TI1 ADS823 10-bit, 60mhz sampling analog-to-digital converter Datasheet

ADS
ADS
ADS823
ADS826
826
823
SBAS070B – OCTOBER 1995 – REVISED AUGUST 2002
10-Bit, 60MHz Sampling
ANALOG-TO-DIGITAL CONVERTER
● +3V/+5V LOGIC I/O COMPATIBLE (ADS826)
● POWER DOWN: 20mW
● SSOP-28 PACKAGE
FEATURES
●
●
●
●
●
HIGH SNR: 60dB
HIGH SFDR: 74dBFS
LOW POWER: 265mW
INTERNAL/EXTERNAL REFERENCE OPTION
SINGLE-ENDED OR
DIFFERENTIAL ANALOG INPUT
● PROGRAMMABLE INPUT RANGE
● LOW DNL: 0.25LSB
● SINGLE +5V SUPPLY OPERATION
APPLICATIONS
●
●
●
●
●
The ADS823 and ADS826 employ digital error correction
techniques to provide excellent differential linearity for demanding imaging applications. Their low distortion and high
SNR give the extra margin needed for medical imaging,
communications, video, and test instrumentation. The ADS823
and ADS826 offer power dissipation of 265mW and also
provide a power-down mode, thus reducing power dissipation to only 20mW.
DESCRIPTION
The ADS823 and ADS826 are pipeline, CMOS Analog-toDigital Converters (ADCs) that operate from a single +5V
power supply. These converters provide excellent performance with a single-ended input and can be operated with a
differential input for added spurious performance. These
high-performance converters include a 10-bit quantizer, highbandwidth track-and-hold, and a high-accuracy internal reference. They also allow for disabling the internal reference
and utilizing external references. This external reference
option provides excellent gain and offset matching when
used in multi-channel applications or in applications where
full-scale range adjustment is required.
+VS
IN
IN
T/H
The ADS823 and ADS826 are specified at a maximum
sampling frequency of 60MHz and a single-ended input
range of 1.5V to 3.5V. The ADS823 and ADS826 are available in an SSOP-28 package and are pin-compatible with the
10-bit, 40MHz ADS822 and ADS825, and the 10-bit, 75MHz
ADS828.
CLK
ADS823
ADS826
VIN
MEDICAL IMAGING
COMMUNICATIONS
CCD IMAGING
VIDEO DIGITIZING
TEST EQUIPMENT
VDRV
Timing
Circuitry
10-Bit
Pipelined
A/D Core
Error
Correction
Logic
3-State
Outputs
D0
•
•
•
D9
Internal
Reference
CM
Optional External
Reference
Int/Ext
PD
OE
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 1995, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
ELECTROSTATIC
DISCHARGE SENSITIVITY
ABSOLUTE MAXIMUM RATINGS(1)
+VS ....................................................................................................... +6V
Analog Input ............................................................. –0.3V to (+VS + 0.3V)
Logic Input ............................................................... –0.3V to (+VS + 0.3V)
Case Temperature ......................................................................... +100°C
Junction Temperature .................................................................... +150°C
Storage Temperature ..................................................................... +150°C
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
NOTE: (1) Stresses beyond those listed under "absolute maximum ratings" may cause
permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated under
"recommended operating conditions" is not implied. Exposure to absolute-maximumrated conditions of extended periods may affect device reliability.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
EVALUATION MODULE ORDERING INFORMATION
PRODUCT
EVALUATION MODULE
ADS823E
DEM-ADS823E
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR(1)
ADS823E
"
ADS826E
"
SSOP-28
"
SSOP-28
"
DB
"
DB
"
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER(1)
TRANSPORT
MEDIA, QUANTITY
–40°C to +85°C
"
–40°C to +85°C
"
ADS823E
"
ADS826E
"
ADS823E
ADS823E/1K
ADS826E
ADS826E/1K
Rails
Tape and Reel, 1000
Rails
Tape and Reel, 1000
NOTE: (1) Fot the most current specifications and package information, refer to our web site at www.ti.com. (2) Models with a slash (/) are available only in Tape
and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces of ADS823E/1K” will get a single 1000-piece Tape and Reel.
ELECTRICAL CHARACTERISTICS
At TA = full specified temperature range, VS = +5V single-ended input range = 1.5V to 3.5V, sampling rate = 60MHz, external reference, unless otherwise noted.
