Altera EP1SGX40CF1020I7ES Section i. stratix gx device family data sheet Datasheet

Section I. Stratix GX
Device Family Data Sheet
This section provides the data sheet specifications for Stratix® GX
devices. It contains feature definitions of the internal architecture,
configuration information, testing information, DC operating conditions,
and AC timing parameters.
This section includes the following chapters:
Altera Corporation
■
Chapter 1, Introduction to the Stratix GX Device Data Sheet
■
Chapter 2, Stratix GX Transceivers
■
Chapter 3, Source-Synchronous Signaling With DPA
■
Chapter 4, Stratix GX Architecture
■
Chapter 5, Configuration & Testing
■
Chapter 6, DC & Switching Characteristics
■
Chapter 7, Reference & Ordering Information
Section I–1
Preliminary
Stratix GX Device Family Data Sheet
Revision History
Chapter(s)
Stratix GX Device Handbook, Volume 1
The table below shows the revision history for Chapters 1 through 7.
Date / Version
Changes Made
1
February 2005,
v1.0
Initial Release.
2
June 2006, v1.1
●
●
●
●
Updated “Serial Loopback” section.
Updated Figures 2–1 through 2–3.
Updated Figure 2–13.
Updated Figures 2–26 and 2–27.
February 2005,
v1.0
Initial Release.
3
August 2005,
v1.1
Added Note (3) to Figure 3-7.
4
February 2005,
v1.0
Initial Release.
5
February 2005,
v1.0
Initial Release.
6
June 2006, v1.2
●
●
●
●
●
●
●
Comments
Updated “Operating Conditions” section.
Updated Table 6–4.
Updated note 3 in Table 6–6.
Added note 12 in Table 6–7.
Updated Figure 6–1.
Added Figure 6–2.
Updated Tables 6–13 through 6–16.
●
●
●
●
7
Section I–2
Preliminary
August 2005,
v1.1
Updated Tables 6-7 and 6-50.
February 2005,
v1.0
Initial Release.
Changed VO D to VI D for
receiver input voltage and
refclkb input voltage in
Table 6–4.
Changed value for
undershoot during transition
from -0.5 V to -2.0 V in note 3
of Table 6–6.
Changed value of VO C M from
mV to V in Table 6–15.
Changed unit value of W to
Ω..
Altera Corporation
1. Introduction to the
Stratix GX Device Data Sheet
SGX51001-1.0
Overview
The Stratix® GX family of devices is Altera’s second FPGA family to
combine high-speed serial transceivers with a scalable, high-performance
logic array. Stratix GX devices include 4 to 20 high-speed transceiver
channels, each incorporating clock data recovery (CDR) technology and
embedded SERDES capability at data rates of up to 3.1875 gigabits per
second (Gbps). These transceivers are grouped by four-channel
transceiver blocks, and are designed for low power consumption and
small die size. The Stratix GX FPGA technology is built upon the Stratix
architecture, and offers a 1.5-V logic array with unmatched performance,
flexibility, and time-to-market capabilities. This scalable,
high-performance architecture makes Stratix GX devices ideal for
high-speed backplane interface, chip-to-chip, and communications
protocol-bridging applications.
