TI1 BQ20Z90DBTR-V150 Sbs 1.1-compliant gas gauge enabled with impedance track technology for use with the bq29330 Datasheet

Not Recommended for New Designs
bq20z90
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SLUS778 – JULY 2007
SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK™
TECHNOLOGY FOR USE WITH THE bq29330
FEATURES
1
•
2
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
2
Lifetime Data Logging
30-Pin TSSOP (DBT)
APPLICATIONS
•
•
•
Notebook PCs
Medical and Test Equipment
Portable Instrumentation
DESCRIPTION
The bq20z90 SBS-compliant gas gauge IC,
incorporating
patented
Impedance
Track™
technology, is designed for battery-pack or in-system
installation. The bq20z90 measures and maintains an
accurate record of available charge in Li-ion or
Li-polymer
batteries
using
its
integrated
high-performance analog peripherals. The bq20z90
monitors capacity change, battery impedance,
open-circuit voltage, and other critical parameters of
the battery pack, and reports the information to the
system host controller over a serial-communication
bus. It is designed to work with the bq29330 analog
front-end (AFE) protection IC to maximize
functionality and safety, and minimize component
count and cost in smart battery circuits.
The Impedance Track technology continuously
analyzes the battery impedance, resulting in superior
gas-gauging accuracy. This enables remaining
capacity to be calculated with discharge rate,
temperature, and cell aging all accounted for during
each stage of every cycle.
AVAILABLE OPTIONS
PACKAGE
TA
30-PIN TSSOP (DBT)
Tube
30-PIN TSSOP (DBT)
Tape & Reel
–40°C to
85°C
bq20z90DBT (1)
bq20z90DBTR (2)
(1) A single tube quantity is 50 units.
(2) A single reel quantity is 2000 units
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
IMPEDANCE TRACK is a trademark of Texas Instruments.
•
1
Patented Impedance Track™ Technology
Accurately Measures Available Charge in
Li-Ion and Li-Polymer Batteries
Better than 1% Error Over Lifetime of the
Battery
Instant Accuracy – No Learning Cycle
Required
Automatically adjusts for battery aging,
battery self discharge and temperature
inefficiencies
Supports the Smart Battery Specification SBS
V1.1
Works With the TI bq29330 Analog Front-End
(AFE) Protection IC to Provide Complete Pack
Electronics Solution
Full Array of Programmable Voltage, Current,
and Temperature Protection Features
Integrated Time Base Removes Need for
External Crystal with Optional Crystal Input
Electronics for 7.2-V, 10.8-V or 14.4-V Battery
Packs With 50% Fewer External Components
Based on a Powerful Low-Power RISC CPU
Core With High-Performance Peripherals
Integrated Field Programmable FLASH
Memory Eliminates the Need for External
Configuration Memory
Measures Charge Flow Using a
High-Resolution, 16-Bit Integrating
Delta-Sigma Converter
– Better Than 0.65 nVh of Resolution
– Self-Calibrating
Uses 16-Bit Delta-Sigma Converter for
Accurate Voltage and Temperature
Measurements
Extensive Data Reporting Options For
Improved System Interaction
Optional Pulse Charging Feature for Improved
Charge Times
Drives 3-, 4- or 5-Segment LED Display for
Remaining Capacity Indication
Supports SHA-1 Authentication
•
•
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
Not Recommended for New Designs
bq20z90
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SLUS778 – JULY 2007
SYSTEM PARTITIONING DIAGRAM
Discharge / Charge /
Pre-Charge FETs
Fuse
Pack +
Host Interface & Data
Management
System Interface
2k Bytes of
Data Flash
2k Bytes
of RAM
6k x 22
Mask ROM
24k x 22 Program
Flash
Nch FET Drive
(Charge Pumps)
32.768kHz
Watchdog &
Protection Timing
I2C
System Interface
RAM Configuration, Status
and Control Registers
TOUT and LEDOUT
Power Support
T1
Standard Delta-Sigma A to D Converter
Analog Output Drive
Integrating Delta-Sigma A to D Converter
2-Tier Over Current
Protection
Precharge
Control
Cell, Bat and Pack
Voltage Translation
Reset
32kHz Oscillator and 8MHz System Clock
SMBus
HDQ
LDO +
Reset
2.5V / 3.3V (LED)
Cell Balancing Drive
16 Dig GPIO & Peripherals
8 Dig GPIO or Analog GPI
Pack -
TSSOP (DBT)
(TOP VIEW)
NC
XALERT
SDATA
1
2
3
SCLK
CLKOUT
TS1
TS2
PRES
PFIN
SAFE
4
5
SMBD
NC
SMBC
DISP
NC
6
7
8
9
10
11
12
13
14
15
30
29
28
27
26
25
24
23
22
21
20
VCELLVCELL+
NC
RBI
VCC
VSS
MRST
SRN
SRP
*VSS
19
LED5
LED4
18
17
16
LED3
LED2
LED1
NC - No internal connection
2
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TERMINAL FUNCTIONS
TERMINAL
NO.