ADS826E(1)
ADS823E
MIN
RESOLUTION
SPECIFIED TEMPERATURE RANGE
ANALOG INPUT
Standard Single-Ended Input Range
Optional Single-Ended Input Range
Common-Mode Voltage
Optional Differential Input Range
Analog Input Bias Current
Input Impedance
Track-Mode Input Bandwidth
Ambient Air
2Vp-p
1Vp-p
1.5
2
2Vp-p
2
2
MAX
MIN
UNITS
Bits
–40 to +85
°C
10k
3.5
3
✻
✻
3
✻
74
74
✻
✻
✻
✻
60M
±0.25
±0.25
Tested
±0.5
✻
✻
✻
✻
±1.0
✻
✻
Tested
✻
±2.0
65
64
V
V
V
V
µA
MΩ || pF
MHz
✻
Samples/s
Clk Cyc
✻
LSB
LSB
✻
LSBs
✻
5
67
MAX
–40 to +85
1
1.25 || 5
300
–3dBFS Input
TYP
10 Tested
2.5
CONVERSION CHARACTERISTICS
Sample Rate
Data Latency
DYNAMIC CHARACTERISTICS
Differential Linearity Error (largest code error)
f = 1MHz
f = 10MHz
No Missing Codes
Integral Nonlinearity Error, f = 1MHz
Spurious-Free Dynamic Range(2)
f = 1MHz
f = 10MHz
2-Tone Intermodulation Distortion(4)
f = 9.5MHz and 9.9MHz (–7dB each tone)
Signal-to-Noise Ratio (SNR)
f = 1MHz
f = 10MHz
Signal-to-(Noise + Distortion) (SINAD)
f = 1MHz
f = 10MHz
Effective Number of Bits(5), f = 1MHz
Output Noise
Aperture Delay Time
Aperture Jitter
Over Voltage Recovery Time(5)
Full-Scale Step Acquisition Time
TYP
10 Tested
73
73
dBFS(3)
dBFS
✻
dBc
59
59
dB
dB
58
58
✻
✻
✻
✻
✻
✻
dB
dB
Bits
LSBs rms
ns
ps rms
ns
ns
Referred to Full-Scale Sinewave
57
60
60
56
Referred to Full-Scale Sinewave
56
Input Grounded
59
59
9.5
0.2
3
1.2
2
5
55
ADS823, ADS826
www.ti.com
SBAS070B
ELECTRICAL CHARACTERISTICS (Cont.)
At TA = full specified temperature range, VS = +5V single-ended input range = 1.5V to 3.5V, sampling rate = 60MHz, external reference, unless otherwise noted.
ADS826E(1)
ADS823E
MIN
DIGITAL INPUTS
Logic Family
Convert Command
High Level Input Current(6) (VIN = 5V)
Low Level Input Current (VIN = 0V)
High Level Input Voltage
Low Level Input Voltage
Input Capacitance
DIGITAL OUTPUTS
Logic Family
Logic Coding
Low Output Voltage (IOL = 50µA to 1.6mA)
High Output Voltage, (IOH = 50µA to 0.5mA)
Low Output Voltage, (IOL = 50µA to 1.6mA)
High Output Voltage, (IOH = 50µA to 0.5mA)
3-State Enable Time
3-State Disable Time
Output Capacitance
ACCURACY (Internal Reference, 2Vp-p,
Unless Otherwise Noted)
Zero Error (referred to –FS)
Zero Error Drift (referred to –FS)
Midscale Offset Error
Gain Error(7)
Gain Error Drift(7)
Gain Error(8)
Gain Error Drift(8)
Power-Supply Rejection of Gain
REFT Tolerance
REFB Tolerance(9)
External REFT Voltage Range
External REFB Voltage Range
Reference Input Resistance
POWER-SUPPLY REQUIREMENTS
Supply Voltage: +VS
Supply Current: +IS
Power Dissipation: VDRV = 5V
VDRV = 3V
VDRV = 5V
VDRV = 3V
Power-Down
Thermal Resistance, θJA
SSOP-28
Start Conversion
VDRV = 5V
VDRV = 3V
OE = H to L
OE = L to H
TYP
MAX
MIN
TYP
MAX
CMOS-Compatible
Rising Edge of Convert Clock
+100
+10
+3.5
+1.0
5
TTL, +3V/+5V CMOS-Compatible
Rising Edge of Convert Clock
✻
✻
+2.0
+0.8
✻
CMOS
Straight Offset Binary
+0.1
+4.9
+0.1
+2.8
2
40
2
10
5
CMOS
Straight Offset Binary
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
±0.29
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
UNITS
µA
µA
V
V
pF
V
V
V
V
ns
ns
pF
fS = 2.5Mhz
At 25°C
At 25°C
At 25°C
At 25°C
∆VS = ±5%
Deviation From Ideal 3.5V
Deviation From Ideal 1.5V
REFB + 0.8
1.25
REFT to REFB
Operating
Operating
External Reference
External Reference
Internal Reference
Internal Reference
Operating
+4.75
±1.0
16
±3.0
±1.5
66
±1.0
23
70
±10
±10
3.5
1.5
1.6
±3.5
+5.0
55
275
265
295
285
20
89
±2.5
±25
±25
VS – 1.25
REFT – 0.8
✻
✻
+5.25
✻
335
350
✻
✻
✻
✻
✻
✻
✻
✻
✻
% FS
ppm/°C
% FS
% FS
ppm/°C
% FS
ppm/°C
dB
mV
mV
V
V
kΩ
V
mA
mW
mW
mW
mW
mW
°C/W
✻ Indicates the same specifications as the ADS823E.
