ALSC ASM3P18S19BF-08TT Notebook lcd panel emi reduction ic Datasheet

ASM3P18S19B
August 2005
rev 2.1
Notebook LCD Panel EMI Reduction IC
Features
allows significant system cost savings by reducing the
ƒ FCC approved method of EMI attenuation.
number of circuit board layers, ferrite beads, shielding, and
ƒ Provides up to 15dB EMI reduction.
other passive components that are traditionally required to
ƒ Generates a low EMI Spread Spectrum clock and a
pass EMI regulations.
non-spread reference clock of the input frequency.
ƒ Optimized for Frequency range from 20 to 40MHz.
The ASM3P18S19B modulates the output of a single PLL
ƒ Internal loop filter minimizes external components and
in order to “spread” the bandwidth of a synthesized clock,
and more importantly, decreases the peak amplitudes of its
board space.
ƒ Low Inherent Cycle-to-Cycle jitter.
harmonics. This results in significantly lower system EMI
ƒ Two spread % selections: -1.25% to -1.75%.
compared to the typical narrow band signal produced by
ƒ 3.3V Operating Voltage.
oscillators and most frequency generators. Lowering EMI
ƒ Low power CMOS design.
by increasing a signal’s bandwidth is called ‘Spread
ƒ Supports notebook VGA and other LCD timing
Spectrum Clock Generation’.
controller applications.
ƒ Power Down function for mobile application.
The ASM3P18S19B uses the most efficient and optimized
ƒ Available in Commercial temperature range.
modulation
ƒ Available in 8-pin SOIC and TSSOP Packages.
implemented in a proprietary all digital method.
ƒ RoHS Compliant
profile
approved
by
the
FCC
and
is
Applications
Product Description
The ASM3P18S19B is targeted towards EMI management
The ASM3P18S19B is a Versatile Spread Spectrum
for memory and LVDS interfaces in mobile graphic chipsets
Frequency Modulator designed specifically for input clock
and high-speed digital applications such as PC peripheral
frequencies from 20 to 40MHz. (Refer Input Frequency and
devices, consumer electronics, and embedded controller
Modulation Rate Table). The ASM3P18S19B reduces
systems.
electromagnetic interference (EMI) at the clock source,
allowing system wide reduction of EMI of
down stream
clock and data dependent signals. The ASM3P18S19B
Block Diagram
PD#
VDD
SRS
PLL
Modulation
XIN/CLKIN
XOUT
Crystal
Oscillator
Frequency
Divider
Feedback
Divider
Phase
Detector
Loop
Filter
VCO
Output
Divider
ModOUT
REF
VSS
Alliance Semiconductor
2575 Augustine Drive • Santa Clara, CA • Tel: 408.855.4900 • Fax: 408.855.4999 • www.alsc.com
Notice: The information in this document is subject to change without notice.
ASM3P18S19B
August 2005
rev 2.1
Pin Configuration
XIN/ CLKIN
1
8
XOUT
7
VDD
VSS
2
SRS
3
6
PD#
ModOUT
4
5
REF
ASM3P18S19B
Pin Description
Pin#
Pin Name
Type
Description
1
XIN / CLKIN
I
Crystal Connection or external frequency input.This pin has dual
functions. It can be connected to either an external crystal or an external
reference clock
2
VSS
P
Ground Connection. Connect to system ground.
3
SRS
I
4
ModOUT
O
5
REF
O
Non-modulated Reference clock output of the input frequency.
6
PD#
I
Power down control pin. Pull LOW to enable Power-Down mode. This pin
has an internal pull-up resistor.
7
VDD
P
Power Supply for the entire chip.
8
XOUT
O
Crystal Connection. Input connection for an external crystal. If using an
external reference, this pin must be left unconnected.
Spread range select. Digital logic input used to select frequency deviation
(Refer Spread Deviation Selection Table). This pin has an internal pull-up
resistor.
