Product Folder Sample & Buy Support & Community Tools & Software Technical Documents ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 ADS42JBx9 Dual-Channel, 14- and 16-Bit, 250-MSPS Analog-to-Digital Converters 1 Features 2 Applications • • • • • • • • • • • • • 1 • • • • • • • • • Dual-Channel ADCs 14- and 16-Bit Resolution Maximum Clock Rate: 250 MSPS JESD204B Serial Interface – Subclass 0, 1, 2 Compliant – Up to 3.125 Gbps – Two and Four Lanes Support Analog Input Buffer with High-Impedance Input Flexible Input Clock Buffer: Divide-by-1, -2, and -4 Differential Full-Scale Input: 2 VPP and 2.5 VPP (Register Programmable) Package: 9-mm × 9-mm VQFN-64 Power Dissipation: 850 mW/Ch Aperture Jitter: 85 fS rms Internal Dither Channel Isolation: 100 dB Performance: – fIN = 170 MHz at 2 VPP, –1 dBFS – SNR: 73.3 dBFS – SFDR: 93 dBc for HD2, HD3 – SFDR: 100 dBc for Non HD2, HD3 – fIN = 170 MHz at 2.5 VPP, –1 dBFS – SNR: 74.7 dBFS – SFDR: 89 dBc for HD2, HD3 and 95 dBc for Non HD2, HD3 Communication and Cable Infrastructure Multi-Carrier, Multimode Cellular Receivers Radar and Smart Antenna Arrays Broadband Wireless Test and Measurement Systems Software-Defined and Diversity Radios Microwave and Dual-Channel I/Q Receivers Repeaters Power Amplifier Linearization 3 Description The ADS42JB69 and ADS42JB49 are high-linearity, dual-channel, 16- and 14-bit, 250-MSPS, analog-todigital converters (ADCs). These devices support the JESD204B serial interface with data rates up to 3.125 Gbps. The buffered analog input provides uniform input impedance across a wide frequency range while minimizing sample-and-hold glitch energy making it easy to drive analog inputs up to very high input frequencies. A sampling clock divider allows more flexibility for system clock architecture design. The devices employ internal dither algorithms to provide excellent spurious-free dynamic range (SFDR) over a large input frequency range. Device Information(1) PART NUMBER PACKAGE ADS42JB49 VQFN (64) ADS42JB69 VQFN (64) INTERFACE OPTION 14-bit DDR or QDR LVDS 14-bit JESD204B 16-bit DDR or QDR LVDS 16-bit JESD204B (1) For all available packages, see the orderable addendum at the end of the datasheet. space space 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com Simplified Schematic Device 14-, 16-Bit ADC CLKINP, CLKINM Gain Test Modes -20 SYNC~P, SYNC~M Delay INBP, INBM -40 14-, 16-Bit ADC Digital Block DB0P, DB0M JESD204B Digital DB1P, DB1M Gain Test Modes OVRB Common Mode -60 -80 MODE CTRL1 CTRL2 STBY SDOUT PDN PDN_GBL SEN SCLK SDATA Device Configuration RESET VCM Fs = 250Msps Fin = 170MHz Ain = -1dBFS HD2 = 90dBc HD3 = 89dBc Non HD2,3 = 100dBc DA1P, DA1M PLL x10, x20 Divide by 1, 2, 4 FFT for 170MHz Input Signal 0 DA0P, DA0M JESD204B Digital Amplitude (dB) SYSREFP, SYSREFM OVRA Digital Block INAP, INAM -100 -120 0 2 Submit Documentation Feedback 25 50 75 Frequency (MHz) 100 125 Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 8 9 1 1 1 3 5 5 7 Absolute Maximum Ratings ...................................... 7 ESD Ratings.............................................................. 7 Recommended Operating Conditions....................... 8 Thermal Information .................................................. 8 Electrical Characteristics: ADS42JB69 (16-Bit) ........ 9 Electrical Characteristics: ADS42JB49 (14-Bit) ...... 10 Electrical Characteristics: General .......................... 11 Digital Characteristics ............................................. 12 Timing Characteristics............................................. 13 Typical Characteristics: ADS42JB69 .................... 15 Typical Characteristics: ADS42JB49 .................... 20 Typical Characteristics: Common ......................... 25 Typical Characteristics: Contour ........................... 26 Parameter Measurement Information ................ 29 Detailed Description ............................................ 31 9.1 9.2 9.3 9.4 9.5 9.6 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ Programming........................................................... Register Maps ......................................................... 31 31 31 33 39 42 10 Application and Implementation........................ 57 10.1 Application Information.......................................... 57 10.2 Typical Application ................................................ 57 11 Power Supply Recommendations ..................... 63 12 Layout................................................................... 63 12.1 Layout Guidelines ................................................. 63 12.2 Layout Example .................................................... 65 13 Device and Documentation Support ................. 66 13.1 13.2 13.3 13.4 13.5 13.6 Device Support...................................................... Documentation Support ........................................ Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 66 68 68 68 68 68 14 Mechanical, Packaging, and Orderable Information ........................................................... 68 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (August 2013) to Revision F Page • Changed format to meet latest data sheet standards ............................................................................................................ 1 • Added ESD Ratings table and Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections..................................................................................................................... 1 • Changed title of Device Comparison Table............................................................................................................................ 5 • Changed title of Pin Functions table....................................................................................................................................... 6 • Deleted Ordering Information table ........................................................................................................................................ 7 • Corrected names of registers 10h, 11h, 12h, and 13h in Table 13 ..................................................................................... 42 Changes from Revision D (August 2013) to Revision E • Page Changed document status to Production Data....................................................................................................................... 1 Changes from Revision C (July 2013) to Revision D Page • Updated front page block diagram ......................................................................................................................................... 2 • Changed 2-VPP Full-Scale INL maximum specification in ADS42JB49 Electrical Characteristics table .............................. 10 Changes from Revision B (July 2013) to Revision C Page • Added Internal Dither in Features Section ............................................................................................................................. 1 • Changed From "The devices provide excellent" to "The devices employ internal dither algorithms to provide" ................... 1 • Changed 2-VPP Full-Scale INL maximum specification in ADS42JB69 Electrical Characteristics table ................................ 9 Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 3 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com • Deleted 2.5-VPP Full-Scale INL maximum specification in ADS42JB69 Electrical Characteristics table ............................... 9 • Changed 2-VPP Full-Scale INL maximum specification in ADS42JB49 Electrical Characteristics table .............................. 10 • Deleted 2.5-VPP Full-Scale INL maximum specification in ADS42JB49 Electrical Characteristics table ............................. 10 • Changed EGREF specifications in General Electrical Characteristics table ........................................................................... 11 Changes from Revision A (November 2012) to Revision B • 4 Page Changed document status to Mixed Status............................................................................................................................ 1 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 5 Device Comparison Table INTERFACE OPTION 14-BIT, 160 MSPS 14-BIT, 250 MSPS 16-BIT, 250 MSPS DDR or QDR LVDS — ADS42LB49 ADS42LB69 JESD204B ADS42JB46 ADS42JB49 ADS42JB69 6 Pin Configuration and Functions DRVDD DGND OVRB OVRA DRVDD DB1M DB1P DB0M DB0P IOVDD DA0P DA0M DA1P DA1M DGND DRVDD 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 RGC Package VQFN-64 (Top View) DGND 1 48 DRVDD 2 47 DRVDD DGND 3 46 DGND MODE 4 45 SDOUT STBY 5 44 RESET PDN_GBL 6 43 SCLK DRVDD 7 42 SDATA SYNC~M 8 SYNC~P 9 Thermal Pad DGND 41 SEN 40 AVDD CTRL2 10 39 CTRL1 AVDD 11 38 AVDD AGND 12 37 AGND INBP 13 36 INAP Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 32 AVDD3V AVDD 31 SYSREFM 30 SYSREFP 29 AGND 28 AVDD 27 AGND 26 CLKINP 25 CLKINM 24 23 AVDD 22 21 VCM AGND 20 AGND 33 AVDD 19 AVDD 16 AVDD 18 34 AGND AGND 35 INAM AVDD3V 17 INBM 14 AGND 15 Submit Documentation Feedback 5 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com Pin Functions: JESD204B Output Interface PIN NAME DESCRIPTION NO. I/O FUNCTION AGND 12, 15, 19, 20, 23, 26, 28, 34, 37 I Supply Analog ground AVDD 11, 16, 18, 22, 27, 31, 33, 38, 40 I Supply 1.8-V analog power supply AVDD3V 17, 32 I Supply 3.3-V analog supply for analog buffer CLKINM 24 I Clock Differential ADC clock input CLKINP 25 I Clock Differential ADC clock input CTRL1 39 I Control Power-down control with an internal 150-kΩ pull-down resistor Power-down control with an internal 150-kΩ pull-down resistor CTRL2 10 I Control DA0P/M 54, 53 O Interface JESD204B serial data output for channel A, lane 0 DA1P/M 52,51 O Interface JESD204B serial data output for channel A, lane 1 DB0P/M 56,57 O Interface JESD204B serial data output for channel B, lane 0 DB1P/M 58,59 O Interface JESD204B serial data output for channel B, lane 1 DGND 1, 3, 46, 48, 50, 63 I Supply Digital ground DRVDD 2, 7, 47, 49, 60, 64 I Supply Digital 1.8-V power supply INAM 35 I Input Differential analog input for channel A INAP 36 I Input Differential analog input for channel A INBM 14 I Input Differential analog input for channel B INBP 13 I Input Differential analog input for channel B IOVDD 55 I Supply Digital 1.8-V power supply for the JESD204B transmitter MODE 4 I Control Connect to GND OVRA 61 O Interface Overrange indication channel A in CMOS output format. OVRB 62 O Interface Overrange indication channel B in CMOS output format. PDN_GBL 6 I Control Global power down. Active high with an internal 150-kΩ pull-down resistor. RESET 44 I Control Hardware reset; active high. This pin has an internal 150-kΩ pull-down resistor. SCLK 43 I Control Serial interface clock input. This pin has an internal 150-kΩ pull-down resistor. SDATA 42 I Control Serial interface data input. This pin has an internal 150-kΩ pull-down resistor. SDOUT 45 O Control Serial interface data output SEN 41 I Control Serial interface enable. This pin has an internal 150-kΩ pull-up resistor. STBY 5 I Control Standby. Active high with an internal 150-kΩ pull-down resistor. SYNC~P 9 I Interface Synchronization input for JESD204B port SYNC~M 8 I Interface Synchronization input for JESD204B port SYSREFM 30 I Clock External SYSREF input (subclass 1) SYSREFP 29 I Clock External SYSREF input (subclass 1) VCM 21 O Output 1.9-V common-mode output voltage for analog inputs Thermal pad — GND Ground Connect to ground plane 6 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) Supply voltage MIN MAX UNIT AVDD3V –0.3 3.6 V AVDD –0.3 2.1 V DRVDD –0.3 2.1 V IOVDD –0.3 2.1 V Voltage between AGND and DGND Voltage applied to input pins Temperature –0.3 0.3 V INAP, INBP, INAM, INBM –0.3 3 V CLKINP, CLKINM –0.3 minimum (2.1, AVDD + 0.3) V SYNC~P, SYNC~M –0.3 minimum (2.1, AVDD + 0.3) V SYSREFP, SYSREFM –0.3 minimum (2.1, AVDD + 0.3) V SCLK, SEN, SDATA, RESET, PDN_GBL, CTRL1, CTRL2, STBY, MODE –0.3 3.9 V Operating free-air, TA –40 Operating junction, TJ Storage, Tstg (1) –65 +85 °C +125 °C +150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings V(ESD) (1) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) VALUE UNIT ±2000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 7 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN NOM MAX UNIT SUPPLIES AVDD Analog supply voltage AVDD3V Analog buffer supply voltage 1.7 1.8 1.9 V 3.15 3.3 3.45 DRVDD V Digital supply voltage 1.7 1.8 1.9 V IOVDD Output buffer supply voltage 1.7 1.8 1.9 V ANALOG INPUTS VID Differential input voltage range VICR Input common-mode voltage Default after reset Register programmable (2) 2 VPP 2.5 VPP VCM ± 0.025 V Maximum analog input frequency with 2.5-VPP input amplitude 250 MHz Maximum analog input frequency with 2-VPP input amplitude 400 MHz CLOCK INPUT Input clock sample rate Input clock amplitude differential (VCLKP – VCLKM) 10x mode 60 250 MSPS 20x mode 40 156.25 MSPS Sine wave, ac-coupled (3) 1.5 VPP LVPECL, ac-coupled 0.3 1.6 VPP LVDS, ac-coupled 0.7 VPP LVCMOS, single-ended, ac-coupled Input clock duty cycle 1.5 35% 50% V 65% DIGITAL OUTPUTS CLOAD Maximum external load capacitance from each output pin to DRGND RLOAD Single-ended load resistance TA Operating free-air temperature (1) (2) (3) 3.3 pF Ω +50 –40 +85 °C After power-up, to reset the device for the first time, use the RESET pin only. Refer to the Register Initialization section. For details, refer to the Digital Gain section. Refer to the Performance vs Clock Amplitude curves, Figure 28 and Figure 29. 