NOTES: (1) ADS826 accepts a +3V clock input. (2) Spurious-Free Dynamic Range refers to the magnitude of the largest harmonic. (3) dBFS means dB relative to Full-Scale. (4) 2-tone intermodulation
distortion is referred to the largest fundamental tone. This number will be 6dB higher if it is referred to the magnitude of the 2-tone fundamental envelope. (5) Effective number of bits (ENOB) is defined
by (SINAD – 1.76)/6.02. (6) A 50kΩ pull-down resistor is inserted internally on OE pin. (7) Includes internal reference. (8) Excludes internal reference. (9) Ensured by design.
ADS823, ADS826
SBAS070B
www.ti.com
3
PIN CONFIGURATION
PIN DESCRIPTIONS
Top View
SSOP
GND
1
28
VDRV
Bit 1 (MSB)
2
27
+VS
Bit 2
3
26
GND
Bit 3
4
25
IN
Bit 4
5
24
IN
Bit 5
6
23
CM
Bit 6
7
22
REFT
Bit 7
8
21
ByT
Bit 8
9
20
ByB
Bit 9 10
19
REFB
Bit 10 (LSB) 11
18
INT/EXT
OE 12
17
RSEL
PD 13
16
GND
CLK 14
15
+VS
ADS823
ADS826
PIN
DESIGNATOR
1
2
3
4
5
6
7
8
9
10
11
12
GND
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Bit 8
Bit 9
Bit 10
OE
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
PD
CLK
+VS
GND
RSEL
INT/EXT
REFB
ByB
ByT
REFT
CM
IN
IN
GND
+VS
VDRV
DESCRIPTION
Ground
Data Bit 1 (D9) (MSB)
Data Bit 2 (D8)
Data Bit 3 (D7)
Data Bit 4 (D6)
Data Bit 5 (D5)
Data Bit 6 (D4)
Data Bit 7 (D3)
Data Bit 8 (D2)
Data Bit 9 (D1)
Data Bit 10 (D0) (LSB)
Output Enable. HI: High Impedance State.
LO: Normal Operation (Internal Pull-Down
Resistor)
Power Down: HI = Power Down; LO = Normal
Convert Clock Input
+5V Supply
Ground
Input Range Select: HI = 2V; LO = 1V
Reference Select: HI = External; LO = Internal
Bottom Reference
Bottom Ladder Bypass
Top Ladder Bypass
Top Reference
Common-Mode Voltage Output
Complementary Input (–)
Analog Input (+)
Ground
+5V Supply
Output Logic Driver Supply Voltage
TIMING DIAGRAM
N+2
N+1
Analog In
N+4
N+3
N
tD
N+5
tL
tCONV
N+7
N+6
tH
Clock
5 Clock Cycles
t2
Data Out
N–5
N–4
N–3
N–2
N–1
N
Data Invalid
SYMBOL
tCONV
tL
tH
tD
t1
t2
4
N+1
N+2
t1
DESCRIPTION
MIN
Convert Clock Period
Clock Pulse LOW
Clock Pulse HIGH
Aperture Delay
Data Hold Time, CL = 0pF
New Data Delay Time, CL = 15pF max
16.6
7.9
7.9
TYP
MAX
UNITS
100µs
ns
ns
ns
ns
ns
ns
8.3
8.3
3
3.9
12
ADS823, ADS826
www.ti.com
SBAS070B
TYPICAL CHARACTERISTICS
At TA = full specified temperature range, VS = +5V single-ended input range = 1.5V to 3.5V, sampling rate = 60MHz, external reference, unless otherwise noted.
SPECTRAL PERFORMANCE
SPECTRAL PERFORMANCE
0
0
fIN = 1MHz
SNR = 60dBFS
SFDR = 77dBFS
–20
Magnitude (dB)
Magnitude (dB)
–20
–40
–60
–40
–60
–80
–80
–100
–100
0
7.5
15
22.5
0
30
7.5
22.5
Frequency (MHz)
SPECTRAL PERFORMANCE
(Single-Ended, 1Vp-p)
SPECTRAL PERFORMANCE
(Differential Input, 2Vp-p)
30
0
fIN = 10MHz
SNR = 56.6dBFS
SFDR = 74dBFS
fIN = 10MHz
SNR = 60dBFS
SFDR = 73dBFS
–20
Magnitude (dB)
–20
–40
–60
–40
–60
–80
–80
–100
–100
0
7.5
15
22.5
0
30
7.5
15
22.5
30
Frequency (MHz)
Frequency (MHz)
SPECTRAL PERFORMANCE
(Differential Input, 2Vp-p)
SPECTRAL PERFORMANCE
0
0
fIN = 20MHz
SNR = 60.4dBFS
SFDR = 72dBFS
–40
–60
fIN = 20MHz
SNR = 58.7dBFS
SFDR = 70dBFS
–20
Magnitude (dB)
–20
Magnitude (dB)
15
Frequency (MHz)
0
Magnitude (dB)
fIN = 10MHz
SNR = 60dBFS
SFDR = 76dBFS
–80
–40
–60
–80
–100
–100
0
7.5
15
22.5
30
0
Frequency (MHz)
15
22.5
30
Frequency (MHz)
ADS823, ADS826
SBAS070B
7.5
www.ti.com
5
TYPICAL CHARACTERISTICS (Cont.)