(1)
NAME
I/O (1)
DESCRIPTION
1
NC
–
2
XALERT
I
Not used— leave floating
3
SDATA
I/O
Data transfer to and from bq29330
4
SCLK
I/O
Communication clock to the bq29330
5
CLKOUT
O
32.768-kHz output for the bq29330. This pin should be directly connected to the AFE.
6
TS1
I
1st Thermistor voltage input connection to monitor temperature
7
TS2
I
2nd Thermistor voltage input connection to monitor temperature
8
PRES
I
Active low input to sense system insertion and typically requires additional ESD protection
9
PFIN
I
Active low input to detect secondary protector output status and allows the bq20z90 to report the
status of the 2nd level protection output
Active high output to enforce additional level of safety protection; e.g., fuse blow.
Input from bq29330 XALERT output.
10
SAFE
O
11
SMBD
I/OD
12
NC
–
13
SMBC
I/OD
SMBus clock open-drain bidirectional pin used to clock the data transfer to and from the bq20z90
14
DISP
I
Display control for the LEDs. This pin is typically connected to bq29330 REG via a 100-kΩ resistor
and a push-button switch to VSS.
SMBus data open-drain bidirectional pin used to transfer address and data to and from the bq20z90
Not used— leave floating
15
NC
–
Not used— leave floating
16
LED1
O
LED1 display segment that drives an external LED depending on the firmware configuration
17
LED2
O
LED2 display segment that drives an external LED depending on the firmware configuration
18
LED3
O
LED3 display segment that drives an external LED depending on the firmware configuration
19
LED4
O
LED4 display segment that drives an external LED depending on the firmware configuration
20
LED5
O
LED5 display segment that drives an external LED depending on the firmware configuration
21
VSS
–
Connected I/O pin to VSS
22
SRP
IA
Connections to the top of a small-value sense resistor to monitor the battery charge- and
discharge-current flow
23
SRN
IA
Connections to the bottom of a small-value sense resistor to monitor the battery charge- and
discharge-current flow
24
MRST
I
Master reset input that forces the device into reset when held low. Must be held high for normal
operation
25
VSS
P
Negative Supply Voltage
26
VCC
P
Positive Supply Voltage
27
RBI
P
Backup power to the bq20z90 data registers during periods of low operating voltage. RBI accepts a
storage capacitor or a battery input.