Features
■
Altera Corporation
February 2005
Transceiver block features are as follows:
●
High-speed serial transceiver channels with CDR provides
500-megabits per second (Mbps) to 3.1875-Gbps full-duplex
operation
●
Devices are available with 4, 8, 16, or 20 high-speed serial
transceiver channels providing up to 127.5 Gbps of full-duplex
serial bandwidth
●
Support for transceiver-based protocols, including 10 Gigabit
Ethernet attachment unit interface (XAUI), Gigabit Ethernet
(GigE), and SONET/SDH
●
Compatible with PCI Express, SMPTE 292M, Fibre Channel, and
Serial RapidIO I/O standards
●
Programmable differential output voltage (VOD), pre-emphasis,
and equalization settings for improved signal integrity
●
Individual transmitter and receiver channel power-down
capability implemented automatically by the Quartus® II
software for reduced power consumption during non-operation
●
Programmable transceiver-to-FPGA interface with support for
8-, 10-, 16-, and 20-bit wide data paths
●
1.5-V pseudo current mode logic (PCML) for 500 Mbps to
3.1875 Gbps
●
Support for LVDS, LVPECL, and 3.3-V PCML on reference
clocks and receiver input pins (AC-coupled)
●
Built-in self test (BIST)
●
Hot insertion/removal protection circuitry
1–1
Features
●
●
●
●
●
■
Pattern detector and word aligner supports programmable
patterns
8B/10B encoder/decoder performs 8- to 10-bit encoding and 10to 8-bit decoding
Rate matcher compliant with IEEE 802.3-2002 for GigE mode
and with IEEE 802-3ae for XAUI mode
Channel bonding compliant with IEEE 802.3ae (for XAUI mode
only)
Device can bypass some transceiver block features if necessary
FPGA features are as follows:
●
10,570 to 41,250 logic elements (LEs); see Table 1–1
●
Up to 3,423,744 RAM bits (427,968 bytes) available without
reducing logic resources
●
TriMatrix™ memory consisting of three RAM block sizes to
implement true dual-port memory and first-in-out (FIFO)
buffers
●
Up to 16 global clock networks with up to 22 regional clock
networks per device region
●
High-speed DSP blocks provide dedicated implementation of
multipliers (faster than 300 MHz), multiply-accumulate
functions, and finite impulse response (FIR) filters
●
Up to eight general usage phase-locked loops (four enhanced
PLLs and four fast PLLs) per device provide spread spectrum,
programmable bandwidth, clock switchover, real-time PLL
reconfiguration, and advanced multiplication and phase
shifting
●
Support for numerous single-ended and differential I/O
standards
●
High-speed source-synchronous differential I/O support on up
to 45 channels for 1-Gbps performance
●
Support for source-synchronous bus standards, including
10-Gigabit Ethernet XSBI, Parallel RapidIO, UTOPIA IV,
Network Packet Streaming Interface (NPSI), HyperTransportTM
technology, SPI-4 Phase 2 (POS-PHY Level 4), and SFI-4
●
Support for high-speed external memory, including zero bus
turnaround (ZBT) SRAM, quad data rate (QDR and QDRII)
SRAM, double data rate (DDR) SDRAM, DDR fast cycle RAM
(FCRAM), and single data rate (SDR) SDRAM
●
Support for multiple intellectual property megafunctions from
Altera® MegaCore® functions and Altera Megafunction Partners
Program (AMPPSM) megafunctions
●
Support for remote configuration updates
●
Dynamic phase alignment on LVDS receiver channels
1–2
Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Introduction to the Stratix GX Device Data Sheet
Table 1–1. Stratix GX Device Features
EP1SGX25C
EP1SGX25D
EP1SGX25F
EP1SGX40D
EP1SGX40G
10,570
25,660
41,250
4, 8
4, 8, 16
8, 20
EP1SGX10C
EP1SGX10D
Feature
LEs
Transceiver channels
Source-synchronous channels
22
39
45
M512 RAM blocks (32 × 18 bits)
94
224
384
M4K RAM blocks (128 × 36 bits)
60
138
183
M-RAM blocks (4K ×144 bits)
1
2
4
Total RAM bits
920,448
1,944,576
3,423,744
Digital signal processing (DSP) blocks
6
10
14
Embedded multipliers (1)
48
80
112
PLLs
4
4
8
Note to Table 1–1:
(1)
This parameter lists the total number of 9- × 9-bit multipliers for each device. For the total number of 18- × 18-bit
multipliers per device, divide the total number of 9- × 9-bit multipliers by 2. For the total number of 36- × 36-bit
multipliers per device, decide the total number of 9- × 9-bit multipliers by 8.
Stratix GX devices are available in space-saving FineLine BGA® packages
(refer to Tables 1–2 and 1–3), and in multiple speed grades (refer to
Table 1–4). Stratix GX devices support vertical migration within the same
package (that is, you can migrate between the EP1SGX10C and
EP1SGX25C devices in the 672-pin FineLine BGA package). See the
Stratix GX device pin tables for more information. Vertical migration
means that you can migrate to devices whose dedicated pins,
configuration pins, and power pins are the same for a given package
across device densities. For I/O pin migration across densities, you must
cross-reference the available I/O pins using the device pin-outs for all
planned densities of a given package type, to identify which I/O pins it
is possible to migrate. The Quartus II software can automatically cross
reference and place all pins for migration when given a device migration
list.
