TD62304,305P/AP/F/AF TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62304P,TD62304AP,TD62304F,TD62304AF TD62305P,TD62305AP,TD62305F,TD62305AF 7CH LOW ACTIVE DARLINGTON SINK DRIVER The TD62304P/AP/F/AF and TD62305P/AP/F/AF are non−inverting transistor arrays, which are comprised of eight NPN darlington buffer-transistor output stages and PNP input stages. These devices can be operated by source input voltage and are suitable for operations with a 5-V general purposed logic IC such as 5-V TTL, 5-V CMOS and 5-V Microprocessor which have sink current output drivers. Please observe the thermal condition for using. FEATURES l Output current (single output) 500 mA (Max.) l High sustaining voltage 35 V (TD62304P/F, 62305P/F) 50 V (TD62304AP/AF, 62305AP/AF) (Min.) l Low level active input l Input compatible with 5-V TTL and 5-V CMOS l Package type-P, AP: DIP-16 pin l Package type-F, AF: SOP-18 pin PIN CONNECTION (TOP VIEW) Weight DIP16−P−300−2.54A : 1.11 g (Typ.) SOP16−P−225−1.27 : 0.16 g (Typ.) SCHEMATICS (EACH DRIVER) TD62034P/AP/F/AF Note: TD62305P/AP/F/AF The input and output parasitic diodes cannot be used as clamp diodes. 1 2001-07-16 TD62304,305P/AP/F/AF MAXIMUM RATINGS (Ta = 25°C) CHARACTERISTICS Supply Voltage SYMBOL RATING UNIT VCC −0.5~7.0 V P, F Output Sustaining Voltage AF −0.5~35 VCE (SUS) AP IOUT Input Voltage VIN Input Current IIN P AP Storage Temperature P 500 −22~VCC +0.5 −0.5~7 (Note 1) −10 mA / ch V mA 1.0 PD F, AF Operating Temperature V −0.5~50 Output Current Power Dissipation −0.5~50 1.47 W 0.625 (Note 2) Topr Tstg −30~75 −40~85 −55~150 °C °C Note 1: TD62305P / AP / F / AF Note 2: On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%) 2 2001-07-16 TD62304,305P/AP/F/AF RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C and Ta = −30~75°C for only Type−P) CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT VCC ― 4.5 5.0 5.5 V 0 ― 35 VCE (SUS) ― 0 ― 50 Supply Voltage P, F Output Sustaining Voltage AF AP 0 ― 50 0 ― 350 0 ― 300 0 ― 350 0 ― 200 −20 ― VCC 0 ― 5.5 ― ― ― 0.44 ― ― ― 0.52 ― ― 0.325 MIN TYP. MAX UNIT ― ― −100 µA V DC 1 Circuit Tpw = 25 ms, duty = 10% P 7 circuits Output Current IOUT Tpw = 25 ms, duty = 10% 7 circuits AP Tpw = 25 ms, duty = 20% 7 circuits Input Voltage TD62304P / AP / F / AF VIN TD62305P / AP / F / AF ― P Power Dissipation PD AP V F, AF (Note 1) mA / ch V W Note 1: On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%) ELECTRICAL CHARACTERISTICS (Ta = 25°C) CHARACTERISTIC Output Leakage Current Input Voltage (Output On) Supply Current TEST CIR− CUIT P/F TEST CONDITION VOUT = 35 V Ta = 75°C ICEX 1 VCC = 5.5 V VIN = 0 V VCE (sat) 2 VIN = VIN (ON) VCC = 4.5 V IOUT = 350 mA MAX. ― 1.4 2.0 (Output On) IIN (ON) 3 VCC = 5.5 V, VIN = 0.4 V ― −0.32 −0.45 VCC = 5.5 V, VIN = −20 V ― ― −2.6 (Output Off) IIN (OFF) 4 ― ― −40 ― ― VCC −2.8 ― ― VCC −3.7 Output Saturation Voltage Input Current SYMBOL VOUT = 50 V Ta = 85°C ― TD62304 VIN (ON) 5 ― TD62305 mA µA V (Output On) ICC (ON) 6 VCC = 5.5 V, VIN = 0 V ― 17 22 mA (Output Off) ICC (OFF) 6 VCC = VIN = 5.5 V ― ― 100 µA ― 0.1 ― VOUT = 35 V RL = 87.5 Ω P, F Turn−On Delay tON AP, AF 7 P, F Turn−Off Delay VCC = 5 V, CL = 15 pF tOFF VOUT = 50 V RL = 125 Ω VOUT = 35 V RL = 87.5 Ω VOUT = 50 V RL = 125 Ω AP, AF 3 µs ― 3 ― 2001-07-16 TD62304,305P/AP/F/AF TEST CIRCUIT 1. ICEX 2. hFE, VCE (sat) 3. IIN (ON) 4. IIN (OFF) 5. VIN (ON) 6. ICC 7. tON, tOFF Note 1: Pulse Width 50 µs, duty cycle 10% Output impedance 50 Ω, tr ≤ 10 ns, tf ≤ 5 ns Note 2: CL includes probe and jig capacitance. PRECAUTIONS for USING This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed.Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. 4 2001-07-16 TD62304,305P/AP/F/AF 5 2001-07-16 TD62304,305P/AP/F/AF 6 2001-07-16 TD62304,305P/AP/F/AF PACKAGE DIMENSIONS DIP16−P−300−2.54A Unit : mm Weight: 1.11 g (Typ.) 7 2001-07-16 TD62304,305P/AP/F/AF PACKAGE DIMENSIONS SOP16−P−225−1.27 Unit : mm Weight: 0.16 g (Typ.) 8 2001-07-16 TD62304,305P/AP/F/AF RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 9 2001-07-16