TDK C3216X6S1H335M160AB Multilayer ceramic chip capacitor Datasheet

1 of 3
Creation Date : May 25, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C3216X6S1H335M160AB
TDK item description C3216X6S1H335MT****
Applications
Commercial Grade
Feature
General General (Up to 50V)
Series
C3216 [EIA 1206]
Status
Production (Not Recommended for New Design)
Size
Length(L)
3.20mm ±0.20mm
Width(W)
1.60mm ±0.20mm
Thickness(T)
1.60mm ±0.20mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
1.00mm Min.
2.10mm to 2.50mm(Flow Soldering)
Recommended Land Pattern (PA)
2.00mm to 2.40mm(Reflow Soldering)
1.10mm to 1.30mm(Flow Soldering)
Recommended Land Pattern (PB)
1.00mm to 1.20mm(Reflow Soldering)
1.00mm to 1.30mm(Flow Soldering)
Recommended Land Pattern (PC)
1.10mm to 1.60mm(Reflow Soldering)
Electrical Characteristics
Capacitance
3.3μF ±20%
Rated Voltage
50VDC
Temperature Characteristic
X6S(±22%)
Dissipation Factor (Max.)
5%
Insulation Resistance (Min.)
151MΩ
Other
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
No
Packing
Blister (Plastic)Taping [180mm Reel]
Package Quantity
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : May 25, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C3216X6S1H335M160AB
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
C3216X6S1H335M160AB
ESR
C3216X6S1H335M160AB
Capacitance
C3216X6S1H335M160AB
C3216X6S1H335M160AB
Temperature Characteristic
C3216X6S1H335M160AB(No Bias)
DC Bias Characteristic
C3216X6S1H335M160AB(DC Bias =
25V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Ripple Temperature Rising
C3216X6S1H335M160AB(100kHz)
C3216X6S1H335M160AB(500kHz)
C3216X6S1H335M160AB(1MHz)
Multilayer Ceramic Chip Capacitors
C3216X6S1H335M160AB
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : May 25, 2017 (GMT)
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