At TA = full specified temperature range, VS = +5V single-ended input range = 1.5V to 3.5V, sampling rate = 60MHz, external reference, unless otherwise noted.
UNDERSAMPLING
(Differential Input, 2Vp-p)
2-TONE INTERMODULATION DISTORTION
0
0
fIN = 41MHz
fS = 56MHz
SNR = 59.8dBFS
SFDR = 78dBFS
–20
Magnitude (dB)
Magnitude (dB)
–20
f1 = 9.5MHz at –7dBFS
f2 = 9.9MHz at –7dBFS
IMD(3) = –64.4dBc
–40
–60
–40
–60
–80
–80
–100
–100
0
7
14
21
0
28
7.50
15
22.50
DIFFERENTIAL LINEARITY ERROR
DIFFERENTIAL LINEARITY ERROR
1.0
1.0
fIN = 10MHz
fIN = 20MHz
0.5
0.5
DLE (LSB)
DLE (LSB)
30
Frequency (MHz)
Frequency (MHz)
0
–0.5
0
–0.5
–1.0
–1.0
0
256
512
768
1024
0
256
512
Output Code
768
1024
Output Code
SWEPT POWER SFDR
INTEGRAL LINEARITY ERROR
100
2.0
fIN = 1MHz
fIN = 10MHz
80
SFDR (dB)
ILE (LSB)
1.0
0
–1.0
dBc
40
20
0
–2.0
0
256
512
768
1024
–60
–50
–40
–30
–20
–10
0
Input Amplitude (dBFS)
Output Code
6
dBFS
60
ADS823, ADS826
www.ti.com
SBAS070B
TYPICAL CHARACTERISTICS (Cont.)
At TA = full specified temperature range, VS = +5V single-ended input range = 1.5V to 3.5V, sampling rate = 60MHz, external reference, unless otherwise noted.
DYNAMIC PERFORMANCE vs TEMPERATURE
DYNAMIC PERFORMANCE vs INPUT FREQUENCY
80
80
SFDR
SFDR, SNR (dBFS)
SFDR, SNR (dBFS)
75
70
SNR
60
SFDR (fIN = 10MHz)
70
SFDR (fIN = 20MHz)
65
SNR (fIN = 10MHz)
60
SNR (fIN = 20MHz)
55
50
0.1
1
10
–50
100
–25
0
25
50
75
Frequency (MHz)
Temperature (°C)
SIGNAL-TO-(NOISE + DISTORTION)
vs TEMPERATURE
DIFFERENTIAL LINEARITY ERROR
vs TEMPERATURE
100
.40
65
60
DLE (LSB)
SINAD (dBFS)
fIN = 1MHz
fIN = 10MHz
fIN = 20MHz
.30
fIN = 20MHz
fIN = 1MHz
.20
55
fIN = 10MHz
.10
50
–50
–25
0
25
50
75
–50
100
–25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
POWER DISSIPATION vs TEMPERATURE
OUTPUT NOISE HISTOGRAM (DC Input)
290
800k
VDRV = +5V
Counts
Power (mW)
600k
280
400k
270
200k
260
–50
–25
0
25
50
75
0
N–2
100
Temperature (°C)
N
N+1
N+2
Code
ADS823, ADS826
SBAS070B
N–1
www.ti.com
7
APPLICATION INFORMATION
THEORY OF OPERATION
The ADS823 and ADS826 are high-speed CMOS ADCs
which employ a pipelined converter architecture consisting of
9 internal stages. Each stage feeds its data into the digital
error correction logic ensuring excellent differential linearity
and no missing codes at the 10-bit level. The output data
becomes valid on the rising clock edge (see Timing Diagram
on page 4). The pipeline architecture results in a data latency
of 5 clock cycles.
The analog input of the ADS823 and the ADS826 is a differential track-and-hold, as shown in Figure 1. The differential
topology along with tightly matched capacitors produce a high
level of AC-performance while sampling at very high rates.
