TI CD74HCT374 High speed cmos logic octal d-type flip-flop, three-state positive-edge triggered Datasheet

[ /Title
(CD74
HC374
,
CD74
HCT37
4,
CD74
HC574
,
CD74
HCT57
CD74HC374, CD74HCT374,
CD74HC574, CD74HCT574
Data sheet acquired from Harris Semiconductor
SCHS183
February 1998
High Speed CMOS Logic Octal D-Type Flip-Flop,
Three-State Positive-Edge Triggered
Features
Description
• Buffered Inputs
The Harris CD74HC374, CD74HCT374, CD74HC574 and
CD74HCT574 are Octal D-Type Flip-Flops with Three-State
Outputs and the capability to drive 15 LSTTL loads. The eight
edge-triggered flip-flops enter data into their registers on the
LOW to HIGH transition of clock (CP). The Output Enable
(OE) controls the three-state outputs and is independent of
the register operation. When Output Enable (OE) is HIGH the
outputs will be in the high impedance state. The 374 and 574
are identical in function and differ only in their pinout
arrangements.
• Common Three-State Output Enable Control
• Three-State Outputs
• Bus Line Driving Capability
• Typical Propagation Delay (Clock to Q) = 15ns at
VCC = 5V, CL = 15pF, TA = 25oC
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Ordering Information
• Wide Operating Temperature Range . . . -55oC to 125oC
PART NUMBER
• Balanced Propagation Delay and Transition Times
TEMP. RANGE (oC)
PKG.
NO.
PACKAGE
CD74HC374E
-55 to 125
20 Ld PDIP
E20.3
CD74HCT374E
-55 to 125
20 Ld PDIP
E20.3
CD74HCT574E
-55 to 125
20 Ld PDIP
E20.3
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
CD74HC574E
-55 to 125
20 Ld PDIP
E20.3
CD74HC574M
-55 to 125
20 Ld SOIC
M20.3
CD74HC374M
-55 to 125
20 Ld SOIC
M20.3
CD74HCT374M
-55 to 125
20 Ld SOIC
M20.3
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
CD74HCT574M
-55 to 125
20 Ld SOIC
M20.3
• Significant Power Reduction Compared to LSTTL
Logic ICs
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
2. Wafer and die for this part number is available which meets all
electrical specifications. Please contact your local sales office or
Harris customer service for ordering information.
Pinouts
CD74HC374, CD74HCT374
(PDIP, SOIC)
TOP VIEW
CD74HCT574
(PDIP, SOIC)
TOP VIEW
OE
1
20 VCC
OE
1
Q0
2
19 Q7
D0
2
19 Q0
D0
3
18 D7
D1
3
18 Q1
D1
4
17 D6
D2
4
17 Q2
Q1
5
16 Q6
D3
5
16 Q3
Q2
6
15 Q5
D4
6
15 Q4
D2
7
14 D5
D5
7
14 Q5
D3
8
13 D4
D6
8
13 Q6
Q3
9
12 Q4
D7
9
12 Q7
GND 10
11 CP
GND 10
11 CP
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
20 VCC
© Harris Corporation 1998
1
File Number
1663.1
CD74HC374, CD74HCT374, CD74HC574, CD74HCT574
Functional Diagram
D0
D1
D2
D
D
CP Q
CP Q
D3
D
CP Q
D4
D5
D6
D7
D
D
D
D
D
CP Q
CP Q
CP Q
CP Q
CP Q
CP
OE
Q0
Q1
Q2
Q3
Q4
Q5
TRUTH TABLE
INPUTS
OUTPUT
OE
CP
Dn
Qn
L
↑
H
H
L
↑
L
L
L
L
X
Q0
H
X
X
Z
NOTE:
H = High Level (Steady State)
L = Low Level (Steady State)
X = Don’t Care
↑ = Transition from Low to High Level
Q0 = The level of Q before the indicated steady-state input conditions
were established
Z = High Impedance State
2
Q6
Q7
CD74HC374, CD74HCT374, CD74HC574, CD74HCT574
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, IO
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±35mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Thermal Resistance (Typical, Note 3)
θJA (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
125
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
120
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
VIH
-
-
2
1.5
-
-
1.5
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
-
1.5
-
V
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
II
VCC or
GND
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-
-
-
-
-
-
-
-
-
V
-6
4.5
3.98
-
-
3.84
-
3.7
-
V
-7.8
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
-
-
-
-
-
-
-
-
-
V
6
4.5
-
-
0.26
-
0.33
-
0.4
V
7.8
6
-
-
0.26
-
0.33
-
0.4
V
-
6
-
-
±0.1
-
±1
-
±1
µA
3
CD74HC374, CD74HCT374, CD74HC574, CD74HCT574
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
PARAMETER
Quiescent Device
Current
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
ICC
VCC or
GND
0
6
-
-
8
-
80
-
160
µA
-
6
-
-
±0.5
-
±5.0
-
±10
µA
Three- State Leakage VIL or VIH VO = VCC
Current
or GND
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
HCT TYPES
High Level Input
Voltage
VIH
-
-
4.5 to
5.5
2
-
-
2
-
2
-
V
Low Level Input
Voltage
VIL
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
High Level Output
Voltage
CMOS Loads
VOH
VIH or VIL
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-6
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
6
4.5
-
-
0.26
-
0.33
-
0.4
V
±0.1
-
±1
-
±1
µA
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
II
VCC and
GND
0
5.5
-
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
-
6
-
-
±0.5
-
±5.0
-
±10
µA
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
Three- State Leakage VIL or VIH VO = VCC
Current
or GND
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
∆ICC
VCC
-2.1
NOTE: For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
UNIT LOADS
INPUT
HCT374
HCT574
D0 - D7
0.3
0.4
CP
0.9
0.75
OE
1.3
0.6
NOTE: Unit load is ∆ICC limit specific in DC Electrical Specifications
Table, e.g., 360µA max. at 25oC.