28
NC
–
Not used— leave floating
29
VCELL+
I
Input from bq29330 used to read a scaled value of individual cell voltages
30
VCELL-
I
Input from bq29330 used to read a scaled value of individual cell voltages
I = Input, IA = Analog input, I/O = Input/output, I/OD = Input/Open-drain output, O = Output, OA = Analog output, P = Power
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
RANGE
VCC relative to VSS
Supply voltage range
V(IOD) relative to VSS
Open-drain I/O pins
VI relative to VSS
Input voltage range to all other pins
TA
Operating free-air temperature range
–40°C to 85°C
Tstg
Storage temperature range
–65°C to 150°C
(1)
–0.3 V to 2.75 V
–0.3 V to 6 V
–0.3 V to VCC + 0.3 V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
VCC
ICC
TEST CONDITIONS
Supply voltage
MIN
TYP
MAX
2.4
2.5
2.6
No flash programming
Operating mode current
I(SLP) Low-power storage mode current
400
V
(1)
bq20z90 + bq29330
475
Sleep mode
8 (1)
bq20z90 + bq29330
UNIT
μA
μA
51
Output voltage low SMBC, SMBD, SDATA, SCLK, SAFE
IOL = 0.5 mA
0.4
V
LED1 – LED5
IOL = 10 mA
0.4
V
VOH
Output high voltage, SMBC, SMBD, SDATA, SCLK, SAFE
IOH = –1 mA
VIL
Input voltage low SMBC, SMBD, SDATA, SCLK, XALERT,
PRES, PFIN
–0.3
0.8
DISP
–0.3
0.8
6
VOL
VCC – 0.5
VIH
Input voltage high SMBC, SMBD, SDATA, SCLK, XALERT,
PRES, PFIN
2
DISP
2
CIN
Input capacitance
V
VCC + 0.3
5
V(AI1) Input voltage range VCELL+, VCELL-,TS1, TS2
V(AI2) Input voltage range SRN, SRP
V
V
V
V
pF
- 0.2
0.8XVCC
– 0.20
0.20
V
Z(AI2) Input impedance VCELL+, VCELL-, TS1, TS2
0 V–1 V
8
MΩ
Z(AI1) Input impedance SRN, SRP
0 V–1 V
2.5
MΩ
(1)
4
This value does not include the bq29330
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POWER-ON RESET
VCC = 2.4V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
MIN
TYP
MAX
VIT–
Negative-going voltage input
PARAMETER
TEST CONDITIONS
1.7
1.8
1.9
UNIT
V
VHYS
Power-on reset hysteresis
50
125
200
mV
MAX
UNIT
POWER ON RESET BEHAVIOR
VS
FREE-AIR TEMPERATURE
Power-On Reset Negative-Going Voltage - V
1.81
1.8
1.79
1.78
1.77
1.76
-40
-20
0
20
40
60
80
TA - Free-Air Temperature - °C
INTEGRATING ADC (Coulomb Counter) CHARACTERISTICS
VCC = 2.4V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
V(SR)
Input voltage range, V(SRN) and V(SRP)
V(SROS)
Input offset
INL
Integral nonlinearity error
TEST CONDITIONS
V(SR) = V(SRN) – V(SRP)
MIN
TYP
–0.2
0.2
μV
10
0.007%
V
0.034%
OSCILLATOR
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
4.194
MHz
HIGH FREQUENCY OSCILLATOR
f(OSC) Operating Frequency
f(EIO) Frequency Error (1) (2)
TA = 20°C to 70°C
t(SXO) Start-up Time (3)
-3% 0.25%
3%
-2% 0.25%
2%
2.5
5
ms
LOW FREQUENCY OSCILLATOR
f(LOSC) Operating Frequency
f(LEIO) Frequency Error (2) (4)
(1)
(2)
(3)
(4)
The
The
The
The
32.768
TA = 20°C to 70°C
KHz
-2.5% 0.25%
2.5%
-1.5% 0.25%
1.5%
frequency error is measured from 4.194 MHz.
frequency drift is included and measured from the trimmed frequency at VCC = 2.5 V, TA = 25°C.
start-up time is defined as the time it takes for the oscillator output frequency to be within 1% of the specified frequency.
frequency error is measured from 32.768 kHz.
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OSCILLATOR (continued)
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
t(LSXO) Start-up time
(5)
TEST CONDITIONS
MIN
TYP
(5)
MAX
UNIT
500
μs
The start-up time is defined as the time it takes for the oscillator output frequency to be ± 3%.