Spread spectrum clock output. (Refer Input Frequency and Modulation
Rate Table and Spread Deviation Selection Table)
Input Frequency and Modulation Rate
Part Number
Input Frequency Range
Output Frequency range
Modulation rate
ASM3P18S19B
20MHz to 40MHz
20MHz to 40MHz
Input Frequency / 512
Spread Deviation Selection
Part Number
ASM3P18S19B
SRS
Spread Deviation
0
-1.25% (DOWN)
1
-1.75% (DOWN)
Notebook LCD Panel EMI Reduction IC
Notice: The information in this document is subject to change without notice.
2 of 7
ASM3P18S19B
August 2005
rev 2.1
Absolute Maximum Ratings
Symbol
VDD, VIN
TSTG
Parameter
Rating
Unit
Voltage on any pin with respect to Ground
-0.5 to +7.0
V
Storage temperature
-65 to +125
°C
0 to 70
°C
TA
Operating temperature
Ts
Max. Soldering Temperature (10 sec)
260
°C
TJ
Junction Temperature
150
°C
2
KV
TDV
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
DC Electrical Characteristics
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated)
Symbol
Parameter
Min
Typ
Max
Unit
VIL
Input Low voltage
VSS - 0.3
-
0.8
V
VIH
Input High voltage
2.0
-
VDD + 0.3
V
IIL
Input Low current (inputs PD#, SRS)
-60.0
-
-20.0
µA
IIH
Input High current
-
-
1.0
µA
IXOL
XOUT Output low current @ 0.4V, VDD = 3.3V
-
3
-
mA
IXOH
XOUT Output high current @ 2.5V, VDD = 3.3V
-
3
-
mA
VOL
Output Low voltage VDD = 3.3V, IOL = 20mA
-
-
0.4
V
VOH
Output High voltage VDD = 3.3V, IOH = 20mA
2.5
-
-
V
ICC
Dynamic supply current normal mode
3.3V and 25pF probe loading
7.1
fIN - min
-
26.9
fIN - max
mA
IDD
Static supply current standby mode
-
4.5
-
mA
VDD
Operating Voltage
-
3.3
-
V
tON
Power up time (first locked clock cycle after power up)
-
0.18
-
mS
ZOUT
Clock Output impedance
-
50
-
Ω
AC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
Unit
fIN
Input Frequency
20
-
40
MHz
fOUT
Output Frequency
20
-
40
MHz
tLH*
Output Rise time
Measured from 0.8V to 2.0V
-
0.66
-
nS
tHL*
Output Fall time
Measured from 0.8V to 2.0V
-
0.65
-
nS
tJC
Jitter (Cycle to Cycle)
-200
-
200
pS
tD
Output Duty cycle
45
50
55
%
*tLH and tHL are measured into a capacitive load of 15pF
Notebook LCD Panel EMI Reduction IC
Notice: The information in this document is subject to change without notice.
3 of 7
ASM3P18S19B
August 2005
rev 2.1
Package Information
8-lead (150-mil) SOIC Package
H
E
D
A2
A
C
A1
D
θ
e
L
B
Dimensions
Symbol
Inches
Min
Max
Millimeters
Min
Max
A1
0.004
0.010
0.10
0.25
A
0.053
0.069
1.35
1.75
A2
0.049
0.059
1.25
1.50
B
0.012
0.020
0.31
0.51
C
0.007
0.01
0.18
0.25
D
0.193 BSC
4.9 BSC
E
0.154 BSC
3.91 BSC
e
0.050 BSC
1.27 BSC
H
0.236 BSC
6.00 BSC
L
0.016
0.050
0.41
1.27
θ
0°
8°
0°
8°
Note: Controlling dimensions are millimeters
SOIC – 0.074 grams unit weight
Notebook LCD Panel EMI Reduction IC
Notice: The information in this document is subject to change without notice.