7.4 Thermal Information ADS42JBx9 THERMAL METRIC (1) RGC (QFN) UNIT 64 PINS RθJA Junction-to-ambient thermal resistance 22.9 RθJC(top) Junction-to-case (top) thermal resistance 7.1 RθJB Junction-to-board thermal resistance 2.5 ψJT Junction-to-top characterization parameter 0.1 ψJB Junction-to-board characterization parameter 2.5 RθJC(bot) Junction-to-case (bottom) thermal resistance 0.2 (1) 8 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 7.5 Electrical Characteristics: ADS42JB69 (16-Bit) Typical values are at TA = +25°C, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, 50% clock duty cycle, –1-dBFS differential analog input, and sampling rate = 250 MSPS, unless otherwise noted. Minimum and maximum values are across the full temperature range of TMIN = –40°C to TMAX = +85°C, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, and IOVDD = 1.8 V. PARAMETER SNR Signal-to-noise ratio SINAD Signal-to-noise and distortion ratio TEST CONDITIONS 2-VPP FULL-SCALE MIN TYP THD HD2 HD3 Total harmonic distortion 2nd-order harmonic distortion 3rd-order harmonic distortion TYP MAX UNIT 74 75.9 dBFS fIN = 70 MHz 73.8 75.6 dBFS fIN = 170 MHz 73.3 74.7 dBFS fIN = 230 MHz 70.8 72.6 74 dBFS fIN = 10 MHz 73.9 75.7 dBFS 73.7 75.3 dBFS 73.2 74.5 dBFS 72.2 73.1 dBFS 95 90 dBc 91 88 dBc 93 89 dBc fIN = 230 MHz 84 82 dBc fIN = 10 MHz 92 88 dBc fIN = 70 MHz 89 86 dBc 91 86 dBc fIN = 230 MHz 82 80 dBc fIN = 10 MHz 95 95 dBc fIN = 70 MHz 91 88 dBc 93 94 dBc fIN = 230 MHz 84 82 dBc fIN = 10 MHz 95 90 dBc fIN = 70 MHz 96 93 dBc fIN = 70 MHz fIN = 170 MHz 69.6 fIN = 10 MHz SFDR MIN fIN = 10 MHz fIN = 230 MHz Spurious-free dynamic range (including second and third harmonic distortion) MAX 2.5-VPP FULL-SCALE fIN = 70 MHz fIN = 170 MHz fIN = 170 MHz fIN = 170 MHz 78 81 94 89 dBc fIN = 230 MHz 86 84 dBc fIN = 10 MHz 102 102 dBc 103 103 dBc 100 95 dBc fIN = 230 MHz 99 93 dBc f1 = 46 MHz, f2 = 50 MHz, each tone at –7 dBFS 97 95 dBFS f1 = 185 MHz, f2 = 190 MHz, each tone at –7 dBFS 90 89 dBFS Crosstalk 20-MHz, full-scale signal on channel under observation; 170-MHz, full-scale signal on other channel 100 100 dB Input overload recovery Recovery to within 1% (of fullscale) for 6-dB overload with sinewave input 1 1 PSRR AC power-supply rejection ratio For 50-mVPP signal on AVDD supply, up to 10 MHz > 40 > 40 dB ENOB Effective number of bits fIN = 170 MHz 11.9 12.1 LSBs DNL Differential nonlinearity fIN = 170 MHz ±0.6 ±0.6 LSBs INL Integrated nonlinearity fIN = 170 MHz ±3 ±3.5 LSBs Worst spur (other than second and third harmonics) IMD Two-tone intermodulation distortion fIN = 170 MHz 81 81 fIN = 70 MHz fIN = 170 MHz 87 Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ±8 Submit Documentation Feedback Clock cycle 9 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 7.6 Electrical Characteristics: ADS42JB49 (14-Bit) Typical values are at TA = +25°C, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, 50% clock duty cycle, –1-dBFS differential analog input, and sampling rate = 250 MSPS, unless otherwise noted. Minimum and maximum values are across the full temperature range of TMIN = –40°C to TMAX = +85°C, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, and IOVDD = 1.8 V. PARAMETER SNR Signal-to-noise ratio SINAD Signal-to-noise and distortion ratio TEST CONDITIONS 2-VPP FULL-SCALE MIN TYP THD HD2 HD3 Total harmonic distortion 2nd-order harmonic distortion 3rd-order harmonic distortion TYP MAX UNIT 73.4 75 dBFS fIN = 70 MHz 73.2 74.7 dBFS fIN = 170 MHz 72.7 74 dBFS fIN = 230 MHz 69.5 72.2 73.4 dBFS fIN = 10 MHz 73.3 74.8 dBFS 73.1 74.5 dBFS 72.7 73.8 dBFS 71.8 72.6 dBFS 95 90 dBc 91 88 dBc 93 89 dBc fIN = 230 MHz 84 82 dBc fIN = 10 MHz 92 88 dBc fIN = 70 MHz 89 86 dBc 90 86 dBc fIN = 230 MHz 82 80 dBc fIN = 10 MHz 95 95 dBc fIN = 70 MHz 91 88 dBc 93 94 dBc fIN = 230 MHz 84 82 dBc fIN = 10 MHz 95 90 dBc fIN = 70 MHz 96 93 dBc fIN = 70 MHz fIN = 170 MHz 68.5 fIN = 10 MHz SFDR MIN fIN = 10 MHz fIN = 230 MHz Spurious-free dynamic range (including second and third harmonic distortion) MAX 2.5-VPP FULL-SCALE fIN = 70 MHz fIN = 170 MHz fIN = 170 MHz fIN = 170 MHz 76 79 94 89 dBc fIN = 230 MHz 86 84 dBc fIN = 10 MHz 102 102 dBc 103 103 dBc 101 95 dBc fIN = 230 MHz 99 93 dBc f1 = 46 MHz, f2 = 50 MHz, each tone at –7 dBFS 97 95 dBFS f1 = 185 MHz, f2 = 190 MHz, each tone at –7 dBFS 90 89 dBFS Crosstalk 20-MHz, full-scale signal on channel under observation; 170-MHz, full-scale signal on other channel 100 100 dB Input overload recovery Recovery to within 1% (of fullscale) for 6-dB overload with sinewave input 1 1 PSRR AC power-supply rejection ratio For a 50-mVPP signal on AVDD supply, up to 10 MHz > 40 > 40 ENOB Effective number of bits fIN = 170 MHz 11.8 12 LSBs DNL Differential nonlinearity fIN = 170 MHz ±0.15 ±0.15 LSBs INL Integrated nonlinearity fIN = 170 MHz ±0.75 ±0.9 LSBs Worst spur (other than second and third harmonics) IMD 10 Two-tone intermodulation distortion Submit Documentation Feedback fIN = 170 MHz 79 79 fIN = 70 MHz fIN = 170 MHz 87 ±3 Clock cycle dB Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 7.7 Electrical Characteristics: General Typical values are at +25°C, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, 50% clock duty cycle, –1dBFS differential analog input, and sampling rate = 250 MSPS, unless otherwise noted. Minimum and maximum values are across the full temperature range: TMIN = –40°C to TMAX = +85°C, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, and IOVDD = 1.8 V. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG INPUTS Differential input voltage range VID Default (after reset) 2 VPP Register programmed (1) 2.5 VPP Differential input resistance (at 170 MHz) 1.2 kΩ 4 pF Differential input capacitance (at 170 MHz) Analog input bandwidth VCM With 50-Ω source impedance, and 50-Ω termination 900 MHz Common-mode output voltage 1.9 V VCM output current capability 10 mA DC ACCURACY Offset error –20 20 mV EGREF Gain error as a result of internal reference inaccuracy alone ±2 %FS EGCHAN Gain error of channel alone –5 %FS Temperature coefficient of EGCHAN Δ%/°C 0.01 POWER SUPPLY IAVDD Analog supply current 128 160 mA IAVDD3V Analog buffer supply current 290 330 mA IDRVDD Digital supply current 228 252 mA 60 100 mA IOVDD Output buffer supply current 50-Ω external termination from pin to IOVDD, fIN = 2.5 MHz Analog power 231 mW Analog buffer power 957 mW Digital power 410 mW 109 mW Power consumption by output buffer 50-Ω external termination from pin to IOVDD, fIN = 2.5 MHz Total power 1.7 Global power-down (1) 1.96 W 160 mW Refer to the Serial Interface section. Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 11 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 7.8 Digital Characteristics The dc specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic level '0' or '1'. AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, and IOVDD = 1.8 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DIGITAL INPUTS (RESET, SCLK, SEN, SDATA, PDN_GBL, STBY, CTRL1, CTRL2, MODE) (1) High-level input voltage All digital inputs support 1.8-V and 3.3-V logic levels Low-level input voltage All digital inputs support 1.8-V and 3.3-V logic levels 1.2 V 0.4 SEN V 0 µA RESET, SCLK, SDATA, PDN_GBL, STBY, CTRL1, CTRL2, MODE 10 µA SEN 10 µA 0 µA High-level input voltage 1.3 V Low-level input voltage 0.5 V Input common-mode voltage 0.9 V DRVDD V High-level input current Low-level input current RESET, SCLK, SDATA, PDN_GBL, STBY, CTRL1, CTRL2, MODE DIGITAL INPUTS (SYNC~P, SYNC~M, SYSREFP, SYSREFM) VCM_DIG DIGITAL OUTPUTS (SDOUT, OVRA, OVRB) DRVDD – 0.1 High-level output voltage Low-level output voltage 0.1 DIGITAL OUTPUTS (JESD204B Interface: DA[0,1], DB[0,1]) High-level output voltage IOVDD V Low-level output voltage IOVDD – 0.4 V 0.4 V IOVDD – 0.2 V |VOD| Output differential voltage VOCM Output common-mode voltage Transmitter short-circuit current Transmitter terminals shorted to any voltage between –0.25 V and 1.45 V Single-ended output impedance Output capacitance (1) (2) 12 V (2) Output capacitance inside the device, from either output to ground –100 100 mA 50 Ω 2 pF RESET, SCLK, SDATA, PDN_GBL, STBY, CTRL1, CTRL2 and MODE pins have 150-kΩ (typical) internal pull-down resistor to ground, while SEN pin has 150-kΩ (typical) pull-up resistor to AVDD. 50-Ω, single-ended external termination to IOVDD. Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 7.9 Timing Characteristics Typical values are at +25°C, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, 50% clock duty cycle, –1dBFS differential analog input, and sampling rate = 250 MSPS, unless otherwise noted. Minimum and maximum values are across the full temperature range: TMIN = –40°C to TMAX = +85°C, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, and IOVDD = 1.8 V. See Figure 1. PARAMETER TEST CONDITIONS MIN TYP MAX 0.7 1.1 UNIT SAMPLE TIMING CHARACTERISTICS Aperture delay 0.4 Between two channels on the same device Aperture delay matching Between two devices at the same temperature and supply voltage Aperture jitter Wake-up time ps ±150 ps 85 Time to valid data after coming out of STANDBY mode Time to valid data after coming out of global power-down ns ±70 fS rms 50 200 µs 250 1000 µs tSU_SYNC~ Setup time for SYNC~ Referenced to input clock rising edge 400 ps tH_SYNC~ Hold time for SYNC~ Referenced to input clock rising edge 100 ps tSU_SYSREF Setup time for SYSREF Referenced to input clock rising edge 400 ps tH_SYSREF Hold time for SYSREF Referenced to input clock rising edge 100 ps CML OUTPUT TIMING CHARACTERISTICS Unit interval 320 Serial output data rate Total jitter Data rise time, data fall time tR, tF 2.5 Gbps (10x mode, fS = 250 MSPS) 1667 ps 3.125 Gbps 0.28 P-PUI 3.125 Gbps (20x mode, fS = 156.25 MSPS) 0.3 P-PUI Rise and fall times measured from 20% to 80%, differential output waveform, 600 Mbps ≤ bit rate ≤ 3.125 Gbps 105 ps Table 1. Latency in Different Modes (1) (2) MODE 10x PARAMETER LATENCY (N Cycles) TYPICAL DATA DELAY (tD, ns) ADC latency 23 0.65 × tS + 3 Normal OVR latency 14 6.7 Fast OVR latency 9 6.7 from SYNC~ falling edge to CGS phase 20x (1) (2) (3) (4) (3) 16 0.65 × tS + 3 from SYNC~ rising edge to ILA sequence (4) 25 0.65 × tS + 3 ADC latency 22 0.85 × tS + 3 Normal OVR latency 14 6.7 Fast OVR latency 9 6.7 from SYNC~ falling edge to CGS phase (3) 15 0.85 × tS + 3 from SYNC~ rising edge to ILA sequence (4) 16 0.85 × tS + 3 Overall latency = latency + tD. tS is the time period of the ADC conversion clock. Latency is specified for subclass 2. In subclass 0, the SYNC~ falling edge to CGS phase latency is 16 clock cycles in 10x mode and 15 clock cycles in 20x mode. Latency is specified for subclass 2. In subclass 0, the SYNC~ rising edge to ILA sequence latency is 11 clock cycles in 10x mode and 11 clock cycles in 20x mode. Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 13 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 N+2 Sample N www.ti.com N+3 N+4 N+1 N + Latency + 1 N + Latency N + Latency + 2 tA Input Clock CLKP CLKM ADC Latency (1) tD (2) Dx0P, Dx0M N - Latency-1 N + Latency N - Latency+1 N - Latency+2 N - Latency+3 N-1 N N+1 N+1 N - Latency-1 N + Latency N - Latency+1 N - Latency+2 N - Latency+3 N-1 N N+1 N+1 (2) Dx1P, Dx1M (1) Overall latency = ADC latency + tD. (2) x = A for channel A and B for channel B. Figure 1. ADC Latency 14 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 7.10 Typical Characteristics: ADS42JB69 Typical values are at TA = +25°C, ADC sampling rate = 250 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 0 0 fIN = 10 MHz SFDR = 96 dBc SNR = 74 dBFS SINAD = 73.9 dBFS THD = 94 dBc SFDR Non HD2, HD3 = 102 dBc −40 −60 −80 −100 −120 fIN = 170 MHz SFDR = 88 dBc SNR = 73.3 dBFS SINAD = 73 dBFS THD = 87 dBc SFDR Non HD2, HD3 = 101 dBc −20 Amplitude (dBFS) Amplitude (dBFS) −20 −40 −60 −80 −100 0 25 50 75 Frequency (MHz) 100 −120 125 0 Figure 2. FFT for 10-MHz Input Signal fIN = 300 MHz SFDR = 74 dBc SNR = 72.4 dBFS SINAD = 69.9 dBFS THD = 73 dBc SFDR Non HD2,HD3 = 96 −40 −60 Amplitude (dBFS) Amplitude (dBFS) 125 G002 fIN = 10 MHz SFDR = 90 dBc SNR = 75.8 dBFS SINAD = 75.7 dBFS THD = 89 dBc SFDR Non HD2, HD3 = 105 dBc −20 −80 −100 −40 −60 −80 −100 0 25 50 75 Frequency (MHz) 100 −120 125 0 25 G003 Figure 4. FFT for 300-MHz Input Signal 50 75 Frequency (MHz) 100 125 G004 Figure 5. FFT for 10-MHz Input Signal (2.5-VPP Full-Scale) 0 0 fIN = 170 MHz SFDR = 87 dBc SNR = 74.7 dBFS SINAD = 74.4 dBFS THD = 84 dBc SFDR Non HD2, HD3 = 94 dBc −40 −60 fIN = 300 MHz SFDR = 71 dBc SNR = 73.4 dBFS SINAD = 69 dBFS THD = 70 dBc SFDR Non HD2, HD3 = 94 dBc −20 Amplitude (dBFS) −20 Amplitude (dBFS) 100 0 −20 −80 −100 −120 50 75 Frequency (MHz) Figure 3. FFT for 170-MHz Input Signal 0 −120 25 G001 −40 −60 −80 −100 0 25 50 75 Frequency (MHz) 100 Figure 6. FFT for 170-MHz Input Signal (2.5-VPP Full-Scale) 125 −120 0 25 G005 50 75 Frequency (MHz) 100 125 G006 Figure 7. FFT for 300-MHz Input Signal (2.5-VPP Full-Scale) Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 15 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com Typical Characteristics: ADS42JB69 (continued) Typical values are at TA = +25°C, ADC sampling rate = 250 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 0 0 Each Tone at −7 dBFS Amplitude fIN1 = 46 MHz fIN2 = 50 MHz 2−Tone IMD = 98 dBFS SFDR = 105 dBFS −40 −20 Amplitude (dBFS) Amplitude (dBFS) −20 −60 −80 −100 −120 Each Tone at −36 dBFS Amplitude fIN1 = 46 MHz fIN2 = 50 MHz 2−Tone IMD = 101 dBFS SFDR = 106 dBFS −40 −60 −80 −100 0 25 50 75 Frequency (MHz) 100 −120 125 0 Figure 8. FFT for Two-Tone Input Signal (–7 dBFS at 46 MHz and 50 MHz) 125 G008 −40 Each Tone at −36 dBFS Amplitude fIN1 = 185 MHz fIN2 = 190 MHz 2−Tone IMD = 101 dBFS SFDR = 104 dBFS −20 Amplitude (dBFS) Amplitude (dBFS) 100 0 Each Tone at −7 dBFS Amplitude fIN1 = 185 MHz fIN2 = 190 MHz 2−Tone IMD = 90 dBFS SFDR = 102 dBFS −20 −60 −80 −100 −40 −60 −80 −100 0 25 50 75 Frequency (MHz) 100 −120 125 0 50 75 Frequency (MHz) 100 125 G010 Figure 11. FFT for Two-Tone Input Signal (–36 dBFS at 185 MHz and 190 MHz) −98 −90 fIN1 = 46 MHz fIN2 = 50 MHz −92 Two − Tone IMD (dBFS) −100 25 G009 