DATA FLASH MEMORY CHARACTERISTICS
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Data retention
See
(1)
10
Flash programming write-cycles
See
(1)
20,000
t(WORDPROG) Word programming time
See
(1)
I(DDdPROG)
See
(1)
tDR
(1)
Flash-write supply current
TYP
MAX
UNIT
Years
Cycles
2
ms
5
10
mA
TYP
MAX
UNIT
1500
nA
Assured by design. Not production tested
REGISTER BACKUP
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
I(RB)
RB data-retention input current
TEST CONDITIONS
MIN
V(RB) > V(RBMIN), VCC < VITV(RB) > V(RBMIN), VCC < VIT-, TA = 0°C
to 50°C
V(RB)
(1)
6
RB data-retention voltage (1)
40
1.7
160
V
Specified by design. Not production tested.
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SMBus TIMING SPECIFICATIONS
VCC = 2.4 V to 2.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
fSMB
SMBus operating frequency
Slave mode, SMBC 50% duty cycle
fMAS
SMBus master clock frequency
Master mode, no clock low slave extend
tBUF
Bus free time between start and stop
tHD:STA
Hold time after (repeated) start
tSU:STA
Repeated start setup time
tSU:STO
Stop setup time
TYP
10
MAX
100
51.2
kHz
4.7
4
μs
4.7
4
Receive mode
0
Transmit mode
300
tHD:DAT
Data hold time
tSU:DAT
Data setup time
tTIMEOUT
Error signal/detect
tLOW
Clock low period
tHIGH
Clock high period
See
(2)
tLOW:SEXT
Cumulative clock low slave extend time
See
(3)
25
tLOW:MEXT
Cumulative clock low master extend time
See
(4)
10
tF
Clock/data fall time
(VILMAX – 0.15 V) to (VIHMIN + 0.15 V)
tR
Clock/data rise time
0.9 VCC to (VILMAX – 0.15 V)
(1)
(2)
(3)
(4)
UNIT
ns
250
See
(1)
25
35
4.7
4
50
300
1000
ms
μs
ms
ns
The bq20z90 times out when any clock low exceeds tTIMEOUT.
tHIGH:MAX. is minimum bus idle time. SMBC = 1 for t > 50 μs causes reset of any transaction involving the bq20z90 that is in progress.
tLOW:SEXT is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop.
tLOW:MEXT is the cumulative time a master device is allowed to extend the clock cycles in one message from initial start to the stop.
SMBus TIMING DIAGRAM
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FEATURE SET
Primary (1st Level) Safety Features
The bq20z90 supports a wide range of battery and system protection features that can easily be configured. The
primary safety features include:
•
•
•
•
•
•
•
•
Battery cell over/under voltage protection
Battery pack over/under voltage protection
2 independent charge overcurrent protection
3 independent discharge overcurrent protection
Short circuit protection
Over temperature protection
AFE Watchdog
Host Watchdog
Secondary (2nd Level) Safety Features
The secondary safety features of the bq20z90 can be used to indicate more serious faults via the SAFE (pin 10)
pin. This pin can be used to blow an in-line fuse to permanently disable the battery pack from charging or
discharging. The secondary safety features include:
•
•
•
•
•
•
•
•
•
•
•
•
Safety over voltage
Battery cell imbalance
2nd level protection IC input
Safety over current
Safety over temperature
Open thermistor
Charge FET and Zero-Volt Charge FET fault
Discharge FET fault
Fuse blow failure detection
AFE Communication error
AFE Verification error
Internal flash data error
Charge Control Features
The bq20z90 charge control features include:
•
•
•
•
•
•
•
Report the appropriate charging current needed for constant current charging and the appropriate charging
voltage needed for constant voltage charging to a smart charger using SMBus broadcasts.
Determine the chemical state of charge of each battery cell using Impedance Track™. Using cell balancing
algorithm, gradually decrease the differences in the cells' state of charge in a fully charged state. This
prevents high cells from overcharging, causing excessive degradation and also increases the usable pack
energy by preventing early charge termination.