Table 1–2. Stratix GX Package Options & I/O Pin Counts (Part 1
of 2)
Note (1)
Device
Altera Corporation
February 2005
672-Pin FineLine BGA
EP1SGX10C
362
EP1SGX10D
362
EP1SGX25C
455
1,020-Pin FineLine BGA
1–3
Stratix GX Device Handbook, Volume 1
High-Speed I/O Interface Functional Description
Table 1–2. Stratix GX Package Options & I/O Pin Counts (Part 2
of 2)
Note (1)
Device
672-Pin FineLine BGA
1,020-Pin FineLine BGA
455
607
EP1SGX25D
EP1SGX25F
607
EP1SGX40D
624
EP1SGX40G
624
Note to Table 1–2:
(1)
The number of I/O pins listed for each package includes dedicated clock pins and
dedicated fast I/O pins. However, these numbers do not include high-speed or
clock reference pins for high-speed I/O standards.
Table 1–3. Stratix GX FineLine BGA Package Sizes
Dimension
672 Pin
1,020 Pin
Pitch (mm)
1.00
1.00
(mm2)
729
1,089
27 × 27
33 × 33
Area
Length × width (mm × mm)
Table 1–4. Stratix GX Device Speed Grades
Device
EP1SGX10
-5, -6, -7
EP1SGX25
-5, -6, -7
EP1SGX40
High-Speed I/O
Interface
Functional
Description
672-Pin FineLine BGA
1,020-pin FineLine BGA
-5, -6, -7
-5, -6, -7
The Stratix GX device family supports high-speed serial transceiver
blocks with CDR circuitry as well as source-synchronous interfaces. The
channels on the right side of the device use an embedded circuit
dedicated for receiving and transmitting high-speed serial data streams
to and from the system board. These channels are clustered in a
four-channel serial transceiver building block and deliver high-speed
bidirectional point-to-point data transmissions to provide up to
3.1875 Gbps of full-duplex data transmission per channel. The channels
on the left side of the device support source-synchronous data transfers
at up to 1 Gbps using LVDS, LVPECL, 3.3-V PCML, or HyperTransport
technology I/O standards. Figure 1–1 shows the Stratix GX I/O blocks.
The differential source-synchronous serial interface and the high-speed
serial interface are described in the Stratix GX Transceivers chapter of the
Stratix GX Device Handbook, Volume 1.
1–4
Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Introduction to the Stratix GX Device Data Sheet
Figure 1–1. Stratix GX I/O Blocks
DQST9
PLL7
DQST8
DQST7
DQST6
Note (1)
DQST5
9
DQST4
PLL11
DQST3
DQST2
DQST1
DQST0
VREF1B4 VREF2B4 VREF3B4 VREF4B4 VREF5B4
10
Bank 4
I/O Bank 13 (5)
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (3)
Bank 2
VREF1B2 VREF2B2 VREF3B2 VREF4B2
Bank 3
(4)
I/O Banks 3, 4, 9 & 10 Support
All Single-Ended I/O Standards (2)
I/O Banks 1 and 2 Support All
Single-Ended I/O Standards Except
Differential HSTL Output Clocks,
Differential SSTL-2 Output Clocks,
HSTL Class II, GTL, SSTL-18 Class II,
PCI, PCI-X, and AGP 1×/2×
PLL1
Bank 1
PLL2
VREF1B1 VREF2B1 VREF3B1 VREF4B1
PLL5
VREF1B3 VREF2B3 VREF3B3 VREF4B3 VREF5B3
I/O Bank 17 (5)
1.5-V PCML (5)
I/O Bank 16 (5)
I/O Banks 7, 8, 11 & 12 Support
All Single-Ended I/O Standards (2)
(4)
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (3)
I/O Bank 15 (5)
Bank 8
PLL8
I/O Bank 14 (5)
11
VREF5B8 VREF4B8 VREF3B8 VREF2B8 VREF1B8
DQSB9
DQSB8
DQSB7
DQSB6
DQSB5
12
PLL6
Bank 7
PLL12
VREF5B7 VREF4B7 VREF3B7 VREF2B7 VREF1B7
DQSB4
DQSB3
DQSB2
DQSB1
DQSB0
Notes to Figure 1–1:
(1)
(2)
(3)
(4)
(5)
Figure 1–1 is a top view of the Stratix GX silicon die.
Banks 9 through 12 are enhanced PLL external clock output banks.