The ADS823 and ADS826 allows its analog inputs to be
driven either single-ended or differentially. The typical configuration for the ADS823 and the ADS826 is for the singleended mode in which the input track-and-hold performs a
single-ended to differential conversion of the analog input
signal.
Both inputs (IN, IN) require external biasing using a commonmode voltage that is typically at the mid-supply level (+VS/2).
The following application discussion focuses on the singleended configuration. Typically, its implementation is easier to
achieve and the rated specifications for the ADS823 and
ADS826 are characterized using the single-ended mode of
operation.
DRIVING THE ANALOG INPUT
The ADS823 and ADS826 achieve excellent AC performance
either in the single-ended or differential mode of operation. The
selection for the optimum interface configuration will depend
Op Amp
Bias
φ1
VCM
φ1
CH
φ2
CI
IN
IN
φ1
φ2
φ1
φ1
φ1
See Figure 2 for the typical circuit for an AC-coupled analog
input configuration of the ADS823 and ADS826 while all
components are powered from a single +5V supply.
With the RSEL pin connected HIGH, the full-scale input
range is set to 2Vp-p. In this configuration, the top and
bottom references (REFT, REFB) provide an output voltage
of +3.5V and +1.5V, respectively. Two resistors ( 2x 1.62kΩ)
are used to create a common-mode voltage (VCM) of approximately +2.5V to bias the inputs of the driving amplifier A1.
Using the OPA680 on a single +5V supply, its ideal commonmode point is at +2.5V, which coincides with the recommended common-mode input level for the ADS823 and
ADS826, thus obviating the need of a coupling capacitor
between the amplifier and the converter. Even though the
OPA680 has an AC gain of +2, the DC gain is only +1 due
to the blocking capacitor at resistor RG.
The addition of a small series resistor (RS) between the
output of the op amp and the input of the ADS823 and
ADS826 will be beneficial in almost all interface configurations. This will decouple the op amp’s output from the
capacitive load and avoid gain peaking, which can result in
increased noise. For best spurious and distortion performance, the resistor value should be kept below 100Ω.
Furthermore, the series resistor in combination with the 10pF
capacitor establishes a passive low-pass filter limiting the
bandwidth for the wideband noise, thus helping improve the
SNR performance.
AC-Coupled, Dual-Supply Interface
OUT
See The circuit provided in Figure 3 for typical connections
of the analog input in case the selected amplifier operates on
dual supplies. This might be necessary to take full advantage
of very low distortion operational amplifiers, like the OPA642.
The advantage is that the driving amplifier can be operated
with a ground referenced bipolar signal swing. This will keep
the distortion performance at its lowest since the signal range
stays within the linear region of the op amp and sufficient
headroom to the supply rails can be maintained. By capacitively coupling the single-ended signal to the input of the
ADS823 and ADS826, their common-mode requirements
can easily be satisfied with two resistors connected between
the top and bottom reference.
φ2
φ1
Input Clock (50%)
Op Amp
Bias
INPUT CONFIGURATIONS
AC-Coupled, Single-Supply Interface
OUT
CI
CH
on the individual application requirements and system structure. For example, communications applications often process a band of frequencies that does not include DC,
whereas in imaging applications, the previously restored DC
level must be maintained correctly up to the ADC. Features
on the ADS823 and ADS826 like the input range select
(RSEL pin) or the option for an external reference, provide
the needed flexibility to accommodate a wide range of
applications. In any case, the ADS823 and ADS826 should
be configured such that the application objectives are met
while observing the headroom requirements of the driving
amplifier in order to yield the best overall performance.
VCM
Internal Non-overlapping Clock
φ1
φ2
φ1
FIGURE 1. Simplified Circuit of Input Track-and-Hold with
Timing Diagram.
8
ADS823, ADS826
www.ti.com
SBAS070B
1.62kΩ
+5V
VCM +2.5V
1.62kΩ
+5V
0.1µF
50Ω
REFB
+1.5V
RS
50Ω
VIN
REFT
+3.5V
RSEL
+VS
IN
OPA690
10pF
+VIN
0V
ADS823
ADS826
RF
402Ω
–VIN
CM
IN
RG
402Ω
0.1µF
INT/EXT
0.1µF
GND
FIGURE 2. AC-Coupled Input Configuration for a 2Vp-p Full-Scale Range and a Common-Mode Voltage, VCM, at +2.5V Derived
from the Internal Top (REFT) and Bottom Reference (REFB).
+5V
1.62kΩ
+5V
RS
24.9Ω
VIN
REFT
+3.5V
0.1µF
RSEL
+VS
IN
OPA642
100pF
ADS823
ADS826
–5V
RF
402Ω
1.62kΩ
CM
IN
0.1µF
RG
402Ω
REFB
+1.5V
INT/EXT
GND
FIGURE 3. AC-Coupling the Dual-Supply Amplifier OPA642 to the ADS823 and ADS826 for a 2Vp-p Full-Scale Input Range.