Figure 10. FFT for Two-Tone Input Signal (–7 dBFS at 185 MHz and 190 MHz) Two − Tone IMD (dBFS) 50 75 Frequency (MHz) Figure 9. FFT for Two-Tone Input Signal (–36 dBFS at 46 MHz and 50 MHz) 0 −120 25 G007 −102 −104 −106 −108 fIN1 = 185 MHz fIN2 = 190 MHz −94 −96 −98 −100 −102 −104 −106 −108 −110 −36 −33 −30 −27 −24 −21 −18 −15 Each Tone Amplitude (dBFS) −12 Figure 12. Intermodulation Distortion vs Input Amplitude (46 MHz and 50 MHz) 16 Submit Documentation Feedback −9 −7 −110 −36 −33 −30 G011 −27 −24 −21 −18 −15 Each Tone Amplitude (dBFS) −12 −9 −7 G012 Figure 13. Intermodulation Distortion vs Input Amplitude (185 MHz and 190 MHz) Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 Typical Characteristics: ADS42JB69 (continued) Typical values are at TA = +25°C, ADC sampling rate = 250 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 100 77 2−VPP Full−Scale 2.5−VPP Full−Scale 95 2−VPP Full−Scale 2.5−VPP Full−Scale 76 75 85 SNR (dBFS) SFDR (dBc) 90 80 75 70 74 73 72 65 71 60 0 50 100 150 200 250 300 Input Frequency (MHz) 350 70 400 0 50 Figure 14. Spurious-Free Dynamic Range vs Input Frequency 170 MHz 230 MHz 270 MHz 350 MHz 400 MHz 491 MHz 10 MHz 70 MHz 100 MHz 130 MHz 78 76 100 SNR (dBFS) SFDR (dBc) 350 400 G014 80 10 MHz 70 MHz 100 MHz 130 MHz 110 90 80 170 MHz 230 MHz 270 MHz 350 MHz 400 MHz 491 MHz 74 72 70 70 68 66 −2 −1.5 −1 −0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Digital Gain (dB) G015 −2 −1.5 −1 −0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Digital Gain (dB) G016 Figure 16. Spurious-Free Dynamic Range vs Digital Gain Figure 17. Signal-to-Noise Ratio vs Digital Gain 130 77 120 120 76.5 110 76 110 76 100 75.5 100 75.5 90 75 80 74.5 70 74 60 73.5 50 75 90 74.5 80 74 70 73.5 60 73 50 SNR(dBFS) SFDR(dBc) SFDR(dBFS) 72.5 72 71.5 −70 Input Frequency = 70 MHz −60 −50 −40 −30 −20 Amplitude (dBFS) −10 0 Figure 18. Performance vs Input Amplitude (70 MHz) SNR (dBFS) 77 76.5 SFDR (dBc,dBFS) SNR (dBFS) 150 200 250 300 Input Frequency (MHz) Figure 15. Signal-to-Noise Ratio vs Input Frequency 120 60 100 G013 40 72.5 30 72 20 40 73 71.5 −70 Input Frequency = 170 MHz −60 −50 G017 −40 −30 −20 Amplitude (dBFS) SNR(dBFS) SFDR(dBc) SFDR(dBFS) −10 SFDR (dBc,dBFS) 55 30 20 0 10 G018 Figure 19. Performance vs Input Amplitude (170 MHz) Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 17 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com Typical Characteristics: ADS42JB69 (continued) Typical values are at TA = +25°C, ADC sampling rate = 250 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. Input Frequency = 70 MHz SFDR SNR Input Frequency = 170 MHz 75 95 74.5 92 74.5 92 74 89 74 89 73.5 86 73.5 86 73 84 73 83 72.5 SFDR (dBc) 94 SNR (dBFS) 98 82 1.85 72.5 1.95 1.87 1.9 1.93 Input Common−Mode Voltage (V) 80 1.85 G019 G020 Figure 21. Performance vs Input Common-Mode Voltage (170 MHz) 75 AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V AVDD = 1.7 V AVDD = 1.75V AVDD = 1.8 V 74.5 SNR (dBFS) SFDR (dBc) 99 98 97 96 95 94 93 92 91 90 89 75 72 1.95 1.87 1.9 1.93 Input Common−Mode Voltage (V) Figure 20. Performance vs Input Common-Mode Voltage (70 MHz) AVDD = 1.85 V AVDD = 1.9 V 74 73.5 73 72.5 88 Input Frequency = 170 MHz 87 −40 −15 10 35 Temperature (°C) Input Frequency = 170 MHz 60 72 −40 85 96 95 10 35 Temperature (°C) 60 85 G022 Figure 23. Signal-to-Noise Ratio vs AVDD Supply and Temperature (170 MHz) 98 97 −15 G021 Figure 22. Spurious-Free Dynamic Range vs AVDD Supply and Temperature (170 MHz) 75 AVDD3V = 3.15 V AVDD3V = 3.2 V AVDD3V = 3.25 V AVDD3V = 3.3 V AVDD3V = 3.35 V AVDD3V = 3.4 V AVDD3V = 3.45 V AVDD3V = 3.15 V AVDD3V = 3.2 V AVDD3V = 3.25 V AVDD3V = 3.3 V 74.5 94 SNR (dBFS) SFDR (dBc) SFDR SNR 75.5 96 SFDR (dBc) 75.5 101 SNR (dBFS) 76 99 93 92 91 AVDD3V = 3.35 V AVDD3V = 3.4 V AVDD3V = 3.45 V 74 73.5 73 90 89 88 87 −40 72.5 Input Frequency = 170 MHz −15 Input Frequency = 170 MHz 10 35 Temperature (°C) 60 85 Submit Documentation Feedback −15 G023 Figure 24. Spurious-free Dynamic Range vs AVDD_BUF Supply and Temperature (170 MHz) 18 72 −40 10 35 Temperature (°C) 60 85 G024 Figure 25. Signal-to-Noise Ratio vs AVDD_BUF Supply and Temperature (170 MHz) Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 Typical Characteristics: ADS42JB69 (continued) Typical values are at TA = +25°C, ADC sampling rate = 250 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 97 75 DRVDD = 1.7 V DRVDD = 1.75 V DRVDD = 1.8 V 96 DRVDD = 1.7 V DRVDD = 1.75 V DRVDD = 1.8 V 74.5 94 SNR (dBFS) SFDR (dBc) 95 DRVDD = 1.85 V DRVDD = 1.9 V 93 92 91 DRVDD = 1.85 V DRVDD = 1.9 V 74 73.5 73 90 72.5 Input Frequency = 170 MHz −15 Input Frequency = 170 MHz 10 35 Temperature (°C) 60 72 −40 85 Figure 26. Spurious-Free Dynamic Range vs DRVDD Supply and Temperature (170 MHz) 75 90 74 88 73 86 72 84 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 Differential Clock Amplitudes (Vpp) 1.9 94 76 92 71 2.1 74 88 72 86 70 84 68 90 75 88 74 86 73 84 40 50 60 Input Clock Duty Cycle (%) 70 1.9 66 2.1 G028 77 96 77 76 30 0.5 0.7 0.9 1.1 1.3 1.5 1.7 Differential Clock Amplitudes (Vpp) Input Frequency = 170 MHz 92 82 0.3 Figure 29. Performance vs Clock Amplitude (170 MHz) 94 SNR SFDR 76 92 75 90 74 88 73 72 86 72 71 84 Figure 30. Performance vs Clock Duty Cycle (70 MHz) SFDR (dBc) SNR (dBFS) SFDR (dBc) 94 78 90 82 0.1 78 SNR SFDR SFDR SNR 76 Figure 28. Performance vs Clock Amplitude (70 MHz) Input Frequency = 70 MHz G026 92 G027 96 85 80 Input Frequency =170 MHz SFDR (dBc) SFDR (dBc) 94 60 96 SNR (dBFS) SFDR SNR 10 35 Temperature (°C) Figure 27. Signal-to-Noise Ratio vs DRVDD Supply and Temperature (170 MHz) 77 96 Input Frequency = 70 MHz −15 G025 SNR (dBFS) 88 −40 G029 30 40 50 60 Input Clock Duty Cycle (%) 70 SNR (dBFS) 89 71 G030 Figure 31. Performance vs Clock Duty Cycle (170 MHz) Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 19 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 7.11 Typical Characteristics: ADS42JB49 Typical values are at TA = +25°C, full temperature range is TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 250 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 0 0 fIN = 10 MHz SFDR = 97 dBc SNR = 73.4 dBFS SINAD = 73.3 dBFS THD = 95 dBc SFDR Non HD2, HD3 = 103 dBc −40 −60 −20 Amplitude (dBFS) Amplitude (dBFS) −20 −80 −100 −120 fIN = 170 MHz SFDR = 89 dBc SNR = 72.8 dBFS SINAD = 72.5 dBFS THD = 88 dBc SFDR Non HD2, HD3 = 100 dBc −40 −60 −80 −100 0 25 50 75 Frequency (MHz) 100 −120 125 0 Figure 32. FFT for 10-MHz Input Signal fIN = 300 MHz SFDR = 74 dBc SNR = 72.1 dBFS SINAD = 69.8 dBFS THD = 72 dBc SFDR Non HD2, HD3 = 96 dBc −60 Amplitude (dBFS) Amplitude (dBFS) −40 −80 −40 −60 G032 −80 −100 0 25 50 75 Frequency (MHz) 100 −120 125 0 25 G033 Figure 34. FFT for 300-MHz Input Signal 50 75 Frequency (MHz) 100 125 G034 Figure 35. FFT for 10-MHz Input Signal (2.5-VPP Full-Scale) 0 0 fIN = 170 MHz SFDR = 87 dBc SNR = 73.9 dBFS SINAD = 73.7 dBFS THD = 85 dBc SFDR Non HD2, HD3 = 94 dBc −40 −60 fIN = 300 MHz SFDR = 71 dBc SNR = 73.1 dBFS SINAD = 68.4 dBFS THD = 69 dBc SFDR Non HD2, HD3 = 93 dBc −20 Amplitude (dBFS) −20 Amplitude (dBFS) 125 fIN = 10 MHz SFDR = 89 dBc SNR = 75 dBFS SINAD = 74.8 dBFS THD = 88 dBc SFDR Non HD2, HD3 = 103 dBc −20 −100 −80 −100 −40 −60 −80 −100 0 25 50 75 Frequency (MHz) 100 Figure 36. FFT for 170-MHz Input Signal (2.5-VPP Full-Scale) 20 100 0 −20 −120 50 75 Frequency (MHz) Figure 33. FFT for 170-MHz Input Signal 0 −120 25 G031 Submit Documentation Feedback 125 −120 0 25 G035 50 75 Frequency (MHz) 100 125 G036 Figure 37. FFT for 300-MHz Input Signal (2.5-VPP Full-Scale) Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 Typical Characteristics: ADS42JB49 (continued) Typical values are at TA = +25°C, full temperature range is TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 250 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 0 0 Each Tone at −7 dBFS Amplitude fIN1 = 46 MHz fIN2 = 50 MHz 2−Tone IMD = 98 dBFS SFDR = 105 dBFS −40 −60 −80 −100 −120 Each Tone at −36 dBFS Amplitude fIN1 = 46 MHz fIN2 = 50 MHz 2−Tone IMD = 101 dBFS SFDR = 106 dBFS −20 Amplitude (dBFS) Amplitude (dBFS) −20 −40 −60 −80 −100 0 25 50 75 Frequency (MHz) 100 −120 125 0 Figure 38. FFT for Two-Tone Input Signal (–7 dBFS at 46 MHz and 50 MHz) 125 G038 −40 Each Tone at −36 dBFS Amplitude fIN1 = 185 MHz fIN2 = 190 MHz 2−Tone IMD = 101 dBFS SFDR = 104 dBFS −20 Amplitude (dBFS) Amplitude (dBFS) 100 0 Each Tone at −7 dBFS Amplitude fIN1 = 185 MHz fIN2 = 190 MHz 2−Tone IMD = 90 dBFS SFDR = 102 dBFS −20 −60 −80 −100 −40 −60 −80 −100 0 25 50 75 Frequency (MHz) 100 −120 125 0 50 75 Frequency (MHz) 100 125 G040 Figure 41. FFT for Two-Tone Input Signal (–36 dBFS at 185 MHz and 190 MHz) −98 −90 fIN1 = 46 MHz fIN2 = 50 MHz −92 Two − Tone IMD (dBFS) −100 25 G039 Figure 40. FFT for Two-Tone Input Signal (–7 dBFS at 185 MHz and 190 MHz) Two − Tone IMD (dBFS) 50 75 Frequency (MHz) Figure 39. FFT for Two-Tone Input Signal (–36 dBFS at 46 MHz and 50 MHz) 0 −120 25 G037 −102 −104 −106 −108 fIN1 = 185 MHz fIN2 = 190 MHz −94 −96 −98 −100 −102 −104 −106 −108 −110 −36 −33 −30 −27 −24 −21 −18 −15 Each Tone Amplitude (dBFS) −12 Figure 42. Intermodulation Distortion vs Input Amplitude (46 MHz and 50 MHz) −9 −7 −110 −36 −33 −30 G041 −27 −24 −21 −18 −15 Each Tone Amplitude (dBFS) −12 −9 −7 G042 Figure 43. Intermodulation Distortion vs Input Amplitude (185 MHz and 190 MHz) Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 21 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com Typical Characteristics: ADS42JB49 (continued) Typical values are at TA = +25°C, full temperature range is TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 250 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 100 76 2−VPP Full−Scale 2.5−VPP Full−Scale 95 74 SNR (dBFS) SFDR (dBc) 90 85 80 75 73 72 71 70 70 65 60 2−VPP Full−Scale 2.5−VPP Full−Scale 75 0 50 100 150 200 250 300 Input Frequency (MHz) 350 69 400 0 50 Figure 44. Spurious-Free Dynamic Range vs Input Frequency 150 200 250 300 Input Frequency (MHz) 350 400 G044 Figure 45. Signal-to-Noise Ratio vs Input Frequency 78 120 10 MHz 70 MHz 100 MHz 130 MHz 110 170 MHz 230 MHz 270 MHz 350 MHz 400 MHz 491 MHz 10 MHz 70 MHz 100 MHz 130 MHz 77 76 75 SNR (dBFS) 100 SFDR (dBc) 100 G043 90 80 170 MHz 230 MHz 270 MHz 350 MHz 400 MHz 491 MHz 74 73 72 71 70 69 70 68 67 −2 −1.5 −1 −0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Digital Gain (dB) G045 −2 −1.5 −1 −0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Digital Gain (dB) G046 Figure 46. Spurious-Free Dynamic Range vs Digital Gain SNR (dBFS) 75.5 130 76.5 120 76 110 75.5 110 100 75 100 90 80 74.5 70 60 73.5 50 SNR(dBFS) SFDR(dBc) SFDR(dBFS) 72.5 71.5 −70 −60 −50 −40 −30 −20 Amplitude (dBFS) −10 0 Figure 48. Performance vs Input Amplitude (70 MHz) 22 Submit Documentation Feedback SNR (dBFS) Input Frequency = 70 MHz SFDR (dBc,dBFS) 77 76.5 Figure 47. Signal-to-Noise Ratio vs Digital Gain 130 Input Frequency = 170 MHz 120 74.5 90 74 80 73.5 70 73 60 50 72.5 40 72 30 71.5 20 71 −70 SNR(dBFS) SFDR(dBc) SFDR(dBFS) −60 −50 G047 −40 −30 −20 Amplitude (dBFS) −10 SFDR (dBc,dBFS) 60 40 30 0 20 G048 Figure 49. Performance vs Input Amplitude (170 MHz) Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 Typical Characteristics: ADS42JB49 (continued) Typical values are at TA = +25°C, full temperature range is TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 250 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. Input Frequency = 70 MHz SFDR SNR Input Frequency = 170 MHz 74.5 95 74 92 74 92 73.5 89 73.5 89 73 86 73 86 72.5 84 72.5 83 72 SFDR (dBc) 94 SNR (dBFS) 98 82 1.85 72 1.95 1.87 1.9 1.93 Input Common−Mode Voltage (V) 80 1.85 G049 99 98 97 96 95 94 93 92 91 90 89 74.5 71.5 1.95 1.87 1.9 1.93 Input Common−Mode Voltage (V) G050 Figure 51. Performance vs Input Common-Mode Voltage (170 MHz) 74.5 AVDD = 1.7 V AVDD = 1.75 V AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V AVDD = 1.7 V AVDD = 1.75V AVDD = 1.8 V 74 AVDD = 1.85 V AVDD = 1.9 V 73.5 SNR (dBFS) SFDR (dBc) Figure 50. Performance vs Input Common-Mode Voltage (70 MHz) 73 72.5 72 71.5 88 Input Frequency = 170 MHz 87 −40 −15 10 35 Temperature (°C) Input Frequency = 170 MHz 60 71 −40 85 −15 G051 Figure 52. Spurious-Free Dynamic Range vs AVDD Supply and Temperature (170 MHz) 10 35 Temperature (°C) 60 85 G052 Figure 53. Signal-to-Noise Ratio vs AVDD Supply and Temperature (170 MHz) 99 74.5 AVDD3V = 3.15 V AVDD3V = 3.2 V AVDD3V = 3.25 V AVDD3V = 3.3 V 98 97 96 AVDD3V = 3.35 V AVDD3V = 3.4 V AVDD3V = 3.45 V AVDD3V = 3.15 V AVDD3V = 3.2 V AVDD3V = 3.25 V AVDD3V = 3.3 V 74 95 SNR (dBFS) SNR (dBFS) SFDR SNR 75 96 SFDR (dBc) 75 101 SNR (dBFS) 75.5 99 94 93 92 AVDD3V = 3.35 V AVDD3V = 3.4 V AVDD3V = 3.45 V 73.5 73 72.5 91 90 89 88 −40 72 Input Frequency = 170 MHz −15 Input Frequency = 170 MHz 10 35 Temperature (°C) 60 85 71.5 −40 −15 G053 Figure 54. Spurious-Free Dynamic Range vs AVDD_BUF Supply and Temperature (170 MHz) 10 35 Temperature (°C) 60 85 G054 Figure 55. Signal-to-Noise Ratio vs AVDD_BUF Supply and Temperature (170 MHz) Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 23 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com Typical Characteristics: ADS42JB49 (continued) Typical values are at TA = +25°C, full temperature range is TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 250 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 32k-point FFT, unless otherwise noted. 