ASB ASX520 Gain block amplifier mmic over dc ~1000mhz Datasheet

ASX520
250 ~ 3000 MHz MMIC Amplifier
Description
Features
 31 dB Gain at 900 MHz
 33 dBm P1dB at 900 MHz
 48 dBm Output IP3 at 900 MHz
 MTTF > 100 Years
 Two Power Supplies
The ASX520, a power amplifier MMIC, has a high
linearity, high gain, and high efficiency over a wide
range of frequency, being suitable for use in both
receiver and transmitter of telecommunication
systems up to 3 GHz. The amplifier is available in
a SOIC package and passes through the stringent
DC, RF, and reliability tests.
Package Style: SOIC8
Typical Performance
(Supply Voltage = Device Voltage, TA = +25 C, Z0 = 50 )
Parameters
Units
Typical
Frequency
MHz
900
Gain
dB
31.0
 IF (400 ~ 430 MHz)
S11
dB
-15
 LTE (700 ~ 800 MHz)
S22
dB
-9
 CDMA
Output IP31)
dBm
48
 GSM
Noise Figure
dB
7.0
 RFID (USA)
Output P1dB
dBm
33
 Others (1250 ~ 1300 MHz)
Current
mA
650
Device Voltage
V
+5
Application Circuit
 Others (950 ~ 1240 MHz)
1) OIP3 measured with two tones at an output power of +15 dBm/tone separated by 1 MHz.
Product Specifications
Parameters
Units
Min
Typ
Testing Frequency
MHz
Gain
dB
S11
dB
-15
S22
dB
-9
Output IP3
dBm
Noise Figure
dB
Output P1dB
dBm
32
33
Current
mA
610
650
Device Voltage
V
Max
900
30.0
45
31.0
48
7.0
7.3
690
+5
Pin Configuration
Absolute Maximum Ratings
Parameters
Rating
Pin No.
Function
Operating Case Temperature
-40 to 85 C
1
2nd stage RF IN
Storage Temperature
-40 to 150 C
2
1st stage RF OUT
Device Voltage
+6 V
Operating Junction Temperature
+150 C
3,5,8
GND
Input RF Power (CW, 50  matched)1)
+25 dBm
4
1st stage RF IN
Thermal Resistance
18 C/W
6,7
2nd stage RF OUT
1) Please find the max. input power data from http://www.asb.co.kr/pdf/Maximum_Input_Power_Analysis.pdf
1/11
ASB Inc.  [email protected]  Tel: +82-42-528-7225
February 2017
ASX520
250 ~ 3000 MHz MMIC Amplifier
Outline Drawing
Part No.
Symbols
ASX520
●
A
A1
A2
B
C
D
D2
E
E1
E2
e
L
y

|L1-L1’|
L1
Pin No.
1
2
3
4
Dimensions (In mm)
MIN
NOM
1.40
1.50
0.00
----1.45
0.33
--0.19
--4.80
--3.20
3.30
5.80
6.00
3.80
3.90
2.30
2.40
--1.27
0.40
--------0
----1.04REF
Function
2nd stage RF IN
1st stage RF OUT
GND
1st stage RF IN
Pin No.
5
6
7
8
MAX
1.60
0.10
--0.51
0.25
5.00
3.40
6.20
4.00
2.50
--1.27
0.10
8
0.12
Function.
GND
2nd stage RF OUT
2nd stage RF OUT
GND
Note: 1. Backside metal paddle is RF and DC ground.
Mounting Recommendation (In mm)
Note: 1. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
2. To ensure reliable operation, device ground paddle-to-ground
pad soldering is critical.
3. Add mounting screws near the part to fasten the board to a heat
sinker. Ensure that the ground / thermal via region contacts the
heat sinker.
4. A proper heat dissipation path underneath the area of the PCB
for the mounted device is strictly required for proper thermal operation. Damage to the device can result from inappropriate heat
dissipation.
ESD Classification
HBM
Class 1B
Voltage Level: 500 V ~ 1000 V
MM
Class A
Voltage Level: < 200 V
CAUTION: ESD-sensitive device!
Moisture Sensitivity Level (MSL)
Level 3 at 260 C reflow
2/11
ASB Inc.  [email protected]  Tel: +82-42-528-7225
February 2017
ASX520
250 ~ 3000 MHz MMIC Amplifier
APPLICATION CIRCUIT
IF
400 ~ 430 MHz
+5 V
Frequency (MHz)
400 ~ 430
Magnitude S21 (dB)
37.5
39.0
Magnitude S11 (dB)
-11.0
-12.0
Magnitude S22 (dB)
-2.5
-5.0
Output P1dB (dBm)
30
Output IP31) (dBm)
45
Noise Figure (dB)
8.3
Device Voltage (V)
+5
Current (mA)
650
1) OIP3 is measured with two tones at an output power of +11
dBm/tone separated by 1 MHz.
