ESDAxxSCxY Automotive quad-line Transil™ transient voltage suppressor (TVS) for ESD protection Datasheet - production data Applications Where ESD and EOS transient overvoltage protection in susceptible equipment is required, such as: • Information - entertainment • Signal communications • Connectivity 627/ • Comfort and convenience 627/ Description The ESDAxxSCxY devices are monolithic voltage suppressors designed to protect components which are connected to data and transmission lines against ESD. Features • 4 unidirectional Transil functions They clamp the voltage just above the logic level supply for positive transients, and to a diode drop below ground for negative transient. • 400 W peak pulse power (8/20 µs) Benefits • High EOS and ESD protection levels Figure 1. Pin configuration • Suitable for high density boards • AEC-Q101 qualified Complies with the following standards: • ISO 10605: C = 150 pF, R = 330 Ω – 30 kV (air discharge) – 30 kV (contact discharge) October 2015 This is information on a product in full production. 627/ 627/ • ISO 10605: C = 330 pF, R = 330 Ω – 30 kV (air discharge) – 30 kV (contact discharge) • ISO 7637-2 – Pulse 1: VS = -100 V – Pulse 2a: VS = +50 V – Pulse 3a: VS = -150 V – Pulse 3b: VS = +100 V Table 1. Device summary Order code VBR(min.) Package ESDA5V3SC6Y 5.3 SOT23-6L ESDA6V1SC6Y 6.1 SOT23-6L ESDA14V2SC5Y 14.2 SOT23-5L ESDA14V2SC6Y 14.2 SOT23-6L ESDA25SC6Y 25 SOT23-6L DocID028400 Rev 1 1/15 www.st.com Characteristics 1 ESDAxxSCxY Characteristics Table 2. Absolute ratings (Tamb = 25 °C) Symbol VPP PPP Parameter Peak pulse voltage Peak pulse power (8/20µs) Value ISO10605 (C = 150 pF, R = 330 Ω) Contact discharge Air discharge ISO10605 (C = 330 pF, R = 330 Ω) Contact discharge Air discharge Unit 30 30 kV 30 30 ESDA5V3SC6Y, ESDA6V1SC6Y 300 ESDA14V2SC5Y, ESDA14V2SC6Y, ESDA25SC6Y 400 ESDA5V3SC6Y ESDA6V1SC6Y ESDA14V2SC5Y, ESDA14V2SC6Y ESDA25SC6Y 22 18 14 9 A W IPP Peak pulse current (8/20µs) Tj Operating junction temperature range -40 to +150 °C Tstg Storage temperature range -65 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C Figure 2. Electrical characteristics (definitions) 6\PERO3DUDPHWHU 9%5 %UHDNGRZQYROWDJH ,50 /HDNDJHFXUUHQW# 950 950 6WDQGRIIYROWDJH 9&/ &ODPSLQJYROWDJH ,33 3HDNSXOVHFXUUHQW ,) )RUZDUGFXUUHQW 9) )RUZDUGYROWDJH 5G '\QDPLFLPSHGDQFH &/,1( /LQHFDSDFLWDQFH 2/15 , ,) 9) 9&/ 9%5 950 ,50 6ORSH 5G DocID028400 Rev 1 ,33 9 ESDAxxSCxY Characteristics Table 3. Electrical characteristics - values (Tamb = 25 °C) VBR at IR Order code VCL at Ipp(1) IRM at VRM max. max. αT(2) Cline max. typ. min. max. V V mA µA V V A V mA 10-4/C pF ESDA5V3SC6Y 5.3 5.9 1 2 3 21 22 1.25 200 5 320 ESDA6V1SC6Y 6.1 7.2 1 2 5.2 19 18 1.25 200 6 190 ESDA14V2SC5Y, ESDA14V2SC6Y 14.2 15.8 1 5 12 35 14 1.25 200 10 100 25 30 1 1 24 51 9 1.2 10 10 60 ESDA25SC6Y max. VF at IF 1. 8/20 µs waveform 2. Δ VBR = αT* (Tamb - 25 °C) * VBR (25 °C) Figure 3. Pulse power versus junction temperature Figure 4. Peak pulse power versus exponential pulse duration (typical values) 333 : 3SS : V 7M & Figure 5. Clamping voltage versus peak pulse current (typical values, 8/20 μs waveform) W S V ,SS $ ,5 QD (6'$96&< 95 9 (6'$96&< Figure 6. Leakage current versus junction temperature (typical values) V 7- & (6'$96&< (6'$96&< (6'$96&< (6'$96&< 95 9 (6'$6&< (6'$96&< (6'$96&< 95 9 9FO 9 (6'$6&< 95 9 DocID028400 Rev 1 7M & 3/15 15 Characteristics Note: ESDAxxSCxY ISO7637-2 pulse responses are not applicable for products with a breakdown voltage lower than the average battery voltage (13.5 V) like ESDA6V1SC6Y. Figure 7. ISO7637-2 