97 74.5 DRVDD = 1.7 V DRVDD = 1.75 V DRVDD = 1.8 V 96 95 DRVDD = 1.85 V DRVDD = 1.9 V DRVDD = 1.85 V DRVDD = 1.9 V 73.5 SNR (dBFS) 94 SFDR (dBc) DRVDD = 1.7 V DRVDD = 1.75 V DRVDD = 1.8 V 74 93 92 91 73 72.5 72 90 71.5 Input Frequency = 170 MHz −15 Input Frequency = 170 MHz 10 35 Temperature (°C) 60 71 −40 85 Figure 56. Spurious-Free Dynamic Range vs DRVDD Supply and Temperature (170 MHz) 96 76 92 75 90 74 88 73 72 86 84 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 Differential Clock Amplitudes (Vpp) 1.9 71 2.1 76 90 74 88 72 86 70 84 68 0.5 0.7 0.9 1.1 1.3 1.5 1.7 Differential Clock Amplitudes (Vpp) 1.9 66 2.1 G058 Figure 59. Performance vs Clock Amplitude (170 MHz) 74.5 96 Input Frequency = 170 MHz SNR SFDR 94 92 74 92 73.5 90 73.5 90 73 88 73 88 72.5 86 72.5 86 72 84 72 84 71.5 71.5 82 82 30 40 50 60 Input Clock Duty Cycle (%) 70 Figure 60. Performance vs Clock Duty Cycle (70 MHz) Submit Documentation Feedback SFDR (dBc) SNR (dBFS) SFDR (dBc) 0.3 74.5 94 24 80 92 82 0.1 75 SNR SFDR SFDR SNR 78 Figure 58. Performance vs Clock Amplitude (70 MHz) Input Frequency = 70 MHz G056 94 G057 96 85 82 Input Frequency = 170 MHz SFDR (dBc) SFDR (dBc) 94 60 98 SNR (dBFS) SFDR SNR 10 35 Temperature (°C) Figure 57. Signal-to-Noise Ratio vs DRVDD Supply and Temperature (170 MHz) 77 96 Input Frequency = 70 MHz −15 G055 SNR (dBFS) 88 −40 G059 30 40 50 60 Input Clock Duty Cycle (%) 70 74 SNR (dBFS) 89 71 G060 Figure 61. Performance vs Clock Duty Cycle (170 MHz) Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 7.12 Typical Characteristics: Common Typical values are at TA = +25°C, full temperature range is TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 250 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 64k-point FFT, unless otherwise noted. 0 Amplitude (dBFS) −20 −40 −60 CMRR (dB) fIN = 100 MHz SFDR = 86 dBc fCM = 5 MHz, 50 mVPP Amplitude (fIN) = −1 dBFS Amplitude (fCM) = −105 dBFS Amplitude (fIN + fCM) = −90 dBFS Amplitude (fIN − fCM) = −87 dBFS −80 −100 −120 0 20 40 60 80 Frequency (MHz) 100 120 0 −5 −10 −15 −20 −25 −30 −35 −40 −45 −50 −55 −60 −65 0 G061 Figure 62. Common-Mode Rejection Ratio FFT 50 100 150 200 250 Common−Mode Test Signal Frequency (MHz) 300 G062 Figure 63. Common-Mode Rejection Ratio vs Test Signal Frequency 0 −20 fIN = 20 MHz SFDR = 87 dBc fPSRR = 5 MHz, 50 mVPP Amplitude (fIN) = −1 dBFS Amplitude (fPSRR) = −88 dBFS Amplitude (fIN + fPSRR) = −97.8 dBFS −40 50−mVPP Signal Superimposed on AVDD 100−mVPP Signal Superimposed on AVDD3V −30 −40 PSRR (dB) −20 Amplitude (dBFS) Input Frequency = 10MHz 50−mVPP Signal Superimposed on VCM −60 −80 −50 −60 −70 −100 −80 Input Frequency = 20MHz −120 0 20 40 60 80 Frequency (MHz) 100 −90 120 0 G063 Figure 64. Power-Supply Rejection Ratio FFT for AVDD Supply 300 G064 Figure 65. Power-Supply Rejection Ratio vs Test Signal Frequency 0.18 2 AVDD Power DVDD Power IOVDD Power AVDD3V Power Total Power 1.6 1.4 20X Mode 10X Mode 0.15 IOVDD Power (W) 1.8 Total Power (W) 50 100 150 200 250 Test Signal Frequency on Supply (MHz) 1.2 1 0.8 0.6 0.4 0.12 0.09 0.06 0.03 0.2 0 0 50 100 150 Sampling Speed (MSPS) 200 Figure 66. Total Power vs Sampling Frequency 250 0 0 50 G065 100 150 Sampling Speed (MSPS) 200 250 G066 Figure 67. IOVDD Power vs Sampling Frequency Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 25 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 7.13 Typical Characteristics: Contour Typical values are at TA = +25°C, full temperature range is TMIN = –40°C to TMAX = +85°C, ADC sampling rate = 250 MSPS, 50% clock duty cycle, AVDD = 1.8 V, AVDD3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, –1-dBFS differential input, 2-VPP full-scale, and 64k-point FFT, unless otherwise noted. 7.13.1 Spurious-Free Dynamic Range (SFDR): General 240 fS - Sampling Frequency - MSPS 220 75 80 85 95 70 90 200 180 160 80 85 68 75 70 65 90 95 140 90 120 95 90 100 80 85 80 150 100 50 200 250 75 70 300 61 400 350 fIN - Input Frequency - MHz 65 70 80 75 85 90 95 SFDR - dBc Figure 68. 0-dB Gain (SFDR) 95 240 fS - Sampling Frequency - MSPS 220 95 90 85 75 80 70 95 200 95 180 95 90 160 140 85 75 80 70 95 120 95 100 95 80 100 200 90 85 300 75 70 80 400 500 600 85 90 95 fIN - Input Frequency - MHz 70 75 80 SFDR - dBc Figure 69. 6-dB Gain (SFDR) 26 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 7.13.2 Signal-to-Noise Ratio (SNR): ADS42JB69 240 220 fS - Sampling Frequency - MSPS 73.2 73.6 72.8 72.4 72 71.5 74 200 180 73.2 73.6 160 72.8 72 72.4 71.5 71 140 74 120 100 73.6 73.2 72.4 72.8 72 71.5 80 50 70.5 71 74 150 100 250 200 300 350 400 73 73.5 74 fIN - Input Frequency - MHz 70.5 71 71.5 72 72.5 SNR - dBFS Figure 70. 0-dB Gain (SNR, ADS42JB69) 240 68.1 220 fS - Sampling Frequency - MSPS 67.5 67.2 67.5 67.2 66.9 66.4 67.8 200 68.1 180 67.8 160 140 66.4 66.9 68.1 120 67.8 100 80 68.1 68.4 50 100 150 67.2 67.5 200 250 350 300 400 65.9 66.4 66.9 450 550 500 600 fIN - Input Frequency - MHz 65.5 66 66.5 67 67.5 68 SNR - dBFS Figure 71. 6-dB Gain (SNR, ADS42JB69) Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 27 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 7.13.3 Signal-to-Noise Ratio (SNR): ADS42JB49 240 72.6 73 fS - Sampling Frequency - MSPS 220 72.2 71.3 71.8 73.4 200 180 70.8 160 140 72.6 73 72.2 71.3 71.8 73.4 120 70.8 100 73 71.3 71.8 72.2 72.6 70.3 73.4 80 71 150 100 50 200 250 300 400 350 fIN - Input Frequency - MHz 70.5 70 71 71.5 72 72.5 73 SNR - dBFS Figure 72. 0-dB Gain (SNR, ADS42JB49) 240 67.3 67.6 67.9 67 66.7 66.4 fS - Sampling Frequency - MSPS 220 200 67.9 180 67.3 67.6 160 67 66.7 66.4 67.9 140 120 67.9 100 67.6 68.2 80 200 100 67 67.3 300 66.7 65.9 66.4 400 500 600 fIN - Input Frequency - MHz 65.5 66 66.5 67 67.5 68 SNR - dBFS Figure 73. 6-dB Gain (SNR, ADS42JB49) 28 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 8 Parameter Measurement Information CLKINP Input Clock CLKINM tSU_SYNC~ tH_SYNC~ SYNC~ tD SYNC~ Asserted Latency Dx0P, Dx0M Dx1P, Dx1M CGS Phase (1) Data Data Data Data Data Data Data Data Data K28.5 Data Data Data Data Data Data Data Data Data K28.5 (1) (1) x = A for channel A and B for channel B. Figure 74. SYNC~ Latency in CGS Phase (Two-Lane Mode) CLKINP Input Clock CLKINM tSU_SYNC~ tH_SYNC~ SYNC~ tD SYNC~ Deasserted Latency ILA Sequence Dx0P, Dx0M Dx1P, Dx1M (1) K28.5 K28.5 K28.5 K28.5 K28.5 K28.5 K28.5 K28.5 K28.0 K28.0 K28.5 K28.5 K28.5 K28.5 K28.5 K28.5 K28.5 K28.5 K28.0 K28.0 (1) (1) x = A for channel A and B for channel B. Figure 75. SYNC~ Latency in ILAS Phase (Two-Lane Mode) Sample N tSU_SYSREF tH_SYSREF CLKIN SYSREF Figure 76. SYSREF Timing (Subclass 1) Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 29 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com Parameter Measurement Information (continued) Sample N tSU_SYNC~ tH_SYNC~ CLKIN SYNC~ Figure 77. SYNC~ Timing (Subclass 2) 30 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 9 Detailed Description 9.1 Overview The ADS42JB69 and ADS42JB49 is a family of high linearity, buffered analog input, dual-channel ADCs with maximum sampling rates up to 250 MSPS employing JESD204B interface. The conversion process is initiated by a rising edge of the external input clock and the analog input signal is sampled. The sampled signal is sequentially converted by a series of small resolution stages, with the outputs combined in a digital correction logic block. At every clock edge the sample propagates through the pipeline, resulting in a data latency of 23 clock cycles. The output is available in CML logic levels following JESD204B standard. 9.2 Functional Block Diagram Device OVRA Digital Block INAP, INAM 14-, 16-Bit ADC CLKINP, CLKINM Gain Test Modes PLL x10, x20 Divide by 1, 2, 4 SYSREFP, SYSREFM JESD204B Digital DA0P, DA0M DA1P, DA1M SYNC~P, SYNC~M Delay INBP, INBM 14-, 16-Bit ADC Digital Block JESD204B Digital Gain Test Modes DB0P, DB0M DB1P, DB1M OVRB Common Mode MODE CTRL1 CTRL2 STBY PDN PDN_GBL SDOUT SEN SCLK SDATA Device Configuration RESET VCM 9.3 Feature Description 9.3.1 Digital Gain The device includes gain settings that can be used to obtain improved SFDR performance (compared to no gain). Gain is programmable from –2 dB to 6 dB (in 0.5-dB steps). For each gain setting, the analog input fullscale range scales proportionally. Table 2 shows how full-scale input voltage changes when digital gain are programmed in 1-dB steps. Refer to Table 19 to set digital gain using a serial interface register. SFDR improvement is achieved at the expense of SNR; for 1 dB increase in digital gain, SNR degrades approximately between 0.5 dB and 1 dB. Therefore, gain can be used as a trade-off between SFDR and SNR. Note that the default gain after reset is 0 dB with a 2.0-VPP full-scale voltage. Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 31 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com Table 2. Full-Scale Range Across Gains (1) DIGITAL GAIN FULL-SCALE INPUT VOLTAGE –2 dB 2.5 VPP (1) –1 dB 2.2 VPP 0 dB (default) 2.0 VPP 1 dB 1.8 VPP 2 dB 1.6 VPP 3 dB 1.4 VPP 4 dB 1.25 VPP 5 dB 1.1 VPP 6 dB 1.0 VPP Shaded cells indicate performance settings used in the Electrical Characteristics and Typical Characteristics. 9.3.2 Input Clock Divider The device is equipped with an internal divider on the clock input. This divider allows operation with a faster input clock, simplifying the system clock distribution design. The clock divider can be bypassed (divide-by-1) for operation with a 250-MHz clock. The divide-by-2 option supports a maximum 500-MHz input clock and the divide-by-4 option supports a maximum 1-GHz input clock frequency. 9.3.3 Overrange Indication The device provides two different overrange indications. Normal OVR (default) is triggered if the final 16-bit data output exceeds the maximum code value. Fast OVR is triggered if the input voltage exceeds the programmable overrange threshold and is presented after only nine clock cycles, thus enabling a quicker reaction to an overrange event. By default, the normal overrange indication is output on the OVRA and OVRB pins. Using the register bit FAST OVR EN, the fast OVR indication can be presented on the overrange pins instead. The input voltage level at which the overload is detected is referred to as the threshold and is programmable using the FAST OVR THRESHOLD bits. FAST OVR is triggered nine output clock cycles after the overload condition occurs. The threshold voltage amplitude at which fast OVR is triggered is: 1 × [the decimal value of the FAST OVR THRESH bits] / 127 When digital is programmed (for gain values > 0 dB), the 10–Gain / 20 × [the decimal value of the FAST OVR THRESH bits] / 127 threshold voltage amplitude is: 9.3.4 Pin Controls The device power-down functions can be controlled either through the parallel control pins (STBY, PDN_GBL, CTRL1, and CTRL2) or through an SPI register setting. STBY places the device in a standby power-down mode. PDN_GBL places the device in global power-down mode. Table 3. CTRL1, CTRL2 Pin Functions CTRL1 CTRL2 DESCRIPTION Low Low Normal operation High Low Channel A powered down Low High Channel B powered down High High Global power-down Table 4. PDN_GBL Pin Function 32 PDN_GBL DESCRIPTION Low Normal operation High Global power-down. Wake-up from this mode is slow. Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 Table 5. STBY Pin Function STBY DESCRIPTION Low Normal operation High ADCs are powered down while the input clock buffer and output CML buffers are alive. Wake-up from this mode is fast. 9.4 Device Functional Modes 9.4.1 JESD204B Interface The JESD interface of ADS42JB49 and ADS42JB69, as shown in Figure 78, supports device subclasses 0, 1, and 2 with a maximum output data rate (per lane) of 3.125 Gbps. An external SYSREF (subclass 1) or SYNC~ (subclass 2) signal is used to align all internal clock phases and the local multiframe clock to a specific sampling clock edge. This alignment allows synchronization of multiple devices in a system and minimizes timing and alignment uncertainty. SYSREF SYNC~ INA JESD 204B JESD204B D0, D1 INB JESD 204B JESD204B D0, D1 Sample Clock Figure 78. JESD204B Interface Depending on the ADC sampling rate, the JESD204B output interface can be operated with either one or two lanes per ADC. The JESD204B interface can be configured using serial registers. The JESD204B transmitter block (Figure 79) consists of the transport layer, the data scrambler, and the link layer. The transport layer maps the ADC output data into the selected JESD204B frame data format and manages if the ADC output data or test patterns are transmitted. The link layer performs the 8b and 10b data encoding as well as the synchronization and initial lane alignment using the SYNC~ input signal. Optionally, data from the transport layer can be scrambled. JESD204B Block Transport Layer Frame Data Mapping Link Layer Scrambler 1+x14+x15 Test Patterns 8b,10b encoding Comma characters Initial lane alignment D0 D1 SYNC~ Figure 79. JESD204B Block 9.4.1.1 JESD204B Initial Lane Alignment (ILA) When receiving device asserts the SYNC~ signal ( i.e a logic low signal is applied on SYNC~P - SYNC~M), the device begins transmitting comma (K28.5) characters to establish code group synchronization (CGS). Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 33 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com Device Functional Modes (continued) When synchronization is complete, the receiving device de-asserts the SYNC~ signal and the ADS42JB49 and ADS42JB69 begin the initial lane alignment (ILA) sequence with the next local multiframe clock boundary. The device transmits four multiframes, each containing K frames (where K is SPI programmable). Each multiframe contains the frame start and end symbols; the second multiframe also contains the JESD204 link configuration data. 9.4.1.2 JESD204B Test Patterns There are three different test patterns available in the transport layer of the JESD204B interface. The device supports a clock output, an encoded, and a PRBS (215 – 1) pattern. These patterns can be enabled by serial register write in address 26h, bits D[7:6]. 