Board Layout (FR4, 40x40 mm2, 0.8T)
Schematic
Vcc=5 V
D1=5.6V
Zener Diode
R1=3 
C7=1 F
C6=100pF
C9=1 F
C8=100pF
C5=15 pF
C4=100 pF
L1=12 nH
(Coil Inductor)
L4=6.8 nH
C2=270 pF
2.5 mm
ASX520
L2=12 nH
RF IN
RF OUT
3.5 mm L3=1.8 nH
C3=22 pF
C1=100 pF
50
0
40
-5
30
-10
S11 (dB)
Gain (dB)
S-parameters & K-factor
20
-20
10
0
300
-15
350
400
450
500
550
600
-25
300
350
400
450
500
550
600
Frequency (MHz)
Frequency (MHz)
5
5
4
Stability Factor
S22 (dB)
0
-5
3
2
-10
1
-15
300
350
400
450
500
550
600
0
0
500
Frequency (MHz)
3/11
1000
1500
2000
2500
3000
3500
Frequency (MHz)
ASB Inc.  [email protected]  Tel: +82-42-528-7225
February 2017
ASX520
250 ~ 3000 MHz MMIC Amplifier
APPLICATION CIRCUIT
LTE
700 ~ 800 MHz
+5 V
Frequency (MHz)
700 ~ 800
Magnitude S21 (dB)
36.8
32.3
Magnitude S11 (dB)
-12
-12
Magnitude S22 (dB)
-8
-8
Output P1dB (dBm)
32.5
Output IP31) (dBm)
48
Noise Figure (dB)
6.7
Device Voltage (V)
+5
Current (mA)
650
1) OIP3 is measured with two tones at an output power of +14
dBm/tone separated by 1 MHz.
Board Layout (FR4, 40x40 mm2, 0.8T)
Schematic
Vcc=5 V
D1=5.6V
Zener Diode
R1=3 
C8=1 F
C7=100pF
C10=1 F
C9=100pF
C6=7 pF
C5=100 pF
L1=39 nH
(Coil Inductor)
L3=3.9 nH
C3=68 pF
3 mm
RF OUT
ASX520
L2=82 nH
RF IN
5.5 mm
1 mm
C4=9 pF
C1=68 pF
C2=2 pF
50
0
40
-5
30
-10
S11 (dB)
Gain (dB)
S-parameters & K-factor
20
10
0
400
-15
-20
500
600
700
800
900
1000
-25
400
500
600
Frequency (MHz)
5
0
4
Stability Factor
5
S22 (dB)
-5
-10
900
1000
3
2
0
500
600
700
800
900
1000
0
500
1000
1500
2000
2500
3000
3500
Frequency (MHz)
Frequency (MHz)
4/11
800
1
-15
-20
400
700
Frequency (MHz)
ASB Inc.  [email protected]  Tel: +82-42-528-7225
February 2017
ASX520
250 ~ 3000 MHz MMIC Amplifier
APPLICATION CIRCUIT
Frequency (MHz)
824 ~ 849
Magnitude S21 (dB)
32.0
Magnitude S11 (dB)
-15
Magnitude S22 (dB)
-8
CDMA Rx
Output P1dB (dBm)
32
824 ~ 849 MHz
Output IP31) (dBm)
46.5
Noise Figure (dB)
7.0
Device Voltage (V)
+5
Current (mA)
650
+5 V
1) OIP3 is measured with two tones at an output power of +15
dBm/tone separated by 1 MHz.
Board Layout (FR4, 40x40 mm2, 0.8T)
Schematic
Vcc=5 V
D1=5.6V
Zener Diode
R1=3 
C8=1 F
C7=100pF
C10=1 F
C6=5.6 pF
C5=100 pF
C9=100pF
L1=82 nH
(Coil Inductor)
L3=3.3 nH
C3=68 pF RF OUT
3 mm
ASX520
L2=100 nH
RF IN
4.5 mm
C1=68 pF
C4=9 pF
C2=1.2 pF
S-parameters & K-factor
40
0
35
-5
S11 (dB)
Gain (dB)
30
25
-10
20
-15
15
10
600
700
800
900
1000
1100
1200
-20
600
700
800
Frequency (MHz)
900
1000
1100
1200
Frequency (MHz)
0
5
4
Stability Factor
S22 (dB)
-5
-10
3
2
-15
1
-20
600
700
800
900
1000
1100
1200
0
0
500
Frequency (MHz)
5/11
1000
1500
2000
2500
3000
3500
Frequency (MHz)
ASB Inc.  [email protected]  Tel: +82-42-528-7225
February 2017
ASX520
250 ~ 3000 MHz MMIC Amplifier
APPLICATION CIRCUIT
Frequency (MHz)
869 ~ 894
890 ~ 915
935 ~ 960
Magnitude S21 (dB)
31.5
31.0
29.0
Magnitude S11 (dB)
-15.0
-15.0
-14.0
Magnitude S22 (dB)
-10.0
-9.0
-7.5
CDMA Tx, GSM
Output P1dB (dBm)
32.5
33.0
33.0
869 ~ 960 MHz
Output IP31) (dBm)
47
48
48
Noise Figure (dB)
7.5
7.0
7.0
Device Voltage (V)
+5
+5
+5
Current (mA)
650
650
650
+5 V
1) OIP3 is measured with two tones at an output power of +15 dBm/tone separated by 1 MHz.