4
CD74HC374, CD74HCT374, CD74HC574, CD74HCT574
Prerequisite for Switching Specifications
25oC
PARAMETER
-40oC TO 85oC
-55oC TO 125oC
SYMBOL
VCC (V)
MIN
TYP
MAX
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
fMAX
2
6
-
-
5
-
-
4
-
-
MHz
4.5
30
-
-
25
-
-
20
-
-
MHz
6
35
-
-
29
-
-
23
-
-
MHz
2
80
-
-
100
-
-
120
-
-
ns
4.5
16
-
-
20
-
-
24
-
-
ns
6
14
-
-
17
-
-
20
-
-
ns
2
60
-
-
75
-
-
90
-
-
ns
4.5
12
-
-
15
-
-
18
-
-
ns
6
10
-
-
13
-
-
15
-
-
ns
2
5
-
-
5
-
-
5
-
-
ns
4.5
5
-
-
5
-
-
5
-
-
ns
6
5
-
-
5
-
-
5
-
-
ns
fMAX
4.5
30
-
-
25
-
-
20
-
-
MHz
Clock Pulse Width
tW
4.5
16
-
-
20
-
-
24
-
-
ns
Setup Time
Data to Clock
tSU
4.5
12
-
-
15
-
-
18
-
-
ns
Hold Time
Data to Clock
tH
4.5
5
-
-
5
-
-
5
-
-
ns
HC TYPES
Maximum Clock
Frequency
Clock Pulse Width
Setup Time
Data to Clock
Hold Time
Data to Clock
tW
tSU
tH
HCT TYPES
Maximum Clock
Frequency
Switching Specifications
PARAMETER
CL = 50pF, Input tr, tf = 6ns
SYMBOL
TEST
CONDITIONS
tPLH, tPHL
CL = 50pF
-40oC TO
85oC
25oC
-55oC TO
125oC
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
165
-
205
-
250
ns
4.5
-
-
33
-
41
-
50
ns
CL = 15pF
5
-
15
-
-
-
-
-
ns
CL = 50pF
6
-
-
28
-
35
-
43
ns
CL = 50pF
2
-
-
135
-
170
-
205
ns
4.5
-
-
27
-
34
-
41
ns
CL = 15pF
5
-
11
-
-
-
-
-
ns
CL = 50pF
6
-
-
23
-
29
-
35
ns
HC TYPES
Propagation Delay
Clock to Output
Output Disable to Q
tPLZ, tPHZ
5
CD74HC374, CD74HCT374, CD74HC574, CD74HCT574
Switching Specifications
CL = 50pF, Input tr, tf = 6ns (Continued)
-40oC TO
85oC
25oC
-55oC TO
125oC
PARAMETER
SYMBOL
TEST
CONDITIONS
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
Output Enable to Q
tPZL, tPZH
CL = 50pF
2
-
-
150
-
190
-
225
ns
4.5
-
-
30
-
38
-
45
ns
CL = 15pF
5
-
12
-
-
-
-
-
ns
CL = 50pF
6
-
-
26
-
33
-
38
ns
fMAX
CL = 15pF
5
-
60
-
-
-
-
-
MHz
tTHL, tTLH
CL = 50pF
2
-
-
60
-
75
-
90
ns
4.5
-
-
12
-
15
-
18
ns
6
-
-
10
-
13
-
15
ns
Maximum Clock Frequency
Output Transition Time
Input Capacitance
CI
CL = 50pF
-
10
-
10
-
10
-
10
pF
Three-State Output
Capacitance
CO
-
-
20
-
20
-
20
-
20
pF
Power Dissipation Capacitance
(Notes 4, 5)
CPD
CL = 15pF
5
-
39
-
-
-
-
-
pF
CL = 50pF
4.5
-
-
33
-
41
-
50
ns
CL = 15pF
5
-
15
-
-
-
-
-
ns
CL = 50pF
4.5
-
-
28
-
35
-
42
ns
CL = 15pF
5
-
11
-
-
-
-
-
ns
CL = 50pF
4.5
-
-
30
-
38
-
45
ns
CL = 15pF
5
-
12
-
-
-
-
-
ns
fMAX
CL = 15pF
5
-
60
-
-
-
-
-
MHz
tTLH, tTHL
CL = 50pF
4.5
-
-
12
-
15
-
18
ns
Input Capacitance
CI
CL = 50pF
-
10
-
10
-
10
-
10
pF
Three-State Output
Capacitance
CO
-
-
20
-
20
-
20
-
20
pF
Power Dissipation Capacitance
(Notes 4, 5)
CPD
CL = 15pF
5
-
47
-
-
-
-
-
pF
HCT TYPES
Propagation Delay
tPHL, tPLH
Clock to Output
Output Disable to Q
Output Enable to Q
Maximum Clock Frequency
Output Transition Time
tPLZ, tPHZ
tPZL, tPZH
NOTES:
