TI1 CD4012B-MIL Cmos nand gate Datasheet

Data sheet acquired from Harris Semiconductor
SCHS021D – Revised September 2003
The CD4011B, CD4012B, and CD4023B types
are supplied in 14-lead hermetic dual-in-line
ceramic packages (F3A suffix), 14-lead
dual-in-line plastic packages (E suffix), 14-lead
small-outline packages (M, MT, M96, and NSR
suffixes), and 14-lead thin shrink small-outline
packages (PWR suffix). The CD4011B and
CD4023B types also are supplied in 14-lead thin
shrink small-outline packages (PW suffix).
Copyright © 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
CD4011BE
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD4011BE
CD4011BEE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD4011BE
CD4011BF
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
CD4011BF
CD4011BF3A
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
CD4011BF3A
CD4011BM
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4011BM
CD4011BM96
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4011BM
CD4011BM96E4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4011BM
CD4011BM96G4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4011BM
CD4011BME4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4011BM
CD4011BMT
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4011BM
CD4011BNSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4011B
CD4011BNSRG4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4011B
CD4011BPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM011B
CD4011BPWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM011B
CD4011BPWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM011B
CD4011BPWRG4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM011B
CD4012BE
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD4012BE
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2017
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
CD4012BEE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD4012BE
CD4012BF3A
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
CD4012BF3A
CD4012BM
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4012BM
CD4012BM96
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4012BM
CD4012BM96E4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4012BM
CD4012BM96G4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4012BM
CD4012BMG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4012BM
CD4012BNSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4012B
CD4012BNSRG4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4012B
CD4012BPWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM012B
CD4023BE
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD4023BE
CD4023BEE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD4023BE
CD4023BF
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
CD4023BF
CD4023BF3A
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
CD4023BF3A
CD4023BM
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4023BM
CD4023BM96
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4023BM
CD4023BME4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4023BM
CD4023BMG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4023BM
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2017
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
CD4023BMT
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4023BM
CD4023BMTE4
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4023BM
CD4023BNSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4023B
CD4023BNSRG4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4023B
CD4023BPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM023B
CD4023BPWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CM023B
JM38510/05051BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
05051BCA
JM38510/05052BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
05052BCA
JM38510/05053BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
05053BCA
M38510/05051BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
05051BCA
M38510/05052BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
05052BCA
M38510/05053BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
05053BCA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2017
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4011B, CD4011B-MIL, CD4012B, CD4012B-MIL :
• Catalog: CD4011B, CD4012B
• Military: CD4011B-MIL, CD4012B-MIL
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Aug-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
CD4011BM96
SOIC
D
14
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
6.5
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
9.0
2.1
8.0
16.0
Q1
CD4011BMT
SOIC
D
14
250
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CD4011BNSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
CD4011BPWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD4012BM96
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CD4012BNSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
CD4012BPWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD4023BM96
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CD4023BMT
SOIC
D
14
250
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CD4023BNSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
CD4023BPWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Aug-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD4011BM96
SOIC
D
14
2500
367.0
367.0
38.0
CD4011BMT
SOIC
D
14
250
367.0
367.0
38.0
CD4011BNSR
SO
NS
14
2000
367.0
367.0
38.0
CD4011BPWR
TSSOP
PW
14
2000
367.0
367.0
35.0
CD4012BM96
SOIC
D
14
2500
367.0
367.0
38.0
CD4012BNSR
SO
NS
14
2000
367.0
367.0
38.0
CD4012BPWR
TSSOP
PW
14
2000
367.0
367.0
35.0
CD4023BM96
SOIC
D
14
2500
367.0
367.0
38.0
CD4023BMT
SOIC
D
14
250
367.0
367.0
38.0
CD4023BNSR
SO
NS
14
2000
367.0
367.0
38.0
CD4023BPWR
TSSOP
PW
14
2000
367.0
367.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
J0014A
CDIP - 5.08 mm max height
SCALE 0.900
CERAMIC DUAL IN LINE PACKAGE
PIN 1 ID
(OPTIONAL)
A
4X .005 MIN
[0.13]
.015-.060 TYP
[0.38-1.52]
1
14
12X .100
[2.54]
14X .014-.026
[0.36-0.66]
14X .045-.065
[1.15-1.65]
.010 [0.25] C A B
.754-.785
[19.15-19.94]
8
7
B
.245-.283
[6.22-7.19]
.2 MAX TYP
[5.08]
C
.13 MIN TYP
[3.3]
SEATING PLANE
.308-.314
[7.83-7.97]
AT GAGE PLANE
.015 GAGE PLANE
[0.38]
0 -15
TYP
14X .008-.014
[0.2-0.36]
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
www.ti.com
EXAMPLE BOARD LAYOUT
J0014A
CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE
(.300 ) TYP
[7.62]
SEE DETAIL A
SEE DETAIL B
1
14
12X (.100 )
[2.54]
SYMM
14X ( .039)
[1]
8
7
SYMM
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
.002 MAX
[0.05]
ALL AROUND
(.063)
[1.6]
METAL
( .063)
[1.6]
SOLDER MASK
OPENING
METAL
(R.002 ) TYP
[0.05]
.002 MAX
[0.05]
ALL AROUND
SOLDER MASK
OPENING
DETAIL A
DETAIL B
SCALE: 15X
13X, SCALE: 15X
4214771/A 05/2017
www.ti.com
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