4 of 7
ASM3P18S19B
August 2005
rev 2.1
8-lead Thin Shrunk Small Outline Package (4.40-MM Body)
H
E
D
A2
A
C
θ
e
A1
L
B
Dimensions
Symbol
Inches
Min
Millimeters
Max
A
Min
Max
0.043
1.10
A1
0.002
0.006
0.05
0.15
A2
0.033
0.037
0.85
0.95
B
0.008
0.012
0.19
0.30
C
0.004
0.008
0.09
0.20
D
0.114
0.122
2.90
3.10
E
0.169
0.177
4.30
4.50
e
0.026 BSC
0.65 BSC
H
0.252 BSC
6.40 BSC
L
0.020
0.028
0.50
0.70
θ
0°
8°
0°
8°
Note: Controlling dimensions are millimeters
TSSOP – 0.0325 grams unit weight
Notebook LCD Panel EMI Reduction IC
Notice: The information in this document is subject to change without notice.
5 of 7
ASM3P18S19B
August 2005
rev 2.1
Ordering Information
Part Number
Marking
Package Type
Temperature
ASM3P18S19BF-08TT
3P18S19BF
8-Pin TSSOP, TUBE, RoHS Compliant
Commercial
ASM3P18S19BF-08TR
3P18S19BF
8-Pin TSSOP, TAPE & REEL ,RoHS Compliant
Commercial
ASM3P18S19BF-08ST
3P18S19BF
8-Pin SOIC, TUBE, RoHS Compliant
Commercial
ASM3P18S19BF-08SR
3P18S19BF
8-Pin SOIC, TAPE & REEL, RoHS Compliant
Commercial
ASM3P18S19B-08TT
3P18S19B
8-Pin TSSOP, TUBE
Commercial
ASM3P18S19B-08TR
3P18S19B
8-Pin TSSOP, TAPE & REEL
Commercial
ASM3P18S19B-08ST
3P18S19B
8-Pin SOIC, TUBE
Commercial
ASM3P18S19B-08SR
3P18S19B
8-Pin SOIC, TAPE & REEL
Commercial
ASM3P18S19BG-08TT
3P18S19BG
8-Pin TSSOP, TUBE, Green
Commercial
ASM3P18S19BG-08TR
3P18S19BG
8-Pin TSSOP, TAPE & REEL, Green
Commercial
ASM3P18S19BG-08ST
3P18S19BG
8-Pin SOIC, TUBE, Green
Commercial
ASM3P18S19BG-08SR
3P18S19BG
8-Pin SOIC, TAPE & REEL, Green
Commercial
Products are available for industrial temperature range operation. Please contact factory for more information.
Device Ordering Information
A S M 3 P 1 8 S 1 9 B F - 0 8 T R
R = Tape & reel, T = Tube or Tray
O = SOT
S = SOIC
T = TSSOP
A = SSOP
V = TVSOP
B = BGA
Q = QFN
U = MSOP
E = TQFP
L = LQFP
U = MSOP
P = PDIP
D = QSOP
X = SC-70
DEVICE PIN COUNT
F = LEAD FREE AND RoHS COMPLIANT PART
G = GREEN PACKAGE
PART NUMBER
X= Automotive
I= Industrial
P or n/c = Commercial
(-40C to +125C) (-40C to +85C)
(0C to +70C)
1 = Reserved
2 = Non PLL based
3 = EMI Reduction
4 = DDR support products
5 = STD Zero Delay Buffer
6 = Power Management
7 = Power Management
8 = Power Management
9 = Hi Performance
0 = Reserved
ALLIANCE SEMICONDUCTOR MIXED SIGNAL PRODUCT
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.
Notebook LCD Panel EMI Reduction IC
Notice: The information in this document is subject to change without notice.
6 of 7
ASM3P18S19B
August 2005
rev 2.1
Alliance Semiconductor Corporation
2575 Augustine Drive,
Santa Clara, CA 95054
Tel# 408-855-4900
Fax: 408-855-4999
www.alsc.com
Copyright © Alliance Semiconductor
All Rights Reserved
Preliminary Information
Part Number: ASM3P18S19B
Document Version: v2.1
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, dated 11-11-2003
© Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are
trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their
respective companies. Alliance reserves the right to make changes to this document and its products at any time without
notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein
represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this
data at any time, without notice. If the product described herein is under development, significant changes to these
specifications are possible. The information in this product data sheet is intended to be general descriptive information for
potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or
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assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use.
Notebook LCD Panel EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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