For applications requiring the driving amplifier to provide a
signal amplification, with a gain ≥ 5, consider using decompensated voltage-feedback op amps, like the OPA686, or
current-feedback op amps like the OPA6901.
DC-Coupled with Level Shift
Several applications may require that the bandwidth of the
signal path includes DC, in which case the signal has to be
DC-coupled to the ADC. In order to accomplish this, the
interface circuit has to provide a DC level shift to the analog
input signal. The circuit of in Figure 4 employs a dual op amp,
A1, to drive the input of the ADS823 and ADS826, and level
shift the signal to be compatible with the selected input
range. With the RSEL pin tied to the supply and the INT/EXT
pin to ground, the ADS823 and ADS826 are configured for a
2Vp-p input range and uses the internal references. The
complementary input (IN) may be appropriately biased using
the +2.5V common-mode voltage available at the CM pin.
One half of amplifier A1 buffers the REFB pin and drives the
voltage divider R1, R2. Due to the op amp’s noise gain of
+2V/V, assuming RF = RIN, the common-mode voltage (VCM)
has to be re-scaled to +1.25V. This results in the correct DC
level of +2.5V for the signal input (IN). Any DC voltage
differences between the IN and IN inputs of the ADS823 and
ADS826 effectively produce an offset, which can be corrected for by adjusting the resistor values of the divider, R1
and R2. The selection criteria for a suitable op amp should
include the supply voltage, input bias current, output voltage
swing, distortion, and noise specification. Note that in this
example the overall signal phase is inverted. To re-establish
the original signal polarity, it is always possible to interchange the IN and IN connections.
ADS823, ADS826
SBAS070B
www.ti.com
9
+5V
RF
499Ω
RIN
499Ω
VIN
1/2
OPA2681
+VS
RSEL
RS
50Ω
IN
2Vp-p
10pF
ADS823
ADS826
NOTE: RF = RIN, G = –1
CM (+2.5V)
IN
0.1µF
+5V
REFB
(+1.5V)
REFT
(+3.5V)
INT/EXT
50Ω
R2
200Ω
0.1µF
1/2
OPA2681
VCM = +1.25V
0.1µF
R1
1kΩ
RF
1kΩ
FIGURE 4. DC-Coupled Interface Circuit with Level-Shifting, Dual Current-Feedback Amplifier OPA2681.
SINGLE-ENDED TO DIFFERENTIAL CONFIGURATION
(Transformer Coupled)
If the application requires a signal conversion from a singleended source to feed the ADS823 and ADS826 differentially,
a RF transformer might be a good solution. The selected
transformer must have a center tap in order to apply the
common-mode DC voltage necessary to bias the converter
inputs. AC grounding the center tap will generate the differential signal swing across the secondary winding. Consider
a step-up transformer to take advantage of a signal amplification without the introduction of another noise source.
Furthermore, the reduced signal swing from the source may
lead to an improved distortion performance.
The component values of the R-C low-pass may be optimized depending on the desired roll-off frequency. The
resistor across the secondary side (RT) should be calculated
using the equation RT = n2 • RG to match the source
impedance (RG) for good power transfer and VSWR.
REFERENCE OPERATION
Figure 6 depicts the simplified model of the internal reference
circuit. The internal blocks are the bandgap voltage reference, the drivers for the top and bottom reference, and the
RSEL
The differential input configuration may provide a noticeable
advantage of achieving good SFDR performance over a wide
range of input frequencies. In this mode, both inputs of the
ADS823 and ADS826 see matched impedances, and the
differential signal swing can be reduced to half of the swing
required for single-ended drive. Figure 5 shows the schematic for the suggested transformer-coupled interface circuit.
ADS823
ADS826
50kΩ
+VS
INT/EXT
50kΩ
Bandgap Reference and Logic
VREF
+1
+1
RG
0.1µF 1:n
22Ω
VIN
IN
400Ω
47pF
400Ω
400Ω
400Ω
ADS823
ADS826
RT
REFT
22Ω
IN
CM
ByT
CM
ByB
REFB
RSEL INT/EXT
47pF
+5V
+
10µF
FIGURE 5. Transformer-Coupled Input.
10
Bypass Capacitors: 0.1µF each (optionally, 2.2µF
tantalum capacitors maybe added to ByT and ByB
pins for the best results).
0.1µF
FIGURE 6. Equivalent Reference Circuit with Recommended
Reference Bypassing.
ADS823, ADS826
www.ti.com
SBAS070B
resistive reference ladder. The bandgap reference circuit
includes logic functions that allow to set the analog input
swing of the ADS823 and ADS826 to either a 1Vp-p or
2Vp-p full-scale range simply by tying the RSEL pin to a LOW
or HIGH potential, respectively. While operating the ADS823
and ADS826 in the external reference mode, the buffer
amplifiers for the REFT and REFB are disconnected from the
reference ladder.