Board Layout (FR4, 40x40 mm2, 0.8T)
Schematic
Vcc=5 V
D1=5.6V
Zener Diode
R1=3 
C8=1 F
C7=100pF
C10=1 F
C6=5.6 pF
C5=100 pF
C9=100pF
L1=82 nH
(Coil Inductor)
L3=2.7 nH
C3=68 pF RF OUT
3 mm
ASX520
L2=100 nH
RF IN
5 mm
C1=68 pF
C4=7.5 pF
C2=1.5 pF
S-parameters & K-factor
50
0
-5
40
-10
S11 (dB)
Gain (dB)
30
20
-20
o
-40 c
o
25 c
o
85 c
10
0
600
700
800
900
1000
1100
-15
o
-40 c
o
25 c
o
85 c
-25
1200
-30
600
700
800
Frequency (MHz)
5
0
4
Stability Factor
5
S22 (dB)
-5
-10
o
-40 c
o
25 c
o
85 c
-15
-20
600
700
800
900
1000
1000
1100
1200
1100
3
2
1
1200
0
0
500
Frequency (MHz)
6/11
900
Frequency (MHz)
1000
1500
2000
2500
3000
3500
Frequency (MHz)
ASB Inc.  [email protected]  Tel: +82-42-528-7225
February 2017
ASX520
250 ~ 3000 MHz MMIC Amplifier
Gain vs. Temperature
900
38
800
36
700
34
Gain (dB)
Current (mA)
Current vs. Temperature
600
32
500
30
400
28
Frequency = 880 MHz
300
-60
-40
-20
0
20
40
60
80
26
-60
100
-40
-20
0
o
20
40
60
80
100
o
Temperature ( C)
Temperature ( C)
Output IP3 vs. Tone Power (Frequency = 880 MHz)
P1dB vs. Temperature
MHz)80
44
70
40
60
Output IP3 (dBm)
P1dB (dBm)
36
32
28
40
30
o
-40 c
o
25 c
o
85 c
20
Frequency = 880 MHz
24
20
-60
50
10
-40
-20
0
20
40
60
80
100
0
11
12
13
Temperature ( C)
7/11
14
15
16
17
18
19
20
21
22
23
Pout per Tone (dBm)
o
ASB Inc.  [email protected]  Tel: +82-42-528-7225
February 2017
ASX520
250 ~ 3000 MHz MMIC Amplifier
APPLICATION CIRCUIT
RFID (USA)
Country
EU 2)
USA
Korea 2)
Japan 2)
Frequency (MHz)
865.6 ~ 867.6
902 ~ 928
910 ~ 914
950 ~ 956
Magnitude S21 (dB)
31.0
30.0
31.0
29.0
Magnitude S11 (dB)
-15.0
-15.0
-15.0
-14.0
Magnitude S22 (dB)
-10.0
-8.0
-9.0
-7.5
Output P1dB (dBm)
32
33
33
33
902 ~ 928 MHz
Output IP3 (dBm)
47
48
48
48
+5 V
Noise Figure (dB)
7.4
6.9
6.8
6.9
Device Voltage (V)
+5
+5
+5
+5
Current (mA)
650
650
650
650
1)
1) OIP3 is measured with two tones at an output power of +15 dBm/tone separated by 1 MHz.
2) Test Results are measured by CDMA Tx (EU), GSM Rx (Korea), GSM Tx (Japan) Application circuits.