Support Pre-charging/Zero-volt charging
Support Fast charging
Support Pulse charging
Support Charge Inhibit and Charge Suspend modes
Report charging faults and also indicate charging status via charge and discharge alarms.
Gas Gauging
The bq20z90 uses the Impedance Track™ Technology to measure and calculate the available charge in battery
cells. The achievable accuracy is better than 1% error over the lifetime of the battery and there is no full
charge-discharge learning cycle required.
8
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See Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm application note (SLUA364)
for further details.
LED Display
The bq20z90 can drive a 3-, 4-, or 5- segment LED display for remaining capacity indication. The LED drive
current can be adjusted to 3mA, 4mA and 5mA digitally.
LifeTime Data Logging Features
The bq20z90 offers a lifetime data logging array, where all important measurements are stored for warranty and
analysis purposes. The data monitored include:
•
•
•
•
•
•
•
•
•
•
•
•
•
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
Lifetime
maximum temperature
minimum temperature
maximum battery cell voltage
minimum battery cell voltage
maximum battery pack voltage
minimum battery pack voltage
maximum charge current
maximum discharge current
maximum charge power
maximum discharge power
maximum average discharge current
maximum average discharge power
average temperature
Authentication
The bq20z90 supports authentication by the host using SHA-1.
Power Modes
The bq20z90 supports 3 different power modes to reduce power consumption:
•
•
•
In Normal Mode, the bq20z90 performs measurements, calculations, protection decisions, and data updates
in 1 second intervals. Between these intervals, the bq20z90 is in a reduced power stage.
In Sleep Mode, the bq20z90 performs measurements, calculations, protection decisions, and data updates in
adjustable time intervals. Between these intervals, the bq20z90 is in a reduced power stage.
In Shutdown Mode the bq20z90 is completety disabled.
CONFIGURATION
Oscillator Function
The bq20z90 fully integrates the system and processor oscillators and, therefore, requires no pins or
components for this feature.
System Present Operation
The bq20z90 periodically verifies the PRES pin and detects that the battery is present in the system via a low
state on a PRES input. When this occurs, bq20z90 enters normal operating mode. When the pack is removed
from the system and the PRES input is high, the bq20z90 enters the battery-removed state, disabling the charge,
discharge and ZVCHG FETs. The PRES input is ignored and can be left floating when non-removal mode is set
in the data flash.
BATTERY PARAMETER MEASUREMENTS
The bq20z90 uses an integrating delta-sigma analog-to-digital converter (ADC) for current measurement, and a
second delta-sigma ADC for individual cell and battery voltage, and temperature measurement.
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Charge and Discharge Counting
The integrating delta-sigma ADC measures the charge/discharge flow of the battery by measuring the voltage
drop across a small-value sense resistor between the SRP and SRN pins. The integrating ADC measures bipolar
signals from -0.25 V to 0.25 V. The bq20z90 detects charge activity when VSR = V(SRP)-V(SRN)is positive and
discharge activity when VSR = V(SRP)-V(SRN) is negative. The bq20z90 continuously integrates the signal over
time, using an internal counter. The fundamental rate of the counter is 0.65 nVh.
Voltage
The bq20z90 updates the individual series cell voltages through the bq29330 at one second intervals. The
bq20z90 configures the bq29330 to connect the selected cell, cell offset, or bq29330 VREF to the CELL pin of
the bq29330, which is required to be connected to VIN of the bq20z90. The internal ADC of the bq20z90
measures the voltage, scales it, and calibrates itself appropriately. This data is also used to calculate the
impedance of the cell for the Impedance Track™ gas-gauging.
Current
The bq20z90 uses the SRP and SRN inputs to measure and calculate the battery charge and discharge current
using a 5 mΩ to 20 mΩ typ. sense resistor.
Wake Function
The bq20z90 can exit sleep mode, if enabled, by the presence of a programmable level of current signal across
SRP and SRN.