9.4.1.3 JESD204B Frame Assembly The JESD204B standard defines the following parameters: • L is the number of lanes per Lane. • M is the number of converters per device. • F is the number of octets per frame clock period. • S is the number of samples per frame. Table 6 lists the available JESD204B formats and valid device ranges. Ranges are limited by the maximum ADC sample frequency and the SERDES line rate. Table 6. JESD240B Ranges L M F S MAX ADC SAMPLING RATE (MSPS) MAX fSERDES (Gbps) 4 2 1 1 250 2.5 2 2 2 1 156.25 3.125 The detailed frame assembly in 10x and 20x modes for dual-channel operation is shown in Table 7. Note that unused lanes in 10x mode become 3-stated. Table 7. Frame Assembly for Dual-Channel Mode (1) LANE (1) 34 LMF = 421 LMF = 222 DA0 A0[15:8] A1[15:8] A2[15:8] A0[15:8] A0[7:0] A1[15:8] A1[7:0] A2[15:8] DA1 A0[7:0] A1[7:0] A2[7:0] — — — — — A2[7:0] — DB0 B0[15:8] B1[15:8] B2[15:8] B0[15:8] B0[7:0] B1[15:8] B1[7:0] B2[15:8] B2[7:0] DB1 B0[7:0] B1[7:0] B2[7:0] — — — — — — In ADS42JB49 two LSBs of 16-bit data are padded with 00. Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 9.4.1.4 JESD Link Configuration During the lane alignment sequence, the ADS42JB69 and ADS42JB49 transmit JESD204B configuration parameters in the second multi-frame of the ILA sequence. Configuration bits are mapped in octets, as per the JESD204B standard described in Figure 80 and Table 8. Figure 80. Initial Lane Alignment Sequence Table 8. Mapping of Configuration Bits to Octets OCTET NO. MSB D6 D5 0 D4 D3 1 ADJCNT[3:0] 2 X 3 SCR[0] ADJDIR[0] D1 LSB BID[3:0] PHADJ[0] LID[4:0] L[4:0] 4 F[7:0] 5 K[4:0] 6 M[7:0] 7 CS[1:0] X 8 SUBCLASSV[2:0] 9 JESDV[2:0] 10 D2 DID[7:0] HD[0] N[4:0] N'[4:0] S[4:0] X X 11 CF[4:0] RES1[7:0] 12 RES2[7:0] 13 FCHK[7:0] Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 35 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 9.4.1.4.1 Configuration for 2-Lane (20x) SERDES Mode Table 9 lists the values of the JESD204B configuration bits applicable for the 2-lane SERDES Mode. The default value of these bits after reset is also specified in the table. Table 9. Configuration for 2-Lane SERDES Mode PARAMETER DESCRIPTION PARAMETER RANGE FIELD ENCODING DEFAULT VALUE AFTER RESET ADJCNT Number of adjustment resolution steps to adjust DAC LMFC. Applies to subclass 2 operation only. 0-15 ADJCNT[3:0] Binary value 0 ADJDIR Direction to adjust DAC LMFC 0 : Advance 1 : Delay applies to subclass 2 operation only 0-1 ADJDIR[0] Binary value 0 BID Bank ID – extension to DID 0-15 BID[3:0] Binary value 0 CF No. of control words per frame clock period per link 0-32 CF[4:0] Binary value 0 CS No. of control bits per sample 0-3 CS[1:0] Binary value 0 DID Device (= link) identification no. 0-255 DID[7:0] Binary value 0 1-256 F[7:0] Binary value minus 1 1 High-density format 0-1 HD[0] Binary value 0 JESD204 version 000 : JESD204A 001 : JESD204B 0-7 JESDV[2:0] Binary value 1 K No. of frames per multi-frame 1-32 K[4:0] Binary value minus 1 8 L No. of lanes per converter device (link) 1-32 L[4:0] Binary value minus 1 0 Lane identification no. (within link) 0-31 LID[4:0] Binary value LID[0] = 0, LID[1] = 1 M No. of converters per device 1-256 M[7:0] Binary value minus 1 1 N Converter resolution 1-32 N[4:0] Binary value minus 1 15 N’ Total no. of bits per sample 1-32 N'[4:0] Binary value minus 1 15 Phase adjustment request to DAC subclass 2 only. 0-1 PHADJ[0] Binary value 0 No. of samples per converter per frame cycle 1-32 S[4:0] Binary value minus 1 0 Scrambling enabled 0-1 SCR[0] Binary value 0 SUBCLASSV Device subclass version 000 : Subclass 0 001 : Subclass 1 010 : Subclass 2 0-7 SUBCLASSV[2:0] Binary value 2 RES1 Device subclass version 000 : Subclass 0 001 : Subclass 1 010 : Subclass 2 0-255 RES1[7:0] Binary value 0 RES2 Reserved field 2 0-255 RES2[7:0] Binary value 0 Checksum Σ (all above fields) mod 256 0-255 FCHK[7:0] Binary value 44, 45 F HD JESDV LID PHADJ S SCR CHKSUM 36 No. of octets per frame Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 9.4.1.4.2 Configuration for 4-Lane (10x) SERDES Mode Table 10 lists the values of the JESD204 configuration bits applicable for the 4-lane SERDES Mode. The default value of these bits after reset is also specified in the table. Table 10. Configuration for 4-Lane SERDES Mode PARAMETER DESCRIPTION PARAMETER RANGE FIELD ENCODING DEFAULT VALUE AFTER RESET ADJCNT Number of adjustment resolution steps to adjust DAC LMFC. Applies to subclass 2 operation only. 0-15 ADJCNT[3:0] Binary value 0 ADJDIR Direction to adjust DAC LMFC 0 : Advance 1 : Delay applies to subclass 2 operation only 0-1 ADJDIR[0] Binary value 0 BID Bank ID; extension to DID 0-15 BID[3:0] Binary value 0 CF No. of control words per frame clock period per link 0-32 CF[4:0] Binary value 0 CS No. of control bits per sample 0-3 CS[1:0] Binary value 0 DID Device (= link) identification no. 0-255 DID[7:0] Binary value 0 1-256 F[7:0] Binary value minus 1 0 High-density format 0-1 HD[0] Binary value 1 JESD204 version 000 : JESD204A 001 : JESD204B 0-7 JESDV[2:0] Binary value 1 K No. of frames per multi-frame 1-32 K[4:0] Binary value minus 1 16 L No. of lanes per converter device (link) 1-32 L[4:0] Binary value minus 1 3 Lane identification no (within link) 0-31 LID[4:0] Binary value LID[0] = 0, LID[1] = 1, LID[2] = 2, LID[3] = 3 M No. of converters per device 1-256 M[7:0] Binary value minus 1 1 N Converter resolution 1-32 N[4:0] Binary value minus 1 15 N’ Total no. of bits per sample 1-32 N'[4:0] Binary value minus 1 15 Phase adjustment request to DAC subclass 2 only. 0-1 PHADJ[0] Binary value 0 No. of samples per converter per frame cycle 1-32 S[4:0] Binary value minus 1 0 Scrambling enabled 0-1 SCR[0] Binary value 0 SUBCLASSV Device subclass version 000 : Subclass 0 001 : Subclass 1 010 : Subclass 2 0-7 SUBCLASSV[2:0] Binary value 2 RES1 Device subclass version 000 : Subclass 0 001 : Subclass 1 010 : Subclass 2 0-255 RES1[7:0] Binary value 0 RES2 Reserved field 2 0-255 RES2[7:0] Binary value 0 Checksum Σ (all above fields) mod 256 0-255 FCHK[7:0] Binary value 54, 55, 56, 57 F HD JESDV LID PHADJ S SCR CHKSUM No. of octets per frame Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 37 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 9.4.1.5 CML Outputs The device JESD204B transmitter uses differential CML output drivers. The CML output current is programmable from 5 mA to 20 mA using register settings. The output driver includes an internal 50-Ω termination to IOVDD supply. External 50-Ω termination resistors connected to receiver common-mode voltage should be placed close to receiver pins. AC coupling can be used to avoid the common-mode mismatch between transmitter and receiver, as shown in Figure 81. Vterm Rt= ZO Transmission Line Zo Rt= ZO 0.1uF DA/B[0,1]P Receiver DA/B[0,1]M 0.1uF Figure 81. CML Output Connections Figure 82 and Figure 83 show the data eye measurements of the device JESD204B transmitter against the JESD204B transmitter mask at 2.5 GBPS (10x mode) and 3.125 GBPS (20x mode), respectively. 300 300 150 Voltage (mV) Voltage (mV) 150 0 0 -150 -150 -300 -300 -200 -300 -200 -100 0 100 200 -150 -100 300 -50 0 50 100 150 200 Time (ps) Time (ps) Figure 82. Eye Diagram: 2.5 Gbps 38 Submit Documentation Feedback Figure 83. Eye Diagram: 3.125 Gbps Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 9.5 Programming 9.5.1 Device Configuration The ADS42JB49 and ADS42JB69 can be configured using a serial programming interface, as described in the Serial Interface section. In addition, the device has four dedicated parallel pins (PDN_GBL, STBY, CTRL1, and CTRL2) for controlling the power-down modes. 9.5.2 Details of Serial Interface The ADC has a set of internal registers that can be accessed by the serial interface formed by the SEN (serial interface enable), SCLK (serial interface clock), SDATA (serial interface data), and SDOUT (serial interface data output) pins. Serially shifting bits into the device is enabled when SEN is low. SDATA serial data are latched at every SCLK rising edge when SEN is active (low). The serial data are loaded into the register at every 16th SCLK rising edge when SEN is low. When the word length exceeds a multiple of 16 bits, the excess bits are ignored. Data can be loaded in multiples of 16-bit words within a single active SEN pulse. The interface functions with SCLK frequencies from 20 MHz down to very low speeds (of a few hertz) and also with non-50% SCLK duty cycle. 9.5.2.1 Register Initialization After power-up, the internal registers must be initialized to their default values through a hardware reset by applying a high pulse on the RESET pin (of widths greater than 10 ns), as shown in Figure 84. Later during operation, if required serial interface registers can be cleared by: 1. Either through a hardware reset or 2. By applying a software reset. When using the serial interface, set the RESET bit (D0 in register address 08h) high. This setting initializes the internal registers to the default values and then self-resets the RESET bit low. In this case, the RESET pin is kept low. Power Supply AVDD, DRVDD t1 RESET t2 t3 SEN NOTE: After power-up, the internal registers must be initialized to their default values through a hardware reset by applying a high pulse on the RESET pin. Figure 84. Reset Timing Diagram Table 11. Reset Timing (1) TEST CONDITIONS MIN t1 Power-on delay Delay from AVDD and DRVDD power-up to active RESET pulse t2 Reset pulse width Active RESET signal pulse width t3 Register write delay Delay from RESET disable to SEN active (1) TYP MAX UNIT 1 ms 10 ns 1 100 µs ns Typical values at +25°C; minimum and maximum values across the full temperature range: TMIN = –40°C to TMAX = +85°C, unless otherwise noted. Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 39 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 9.5.2.2 Serial Register Write The internal device register can be programmed following these steps: 1. Drive the SEN pin low. 2. Set the R/W bit to ‘0’ (bit A7 of the 8-bit address). 3. Set bit A6 in the address field to ‘0’. 4. Initiate a serial interface cycle specifying the address of the register (A5 to A0) whose content must be written (as shown in Figure 85 and Table 12). 5. Write the 8-bit data that is latched on the SCLK rising edge. Register Address <5:0> SDATA R/W 0 A5 A4 A3 A2 A1 Register Data <7:0> A0 D7 D6 D5 D4 D3 =0 D2 D1 D0 tDH tSCLK tDSU SCLK tSLOADS tSLOADH SEN RESET Figure 85. Serial Register Write Timing Diagram Table 12. Serial Interface Timing (1) MIN MAX UNIT 20 MHz SCLK frequency (equal to 1 / tSCLK) tSLOADS SEN to SCLK setup time 25 ns tSLOADH SCLK to SEN hold time 25 ns tDSU SDIO setup time 25 ns tDH SDIO hold time 25 ns (1) 40 > dc TYP fSCLK Typical values are at +25°C, minimum and maximum values are across the full temperature range of TMIN = –40°C to TMAX = +85°C, AVDD3V = 3.3 V, and AVDD = DRVDD = IOVDD = 1.8 V, unless otherwise noted. Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 9.5.2.3 Serial Register Readout The device includes a mode where the contents of the internal registers can be read back. This readback mode may be useful as a diagnostic check to verify the serial interface communication between the external controller and the ADC. 1. Set bit A7 (MSB) of 8 bit address to '1'. 2. Write the address of register on bits A5 through A0 whose contents must be read. See Figure 86 3. The device outputs the contents (D7 to D0) of the selected register on the SDOUT pin (pin 45). 4. The external controller can latch the contents at the SCLK rising edge. When serial registers are enabled for writing (bit A7 of 8-bit address bus is 0), the SDOUT pin is in a highimpedance mode. If serial readout is not used, the SDOUT pin must float. Figure 86 shows a timing diagram of this readout mode. SDOUT comes out at the SCLK falling edge with an approximate delay (tSD_DELAY) of 20 ns, as shown in Figure 87. Register Address <5:0> SDATA R/W 0 A5 A4 A3 A2 A1 Register Data: don’t care A0 D7 D6 D5 D4 D3 D2 D1 D0 D1 D0 =1 Register Read Data <7:0> SDOUT D7 D6 D5 D4 D3 D2 SCLK SEN Figure 86. Serial Register Readout Timing Diagram SCLK tSD_DELAY SDOUT Figure 87. SDOUT Timing Diagram Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 41 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 9.6 Register Maps Table 13 lists a summary of the serial interface registers. Table 13. Summary of Serial Interface Registers REGISTER ADDRESS REGISTER DATA A[7:0] (Hex) D7 D6 D5 D4 D3 D2 06 0 0 0 0 0 0 07 0 0 0 0 0 08 PDN CHA PDN CHB STDBY DATA FORMAT Always write 1 D1 D0 CLK DIV SYSREF DELAY 0 0 RESET 0B CHA GAIN CHA GAIN EN 0 0 0C CHBGAIN CHB GAIN EN 0 0 0D HIGH FREQ 1 0 0 HIGH FREQ 1 0 0 0 FAST OVR EN 0E HIGH FREQ 2 0 0 HIGH FREQ 2 0 0 0 0 0F CHA TEST PATTERNS CHB TEST PATTERNS 10 CUSTOM PATTERN 1[15:8] 11 CUSTOM PATTERN 1[7:0] 12 CUSTOM PATTERN 2[15:8] 13 CUSTOM PATTERN 2[7:0] 1F 26 Always write 0 FAST OVR THRESHOLD SERDES TEST PATTERN IDLE SYNC TESTMODE EN FLIP ADC DATA LAN ALIGN FRAME ALIGN TX LINK CONFIG DATA0 27 0 0 0 0 0 0 CTRLK CTRLF 2B SCRAMBLE EN 0 0 0 0 0 0 0 2C 0 0 0 0 0 0 0 OCTETS PER FRAME 2D 0 0 0 0 0 30 SUBCLASS 36 LMFC RESET MASK 37 38 SYNC REQ 0 0 LINK LAYER TESTMODE FORCE LMFC COUNT FRAMES PER MULTIFRAME 0 0 0 LINK LAYER RPAT OUTPUT CURRENT SEL 0 PULSE DET MODES LMFC COUNT INIT RELEASE ILANE SEQ Table 14. High-Frequency Modes Summary 42 REGISTER ADDRESS VALUE Dh 90h High-frequency modes should be enabled for input frequencies greater than 250 MHz. Eh 90h High-frequency modes should be enabled for input frequencies greater than 250 MHz. DESCRIPTION Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 9.6.1 Description of Serial Interface Registers 9.6.1.1 Register 6 (offset = 06h) [reset = 00h] Figure 88. Register 6 D7 0 W-0h D6 0 W-0h D5 0 W-0h D4 0 W-0h D3 0 W-0h D2 0 W-0h D1 D0 CLK DIV R/W-0h LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 15. Register 6 Field Descriptions Bit D[7:2] D[1:0] Field Type Reset Description 0 W 0h Always write '0' 0h Internal clock divider for input sample clock 00 : Divide-by-1 (clock divider bypassed) 01 : Divide-by-2 10 : Divide-by-1 11 : Divide-by-4 CLK DIV R/W 9.6.1.2 Register 7 (offset = 07h) [reset = 00h] Figure 89. Register 7 D7 0 W-0h D6 0 W-0h D5 0 W-0h D4 0 W-0h D3 0 W-0h D2 0 W-0h D1 D0 SYSREF DELAY R/W-0h LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 16. Register 7 Field Descriptions Bit D[7:2] D[1:0] Field Type Reset Description 0 W 0h Always write '0' 0h Controls the delay of the SYSREF input with respect to the input clock. Typical values for the expected delay of different settings are: 000 : 0-ps delay 001 : 60-ps delay 010 : 120-ps delay 011 : 180-ps delay 100 : 240-ps delay 101 : 300-ps delay 110 : 360-ps delay 111 : 420-ps delay SYSREF DELAY R/W Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 43 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 9.6.1.3 Register 8 (offset = 08h) [reset = 00h] Figure 90. Register 8 D7 D6 D5 PDN CHA PDN CHB STDBY R/W-0h R/W-0h R/W-0h D4 DATA FORMAT R/W-0h D3 D2 D1 D0 1 0 0 RESET W-1h W-0h W-0h R/W-0h LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 17. Register 8 Field Descriptions Bit Field Type Reset Description D7 PDN CHA R/W 0h Power-down channel A 0 : Normal operation 1 : Channel A power-down D6 PDN CHB R/W 0h Power-down channel B 0 : Normal operation 1 : Channel B power-down D5 STBY R/W 0h Dual ADC is placed into standby mode 0 : Normal operation 1 : Both ADCs are powered down (input clock buffer and CML output buffers are alive) D4 DATA FORMAT R/W 0h Digital output data format 0 : Twos complement 1 : Offset binary D3 1 W 1h Always write '1' Default value of this bit is '0'. This bit must always be set to '1'. D[2:1] 0 W 0h Always write '0' RESET R/W 0h Software reset applied This bit resets all internal registers to the default values and selfclears to ‘0’. D0 44 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 9.6.1.4 Register B (offset = 0Bh) [reset = 00h] Figure 91. Register B D7 D6 D5 CHA GAIN R/W-0h D4 D3 D2 CHA GAIN EN R/W-0h D1 0 W-0h D0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 18. Register B Field Descriptions Bit D[7:3] D2 D[1:0] Field Type Reset Description CHA GAIN R/W 0h Digital gain for channel A (must set the CHA GAIN EN bit first, bit D2). Bit descriptions are listed in Table 19. CHA GAIN EN R/W 0h Digital gain enable bit for channel A 0 : Digital gain disabled 1 : Digital gain enabled 0 W 0h Always write '0' Table 19. Digital Gain for Channel A REGISTER VALUE DIGITAL GAIN FULL-SCALE INPUT VOLTAGE REGISTER VALUE DIGITAL GAIN FULL-SCALE INPUT VOLTAGE 00000 0 dB 2.0 VPP 01010 1.5 dB 1.7 VPP 00001 Do not use — 01011 2 dB 1.6 VPP 00010 Do not use — 01100 2.5 dB 1.5 VPP 00011 –2.0 dB 2.5 VPP 01101 3 dB 1.4 VPP 00100 –1.5 dB 2.4 VPP 01110 3.5 dB 1.3 VPP 00101 –1.0 dB 2.2 VPP 01111 4 dB 1.25 VPP 00110 –0.5 dB 2.1 VPP 10000 4.5 dB 1.2 VPP 00111 0 dB 2.0 VPP 10001 5 dB 1.1 VPP 01000 0.5 dB 1.9 VPP 10010 5.5 dB 1.05 VPP 01001 1 dB 1.8 VPP 10011 6 dB 1.0 VPP Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 45 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 9.6.1.5 Register C (offset = 0Ch) [reset = 00h] Figure 92. Register C D7 D6 D5 CHB GAIN R/W-0h D4 D3 D2 CHB GAIN EN R/W-0h D1 0 W-0h D0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 20. Register C Field Descriptions Bit D[7:3] D2 D[1:0] Field Type Reset Description CHB GAIN R/W 0h Digital gain for channel B (must set the CHA GAIN EN bit first, bit D2). Bit descriptions are listed in Table 21. CHB GAIN EN R/W 0h Digital gain enable bit for channel B 0 : Digital gain disabled 1 : Digital gain enabled 0 W 0h Always write '0' Table 21. Digital Gain for Channel B REGISTER VALUE DIGITAL GAIN FULL-SCALE INPUT VOLTAGE REGISTER VALUE DIGITAL GAIN FULL-SCALE INPUT VOLTAGE 00000 0 dB 2.0 VPP 01010 1.5 dB 1.7 VPP 00001 Do not use — 01011 2 dB 1.6 VPP 00010 Do not use — 01100 2.5 dB 1.5 VPP 00011 –2.0 dB 2.5 VPP 01101 3 dB 1.4 VPP 00100 –1.5 dB 2.4 VPP 01110 3.5 dB 1.3 VPP 00101 –1.0 dB 2.2 VPP 01111 4 dB 1.25 VPP 00110 –0.5 dB 2.1 VPP 10000 4.5 dB 1.2 VPP 00111 0 dB 2.0 VPP 10001 5 dB 1.1 VPP 01000 0.5 dB 1.9 VPP 10010 5.5 dB 1.05 VPP 01001 1 dB 1.8 VPP 10011 6 dB 1.0 VPP 46 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 9.6.1.6 Register D (offset = 0Dh) [reset = 00h] Figure 93. Register D D7 HIGH FREQ 1 R/W-0h D6 0 W-0h D5 0 W-0h D4 HIGH FREQ 1 R/W-0h D3 0 W-0h D2 0 W-0h D1 0 W-0h D0 FAST OVR EN R/W-0h LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 22. Register D Field Descriptions Bit D7 D[6:5] D4 D[3:1] D0 Field Type Reset Description HIGH FREQ 1 R/W 0h High-frequency mode 1 00 : Default 11 : Use for input frequencies > 250 MHz along with HIGH FREQ 2 0 W 0h Always write '0' HIGH FREQ 1 R/W 0h High-frequency mode 1 00 : Default 11 : Use for input frequencies > 250 MHz along with HIGH FREQ 2 0 W 0h Always write '0' FAST OVR EN R/W 0h Selects if normal or fast OVR signal is presented on OVRA, OVRB pins 0 : Normal OVR on OVRA, OVRB pins 1 : Fast OVR on OVRA, OVRB pins 9.6.1.7 Register E (offset = 0Eh) [reset = 00h] Figure 94. Register E D7 HIGH FREQ 2 R/W-0h D6 0 W-0h D5 0 W-0h D4 HIGH FREQ 2 R/W-0h D3 0 W-0h D2 0 W-0h D1 0 W-0h D0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 23. Register E Field Descriptions Bit Field Type Reset Description D7 HIGH FREQ 2 R/W 0h High-frequency mode 2 00 : Default 11 : Use for input frequencies > 250 MHz along with HIGH FREQ 1 0 W 0h Always write '0' HIGH FREQ 2 R/W 0h High-frequency mode 2 00 : Default 11 : Use for input frequencies > 250 MHz along with HIGH FREQ 1 0 W 0h Always write '0' D[6:5] D4 D[3:0] Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 47 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 9.6.1.8 Register F (offset = 0Fh) [reset = 00h] Figure 95. Register F D7 D6 D5 CHA TEST PATTERNS R/W-0h D4 D3 D2 D1 CHB TEST PATTERNS R/W-0h D0 LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 24. Register F Field Descriptions Bit Field D[7:4] 48 CHA TEST PATTERNS Submit Documentation Feedback Type R/W Reset Description 0h Channel A test pattern programmability The 16-bit test pattern data are selected as an input to the JESD block (in the ADS42JB49, the last two LSBs of the 16-bit data are replaced by 00). 0000 : Normal operation 0001 : All '0's 0010 : All '1's 0011 : Toggle pattern: In the ADS42JB69, data are an alternating sequence of 1010101010101010 and 0101010101010101. In the ADS42JB49, data alternate between 10101010101010 and 01010101010101. 0100 : Digital ramp: In the ADS42JB69, data increment by 1 LSB every clock cycle from code 0 to 65535. In the ADS42JB49, data increment by 1 LSB every 4th clock cycle from code 0 to 16383. 0101 : Do not use 0110 : Single pattern: In the ADS42JB69, data are the same as programmed by the CUSTOM PATTERN 1[15:0] registers bits. In the ADS42JB49, data are the same as programmed by the CUSTOM PATTERN 1[15:2] register bits. 0111 : Double pattern: In the ADS42JB69, data alternate between CUSTOM PATTERN 1[15:0] and CUSTOM PATTERN 2[15:0]. In the ADS42JB49 data alternate between CUSTOM PATTERN 1[15:2] and CUSTOM PATTERN 2[15:2]. 1000 : Deskew pattern: In the ADS42JB69, data are AAAAh. In the ADS42JB49, data are 3AAAh. 1001 : Do not use 1010 : PRBS pattern: Data are a sequence of pseudo random numbers. 1011 : 8-point sine wave: In the ADS42JB69, data are a repetitive sequence of the following eight numbers, forming a sine-wave in twos complement format: 1, 9598, 32768, 55938, 65535, 55938, 32768, 9598. In the ADS42JB49, data are a repetitive sequence of the following eight numbers, forming a sine-wave in twos complement format: 0, 2399, 8192, 13984, 16383, 13984, 8192, 2399. Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 Table 24. Register F Field Descriptions (continued) Bit D[3:0] Field Type CHB TEST PATTERNS R/W Reset Description 0h Channel B test pattern programmability 16-bit test pattern data are selected as an input to the JESD block (in the ADS42JB49, the last two LSBs of the 16-bit data are replaced by 00). 0000 : Normal operation 0001 : All '0's 0010 : All '1's 0011 : Toggle pattern: In the ADS42JB69, data are an alternating sequence of 1010101010101010 and 0101010101010101. In the ADS42JB49, data alternate between 10101010101010 and 01010101010101. 0100 : Digital ramp: In the ADS42JB69, data increment by 1 LSB every clock cycle from code 0 to 65535. In the ADS42JB49, data increment by 1 LSB every 4th clock cycle from code 0 to 16383. 0101 : Do not use 0110 : Single pattern: In the ADS42JB69, data are the same as programmed by the CUSTOM PATTERN 1[15:0] registers bits. In the ADS42JB49, data are the same as programmed by the CUSTOM PATTERN 1[15:2] register bits. 0111 : Double pattern: In the ADS42JB69, data alternate between CUSTOM PATTERN 1[15:0] and CUSTOM PATTERN 2[15:0]. In the ADS42JB49, data alternate between CUSTOM PATTERN 1[15:2] and CUSTOM PATTERN 2[15:2]. 1000 : Deskew pattern: In the ADS42JB69, data are AAAAh. In the ADS42JB49, data are 3AAAh. 1001 : Do not use 1010 : PRBS pattern: Data are a sequence of pseudo random numbers. 1011 : 8-point sine wave: In the ADS42JB69, data are a repetitive sequence of the following eight numbers, forming a sine-wave in twos complement format: 1, 9598, 32768, 55938, 65535, 55938, 32768, 9598. In the ADS42JB49, data are a repetitive sequence of the following eight numbers, forming a sine-wave in twos complement format: 0, 2399, 8192, 13984, 16383, 13984, 8192, 2399. Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 49 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 9.6.1.9 Register 10 (offset = 10h) [reset = 00h] Figure 96. Register 10 D7 D6 D5 D4 D3 CUSTOM PATTERN 1[15:8] R/W-0h D2 D1 D0 LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 25. Register 10 Field Descriptions Bit D[7:0] Field Type Reset Description CUSTOM PATTERN 1[15:8] R/W 0h Sets CUSTOM PATTERN 1[15:8] using these bits for both channels 9.6.1.10 Register 11 (offset = 11h) [reset = 00h] Figure 97. Register 11 D7 D6 D5 D4 D3 CUSTOM PATTERN 1[7:0] R/W-0h D2 D1 D0 LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 26. Register 11 Field Descriptions Bit D[7:0] Field Type Reset Description CUSTOM PATTERN 1[7:0] R/W 0h Sets CUSTOM PATTERN 1[7:0] using these bits for both channels 9.6.1.11 Register 12 (offset = 12h) [reset = 00h] Figure 98. Register 12 D7 D6 D5 D4 D3 CUSTOM PATTERN 2[15:8] R/W-0h D2 D1 D0 LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 27. Register 12 Field Descriptions Bit D[7:0] Field Type Reset Description CUSTOM PATTERN 2[15:8] R/W 0h Sets CUSTOM PATTERN 2[15:8] using these bits for both channels 9.6.1.12 Register 13 (offset = 13h) [reset = 00h] Figure 99. Register 13 D7 D6 D5 D4 D3 CUSTOM PATTERN 2[7:0] R/W-0h D2 D1 D0 LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 28. Register 13 Field Descriptions Bit D[7:0] 50 Field Type Reset Description CUSTOM PATTERN 2[7:0] R/W 0h Sets CUSTOM PATTERN 2[7:0] using these bits for both channels Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 9.6.1.13 Register 1F (offset = 1Fh) [reset = FFh] Figure 100. Register 1F D7 0 W-1h D6 D5 D4 D3 FAST OVR THRESHOLD R/W-0h D2 D1 D0 LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 29. Register 1F Field Descriptions Bit Field Type Reset Description D7 0 W W-1h Always write '0' The default value of this bit is '1'. Always write this bit to '0' when fast OVR thresholds are programmed. 0h The device has a fast OVR mode that indicates an overload condition at the ADC input. The input voltage level at which the overload is detected is referred to as the threshold and is programmable using the FAST OVR THRESHOLD bits. FAST OVR is triggered nine output clock cycles after the overload condition occurs. The threshold at which fast OVR is triggered is (full-scale × [the decimal value of the FAST OVR THRESHOLD bits] / 127). See the Overrange Indication section for details. D[6:0] FAST OVR THRESHOLD R/W Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 51 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 9.6.1.14 Register 26 (offset = 26h) [reset = 00h] Figure 101. Register 26 D7 D6 D5 SERDES TEST PATTERN IDLE SYNC R/W-0h R/W-0h D4 TESTMODE EN R/W-0h D3 FLIP ADC DATA R/W-0h D2 D1 LANE ALIGN FRANE ALIGN R/W-0h R/W-0h D0 TX LINK CONFIG DATA R/W-0h LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 30. Register 26 Field Descriptions Bit Field Type Reset Description SERDES TEST PATTERN R/W 0h Sets test patterns in the transport layer of the JESD204B interface 00 : Normal operation 01 : Outputs clock pattern: Output is a 10101010 pattern 10 : Encoded pattern: Output is 1111111100000000 11 : PRBS sequence: Output is 215 – 1 D5 IDLE SYNC R/W 0h Sets output pattern when SYNC~ is asserted 0 : Sync code is k28.5 (0xBCBC) 1 : Sync code is 0xBC50 D4 TESTMODE EN R/W 0h Generates a long transport layer test pattern mode according to the 5.1.63 clause of the JESD204B specification 0 : Test mode disabled 1 : Test mode enabled D3 FLIP ADC DATA R/W 0h 0 : Normal operation 1 : Output data order is reversed: MSB – LSB 0h Inserts a lane alignment character (K28.3) for the receiver to align to the lane boundary per section 5.3.3.5 of the JESD204B specification. 0 : Lane alignment characters are not inserted. 1 : Inserts lane alignment characters D[7:6] D2 LANE ALIGN R/W D1 FRAME ALIGN R/W 0h Inserts a frame alignment character (K28.7) for the receiver to align to the frame boundary per section 5.3.3.4 of the JESD204B specification. 0 : Frame alignment characters are not inserted. 