TL(RK,RMK,SK,OK,YK)1100C(T11) TOSHIBA LED Lamps TLRK1100C(T11), TLRMK1100C(T11), TLSK1100C(T11), TLOK1100C(T11), TLYK1100C(T11) Panel Circuit Indicator Unit: mm • Surface-mount devices • 3.2 (L) × 2.8 (W) × 1.9 (H) mm • Flat-top type • InGaAℓP LEDs • High luminous intensity • Low drive current, high-intensity light emission • Colors: Red, Orange, Yellow • Applications: automotive use, message signboards, backlighting etc. • Standard embossed tape packing: T11 (2000/reel) 8-mm tape reel Color and Material Product Name Color TLRK1100C Red TLRMK1100C Red TLSK1100C Red TLOK1100C Orange TLYK1100C Yellow Material JEDEC ― JEITA ― TOSHIBA 4-3R1 Weight: 0.035 g (typ.) InGaAℓP 1 2007-10-01 TL(RK,RMK,SK,OK,YK)1100C(T11) Absolute Maximum Ratings (Ta = 25°C) Product Name Forward Current IF (mA) Please see Note 1 Reverse Voltage VR (V) Power Dissipation PD (mW) Operation Temperature Topr (°C) Storage Temperature Tstg (°C) 30 4 75 −40~100 −40~100 TLRK1100C TLRMK1100C TLSK1100C TLOK1100C TLYK1100C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Forward current derating IF – Ta Allowable forward current IF (mA) 50 40 30 20 10 0 0 20 40 60 80 100 120 Ambient temperature Ta (°C)) Electrical Characteristics (Ta = 25°C) Min Typ. Max TLRK1100C 1.8 2.1 2.5 TLRMK1100C 1.8 2.1 2.5 TLSK1100C 1.8 2.1 2.5 TLOK1100C 1.8 2.1 2.5 TLYK1100C 1.8 2.2 2.5 Unit Reverse Current IR Forward Voltage VF Product Name V IF Max VR 20 10 4 mA μA V 2 2007-10-01 TL(RK,RMK,SK,OK,YK)1100C(T11) Optical Characteristics–1 (Ta = 25°C) Product Name TLRK1100C Luminous Intensity IV Available Iv rank Min Typ. Max IF Please see Note 2 100 300 500 20 RA / SA / TA TLRMK1100C 160 400 800 20 SA / TA / UA TLSK1100C 250 500 1250 20 TA / UA / VA TLOK1100C 250 500 1250 20 TA / UA / VA TLYK1100C 160 400 800 20 SA / TA / UA Unit mcd mcd mcd mA mA Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility. Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned. Rank Luminous Intensity IV Min Max RA 100 200 SA 160 320 TA 250 500 UA 400 800 VA 630 1250 Unit mcd mcd Optical Characteristics–2 (Ta = 25°C) Emission Spectrum Product Name Peak Emission Wavelength λp Min Typ. Max Δλ Dominant Wavelength λd Typ. Min Typ. Max TLRK1100C ⎯ 644 ⎯ 14 624 630 638 TLRMK1100C ⎯ 636 ⎯ 14 620 626 634 TLSK1100C ⎯ 623 ⎯ 14 607 613 621 TLOK1100C ⎯ 612 ⎯ 14 599 605 613 TLYK1100C ⎯ 592 ⎯ 13 583 590 595 Unit nm nm nm IF 20 mA The cautions • This product is designed as a general display light source usage, and it has applied the measurement standard that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application (ex. Light source for sensor, optical communication and etc) except general display light source. 3 2007-10-01 TL(RK,RMK,SK,OK,YK)1100C(T11) TLRK1100C IF – V F IV (mcd) 1000 30 Luminous intensity Forward current IF (mA) IV – IF (typ.) 100 10 3 1 1.6 1.8 2.0 2.2 Forward voltage VF 300 100 50 30 (V) IV – Tc Ta = 25°C 500 10 1 2.4 (typ.) 3 5 10 30 Forward current IF 50 100 (mA) Wavelength characteristic (typ.) 10 (typ.) 1.0 Relative luminous intensity Relative luminous intensity IV IF = 20 mA 5 3 1 0.5 0.3 0.1 −25 0 25 50 Case temperature 75 Tc Ta = 25°C 0.8 0.6 0.4 0.2 0 580 100 (°C) 600 620 640 Wavelength 