AMIC A627308M 128k x 8 bit cmos sram Datasheet

A627308 Series
Preliminary
128K X 8 BIT CMOS SRAM
Document Title
128K X 8 BIT CMOS SRAM
Revision History
Rev. No.
History
Issue Date
Remark
0.0
Initial issue
August 15, 2000
Preliminary
0.1
Omit 100ns grade items
October 25, 2000
Change ICC1 from 70mA to 45mA
Change ISB1 from 25µA to 15µA
0.2
PRELIMINARY
Change ISB1 from 15µA to 25µA
(February, 2001, Version 0.2)
February 6, 2001
AMIC Technology, Inc.
A627308 Series
Preliminary
128K X 8 BIT CMOS SRAM
Features
n Common I/O using three-state output
n Output enable and two chip enable inputs for easy
application
n Data retention voltage: 2V (min.)
n Available in 32-pin SOP, TSOP, sTSOP (8X
13.4mm) forward type packages
n Power supply range: 4.5V to 5.5V
n Access times: 70 ns (max.)
n Current:
Operating: 45mA (max.)
Standby: 25µA (max.)
n Full static operation, no clock or refreshing required
n All inputs and outputs are directly TTL compatible
General Description
The A627308 is a low operating current 1048,576-bit
static random access memory organized as 131,072
words by 8 bits and operates on a power supply voltage
from 4.5V to 5.5V.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.
Two chip enable inputs are provided for power down and
a write enable and an output enable input are included
for easy interfacing.
Data retention is guaranteed at a power supply voltage
as low as 2V.
Pin Configurations
1
32
VCC
2
31
A15
A14
3
30
CE2
A12
4
29
WE
A7
5
28
A13
A6
6
27
A8
A5
7
26
A9
A4
8
25
A11
A3
9
24
OE
A2
10
A1
11
23
A10
22
CE1
A0
12
21
I/O7
I/O 0
13
20
I/O6
I/O 1
14
19
I/O5
I/O 2
15
18
I/O4
GND
16
17
I/O3
(February, 2001, Version 0.2)
A11
A9
A8
A13
WE
CE2
A15
VCC
NC
A16
A14
A12
A7
A6
A5
A4
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
~
NC
A16
A627308M
PRELIMINARY
n TSOP/(sTSOP)
(forward type)
A627308V
(A627308X)
~
~
n SOP
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE1
I/O7
I/O 6
I/O 5
I/O4
I/O 3
GND
I/O 2
I/O1
I/O 0
A0
A1
A2
A3
AMIC Technology, Inc.
A627308 Series
Block Diagram
VCC
A0
GND
A14
ROW
512 X 2048
DECODER
MEMORY ARRAY
INPUT DATA
CIRCUIT
COLUMN I/O
A15
A16
I/O0
I/O7
CE2
CE1
CONTROL
CIRCUIT
OE
WE
Pin Descriptions - SOP
Pin Description - TSOP/sTSOP
Pin No.
Symbol
Pin No.
Symbol
2 - 12, 23,
25 - 28, 31
A0 - A16
Address Inputs
1 - 4, 7,
10 - 20, 31
A0 - A16
Address Inputs
13 - 15,
17 - 21
I/O0 - I/O7
Data Inputs/Outputs
21 - 23,
25 - 29
I/O0 - I/O7
Data Inputs/Outputs
22
CE1
Chip Enable 1
30
CE1
Chip Enable 1
30
CE2
Chip Enable 2
6
CE2
Chip Enable 2
24
OE
Output Enable
32
OE
Output Enable
29
WE
Write Enable
5
WE
Write Enable
32
VCC
Power Supply
8
VCC
Power Supply
16
GND
Ground
24
GND
Ground
1
NC
No Connection
9
NC
PRELIMINARY
Description
(February, 2001, Version 0.2)
2
Description
No Connection
AMIC Technology, Inc.
A627308 Series
Recommended DC Operating Conditions
(TA = 0°C to + 70°C)
Symbol
Parameter
VCC
Supply Voltage
GND
Ground
Min.
Typ.
Max.