Auto Calibration
The bq20z90 provides an auto-calibration feature to cancel the voltage offset error across SRP and SRN for
maximum charge measurement accuracy. The bq20z90 performs auto-calibration when the SMBus lines stay
low continuously for a minimum of a programmable amount of time.
Temperature
The bq20z90 TS1 and TS2 inputs, in conjunction with two identical NTC thermistors (default are Semitec
103AT), measure the battery environmental temperature. The bq20z90 can also be configured to use its internal
temperature sensor.
COMMUNICATIONS
The bq20z90 uses SMBus v1.1 with Master Mode and package error checking (PEC) options per the SBS
specification.
SMBus On and Off State
The bq20z90 detects an SMBus off state when SMBC and SMBD are logic-low for ≥ 2 seconds. Clearing this
state requires either SMBC or SMBD to transition high. Within 1 ms, the communication bus is available.
SBS Commands
Table 1. SBS COMMANDS
SBS Cmd
Mode
Name
Format
Size in
Bytes
Min
Value
Max
Value
Default Value
Unit
0x00
R/W
ManufacturerAccess
hex
0x01
R/W
RemainingCapacityAlarm
unsigned int
2
0x0000
0xffff
—
2
0
65535
300
mAh or
10mWh
0x02
R/W
RemainingTimeAlarm
unsigned int
2
0
0x03
R/W
BatteryMode
hex
2
0x0000
65535
10
min
0xe383
—
0x04
R/W
AtRate
signed int
2
-32768
32767
—
mA or 10mW
0x05
R
AtRateTimeToFull
unsigned int
2
0
65534
—
min
0x06
R
AtRateTimeToEmpty
unsigned int
2
0
65534
—
min
10
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Table 1. SBS COMMANDS (continued)
SBS Cmd
Mode
Name
Format
Size in
Bytes
Min
Value
Max
Value
Default Value
Unit
0x07
R
AtRateOK
unsigned int
2
0
65535
—
0x08
R
Temperature
unsigned int
2
0
65535
—
0.1°K
0x09
R
Voltage
unsigned int
2
0
65535
—
mV
0x0a
R
Current
signed int
2
-32768
32767
—
mA
0x0b
R
AverageCurrent
signed int
2
-32768
32767
—
mA
0x0c
R
MaxError
unsigned int
1
0
100
—
%
0x0d
R
RelativeStateOfCharge
unsigned int
1
0
100
—
%
0x0e
R
AbsoluteStateOfCharge
unsigned int
1
0
100+
—
%
0x0f
R/W
RemainingCapacity
unsigned int
2
0
65535
—
mAh or
10mWh
0x10
R
FullChargeCapacity
unsigned int
2
0
65535
—
mAh or
10mWh
0x11
R
RunTimeToEmpty
unsigned int
2
0
65534
—
min
0x12
R
AverageTimeToEmpty
unsigned int
2
0
65534
—
min
0x13
R
AverageTimeToFull
unsigned int
2
0
65534
—
min
0x14
R
ChargingCurrent
unsigned int
2
0
65534
—
mA
0x15
R
ChargingVoltage
unsigned int
2
0
65534
—
mV
0x16
R
BatteryStatus
unsigned int
2
0x0000
0xdbff
—
0x17
R/W
CycleCount
unsigned int
2
0
65535
—
0x18
R/W
DesignCapacity
unsigned int
2
0
65535
4400
mAh or
10mWh
0x19
R/W
DesignVoltage
unsigned int
2
0
65535
14400
mV
0x1a
R/W
SpecificationInfo
hex
2
0x0000
0xffff
0x0031
0x1b
R/W
ManufactureDate
unsigned int
2
—
—
01-Jan-1980
0x1c
R/W
SerialNumber
hex
2
0x0000
0xffff
0x0001
0x20
R/W
ManufacturerName
String
11+1
—
—
Texas Inst.