660 680 700 λ (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 90° 80° 0 0.2 0.4 0.6 0.8 90° 1.0 4 2007-10-01 TL(RK,RMK,SK,OK,YK)1100C(T11) TLRMK1100C IF – V F IV (mcd) 1000 30 Luminous intensity Forward current IF (mA) IV – IF (typ.) 100 10 3 1 1.6 1.8 2.0 2.2 Forward voltage VF 500 300 100 50 30 10 1 2.4 (V) IV – Tc 3 5 10 30 Forward current IF 50 100 (mA) Wavelength characteristic (typ.) 10 (typ.) Ta = 25°C (typ.) 1.0 Ta = 25°C Relative luminous intensity Relative luminous intensity IV IF = 20 mA 5 3 1 0.5 0.3 0.1 −25 0 25 50 Case temperature 75 Tc 0.8 0.6 0.4 0.2 0 580 100 (°C) 600 620 640 Wavelength 660 680 700 λ (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 90° 80° 0 0.2 0.4 0.6 0.8 90° 1.0 5 2007-10-01 TL(RK,RMK,SK,OK,YK)1100C(T11) TLSK1100C IF – V F IV (mcd) 1000 30 Luminous intensity Forward current IF (mA) IV – IF (typ.) 100 10 3 1 1.6 1.8 2.0 2.2 Forward voltage VF 500 300 100 50 30 10 1 2.4 (V) IV – Tc 3 5 10 30 Forward current IF 50 100 (mA) Wavelength characteristic (typ.) 10 (typ.) Ta = 25°C (typ.) 1.0 Ta = 25°C Relative luminous intensity Relative luminous intensity IV IF = 20 mA 5 3 1 0.5 0.3 0.1 −25 0 25 50 Case temperature 75 Tc 0.8 0.6 0.4 0.2 0 560 100 (°C) 580 600 620 Wavelength 640 660 680 λ (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 90° 80° 0 0.2 0.4 0.6 0.8 90° 1.0 6 2007-10-01 TL(RK,RMK,SK,OK,YK)1100C(T11) TLOK1100C IF – V F IV – IF (typ.) IV (mcd) 1000 30 Luminous intensity Forward current IF (mA) 100 10 3 1 1.6 1.8 2.0 2.2 Forward voltage VF 500 300 100 50 30 10 1 2.4 (V) IV – Tc 3 5 10 30 Forward current IF 50 100 (mA) Wavelength characteristic (typ.) 10 (typ.) Ta = 25°C (typ.) 1.0 Ta = 25°C Relative luminous intensity Relative luminous intensity IV IF = 20 mA 5 3 1 0.5 0.3 0.1 −25 0 25 50 Case temperature 75 Tc 0.8 0.6 0.4 0.2 0 540 100 (°C) 560 580 600 Wavelength 620 640 660 λ (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 90° 80° 0 0.2 0.4 0.6 0.8 90° 1.0 7 2007-10-01 TL(RK,RMK,SK,OK,YK)1100C(T11) TLYK1100C IF – V F IV (mcd) 1000 30 Luminous intensity Forward current IF (mA) IV – IF (typ.) 100 10 3 1 1.6 1.8 2.0 2.2 Forward voltage VF 500 300 100 50 30 10 1 2.4 (V) IV – Tc 3 5 10 30 Forward current IF 50 100 (mA) Wavelength characteristic (typ.) 10 (typ.) Ta = 25°C (typ.) 1.0 Ta = 25°C Relative luminous intensity Relative luminous intensity IV IF = 20 mA 5 3 1 0.5 0.3 0.1 −25 0 25 50 Case temperature 75 Tc 0.8 0.6 0.4 0.2 0 540 100 (°C) 560 580 600 Wavelength 620 640 660 λ (nm) Radiation pattern Ta = 25°C (typ.) 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 50° 60° 60° 70° 70° 80° 90° 80° 0 0.2 0.4 0.6 0.8 90° 1.0 8 2007-10-01 TL(RK,RMK,SK,OK,YK)1100C(T11) Packaging These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. This moisture proof bag may be stored unopened within 12 months at the following conditions. Temperature: 5°C~30°C Humidity: 90% (max) 2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of 5°C to 30°C/60% RH or below. 3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60±5°C, for 12 to 24 hours. Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed. 4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not throw or drop the packed devices. Mounting Method Soldering • Reflow soldering (example) Temperature profile for Pb soldering (example) Temperature profile for Pb-free soldering (example) 5 s max(*) 10 s max (*) (*) (*) 140~160°C max(*) (*) 4°C/s max(*) 4°C/s max 60~120 s max(*) Time • • • • • 260°C max Package surface temperature (°C) Package surface temperature (°C) 240°C max 4°C/s max(*) max(*) 150~180°C 230°C 4°C/s max(*) max(*) 60~120 s Time (s) 30~50s max(*) (s) The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions. Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. Second reflow soldering In case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30°C, 60% RH (max) Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron : 25 W Temperature : 300°C or less Time : within 3 s If the products need to be performed by other soldering method (ex. wave soldering), please contact Toshiba sales representative. Recommended soldering pattern 1.65 Unit: mm 1.15 1.65 2.41 9 2007-10-01 TL(RK,RMK,SK,OK,YK)1100C(T11) Cleaning When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition, using condition and etc. ASAHI CLEAN AK-225AES KAO CLEAN TROUGH 750H PINE ALPHA ST-100S TOSHIBA TECHNOCARE (FRW-17, FRW-1, FRV-100) : (made by ASAHI GLASS) : (made by KAO) : (made by ARAKAWA CHEMICAL) : (made by GE TOSHIBA SILICONES) Precautions when Mounting Do not apply force to the plastic part of the LED under high-temperature conditions. To avoid damaging the LED plastic, do not apply friction using a hard material. When installing the PCB in a product, ensure that the device does not come into contact with other cmponents. Tape Specifications 1. Product number format The type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard Toshiba specifications) (1) Tape Type: T11 (4-mm pitch) (2) Example TLYK1100C (T11) Tape type Toshiba product No. 2. Tape dimensions Unit: mm Symbol Dimension Tolerance Symbol Dimension Tolerance D 1.5 +0.1/−0 P2 2.0 ±0.05 E 1.75 ±0.1 W 8.0 ±0.3 P0 4.0 ±0.1 P 4.0 ±0.1 t 0.3 ±0.05 A0 2.9 ±0.1 F 3.5 ±0.05 B0 3.7 ±0.1 D1 1.5 ±0.1 K0 2.3 ±0.1 K0 P0 D t P2 E F W B0 P D1 Polarity A0 10 2007-10-01 TL(RK,RMK,SK,OK,YK)1100C(T11) 3. Reel dimensions Unit: mm 9 ± 0.3 φ60 2 ± 0.5 φ13 φ44 +0 180 −4 11.4 ± 1.0 4. Leader and trailer sections of tape 40 mm or more 40 mm or more (Note 1) (Note 2) Leading part: 190 mm (min) Note1: Empty trailer section Note2: Empty leader section 11 2007-10-01 TL(RK,RMK,SK,OK,YK)1100C(T11) 5. Packing form (1) Packing quantity Reel 2,000 pcs Carton 10,000 pcs (2) Packing form: Each reel is sealed in an aluminum pack with silica gel. 6. Label format (1) Example: TLYK1100C (T11) P/N: TOSHIBA TYPE TLYK1100C ADDC (T11) Q’TY Lot Number Key code for TSB (RANK SYMBOL) 32C 2,000 pcs 2000 Use under 5-30degC/60%RH within 168h SEAL DATE: DIFFUSED IN ***** ASSEMBLED IN ***** [[G]]/RoHS COMPATIBLE *Y3804xxxxxxxxxxxxxxxxx* (2) Label location • Reel • Carton Tape feel direction Label position Label position • The aluminum package in which the reel is supplied also has the label attached to center of one side. 12 2007-10-01 TL(RK,RMK,SK,OK,YK)1100C(T11) RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 13 2007-10-01