Unit
4.5
5.0
5.5
V
0
0
0
V
VIH
Input High Voltage
2.2
-
VCC + 0.5
V
VIL
Input Low Voltage
-0.5
-
+0.8
V
CL
Output Load
-
-
30
pF
TTL
Output Load
-
-
1
-
Absolute Maximum Ratings*
*Comments
VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to +
7.0V
IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V
Operating Temperature, Topr . . . . . . . . -25°C to + 85°C
Storage Temperature, Tstg . .. . . . . . . . -55°C to + 125°C
Power Dissipation, PT . . . . . . . . . . . . . . . . . . . . . . 0.7W
Soldering Temp. & Time . . . . . . . . . . . . . 260°C, 10 sec
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of
this device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may
affect device reliability.
DC Electrical Characteristics
Symbol
(TA = 0°C to + 70°C, VCC = 5.0V±10%, GND = 0V)
Parameter
ILI
Input Leakage Current
ILO
Output Leakage Current
ICC
ICC1
ICC2
PRELIMINARY
Active Power Supply Current
Dynamic Operating Current
Dynamic Operating Current
(February, 2001, Version 0.2)
A627308-70S
Unit
Conditions
Min.
Max.
-
1
µA
VIN = GND to VCC
-
1
µA
CE1 = VIH or CE2 = VIL or
OE = VIH or WE = VIL
VI/O = GND to VCC
-
7
mA
CE1 = VIL, CE2 = VIH
II/O = 0mA
-
45
mA
Min. Cycle, Duty = 100%
CE1 = VIL, CE2 = VIH
II/O = 0mA
-
7
mA
CE1 = VIL, CE2 = VIH
VIH = VCC , VIL = 0V
F = 1MHz, II/O = 0mA
3
AMIC Technology, Inc.
A627308 Series
DC Electrical Characteristics (continued)
Symbol
A627308-70S
Parameter
Unit
Conditions
Min.
Max.
-
0.5
mA
CE1 = VIH or
CE2 = VIL
-
25
µA
CE2 ≤ 0.2V, or
CE1 ≥ VCC - 0.2V
ISB
Standby Power
Supply Current
ISB1
VOL
Output Low Voltage
-
0.4
V
IOL = 2.1mA
VOH
Output High Voltage
2.4
-
V
IOH = -1.0mA
Truth Table
Mode
CE1
CE2
OE
WE
I/O Operation
H
X
X
X
High Z
ISB, ISB1
X
L
X
X
High Z
ISB, ISB1
Output Disable
L
H
H
H
High Z
ICC, ICC1, ICC2
Read
L
H
L
H
DOUT
ICC, ICC1, ICC2
Write
L
H
X
L
DIN
ICC, ICC1, ICC2
Standby
Supply Current
Note: X = H or L
Capacitance (TA = 25°C, f = 1.0MHz)
Symbol
Parameter
Min.
Max.
Unit
Conditions
CIN*
Input Capacitance
-
6
pF
VIN = 0V
CI/O*
Input/Output Capacitance
-
8
pF
VI/O = 0V
* These parameters are sampled and not 100% tested.
PRELIMINARY
(February, 2001, Version 0.2)
4
AMIC Technology, Inc.
A627308 Series
AC Characteristics (TA = 0°C to + 70°, VCC = 5.0V±10%)
Symbol
A627308-70S
Parameter
Unit
Min.
Max.
70
-
ns
-
70
ns
CE1
-
70
ns
CE2
-
70
ns
-
35
ns
CE1
10
-
ns
CE2
10
-
ns
5
-
ns
CE1
0
25
ns
CE2
0
25
ns
Read Cycle
tRC
Read Cycle Time
tAA
Address Access Time
tACE1
Chip Enable Access Time
tACE2
tOE
Output Enable to Output Valid
tCLZ1
Chip Enable to Output in Low Z
tCLZ2
tOLZ
Output Enable to Output in Low Z
tCHZ1
Chip Disable to Output in High Z
tCHZ2
tOHZ
Output Disable to Output in High Z
0
25
ns
tOH
Output Hold from Address Change
10
-
ns
tWC
Write Cycle Time
70
-
ns
tCW
Chip Enable to End of Write
60
-
ns
tAS
Address Setup Time
0
-
ns
tAW
Address Valid to End of Write
60
-
ns
tWP
Write Pulse Width
50
-
ns
tWR
Write Recovery Time
0
-
ns
tWHZ
Write to Output in High Z
0
30
ns
tDW
Data to Write Time Overlap
30
-
ns
tDH
Data Hold from Write Time
0
-
ns
tOW
Output Active from End of Write
5
-
ns
Write Cycle
Notes:
tCHZ1, tCHZ2, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are
not referred to output voltage levels.