1 : Inserts frame alignment characters D0 TX LINK CONFIG DATA R/W 0h Disables sending initial link alignment (ILA) sequence when SYNC~ is de-asserted, '0' 0 : ILA enabled 1 : ILA disabled 9.6.1.15 Register 27 (offset = 27h) [reset = 00h] Figure 102. Register 27 D7 0 W-0h D6 0 W-0h D5 0 W-0h D4 0 W-0h D3 0 W-0h D2 0 W-0h D1 CTRL K R/W-0h D0 CTRL F R/W-0h LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 31. Register 27 Field Descriptions Bit Field Type Reset Description 0 W 0h Always write '0' D1 CTRL K R/W 0h Enables bit for number of frames per multiframe 0 : Default 1 : Frames per multiframe can be set in register 2Dh D0 CTRL F R/W 0h Enables bit for number of octets per frame 0 : Default 1 : Octets per frame can be specified in register 2Ch D[7:2] 52 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 9.6.1.16 Register 2B (offset = 2Bh) [reset = 00h] Figure 103. Register 2B D7 SCRAMBLE EN R/W-0h D6 0 W-0h D5 0 W-0h D4 0 W-0h D3 0 W-0h D2 0 W-0h D1 0 W-0h D0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 32. Register 2B Field Descriptions Bit Field Type Reset Description D7 SCRAMBLE EN R/W 0h Scramble enable bit in the JESD204B interface 0 : Scrambling disabled 1 : Scrambling enabled 0 W 0h Always write '0' D[6:0] 9.6.1.17 Register 2C (offset = 2Ch) [reset = 00h] Figure 104. Register 2C D7 0 W-0h D6 0 W-0h D5 0 W-0h D4 0 W-0h D3 0 W-0h D2 0 W-0h D1 0 W-0h D0 OCTETS PER FRAME R/W-0h LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 33. Register 2C Field Descriptions Bit D[7:1] D0 Field Type Reset Description 0 W 0h Always write '0' OCTETS PER FRAME R/W 0h Sets number of octets per frame (F) 0 : 10x mode using two lanes per ADC 1 : 20x mode using one lane per ADC 9.6.1.18 Register 2D (offset = 2Dh) [reset = 00h] Figure 105. Register 2D D7 0 W-0h D6 0 W-0h D5 0 W-0h D4 D3 D2 D1 FRAMES PER MULTIFRAME R/W-0h D0 LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 34. Register 2D Field Descriptions Bit D[7:5] D[4:0] Field Type Reset Description 0 W 0h Always write '0' 0h Sets number of frames per multiframe After reset, the default settings for frames per multiframe are: 10x : K = 16 20x : K = 8 For each mode, K must not be set to a lower value. FRAMES PER MULTIFRAME R/W Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 53 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 9.6.1.19 Register 30 (offset = 30h) [reset = 40h] Figure 106. Register 30 D7 D6 SUBCLASS R/W-0h D5 D4 0 W-0h D3 0 W-0h D2 0 W-0h D1 0 W-0h D0 0 W-0h LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 35. Register 30 Field Descriptions Bit Field Type Reset Description D[7:5] SUBCLASS R/W 0h Sets JESD204B subclass. Note that the default value of these bits after reset is 010, which makes subclass 2 the default class. 000 : Subclass 0. Backward compatibility with JESD204A. 001 : Subclass 1. Deterministic latency using the SYSREF signal. 010 : Subclass 2. Deterministic latency using SYNC~ detection (default subclass after reset). D[4:0] 0 W 0h Always write '0' 9.6.1.20 Register 36 (offset = 36h) [reset = 00h] Figure 107. Register 36 D7 SYNC REQ R/W-0h D6 LMFC RESET MASK R/W-0h D5 0 W-0h D4 0 W-0h D3 D2 D1 OUTPUT CURRENT SEL R/W-0h D0 LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 36. Register 36 Field Descriptions Bit Field Type Reset Description D7 SYNC REQ R/W 0h Generates synchronization request 0 : Normal operation 1 : Generates sync request D6 LMFC RESET MASK R/W 0h Mask LMFC reset coming to digital 0 : LMFC reset is not masked 1 : Ignores LMFC reset 0 W 0h Always write '0' 0h Changes JESD output buffer current 0000 : 16 mA 0001 : 15 mA 0010 : 14 mA 0011 : 13 mA 0100 : 20 mA 0101 : 19 mA 0110 : 18 mA 0111 : 17 mA 1000 : 8 mA 1001 : 7 mA 1010 : 6 mA 1011 : 5 mA 1100 : 12 mA 1101 : 11 mA 1110 : 10 mA 1111 : 9 mA D[5:4] D[3:0] 54 OUTPUT CURRENT SEL Submit Documentation Feedback R/W Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 9.6.1.21 Register 37 (offset = 37h) [reset = 00h] Figure 108. Register 37 D7 D6 D5 LINK LAYER TESTMODE R/W-0h D4 LINK LAYER RPAT R/W-0h D3 0 W-0h D2 D1 PULSE DET MODES R/W-0h D0 LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 37. Register 37 Field Descriptions Bit D[7:5] Field Type LINK LAYER TESTMODE R/W Reset Description 0h Generates a pattern according to clause 5.3.3.8.2 of the JESD204B document 000 : Normal ADC data 001 : D21.5 (high-frequency jitter pattern) 010 : K28.5 (mixed-frequency jitter pattern) 011 : Repeats initial lane alignment (generates a K28.5 character and repeats lane alignment sequences continuously) 100 : 12-octet RPAT jitter pattern D4 LINK LAYER RPAT R/W 0h Changes the running disparity in modified RPAT pattern test mode (only when link layer test mode = 100) 0 : Normal operation 1 : Changes disparity D3 0 W 0h Always write '0' PULSE DET MODES R/W 0h Selects different detection modes for SYSREF (subclass 1) and SYNC (subclass 2) D[2:0] D2 D1 D0 FUNCTIONALITY 0 Don’t care 0 Allows all pulses to reset input clock dividers 1 Don’t care 0 Do not allow reset of analog clock dividers Don’t care 0 to 1 transition 1 Allows one pulse immediately after the 0 to 1 transition to reset the divider Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 55 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 9.6.1.22 Register 38 (offset = 38h) [reset = 00h] Figure 109. Register 38 D7 FORCE LMFC COUNT R/W-0h D6 D5 D4 LMFC COUNT INIT R/W-0h D3 D2 D1 D0 RELEASE ILANE SEQ R/W-0h LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Table 38. Register 38 Field Descriptions Bit Field Type Reset Description D7 FORCE LMFC COUNT R/W 0h Forces LMFC count 0 : Normal operation 1 : Enables using a different starting value for the LMFC counter 0h SYSREF receives the digital block and resets the LMFC count to '0'. K28.5 stops transmitting when the LMFC count reaches 31. The initial value that the LMFC count resets to can be set using LMFC COUNT INIT. In this manner, the Rx can be synchronized early because the Rx gets the LANE ALIGNMENT SEQUENCE early. The FORCE LMFC COUNT register bit must be enabled. 0h Delays the generation of the lane alignment sequence by 0, 1, 2, or 3 multiframes after the code group synchronization. 00 : 0 01 : 1 10 : 2 11 : 3 D[6:2] D[1:0] 56 LMFC COUNT INIT RELEASE ILANE SEQ Submit Documentation Feedback R/W R/W Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 10.1 Application Information In a typical application (such as a dual-channel digitizer) the ADS42JBx9 is connected to a field-programmable gate array (FPGA) or application-specific integrated circuit (ASIC), as shown in Figure 110. A device clock and SYSREF signal must be provided to the ADC. TI recommends that the device clock and SYSREF are source synchronous (generated from a common source with matched trace lengths) if synchronizing multiple ADCs. An example of a device that can be used to generate a source-synchronous device clock and SYSREF is the LMK04828. The device clock frequency must be the same frequency as the desired sampling rate. The SYSREF period is required to be an integer multiple of the period of the multi-frame clock. Consequently, the frequency of SYSREF must be restricted to Equation 1 Device Clock Frequency / (n × K × F) where: • • • n = 1, 2, 3 and so forth, 1< K < 32 (set by SPI register address 2Dh), and F = 1, (two lanes per ADC mode), F = 2 (one lane per ADC mode). (1) A large enough K is recommended (greater than 16) to absorb the lane skews and avoid data transmission errors across the JESD204B interface. The SYNC~ signal is used by the FPGA or ASIC to acknowledge the correction reception of comma characters from the ADC during the JESD204B link initialization process. During normal operation this signal must be logic 1 if there are no errors in the data transmission from the ADC to the FPGA or ASIC. 10.2 Typical Application Device Clock Device Clock SYSREF SYSREF Lanes Ch A JESD 204B Baseband Processor (FPGA, ASIC) Ch B SYNC~ ADS42JBxx Figure 110. The ADS42JBx9 in a Dual-Channel Digitizer 10.2.1 Design Requirements For this design example, use the parameters listed in Table 39 as the input parameters. Table 39. Design Parameters DESIGN PARAMETER EXAMPLE VALUE fSAMPLE 245.76 MSPS Input frequency (IF) 10 MHz (Figure 122), 170 MHz (Figure 123) Signal-to-noise ratio (SNR) > 72 dBc Spurious-free dynamic range (SFDR) > 80 dBc Second-order harmonic distortion (HD2) > 90 dBc Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 57 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 10.2.2 Detailed Design Procedure 10.2.2.1 Analog Input The analog input pins have analog buffers (running from the AVDD3V supply) that internally drive the differential sampling circuit. As a result of the analog buffer, the input pins present high input impedance to the external driving source (10-kΩ dc resistance and 4-pF input capacitance). The buffer helps isolate the external driving source from the switching currents of the sampling circuit. This buffering makes driving the buffered inputs easier than when compared to an ADC without the buffer. The input common-mode is set internally using a 5-kΩ resistor from each input pin to VCM so the input signal can be ac-coupled to the pins. Each input pin (INP, INM) must swing symmetrically between VCM + 0.5 V and VCM – 0.5 V, resulting in a 2-V PP differential input swing. When programmed for 2.5-V PP full-scale, each input pin must swing symmetrically between VCM + 0.625 V and VCM – 0.625 V. The input sampling circuit has a high 3-dB bandwidth that extends up to 900 MHz (measured with a 50-Ω source driving a 50-Ω termination between INP and INM). The dynamic offset of the first-stage sub-ADC limits the maximum analog input frequency to approximately 250 MHz (with a 2.5-VPP full-scale amplitude) and to approximately 400 MHz (with a 2-VPP full-scale amplitude). This 3-dB bandwidth is different than the analog bandwidth of 900 MHz, which is only an indicator of signal amplitude versus frequency. 10.2.2.1.1 Drive Circuit Requirements For optimum performance, the analog inputs must be driven differentially. This technique improves the commonmode noise immunity and even-order harmonic rejection. A small resistor (5 Ω to 10 Ω) in series with each input pin is recommended to damp out ringing caused by package parasitics. Figure 111, Figure 112, and Figure 113 illustrate the differential impedance (ZIN = RIN || CIN) at the ADC input pins. The presence of the analog input buffer results in an almost constant input capacitance up to 1 GHz. INxP(1) ZIN(2) RIN CIN INxM (1) X = A or B. (2) ZIN = RIN || (1 / jωCIN). Figure 111. ADC Equivalent Input Impedance 58 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 5 Differential Capacitance, Cin (pF) Differential Resistance, Rin (kΩ) 10 1 0.1 0.05 0 200 400 600 Frequency (MHz) 800 4 3 2 1 0 1000 0 200 G073 Figure 112. ADC Analog Input Resistance (RIN) Across Frequency 400 600 Frequency (MHz) 800 1000 G074 Figure 113. ADC Analog Input Capacitance (CIN) Across Frequency 10.2.2.1.2 Driving Circuit An example driving circuit configuration is shown in Figure 114. To optimize even-harmonic performance at high input frequencies (greater than the first Nyquist), the use of back-to-back transformers is recommended, as shown in Figure 114. Note that the drive circuit is terminated by 50 Ω near the ADC side. The ac-coupling capacitors allow the analog inputs to self-bias around the required common-mode voltage. An additional R-C-R (39 Ω - 6.8 pF - 39 Ω) circuit placed near device pins helps further improve HD3. 0.1µF 0.1µF 5Q INP RINT 0.1µF 39 25 6.8 pF 25 RINT 39 INM 1:1 1:1 0.1µF 5 Device Figure 114. Drive Circuit for Input Frequencies up to 250 MHz The mismatch in the transformer parasitic capacitance (between the windings) results in degraded even-order harmonic performance. Connecting two identical RF transformers back-to-back helps minimize this mismatch and good performance is obtained for high-frequency input signals. An additional termination resistor pair may be required between the two transformers, as shown in Figure 114. The center point of this termination is connected to ground to improve the balance between the P (positive) and M (negative) sides. The values of the terminations between the transformers and on the secondary side must be chosen to obtain an effective 50 Ω (for a 50-Ω source impedance). For high input frequencies (> 250 MHz), the R-C-R circuit can be removed as indicated in Figure 115. Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 59 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 0.1µF 0.1µF 5Q INP RINT 25 0.1µF 25 RINT INM 1:1 5 0.1µF 1:1 Device Figure 115. Drive Circuit for Input Frequencies > 250 MHz 10.2.2.2 Clock Input The device clock inputs can be driven differentially (sine, LVPECL, or LVDS) or single-ended (LVCMOS), with little or no difference in performance between them. The common-mode voltage of the clock inputs is set to 1.4 V using internal 5-kΩ resistors. The self-bias clock inputs of the ADS42JB69 and ADS42JB49 can be driven by the transformer-coupled, sine-wave clock source or by the ac-coupled, LVPECL and LVDS clock sources, as shown in Figure 116, Figure 117, and Figure 118. Figure 119 details the internal clock buffer. Note: RT = termination resistor, if necessary. 0.1 mF 0.1 mF Zo CLKP Differential Sine-Wave Clock Input CLKP RT Typical LVDS Clock Input 0.1 mF 100 W CLKM Device 0.1 mF Zo CLKM Figure 116. Differential Sine-Wave Clock Driving Circuit Zo Device Figure 117. LVDS Clock Driving Circuit 0.1 mF CLKP 150 W Typical LVPECL Clock Input 100 W Zo 0.1 mF CLKM Device 150 W Figure 118. LVPECL Clock Driving Circuit 60 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 Clock Buffer LPKG 2 nH 20 W CLKP CBOND 1 pF 5 kW RESR 100 W CEQ CEQ 1.4 V LPKG 2 nH 20 W 5 kW CLKM CBOND 1 pF RESR 100 W NOTE: CEQ is 1 pF to 3 pF and is the equivalent input capacitance of the clock buffer. Figure 119. Internal Clock Buffer A single-ended CMOS clock can be ac-coupled to the CLKP input, with CLKM connected to ground with a 0.1-μF capacitor, as shown in Figure 120. However, for best performance the clock inputs must be driven differentially, thereby reducing susceptibility to common-mode noise. For high input frequency sampling, TI recommends using a clock source with very low jitter. Band-pass filtering of the clock source can help reduce the effects of jitter. There is no change in performance with a non-50% duty cycle clock input. 