As shown, the ADS823 and ADS826 have internal 50kΩ pullup resistors at the range select pin (RSEL) and reference
select pin (INT/EXT). Leaving those pins open configures the
ADS823 for a 2Vp-p input range and external reference
operation. Setting the ADS823 up for internal reference
mode requires bringing the INT/EXT pin LOW.
The reference buffers can be utilized to supply up to 1mA
(sink and source) to external circuitry. The resistor ladders of
the ADS823 and ADS826 are divided into several segments
and have two additional nodes, ByT and ByB, which are
brought out for external bypassing only (See Figure 6). To
ensure proper operation with any reference configurations, it
is necessary to provide solid bypassing at all reference pins
in order to keep the clock feedthrough to a minimum. All
bypassing capacitors should be located as close to their
respective pins as possible.
ADS823
ADS826
REFT
+3.5V
R1
1.6kΩ
REFB
+1.5V
For even more design flexibility, the internal reference can be
disabled and an external reference voltage be used. The
utilization of an external reference may be considered for
applications requiring higher accuracy, improved temperature performance, or a wide adjustment range of the
converter’s full-scale range. Especially in multichannel
applications, the use of a common external reference has the
benefit of obtaining better matching of the full-scale range
between converters.
The external references can vary as long as the value of the
external top reference REFTEXT stays within the range of
(VS – 1.25V) and (REFB + 0.8V), and the external bottom
reference REFBEXT stays within 1.25V and (REFT – 0.8V), as
shown in Figure 8.
Clock jitter is critical to the SNR performance of high-speed,
high-resolution ADCs. Clock jitter leads to aperture jitter (tA),
which adds noise to the signal being converted. The ADS823
and ADS826 samples the input signal on the rising edge of the
CLK input. Therefore, this edge should have the lowest possible jitter. The jitter noise contribution to total SNR is given by
0.1µF
VCM
+2.5V
EXTERNAL REFERENCE OPERATION
DIGITAL INPUTS AND OUTPUTS
Clock Input Requirements
R2
1.6kΩ
0.1µF
The common-mode voltage available at the CM pin may be
used as a bias voltage to provide the appropriate offset for
the driving circuitry. However, care must be taken not to
appreciably load this node, which is not buffered and has a
high impedance. An alternative way of generating a common-mode voltage is given in Figure 7. Here, two external
precision resistors (tolerance 1% or better) are located
between the top and bottom reference pins. The commonmode voltage, VCM, will appear at the midpoint.
FIGURE 7. Alternative Circuit to Generate CM Voltage.
+5V
B
A - Short for 1Vp-p Input Range
B - Short for 2Vp-p Input Range (Default)
+VS
A
RSEL
INT/EXT
GND
IN
VIN
ADS823
ADS826
VCM
+2.5VDC
IN
REFT
External Top Reference
REFT = REFB +0.8V to +3.75V
ByT
GND
4 x 0.1µF
ByB
REFB
External Bottom Reference
REFB = REFT –0.8V to +1.25V
FIGURE 8. Configuration Example for External Reference Operation.
ADS823, ADS826
SBAS070B
www.ti.com
11
the following equation. If this value is near your system
requirements, input clock jitter must be reduced.
Jitter SNR = 20 log
Particularly in undersampling applications, special consideration should be given to clock jitter. The clock input should be
treated as an analog input in order to achieve the highest
level of performance. Any overshoot or undershoot of the
clock signal may cause degradation of the performance.
When digitizing at high sampling rates, the clock should have
50% duty cycle (tH = tL), along with fast rise and fall times of
2ns or less. To estimate the typical performance deviation for
clock duty cycles in the range of 50% ±7.5%, refer to
Figure 9. The clock input of the ADS826 can be driven with
either 3V or 5V logic levels. Using low-voltage logic (3V) may
lead to improved AC performance of the converters.
1111111111
1100000000
1000000000
0100000000
0000000000
TABLE I. Coding Table for Single-Ended Input Configuration
with IN tied to the Common-Mode Voltage (VCM).
DIFFERENTIAL INPUT
STRAIGHT OFFSET BINARY
(SOB)
+FS –1LSB (IN = +3V, IN = +2V)
+1/2 Full-Scale
Bipolar Zero (IN = IN = VCM)
–1/2 Full-Scale
–FS (IN = +2V, IN = +3V)
TABLE II.
1111111111
1100000000
1000000000
0100000000
0000000000
Coding Table for Differential Input Configuration
and 2Vp-p Full-Scale Range.
60
It is recommended to keep the capacitive loading on the data
lines as low as possible (≤ 15pF). Higher capacitive loading
will cause larger dynamic currents as the digital outputs are
changing. Those high current surges can feed back to the
analog portion of the ADS823 and ADS826 and affect performance. If necessary, external buffers or latches close to the
converter’s output pins may be used to minimize the capacitive loading. They also provide the added benefit of isolating
the ADS823 and ADS826 from any digital noise activities on
the bus coupling back high frequency noise.