ASCII
0x21
R/W
DeviceName
String
7+1
—
—
bq20z90
ASCII
0x22
R/W
DeviceChemistry
String
4+1
—
—
LION
ASCII
0x23
R/W
ManufacturerData
String
14+1
—
—
—
ASCII
0x2f
R/W
Authenticate
String
20+1
—
—
—
ASCII
0x3c
R
CellVoltage4
unsigned int
2
0
65535
—
mV
0x3d
R
CellVoltage3
unsigned int
2
0
65535
—
mV
0x3e
R
CellVoltage2
unsigned int
2
0
65535
—
mV
0x3f
R
CellVoltage1
unsigned int
2
0
65535
—
mV
ASCII
Table 2. EXTENDED SBS COMMANDS
SBS
Cmd
Mode
Name
Format
Size in
Bytes
Min Value
Max Value
Default
Value
Unit
0x45
R
AFEData
String
11+1
—
0x46
R/W
FETControl
hex
1
0x00
—
—
ASCII
0x1e
—
0x4f
R
StateOfHealth
unsigned int
1
0
100
—
0x50
R
SafetyAlert
hex
2
0x0000
0xffff
—
0x51
R
SafetyStatus
hex
2
0x0000
0xffff
—
0x52
R
PFAlert
hex
2
0x0000
0x9fff
—
0x53
R
PFStatus
hex
2
0x0000
0x9fff
—
0x54
R
OperationStatus
hex
2
0x0000
0xf7f7
—
0x55
R
ChargingStatus
hex
2
0x0000
0xffff
—
%
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): bq20z90
11
Not Recommended for New Designs
bq20z90
www.ti.com
SLUS778 – JULY 2007
Table 2. EXTENDED SBS COMMANDS (continued)
SBS
Cmd
Mode
Name
Format
Size in
Bytes
Min Value
Max Value
Default
Value
0x57
R
ResetData
0x58
R
WDResetData
hex
2
0x0000
0xffff
—
unsigned int
2
0
65535
—
Unit
0x5a
R
PackVoltage
unsigned int
2
0
65535
---
mV
0x5d
R
AverageVoltage
unsigned int
2
0
65535
—
mV
0x60
R/W
UnSealKey
hex
4
0x00000000
0xffffffff
—
0x61
R/W
FullAccessKey
hex
4
0x00000000
0xffffffff
—
0x62
R/W
PFKey
hex
4
0x00000000
0xffffffff
—
0x63
R/W
AuthenKey3
hex
4
0x00000000
0xffffffff
—
0x64
R/W
AuthenKey2
hex
4
0x00000000
0xffffffff
—
0x65
R/W
AuthenKey1
hex
4
0x00000000
0xffffffff
—
0x66
R/W
AuthenKey0
hex
4
0x00000000
0xffffffff
—
0x70
R/W
ManufacturerInfo
String
8+1
—
—
—
ASCII
0x71
R/W
SenseResistor
unsigned int
2
0
65535
—
μΩ
0x77
R/W
DataFlashSubClassID
hex
2
0x0000
0xffff
—
0x78
R/W
DataFlashSubClassPage1
hex
32
—
—
—
0x79
R/W
DataFlashSubClassPage2
hex
32
—
—
—
0x7a
R/W
DataFlashSubClassPage3
hex
32
—
—
—
0x7b
R/W
DataFlashSubClassPage4
hex
32
—
—
—
0x7c
R/W
DataFlashSubClassPage5
hex
32
—
—
—
0x7d
R/W
DataFlashSubClassPage6
hex
32
—
—
—
0x7e
R/W
DataFlashSubClassPage7
hex
32
—
—
—
0x7f
R/W
DataFlashSubClassPage8
hex
32
—
—
—
12
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): bq20z90
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
BQ20Z90DBT-V150
NRND
TSSOP
DBT
30
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
BQ20Z90
BQ20Z90DBT-V150G4
NRND
TSSOP
DBT
30
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
BQ20Z90
BQ20Z90DBTR-V150
NRND
TSSOP
DBT
30
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
BQ20Z90
HPA00742DBTR
NRND
TSSOP
DBT
30
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
BQ20Z90
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
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semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
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