Vishay DF005M Miniature glass passivated single-phase bridge rectifier Datasheet

DF005M thru DF10M
Vishay General Semiconductor
Miniature Glass Passivated Single-Phase Bridge Rectifiers
FEATURES
• UL recognition, file number E54214
• Ideal for printed circuit boards
• Applicable for automative insertion
• High surge current capability
~
~
• Solder dip 260 °C, 40 s
~
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
~
TYPICAL APPLICATIONS
General purpose use in ac-to-dc bridge full wave
rectification for SMPS, lighting ballaster, adapter,
battery charger, home appliances, office equipment,
and telecommunication applications.
Case Style DFM
PRIMARY CHARACTERISTICS
IF(AV)
1A
VRRM
50 V to 1000 V
IFSM
50 A
Epoxy meets UL 94V-0 flammability rating
IR
5 µA
VF
1.1 V
TJ max.
150 °C
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD22-B102
E3 suffix for consumer grade, meets JESD 201 class
1A whisker test
MECHANICAL DATA
Case: DFM
Polarity: As marked on body
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Device marking code
DF005M
DF01M
DF02M
DF04M
DF06M
DF08M
DF10M
DF005
DF01
DF02
DF04
DF06
DF08
DF10
100
200
400
600
800
1000
V
Maximum repetitive peak reverse voltage
VRRM
50
Maximum RMS voltage
UNIT
VRMS
35
70
140
280
420
560
700
V
Maximum DC blocking voltage
VDC
50
100
200
400
600
800
1000
V
Maximum average forward output rectified
current at TA = 40 °C
IF(AV)
1.0
A
Peak forward surge current single
sine-wave superimposed on rated load
IFSM
50
A
I 2t
10
A 2s
TJ, TSTG
- 55 to + 150
°C
Rating for fusing (t < 8.3 ms)
Operating junction and storage
temperature range
Document Number: 88571
Revision: 14-Jan-08
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
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DF005M thru DF10M
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
SYMBOL
DF005M
DF01M
DF02M
DF04M
DF06M
DF08M
DF10M
UNIT
Maximum
instantaneous forward
voltage drop per diode
1.0 A
VF
1.1
V
Maximum
reverse current at
rated DC blocking
voltage per diode
TA = 25 °C
TA = 125 °C
IR
5.0
500
µA
Typical junction
capacitance per diode
4.0 V, 1 MHz
CJ
25
pF
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
DF005M
DF01M
DF02M
DF04M
RθJA
RθJL
Typical thermal resistance (1)
DF06M
DF08M
DF10M
40
15
UNIT
°C/W
Note:
(1) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.5 x 0.5" (13 x 13 mm) copper pads
ORDERING INFORMATION (Example)
PREFERRED P/N
DF06M-E3/45
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
0.416
45
50
Tube
RATINGS AND CHARACTERISTICS CURVES
(TA = 25 °C unless otherwise noted)
60
60 Hz
Resistive or
Inductive Load
0.5
P.C.B. Mounted on
0.51 x 0.51" (13 x 13 mm)
Copper Pads with 0.06"
(1.5 mm) Lead Length
0
Average Forward Output Current (A)
Average Forward Output Current (A)
1.0
TJ = 150 °C
Single Sine-Wave
50
40
30
20
10
1.0 Cycle
0
20
40
60
80
100
120
140 150
1
100
10
Ambient Temperature (°C)
Number of Cycles at 60 Hz
Figure 1. Derating Curve Output Rectified Current
Figure 2. Maximum Non-Repetitive Peak Forward Surge
Current Per Diode
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For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
Document Number: 88571
Revision: 14-Jan-08
DF005M thru DF10M
Vishay General Semiconductor
100
Junction Capacitance (pF)
Instantaneous Forward Current (A)
10
1
TJ = 25 °C
Pulse Width = 300 µs
1 % Duty Cycle
0.1
0.01
0.4
10
1
0.8
0.6
1.0
1.2
10
1
1.4
100
Instantaneous Forward Voltage (V)
Reverse Voltage (V)
Figure 3. Typical Forward Characteristics Per Diode
Figure 5. Typical Junction Capacitance Per Diode
100
10
Transient Thermal Impedance (°C/W)
100
Instantaneous Reverse Current (µA)
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
TJ = 125 °C
1
0.1
TJ = 25 °C
0.01
0
20
40
60
80
10
1
0.1
0.01
100
1
0.1
10
100
Percent of Rated Peak Reverse Voltage (%)
t - Heating Time (s)
Figure 4. Typical Reverse Leakage Characteristics Per Diode
Figure 6. Typical Transient Thermal Impedance
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
Case Style DFM
0.255 (6.5) 0.315 (8.00)
0.245 (6.2) 0.285 (7.24)
0.335 (8.51)
0.320 (8.12)
0.080 (2.03)
0.050 (1.27)
0.130 (3.30)
0.120 (3.05)
0.045 (1.14)
0.035 (0.89)
0.185 (4.69)
0.150 (3.81)
0.023 (0.58)
0.018 (0.46)
0.205 (5.2)
0.195 (5.0)
Document Number: 88571
Revision: 14-Jan-08
0.075 (1.90)
0.055 (1.39)
0.013 (0.33)
0.0086 (0.22)
0.350 (8.9)
0.300 (7.6)
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
www.vishay.com
3
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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