55
Digital Output Driver (VDRV)
80
SFDR
75
SFDR, SNR (dBFS)
STRAIGHT OFFSET BINARY
(SOB)
+FS –1LSB (IN = REFT)
+1/2 Full-Scale
Bipolar Zero (IN = VCM)
–1/2 Full-Scale
–FS (IN = REFB)
1
rms signal to rms noise
2π ƒ IN t A
where: ƒIN is input signal frequency
tA is rms clock jitter
70
65
SNR
50
57.5
55
52.5
50
47.5
45
42.5
Clock Duty Cycle (tH/tL x 100%)
FIGURE 9. ADS823 and ADS826 Duty Cycle Sensitivity.
Digital Outputs
The output data format of the ADS823 and ADS826 is in positive
Straight Offset Binary code as shown in Tables I and II. This
format can easily be converted into the Binary Two’s Complement code by inverting the MSB.
12
SINGLE-ENDED INPUT
(IN = CMV)
The ADS823 and ADS826 feature a dedicated supply pin for
the output logic drivers, VDRV, which is not internally connected to the other supply pins. Setting the voltage at VDRV
to +5V or +3V, the ADS823 and ADS826 produce corresponding logic levels and can directly interface to the selected logic family. The output stages are designed to supply
sufficient current to drive a variety of logic families. However,
it is recommended to use the ADS823 and ADS826 with +3V
logic supply. This will lower the power dissipation in the
output stages due to the lower output swing and reduce
current glitches on the supply line which may affect the ACperformance of the converter. In some applications, it might
be advantageous to decouple the VDRV pin with additional
capacitors or a pi-filter.
ADS823, ADS826
www.ti.com
SBAS070B
GROUNDING AND DECOUPLING
Proper grounding and bypassing, short lead length, and the
use of ground planes are particularly important for highfrequency designs. Multilayer PC boards are recommended
for best performance since they offer distinct advantages like
minimizing ground impedance, separation of signal layers by
ground layers, etc. The ADS823 and ADS826 should be
treated as analog components. Whenever possible, the supply pins should be powered by the analog supply. This will
ensure the most consistent results, since digital supply lines
often carry high levels of noise which otherwise would be
coupled into the converter and degrade the achievable performance. All ground connections on the ADS823 and ADS826
are internally joined together, obviating the design of split
ground planes. The ground pins (1, 16, 26) should directly
connect to an analog ground plane which covers the PC
board area around the converter. While designing the layout,
it is important to keep the analog signal traces separated
from any digital lines to prevent noise coupling onto the
analog signal path. Due to the high sampling rate, the
ADS823 and ADS826 generate high frequency current transients and noise (clock feedthrough) that are fed back into
the supply and reference lines. This requires that all supply
and reference pins are sufficiently bypassed. Figure 10
shows the recommended decoupling scheme for the ADS823
and ADS826. In most cases 0.1µF ceramic chip capacitors at
each pin are adequate to keep the impedance low over a
wide frequency range. Their effectiveness largely depends
on the proximity to the individual supply pin. Therefore, they
should be located as close to the supply pins as possible. In
addition, a larger bipolar capacitor (1µF to 22µF) should be
placed on the PC board in proximity of the converter circuit.
ADS823
ADS826
+VS
27
+VS
15
0.1µF
GND
16
0.1µF
VDRV
28
0.1µF
10µF
+
+5V
+3/+5V
FIGURE 10. Recommended Bypassing for the Supply Pins.
ADS823, ADS826
SBAS070B
GND
26
www.ti.com
13
PACKAGE OPTION ADDENDUM
www.ti.com
1-Jun-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
ADS823E
ACTIVE
SSOP
DB
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS823E
ADS823E/1K
ACTIVE
SSOP
DB
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS823E
ADS823E/1KG4
ACTIVE
SSOP
DB
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS823E
ADS823EG4
ACTIVE
SSOP
DB
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS823E
ADS826E
ACTIVE
SSOP
DB
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS826E
ADS826E/1K
ACTIVE
SSOP
DB
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS826E
ADS826E/1KG4
ACTIVE
SSOP
DB
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS826E
ADS826EG4
ACTIVE
SSOP
DB
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS826E
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
1-Jun-2013
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
31-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ADS823E/1K
SSOP
DB
28
1000
330.0
16.4
8.1
10.4
2.5
12.0
16.0
Q1
ADS826E/1K
SSOP
DB
28
1000
330.0
16.4
8.1
10.4
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
31-May-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS823E/1K
SSOP
DB
28
1000
367.0
367.0
38.0
ADS826E/1K
SSOP
DB
28
1000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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