0.1 mF CMOS Clock Input CLKP 0.1 mF CLKM Device Figure 120. Single-Ended Clock Driving Circuit 10.2.2.2.1 SNR and Clock Jitter The signal-to-noise ratio (SNR) of the ADC is limited by three different factors, as shown in Equation 2. Quantization noise is typically not noticeable in pipeline converters and is 96 dBFS for a 16-bit ADC. Thermal noise limits SNR at low input frequencies and clock jitter sets SNR for higher input frequencies. SNRQuantization _ Noise æ SNR ADC [dBc] = -20 ´ log çç 10 20 è 2 2 2 ö æ SNRThermalNoise ö æ SNRJitter ö + 10 + 10 ÷÷ ç ÷ ç ÷ 20 20 ø è ø ø è SNR limitation is a result of sample clock jitter and can be calculated by Equation 3: SNRJitter [dBc] = -20 ´ log(2p ´ fIN ´ tJitter) (2) (3) The total clock jitter (TJitter) has three components: the internal aperture jitter (85 fS for the device) is set by the noise of the clock input buffer, the external clock jitter, and the jitter from the analog input signal. TJitter can be calculated by Equation 4: TJitter = (TJitter,Ext.Clock_Input)2 + (TAperture_ADC)2 Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 (4) Submit Documentation Feedback 61 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com External clock jitter can be minimized by using high-quality clock sources and jitter cleaners as well as band-pass filters at the clock input while a faster clock slew rate improves ADC aperture jitter. The device has a 74.1-dBFS thermal noise and an 85-fS internal aperture jitter. The SNR value depends on the amount of external jitter for different input frequencies, as shown in Figure 121. 76 SNR (dBFS) 74 72 35 fs 70 50 fs 68 100 fs 150 fs 66 200 fs 64 10 100 1000 Fin (MHz) Figure 121. SNR versus Input Frequency and External Clock Jitter 10.2.3 Application Curves 0 0 fIN = 10 MHz SFDR = 97 dBc SNR = 73.4 dBFS SINAD = 73.3 dBFS THD = 95 dBc SFDR Non HD2, HD3 = 103 dBc −40 −60 −80 −100 −120 −40 −60 −80 −100 0 25 50 75 Frequency (MHz) 100 Figure 122. FFT for 10-MHz Input Signal 62 fIN = 170 MHz SFDR = 89 dBc SNR = 72.8 dBFS SINAD = 72.5 dBFS THD = 88 dBc SFDR Non HD2, HD3 = 100 dBc −20 Amplitude (dBFS) Amplitude (dBFS) −20 Submit Documentation Feedback 125 −120 0 25 G031 50 75 Frequency (MHz) 100 125 G032 Figure 123. FFT for 170-MHz Input Signal Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 11 Power Supply Recommendations Four different power supply rails are required for ADS42JBxx device family: • A 3.3-V AVDD3V supply is used to supply power to the analog buffers. • A 1.8-V AVDD supply is used to supply power to the analog core of the ADC. • A 1.8-V DRVDD supply is used to supply power to the digital core of the ADC. • A 1.8-V IOVDD supply is used to supply power to the output buffers. TI recommends providing the 1.8-V digital and analog supplies from separate sources because of the switching activities on the digital rail. Both IOVDD and DRVDD can be supplied from a common source and a ferrite bead is recommended on each rail. An example power-supply scheme suitable for the ADS42JBx9 device family is shown in Figure 124. In this example supply scheme, AVDD is provided from a dc-dc converter and a lowdropout (LDO) regulator to increase the efficiency of the implementation. Where cost and area rather than powersupply efficiency are the main design goals, AVDD can be provided using only the LDO. 3.3 V (330 mA) AVDD3V 3.3 V DC-DC Converter 2V 1.8 V (160 mA) LDO AVDD 1.8 V (252 mA) DC-DC Converter DRVDD 1.8 V (100 mA) IOVDD Figure 124. Example Power-Supply Scheme 12 Layout 12.1 Layout Guidelines • • • • The length of the positive and negative traces of a differential pair must be matched to within 2 mils of each other. Each differential pair length must be matched within 10 mils of each other. When the ADC is used on the same printed circuit board (PCB) with a digital intensive component (such as an FPGA or ASIC), separate digital and analog ground planes must be used. Do not overlap these separate ground planes to minimize undesired coupling. Connect decoupling capacitors directly to ground and place these capacitors close to the ADC power pins and the power-supply pins to filter high-frequency current transients directly to the ground plane, as shown in Figure 125. Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 63 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com Layout Guidelines (continued) AVDD DRVDD 10 F 10 F Place the decoupling capacitor close to the power- supply pin. 10 F 10 F Place the decoupling capacitor close to the ADC power-supply pin. Device Figure 125. Recommended Placement of Power-Supply Decoupling Capacitors • • • 64 Ground and power planes must be wide enough to keep the impedance very low. In a multilayer PCB, one layer each must be dedicated to ground and power planes. All high-speed SERDES traces must be routed straight with minimum bends. Where a bend is necessary, avoid making very sharp right angle bends in the trace. FR4 material can be used for the PCB core dielectric, up to the maximum 3.125 Gbps bit rate supported by the ADS42JBx9 device family. Path loss can be compensated for by adjusting the drive strength from the device using SPI register 36h. Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 12.2 Layout Example LMK04828 Power Supply management Channel B input ADS42JBxx Channel A input High Speed Lanes (route straight to FPGA) Balun Figure 126. ADS42JBx9 EVM Top Layer Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 65 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 13 Device and Documentation Support 13.1 Device Support 13.1.1 Device Nomenclature 13.1.1.1 Definition of Specifications AC Power-Supply Rejection Ratio (AC PSRR): AC PSRR is the measure of rejection of variations in the supply voltage by the ADC. If ΔVSUP is the change in supply voltage and ΔVOUT is the resultant change of the ADC output code (referred to the input), then: DVOUT PSRR = 20Log 10 (Expressed in dBc) DVSUP (5) Analog Bandwidth: The analog input frequency at which the power of the fundamental is reduced by 3 dB with respect to the low-frequency value. Aperture Delay: The delay in time between the rising edge of the input sampling clock and the actual time at which the sampling occurs. This delay is different across channels. The maximum variation is specified as aperture delay variation (channel-to-channel). Aperture Uncertainty (Jitter): The sample-to-sample variation in aperture delay. Clock Pulse Width and Duty Cycle: The duty cycle of a clock signal is the ratio of the time the clock signal remains at a logic high (clock pulse width) to the period of the clock signal. Duty cycle is typically expressed as a percentage. A perfect differential sine-wave clock results in a 50% duty cycle. Common-Mode Rejection Ratio (CMRR): CMRR is the measure of rejection of variation in the analog input common-mode by the ADC. If ΔVCM_IN is the change in the common-mode voltage of the input pins and ΔVOUT is the resulting change of the ADC output code (referred to the input), then: DVOUT CMRR = 20Log10 (Expressed in dBc) DVCM (6) Crosstalk (only for Multichannel ADCs): Crosstalk is a measure of the internal coupling of a signal from an adjacent channel into the channel of interest. Crosstalk is specified separately for coupling from the immediate neighboring channel (near-channel) and for coupling from channel across the package (far-channel). Crosstalk is usually measured by applying a full-scale signal in the adjacent channel. Crosstalk is the ratio of the power of the coupling signal (as measured at the output of the channel of interest) to the power of the signal applied at the adjacent channel input. Crosstalk is typically expressed in dBc. DC Power-Supply Rejection Ratio (DC PSRR): DC PSSR is the ratio of the change in offset error to a change in analog supply voltage. The dc PSRR is typically given in units of mV/V. Differential Nonlinearity (DNL): An ideal ADC exhibits code transitions at analog input values spaced exactly 1 LSB apart. The DNL is the deviation of any single step from this ideal value, measured in units of LSBs. Effective Number of Bits (ENOB): ENOB is a measure of the converter performance as compared to the theoretical limit based on quantization noise. ENOB = SINAD - 1.76 6.02 (7) Gain Error: Gain error is the deviation of the ADC actual input full-scale range from its ideal value. The gain error is given as a percentage of the ideal input full-scale range. Gain error has two components: error as a result of reference inaccuracy (EGREF) and error as a result of the channel (EGCHAN). Both errors are specified independently as EGREF and EGCHAN. To a first-order approximation, the total gain error is ETOTAL ~ EGREF + EGCHAN. For example, if ETOTAL = ±0.5%, the full-scale input varies from (1 – 0.5 / 100) x FSideal to (1 + 0.5 / 100) × FSideal. 66 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 ADS42JB49, ADS42JB69 www.ti.com SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 Device Support (continued) Integral Nonlinearity (INL): The INL is the deviation of the ADC transfer function from a best fit line determined by a least squares curve fit of that transfer function, measured in units of LSBs. Maximum Conversion Rate: The maximum sampling rate at which specified operation is given. All parametric testing is performed at this sampling rate unless otherwise noted. Minimum Conversion Rate: The minimum sampling rate at which the ADC functions. Offset Error: The offset error is the difference, given in number of LSBs, between the ADC actual average idle channel output code and the ideal average idle channel output code. This quantity is often mapped into millivolts. Signal-to-Noise and Distortion (SINAD): SINAD is the ratio of the power of the fundamental (PS) to the power of all the other spectral components including noise (PN) and distortion (PD), but excluding dc. SNR = 10Log10 PS PN SINAD = 10Log10 (8) PS PN + PD (9) SINAD is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range. Signal-to-Noise Ratio (SNR): SNR is the ratio of the power of the fundamental (PS) to the noise floor power (PN), excluding the power at dc and the first nine harmonics. SNR is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range. Spurious-Free Dynamic Range (SFDR): The ratio of the power of the fundamental to the highest other spectral component (either spur or harmonic). SFDR is typically given in units of dBc (dB to carrier). Temperature Drift: The temperature drift coefficient (with respect to gain error and offset error) specifies the change per degree Celsius of the parameter from TMIN to TMAX. Temperature drift is calculated by dividing the maximum deviation of the parameter across the TMIN to TMAX range by the difference TMAX – TMIN. Total Harmonic Distortion (THD): THD is the ratio of the power of the fundamental (PS) to the power of the first nine harmonics (PD). THD = 10Log10 PS PN (10) THD is typically given in units of dBc (dB to carrier). Two-Tone Intermodulation Distortion (IMD3): IMD3 is the ratio of the power of the fundamental (at frequencies f1 and f2) to the power of the worst spectral component at either frequency 2f1 – f2 or 2f2 – f1. IMD3 is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range. Voltage Overload Recovery: The number of clock cycles taken to recover to less than 1% error after an overload on the analog inputs. This is tested by separately applying a sine wave signal with 6 dB positive and negative overload. The deviation of the first few samples after the overload (from the expected values) is noted. Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 Submit Documentation Feedback 67 ADS42JB49, ADS42JB69 SLAS900F – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 13.2 Documentation Support 13.2.1 Related Documentation LMK04828 Data Sheet, SNAS605 13.3 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 40. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY ADS42JB49 Click here Click here Click here Click here Click here ADS42JB69 Click here Click here Click here Click here Click here 13.4 Trademarks All trademarks are the property of their respective owners. 13.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 13.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 68 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 PACKAGE OPTION ADDENDUM www.ti.com 10-Oct-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) ADS42JB49IRGC25 ACTIVE VQFN RGC 64 25 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 AZ42JB49 ADS42JB49IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 AZ42JB49 ADS42JB49IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-3-260C-168 HR -40 to 85 AZ42JB49 ADS42JB69IRGC25 ACTIVE VQFN RGC 64 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ42JB69 ADS42JB69IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ42JB69 ADS42JB69IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ42JB69 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Oct-2014 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 10-Oct-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing ADS42JB49IRGCR VQFN RGC 64 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2000 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 ADS42JB49IRGCT VQFN RGC 64 250 180.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 ADS42JB69IRGCR VQFN RGC 64 2000 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 ADS42JB69IRGCT VQFN RGC 64 250 180.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Oct-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADS42JB49IRGCR VQFN RGC 64 2000 336.6 336.6 28.6 ADS42JB49IRGCT VQFN RGC 64 250 213.0 191.0 55.0 ADS42JB69IRGCR VQFN RGC 64 2000 336.6 336.6 28.6 ADS42JB69IRGCT VQFN RGC 64 250 213.0 191.0 55.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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