4. CPD is used to determine the dynamic power consumption, per package.
5. PD = CPD VCC2 fi + ∑ VCC2 fO CL where fi = Input Frequency, fO = Output Frequency, CL = Output Load Capacitance, VCC = Supply
Voltage.
6
CD74HC374, CD74HCT374, CD74HC574, CD74HCT574
Test Circuits and Waveforms
tWL + tWH =
tfCL
trCL
50%
10%
10%
tf = 6ns
tr = 6ns
tTLH
90%
INVERTING
OUTPUT
tPHL
FIGURE 3. HC TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
tPLH
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
trCL
tfCL
VCC
tfCL
GND
1.3V
0.3V
GND
tH(H)
tH(L)
VCC
DATA
INPUT
3V
2.7V
CLOCK
INPUT
50%
tH(H)
tTLH
1.3V
10%
tPLH
10%
GND
tTHL
90%
50%
10%
90%
3V
2.7V
1.3V
0.3V
GND
tTHL
trCL
tWH
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
INPUT
INVERTING
OUTPUT
GND
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
VCC
90%
50%
10%
1.3V
1.3V
tWL
tf = 6ns
tPHL
1.3V
0.3V
tWH
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
INPUT
2.7V
0.3V
GND
tr = 6ns
DATA
INPUT
50%
tH(L)
3V
1.3V
1.3V
1.3V
GND
tSU(H)
tSU(H)
tSU(L)
tTLH
90%
OUTPUT
tTHL
90%
50%
10%
tTLH
90%
1.3V
OUTPUT
tREM
3V
SET, RESET
OR PRESET
GND
tTHL
1.3V
10%
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
tPHL
1.3V
GND
IC
CL
50pF
GND
90%
tPLH
50%
IC
tSU(L)
tPHL
tPLH
I
fCL
3V
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
tREM
VCC
SET, RESET
OR PRESET
tfCL = 6ns
CLOCK
50%
50%
tWL
CLOCK
INPUT
tWL + tWH =
trCL = 6ns
VCC
90%
CLOCK
I
fCL
CL
50pF
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
7
CD74HC374, CD74HCT374, CD74HC574, CD74HCT574
Test Circuits and Waveforms
6ns
(Continued)
6ns
OUTPUT
DISABLE
90%
50%
10%
OUTPUTS
ENABLED
2.7
1.3
OUTPUT HIGH
TO OFF
50%
OUTPUTS
DISABLED
FIGURE 7. HC THREE-STATE PROPAGATION DELAY
WAVEFORM
OTHER
INPUTS
TIED HIGH
OR LOW
OUTPUT
DISABLE
IC WITH
THREESTATE
OUTPUT
GND
1.3V
tPZH
90%
OUTPUTS
ENABLED
OUTPUTS
ENABLED
0.3
10%
tPHZ
tPZH
90%
3V
tPZL
tPLZ
OUTPUT LOW
TO OFF
50%
OUTPUT HIGH
TO OFF
6ns
GND
10%
tPHZ
tf
OUTPUT
DISABLE
tPZL
tPLZ
OUTPUT LOW
TO OFF
6ns
tr
VCC
1.3V
OUTPUTS
DISABLED
OUTPUTS
ENABLED
FIGURE 8. HCT THREE-STATE PROPAGATION DELAY
WAVEFORM
OUTPUT
RL = 1kΩ
CL
50pF
VCC FOR tPLZ AND tPZL
GND FOR tPHZ AND tPZH
NOTE: Open drain waveforms tPLZ and tPZL are the same as those for three-state shown on the left. The test circuit is Output RL = 1kΩ to
VCC, CL = 50pF.
FIGURE 9. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
8
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright  1999, Texas Instruments Incorporated
Similar pages