PRELIMINARY
(February, 2001, Version 0.2)
5
AMIC Technology, Inc.
A627308 Series
Timing Waveforms
Read Cycle 1(1)
tRC
Address
tAA
OE
tOE
tOH
tOLZ5
CE1
tACE1
tCHZ1 5
tCLZ1 5
CE2
tACE2
tOHZ5
tCHZ2 5
tCLZ2 5
DOUT
Read Cycle 2 (1, 2, 4)
tRC
Address
tAA
tOH
tOH
DOUT
PRELIMINARY
(February, 2001, Version 0.2)
6
AMIC Technology, Inc.
A627308 Series
Timing Waveforms (continued)
Read Cycle 3 (1, 3, 4, 6)
CE1
tACE1
tCLZ15
tCHZ15
DOUT
Read Cycle 4 (1, 4, 7, 8)
CE2
tACE2
tCHZ25
tCLZ25
DOUT
Notes: 1.
2.
3.
4.
5.
6.
7.
8.
WE is high for Read Cycle.
Device is continuously enabled CE1 = VIL and CE2 = VIH.
Address valid prior to or coincident with CE1 transition low.
OE = VIL.
Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
CE2 is high.
CE1 is low.
Address valid prior to or coincident with CE2 transition high.
PRELIMINARY
(February, 2001, Version 0.2)
7
AMIC Technology, Inc.
A627308 Series
Timing Waveforms (continued)
Write Cycle 1(6)
(Write Enable Controlled)
tWC
Address
tAW
tWR3
tCW5
CE1
(4)
CE2
(4)
tAS1
tWP2
WE
tDW
tDH
DIN
tWHZ
tOW
DOUT
PRELIMINARY
(February, 2001, Version 0.2)
8
AMIC Technology, Inc.
A627308 Series
Timing Waveforms (continued)
Write Cycle 2(6)
(Chip Enable Controlled)
tWC
Address
tWR3
tAW
tCW5
CE1
tAS1
CE2
(4)
(4)
tCW5
tWP2
WE
tDW
tDH
DIN
tWHZ7
DOUT
Notes: 1.
2.
3.
4.
tAS is measured from the address valid to the beginning of Write.
A Write occurs during the overlap (tWP) of a low CE1 , a high CE2 and a low WE .
tWR is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle.
If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after
the WE transition, outputs remain in a high impedance state.
5. tCW is measured from the later of CE1 going low or CE2 going high to the end of Write.
6. OE is continuously low. ( OE = VIL)
7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
PRELIMINARY
(February, 2001, Version 0.2)
9
AMIC Technology, Inc.
A627308 Series
AC Test Conditions
Input Pulse Levels
0V to 3V
Input Rise and Fall Time
5 ns
Input and Output Timing Reference Levels
1.5V
Output Load
See Figures 1 and 2
TTL
TTL
CL
CL
30pF
5pF
* Including scope and jig.
* Including scope and jig.
Figure 1. Output Load
Data Retention Characteristics
Symbol
Figure 2. Output Load for tCLZ1,
tCLZ2, tOHZ, tOLZ, tCHZ1,
tCHZ2, tWHZ, and tOW
(TA = 0°C to + 70°C)
Parameter
Min.
Max.
Unit
Conditions
VDR
VCC for Data Retention
2.0
5.5
V
CE2 ≤ 0.2V, or
CE1 ≥ VCC - 0.2V
ICCDR
Data Retention Current
-
10*
µA
VCC = 2.0V, CE2 ≤ 0.2V, or
CE1 ≥ VCC - 0.2V
tCDR
Chip Disable to Data Retention Time
0
-
ns
tR
Operation Recovery Time
tRC
-
ns
tVR
VCC Rise Time from Data Retention Voltage
to Operating Voltage
5
-
ms
* A627308-70S
PRELIMINARY
See Retention Waveform
ICCDR: Max. 3µA at TA = 0°C to + 40°C
(February, 2001, Version 0.2)
10
AMIC Technology, Inc.
A627308 Series
Low VCC Data Retention Waveform (1) ( CE1 Controlled)
DATA RETENTION MODE
VCC
4.5V
tCDR
4.5V
tR
VDR ≥ 2V
tVR
CE1
VIH
VIH
CE1 ≥ VDR - 0.2V
Low VCC Data Retention Waveform (2) (CE2 Controlled)
DATA RETENTION MODE
VCC
4.5V
tCDR
4.5V
tR
VDR ≥ 2V
tVR
CE2
VIL
VIL
CE2 ≤ 0.2V
PRELIMINARY
(February, 2001, Version 0.2)
11
AMIC Technology, Inc.