Board Layout (FR4, 40x40 mm2, 0.8T)
Schematic
Vcc=5 V
D1=5.6V
Zener Diode
R1=3 
C8=1 F
C7=100pF
C10=1 F
C6=5.6 pF
C5=100 pF
C9=100pF
L1=82 nH
(Coil Inductor)
L3=2.7 nH
C3=68 pF RF OUT
3 mm
ASX520
L2=100 nH
RF IN
5 mm
C1=68 pF
C4=7.5 pF
C2=1.5 pF
40
0
35
-5
30
-10
S11 (dB)
Gain (dB)
S-parameters & K-factor
25
20
15
600
-15
-20
700
800
900
1000
1100
1200
-25
600
700
800
Frequency (MHz)
900
1000
1100
1200
Frequency (MHz)
5
5
4
Stability Factor
S22 (dB)
0
-5
3
2
-10
1
-15
600
700
800
900
1000
1100
1200
0
0
500
Frequency (MHz)
8/11
1000
1500
2000
2500
3000
3500
Frequency (MHz)
ASB Inc.  [email protected]  Tel: +82-42-528-7225
February 2017
ASX520
250 ~ 3000 MHz MMIC Amplifier
APPLICATION CIRCUIT
Others
1250 ~ 1300 MHz
+5 V
Frequency (MHz)
1250 ~ 1300
Magnitude S21 (dB)
25.0
Magnitude S11 (dB)
-14
Magnitude S22 (dB)
-12
Output P1dB (dBm)
29
Output IP31) (dBm)
47
Noise Figure (dB)
6.8
Device Voltage (V)
+5
Current (mA)
650
1) OIP3 is measured with two tones at an output power of +14
dBm/tone separated by 1 MHz.
Board Layout (FR4, 40x40 mm2, 0.8T)
Schematic
Vcc=5 V
D1=5.6V
Zener Diode
R1=3 
C7=1 F
C6=100pF
C9=1 F
C5=3 pF
C4=9 pF
C8=100pF
L1=82 nH
(Coil Inductor)
L3=1.2 nH
C2=68 pF RF OUT
3 mm
ASX520
L2=100 nH
RF IN
5 mm
C1=68 pF
C3=4 pF
S-parameters & K-factor
30
0
25
-5
20
S11 (dB)
Gain (dB)
-10
15
-15
10
-20
5
0
1000
1100
1200
1300
1400
1500
1600
-25
1000
1100
1200
Frequency (MHz)
1300
1400
1500
1600
Frequency (MHz)
0
5
4
Stability Factor
S22 (dB)
-5
-10
3
2
-15
1
-20
1000
1100
1200
1300
1400
1500
1600
0
0
500
Frequency (MHz)
9/11
1000
1500
2000
2500
3000
3500
Frequency (MHz)
ASB Inc.  [email protected]  Tel: +82-42-528-7225
February 2017
ASX520
250 ~ 3000 MHz MMIC Amplifier
APPLICATION CIRCUIT
Others
950 ~ 1240 MHz
+5 V
Frequency (MHz)
950
1240
Magnitude S21 (dB)
30.0
26.0
Magnitude S11 (dB)
-18.0
-15.0
Magnitude S22 (dB)
-6.5
-9.0
Output P1dB (dBm)
30
30
Output IP31) (dBm)
41
42
Noise Figure (dB)
6.9
6.9
Device Voltage (V)
+5
+5
Current (mA)
660
660
1) OIP3 is measured with two tones at an output power of +14
dBm/tone separated by 1 MHz.
Board Layout (FR4, 40x40 mm2, 0.8T)
Schematic
Vs=5 V
D1=5.6V
Zener Diode
C7=1 F
C6=100pF
C9=1 F
C8=100pF
C5=4 pF
C4=22 pF
L1=56 nH
(Coil Inductor)
L3=1.5 nH
C2=68 pF RF OUT
3 mm
ASX520
L2=100 nH
RF IN
5 mm
C1=68 pF
C3=5 pF
S-parameters & K-factor
0
35
30
-5
-10
20
S11 (dB)
Gain (dB)
25
15
-15
10
-20
5
0
600
800
1000
1200
1400
-25
600
800
Frequency (MHz)
1000
1200
1400
Frequency (MHz)
0
5
4
Stability Factor
S22 (dB)
-5
-10
3
2
-15
1
-20
600
800
1000
1200
1400
0
0
500
Frequency (MHz)
10/11
1000
1500
2000
2500
3000
3500
Frequency [MHz]
ASB Inc.  [email protected]  Tel: +82-42-528-7225
February 2017
ASX520
250 ~ 3000 MHz MMIC Amplifier
Recommended Soldering Reflow Profile
260 C
Ramp-up
(3 C/sec)
20~40 sec
Ramp-down
(6 C/sec)
200 C
150 C
60~180 sec
Copyright 2006-2017 ASB Inc. All rights reserved. Datasheet subject to change without notice. ASB assumes no responsibility for any errors which may appear in this datasheet. No part of the datasheet may be copied or reproduced in
any form or by any means without the prior written consent of ASB.
11/11
ASB Inc.  [email protected]  Tel: +82-42-528-7225
February 2017
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