pulse 1 response (VS = -100 V) 9ROWDJH 9 9ROWDJ H (6'$6&< (6'$96&< (6'$96&< 7LPH PV &XUUHQW $ &XUUHQW (6'$6&< (6'$96&< (6'$96&< Figure 8. ISO7637-2 pulse 2a response (VS = 50 V) 9ROWDJH 9 9ROWDJ H (6'$6&< (6'$96&< (6'$96&< 7LPH V &XUUHQW $ &XUUHQW (6'$6&< (6'$96&< (6'$96&< 7LPH V 4/15 DocID028400 Rev 1 ESDAxxSCxY Characteristics Figure 9. ISO7637-2 pulse 3a response (VS = -150 V) 9ROWDJH 9 9ROWDJ H (6'$6&< (6'$96&< (6'$96&< 7LPH V &XUUHQW $ &XUUHQW (6'$6&< (6'$96&< (6'$96&< 7LPH V Figure 10. ISO7637-2 pulse 3b response (VS = 100 V) 9ROWDJH 9 9ROWDJ H (6'$6&< (6'$96&< (6'$96&< 7LPH V &XUUHQW $ &XUUHQW (6'$6&< (6'$96&< (6'$96&< 7LPH V DocID028400 Rev 1 5/15 15 Application and design guidelines 2 ESDAxxSCxY Application and design guidelines More information is available in the STMicroelectronics Application note AN2689: “Protection of automotive electronics from electrical hazards, guidelines for design and component selection”. 6/15 DocID028400 Rev 1 ESDAxxSCxY 3 Package information Package information • Epoxy meets UL94, V0 • Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DocID028400 Rev 1 7/15 15 Package information 3.1 ESDAxxSCxY SOT23-5L package information Figure 11. SOT23-5L package outline $ F ș / + ( $ H ' E H $ Table 4. SOT23-5L package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Typ. Max. A 0.90 1.45 0.0354 0.0570 A1 0 0.15 0 0.0059 A2 0.90 1.30 0.0354 0.0511 b 0.30 0.50 0.0118 0.0196 c 0.09 0.20 0.0035 0.0078 D 2.80 3.05 0.1102 0.1200 E 1.50 1.75 0.0590 e 8/15 Typ. Inches 0.95 0.0688 0.0374 H 2.60 3.00 0.1023 0.1181 L 0.30 0.60 0.0118 0.0236 θ 0° 10° 0° 10° DocID028400 Rev 1 ESDAxxSCxY Package information Figure 12. SOT23-5L footprint (dimensions in mm) DocID028400 Rev 1 9/15 15 Package information 3.2 ESDAxxSCxY SOT23-6L package information Figure 13. SOT23-6L package outline $ F ș / + ( $ H ' E H $ Table 5. SOT23-6L package mechanical data Dimensions Ref. Millimeters Min. Max. Min. 0.90 1.45 0.0354 0.0570 A1 0 0.15 0 0.0059 A2 0.90 1.30 0.0354 0.0511 b 0.30 0.50 0.0118 0.0196 c 0.09 0.20 0.0035 0.0078 D 2.80 3.05 0.1102 0.1200 E 1.50 1.75 0.0590 0.0688 A e 10/15 Typ. Inches 0.95 Typ. Max. 0.0374 H 2.60 3.00 0.1023 0.1181 L 0.30 0.60 0.0118 0.0236 θ 0° 10° 0° 10° DocID028400 Rev 1 ESDAxxSCxY Package information Figure 14. SOT23-6L footprint (dimensions in mm) DocID028400 Rev 1 11/15 15 Recommendation on PCB assembly ESDAxxSCxY 4 Recommendation on PCB assembly 4.1 Solder paste 4.2 4.3 12/15 1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. DocID028400 Rev 1 ESDAxxSCxY 4.4 Recommendation on PCB assembly Reflow profile Figure 15. ST ECOPACK® recommended soldering reflow profile for PCB mounting & 7HPSHUDWXUH & &V &V VHF P D[ &V &V &V 7LPH V Note: Minimize air convection currents in the reflow oven to avoid component movement. DocID028400 Rev 1 13/15 15 Ordering information 5 ESDAxxSCxY Ordering information Figure 16. Ordering information scheme (6'$;;6&; < (6'DUUD\ %UHDNGRZQYROWDJH 3DFNDJH 6& 627/ 6& 627/ $XWRPRWLYHJUDGH Table 6. Ordering information Marking(1) Package ESDA5V3SC6Y ES5Y SOT23-6L ESDA6V1SC6Y ES6Y SOT23-6L ESDA14V2SC5Y EC1Y SOT23-5L ESDA14V2SC6Y ES1Y SOT23-6L ESDA25SC6Y ES2Y SOT23-6L Order codes Weight Base qty Delivery mode 3000 Tape and reel 14 mg 16 mg 14 mg 1. The marking can be rotated by multiples of 90° to differentiate assembly location 6 Revision history Table 7. Document revision history 14/15 Date Revision 05-Oct-2015 1 Changes Initial release. DocID028400 Rev 1 ESDAxxSCxY IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved DocID028400 Rev 1 15/15 15