A627308 Series
Ordering Information
Part No.
Access Time
(ns)
Operating Current
Max. (mA)
Standby Current
Max. (µ
µA)
A627308M-70S
A627308V-70S
32L SOP
70
45
A627308X-70S
PRELIMINARY
Package
25
32L TSOP
32L sTSOP
(February, 2001, Version 0.2)
12
AMIC Technology, Inc.
A627308 Series
Package Information
SOP (W.B.) 32L Outline Dimensions
unit: inches/mm
HE
17
E
32
θ
L
1
b
16
Detail F
D
Seating Plane
LE
A1
e
S
A
A2
c
D
y
See Detail F
Dimensions in inches
Symbol
Min
Nom
Max
Dimensions in mm
Min
Nom
Max
3.00
A
-
-
0.118
-
-
A1
0.004
-
-
0.10
-
-
A2
0.101
0.106
0.111
2.57
2.69
2.82
b
0.014
0.016
0.020
0.36
0.41
0.51
c
0.006
0.008
0.012
0.15
0.20
0.31
D
-
0.805
0.817
-
20.45
20.75
E
0.440
0.445
0.450
11.18
11.30
11.43
e
0.044
0.050
0.056
1.12
1.27
1.42
HE
0.546
0.556
0.566
13.87
14.12
14.38
L
0.023
0.031
0.039
0.58
0.79
0.99
LE
0.047
0.055
0.063
1.19
1.40
1.60
S
-
-
0.036
-
-
0.91
y
-
-
0.004
-
-
0.10
θ
0°
-
10°
0°
-
10°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(February, 2001, Version 0.2)
13
AMIC Technology, Inc.
A627308 Series
Package Information
TSOP 32L TYPE I (8 X 20mm) Outline Dimensions
unit: inches/mm
A
A1
c
E
A2
e
D
θ
L
LE
HD
Detail "A"
D
Detail "A"
y
S
Dimensions in inches
Symbol
b
Dimensions in mm
Min
Nom
Max
Min
Nom
Max
A
-
-
0.047
-
-
1.20
A1
0.002
-
0.006
0.05
-
0.15
A2
0.037
0.039
0.041
0.95
1.00
1.05
b
0.007
0.009
0.011
0.18
0.22
0.27
c
0.004
-
0.008
0.11
-
0.20
D
0.720
0.724
0.728
18.30
18.40
18.50
E
-
0.315
0.319
-
8.00
8.10
e
0.020 BSC
0.50 BSC
HD
0.779
0.787
0.795
19.80
20.00
20.20
L
0.016
0.020
0.024
0.40
0.50
0.60
LE
-
0.032
-
-
0.80
-
S
-
-
0.020
-
-
0.50
y
-
-
0.003
-
-
0.08
θ
0°
-
5°
0°
-
5°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(February, 2001, Version 0.2)
14
AMIC Technology, Inc.
A627308 Series
Package Information
sTSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions
A
A1
c
E
A2
e
unit: inches/mm
θ
L
LE
D1
D
Detail "A"
D
Detail "A"
0.076MM
S
b
SEATING PLANE
Dimensions in inches
Symbol
Dimensions in mm
Min
Nom
Max
Min
Nom
Max
A
-
-
0.049
-
-
1.25
A1
0.002
-
-
0.05
-
-
A2
0.037
0.039
0.041
0.95
1.00
1.05
b
0.007
0.008
0.009
0.17
0.20
0.23
c
0.0056
0.0059
0.0062
0.142
0.150
0.158
E
0.311
0.315
0.319
7.90
8.00
8.10
e
0.020 TYP
0.50 TYP
D
0.520
0.528
0.535
13.20
13.40
13.60
D1
0.461
0.465
0.469
11.70
11.80
11.90
L
0.012
0.020
0.028
0.30
0.50
0.70
LE
0.0275
0.0315
0.0355
0.700
0.800
0.900
S
θ
0.0109 TYP
0°
3°
0.278 TYP
5°
0°
3°
5°
Notes:
1. The maximum value of dimension D1 includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(February, 2001, Version 0.2)
15
AMIC Technology, Inc.
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