Product overview
Type number[1]
BCP69
Package
NXP
JEITA
Package
configuration
SOT223
SC-73
medium power
BCP69-16
BCP69-16/DG
BCP69-16/IN
BCP69-25
[1]
/DG: halogen-free
1.2 Features
n
n
n
n
High current
Three current gain selections
1.4 W total power dissipation
Medium power SMD plastic package
1.3 Applications
n
n
n
n
n
Linear voltage regulators
High-side switches
Supply line switches
MOSFET drivers
Audio preamplifier
1.4 Quick reference data
Table 2.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCEO
collector-emitter voltage
open base
-
-
−20
V
IC
collector current
-
-
−1
A
ICM
peak collector current
-
-
−2
A
single pulse;
tp ≤ 1 ms
BCP69
NXP Semiconductors
20 V, 1 A PNP medium power transistor
Table 2.
Quick reference data …continued
Symbol
Parameter
Conditions
hFE
DC current gain
VCE = −1 V;
IC = −500 mA
Min
Typ
Max
BCP69
85
-
375
BCP69-16
BCP69-16/DG
100
-
250
BCP69-16/IN
140
-
230
BCP69-25
160
-
375
Unit
2. Pinning information
Table 3.
Pinning
Pin
Description
1
base
2
collector
3
emitter
4
collector
Simplified outline
Graphic symbol
4
2, 4
1
1
2
3
3
sym028
3. Ordering information
Table 4.
Ordering information
Type number[1]
BCP69
BCP69-16
Package
Name
Description
Version
SC-73
plastic surface-mounted package with increased
heatsink; 4 leads
SOT223
BCP69-16/DG
BCP69-16/IN
BCP69-25
[1]
/DG: halogen-free
BCP69_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 2 December 2008
2 of 13
BCP69
NXP Semiconductors
20 V, 1 A PNP medium power transistor
4. Marking
Table 5.
Marking codes
Type number[1]
Marking code
BCP69
BCP69
BCP69-16
BCP69/16
BCP69-16/DG
BCP69-16D
BCP69-16/IN
69-16N
BCP69-25
BCP69/25
[1]
/DG: halogen-free
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCBO
collector-base voltage
open emitter
-
−32
V
VCEO
collector-emitter voltage
open base
-
−20
V
VEBO
emitter-base voltage
open collector
IC
collector current
ICM
peak collector current
IBM
Ptot
-
−5
V
-
−1
A
single pulse;
tp ≤ 1 ms
-
−2
A
peak base current
single pulse;
tp ≤ 1 ms
-
−200
mA
total power dissipation
Tamb ≤ 25 °C
[1]
-
0.625
W
[2]
-
1
W
[3]
-
1.4
W
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
BCP69_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 2 December 2008
3 of 13
BCP69
NXP Semiconductors
20 V, 1 A PNP medium power transistor
mle311
1.6
(1)
Ptot
(W)
1.2
(2)
0.8
(3)
0.4
0
−65
−5
55
115
175
Tamb (°C)
(1) FR4 PCB, mounting pad for collector 6 cm2
(2) FR4 PCB, mounting pad for collector 1 cm2
(3) FR4 PCB, standard footprint
Fig 1.
Power derating curves
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Rth(j-sp)
Thermal characteristics
Parameter
thermal resistance from junction
to ambient
Conditions
in free air
thermal resistance from junction
to solder point
Typ
Max
Unit
-
-
200
K/W
[2]
-
-
125
K/W
[3]
-
-
89
K/W
-
-
15
K/W
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
BCP69_6
Product data sheet
Min
[1]
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 2 December 2008
4 of 13
BCP69
NXP Semiconductors
20 V, 1 A PNP medium power transistor
006aab402
102
duty cycle = 1
0.75
Rth(j-a)
(K/W)
0.5
0.33
0.2
10
0.1
0.05
0.02
0.01
1
δ=
P
0
t1
t2
t
t1
t2
10−1
10−5
10−4
10−3
10−2
10−1
1
10
102
103
tp (s)
FR4 PCB, mounting pad for collector 6 cm2
Fig 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BCP69_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 2 December 2008
5 of 13
BCP69
NXP Semiconductors
20 V, 1 A PNP medium power transistor
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
ICBO
collector-base cut-off
current
VCB = −25 V; IE = 0 A
-
-
−100
nA
VCB = −25 V; IE = 0 A;
Tj = 150 °C
-
-
−10
µA
VEB = −5 V; IC = 0 A
-
-
−100
nA
VCE = −10 V;
IC = −5 mA
50
-
-
VCE = −1 V;
IC = −500 mA
85
-
375
VCE = −1 V; IC = −1 A
60
-
-
BCP69-16
BCP69-16/DG
VCE = −1 V;
IC = −500 mA
100
-
250
BCP69-16/IN
VCE = −1 V;
IC = −500 mA
140
-
230
BCP69-25
VCE = −1 V;
IC = −500 mA
160
-
375
IEBO
emitter-base cut-off
current
hFE
DC current gain
BCP69
VCEsat
collector-emitter
saturation voltage
IC = −1 A;
IB = −100 mA
-
-
−500
mV
VBE
base-emitter voltage
VCE = −10 V;
IC = −5 mA
-
-
−700
mV
VCE = −1 V; IC = −1 A
-
-
−1
V
Cc
collector capacitance
VCB = −10 V;
IE = ie = 0 A;
f = 1 MHz
-
28
-
pF
fT
transition frequency
VCE = −5 V;
IC = −50 mA;
f = 100 MHz
40
140
-
MHz
BCP69_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 2 December 2008
6 of 13
BCP69
NXP Semiconductors
20 V, 1 A PNP medium power transistor
mle305
103
hFE
006aab403
−2.4
IC
(A)
−2.0
IB (mA) = −18.0
−14.4
−1.6
−10.8
−1.2
−16.2
−12.6
−9.0
−7.2
−5.4
−0.8
−3.6
−0.4
102
−10−1
−1
−10
−102
0
−103
−104
IC (mA)
0
−1
−2
−3
−4
−5
VCE (V)
VCE = −1 V
Fig 3.
−1.8
Tamb = 25 °C
BCP69-16: DC current gain as a function of
collector current; typical values
mle304
−1000
VBE
(mV)
−800
Fig 4.
BCP69-16: Collector current as a function of
collector-emitter voltage; typical values
mle306
−103
VCEsat
(mV)
−102
−600
−400
−10
−200
0
−10−1
−1
−10
−102
−1
−10−1
−103
−104
IC (mA)
VCE = −1 V
Fig 5.
−10
−102
−103
−104
IC (mA)
IC/IB = 10
BCP69-16: Base-emitter voltage as a function
of collector current; typical values
Fig 6.
BCP69-16: Collector-emitter saturation voltage
as a function of collector current; typical
values
BCP69_6
Product data sheet
−1
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 2 December 2008
7 of 13
BCP69
NXP Semiconductors
20 V, 1 A PNP medium power transistor
mle309
103
006aab404
−2.4
IC
(A)
IB (mA) = −12.0
−2.0
hFE
−10.8
−9.6
−1.6
−7.2
−1.2
−8.4
−6.0
−4.8
−3.6
−0.8
−2.4
−0.4
102
−10−1
−1
−10
−102
0
−103
−104
IC (mA)
0
−1
−2
−3
−4
−5
VCE (V)
VCE = −1 V
Fig 7.
−1.2
Tamb = 25 °C
BCP69-25: DC current gain as a function of
collector current; typical values
mle304
−1000
VBE
(mV)
−800
Fig 8.
BCP69-25: Collector current as a function of
collector-emitter voltage; typical values
mle310
−103
VCEsat
(mV)
−102
−600
−400
−10
−200
0
−10−1
−1
−10
−102
−103
−104
IC (mA)
VCE = −1 V
Fig 9.
−1
−10−1
−10
−102
−103
−104
IC (mA)
IC/IB = 10
BCP69-25: Base-emitter voltage as a function
of collector current; typical values
Fig 10. BCP69-25: Collector-emitter saturation voltage
as a function of collector current; typical
values
BCP69_6
Product data sheet
−1
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 2 December 2008
8 of 13
BCP69
NXP Semiconductors
20 V, 1 A PNP medium power transistor
8. Package outline
6.7
6.3
3.1
2.9
1.8
1.5
4
1.1
0.7
7.3
6.7
3.7
3.3
1
2
2.3
4.6
3
0.8
0.6
Dimensions in mm
0.32
0.22
04-11-10
Fig 11. Package outline SOT223 (SC-73)
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number[2]
BCP69
Package
SOT223
Description
8 mm pitch, 12 mm tape and reel
Packing quantity
1000
4000
-115
-135
BCP69-16
BCP69-16/DG
BCP69-16/IN
BCP69-25
[1]
For further information and the availability of packing methods, see Section 13.
[2]
/DG: halogen-free
BCP69_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 2 December 2008
9 of 13
BCP69
NXP Semiconductors
20 V, 1 A PNP medium power transistor
10. Soldering
7
3.85
3.6
3.5
0.3
1.3 1.2
(4×) (4×)
solder lands
4
solder resist
3.9
6.1 7.65
solder paste
occupied area
1
2
3
Dimensions in mm
2.3
2.3
1.2
(3×)
1.3
(3×)
6.15
sot223_fr
Fig 12. Reflow soldering footprint SOT223 (SC-73)
8.9
6.7
1.9
solder lands
4
solder resist
6.2
8.7
occupied area
Dimensions in mm
1
2
3
1.9
(3×)
2.7
preferred transport
direction during soldering
2.7
1.1
1.9
(2×)
sot223_fw
Fig 13. Wave soldering footprint SOT223 (SC-73)
BCP69_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 2 December 2008
10 of 13
BCP69
NXP Semiconductors
20 V, 1 A PNP medium power transistor
11. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BCP69_6
20081202
Product data sheet
-
BCP69_5
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
•
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Table 1 “Product overview”: enhanced
Table 4 “Ordering information”: enhanced
Figure 2, 4 and 8: updated
Figure 11: superseded by minimized package outline drawing
Section 9 “Packing information”: added
Section 10 “Soldering”: enhanced
Section 12 “Legal information”: updated
BCP69_5
20031125
Product specification
-
BCP69_4
BCP69_4
20021115
Product specification
-
BCP69_3
BCP69_3
19990408
Product specification
-
BCP69_CNV_2
BCP69_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 2 December 2008
11 of 13
BCP69
NXP Semiconductors
20 V, 1 A PNP medium power transistor
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BCP69_6
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 06 — 2 December 2008
12 of 13
BCP69
NXP Semiconductors
20 V, 1 A PNP medium power transistor
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Packing information. . . . . . . . . . . . . . . . . . . . . . 9
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 2 December 2008
Document identifier: BCP69_6
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