If the high-speed differential I/O pins are not used for high-speed differential signaling, they can support all of the
I/O standards except HSTL class I and II, GTL, SSTL-18 Class II, PCI, PCI-X, and AGP 1×/2×.
For guidelines for placing single-ended I/O pads next to differential I/O pads, see the Selectable I/O Standards in
Stratix & Stratix GX Devices chapter of the Stratix GX Device Handbook, Volume 2.
These I/O banks in Stratix GX devices also support the LVDS, LVPECL, and 3.3-V PCML I/O standards on
reference clocks and receiver input pins (AC coupled).
FPGA Functional
Description
Altera Corporation
February 2005
Stratix GX devices contain a two-dimensional row- and column-based
architecture to implement custom logic. A series of column and row
interconnects of varying length and speed provide signal interconnects
between logic array blocks (LABs), memory block structures, and DSP
blocks.
1–5
Stratix GX Device Handbook, Volume 1
FPGA Functional Description
The logic array consists of LABs, with 10 logic elements (LEs) in each
LAB. An LE is a small unit of logic providing efficient implementation of
user logic functions. LABs are grouped into rows and columns across the
device.
M512 RAM blocks are simple dual-port memory blocks with 512 bits plus
parity (576 bits). These blocks provide dedicated simple dual-port or
single-port memory up to 18-bits wide at up to 318 MHz. M512 blocks are
grouped into columns across the device in between certain LABs.
M4K RAM blocks are true dual-port memory blocks with 4K bits plus
parity (4,608 bits). These blocks provide dedicated true dual-port, simple
dual-port, or single-port memory up to 36-bits wide at up to 291 MHz.
These blocks are grouped into columns across the device in between
certain LABs.
M-RAM blocks are true dual-port memory blocks with 512K bits plus
parity (589,824 bits). These blocks provide dedicated true dual-port,
simple dual-port, or single-port memory up to 144-bits wide at up to
269 MHz. Several M-RAM blocks are located individually or in pairs
within the device’s logic array.
Digital signal processing (DSP) blocks can implement up to either eight
full-precision 9 × 9-bit multipliers, four full-precision 18 × 18-bit
multipliers, or one full-precision 36 × 36-bit multiplier with add or
subtract features. These blocks also contain 18-bit input shift registers for
digital signal processing applications, including FIR and infinite impulse
response (IIR) filters. DSP blocks are grouped into two columns in each
device.
Each Stratix GX device I/O pin is fed by an I/O element (IOE) located at
the end of LAB rows and columns around the periphery of the device.
I/O pins support numerous single-ended and differential I/O standards.
Each IOE contains a bidirectional I/O buffer and six registers for
registering input, output, and output-enable signals. When used with
dedicated clocks, these registers provide exceptional performance and
interface support with external memory devices such as DDR SDRAM,
FCRAM, ZBT, and QDR SRAM devices.
High-speed serial interface channels support transfers at up to 840 Mbps
using LVDS, LVPECL, 3.3-V PCML, or HyperTransport technology I/O
standards.
Figure 1–2 shows an overview of the Stratix GX device.
1–6
Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Introduction to the Stratix GX Device Data Sheet
Figure 1–2. Stratix GX Block Diagram
M512 RAM Blocks for
Dual-Port Memory, Shift
Registers, & FIFO Buffers
DSP Blocks for
Multiplication and Full
Implementation of FIR Filters
M4K RAM Blocks
for True Dual-Port
Memory & Other Embedded
Memory Functions
IOEs Support DDR, PCI, GTL+, SSTL-3,
SSTL-2, HSTL, LVDS, LVPECL, PCML,
HyperTransport & other I/O Standards
IOEs
IOEs
IOEs
IOEs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
IOEs
LABs
LABs
LABs
LABs
M-RAM Block
LABs
LABs
DSP
Block
The number of M512 RAM, M4K RAM, and DSP blocks varies by device
along with row and column numbers and M-RAM blocks. Table 1–5 lists
the resources available in Stratix GX devices.
Table 1–5. Stratix GX Device Resources
Device
M512 RAM
M4K RAM
Columns/Blocks Columns/Blocks
M-RAM
Blocks
DSP Block
Columns/Blocks
LAB
Columns
LAB Rows
EP1SGX10
4 / 94
2 / 60
1
2/6
40
30
EP1SGX25
6 / 224
3 / 138
2
2 / 10
62
46
EP1SGX40
8 / 384
3 / 183
4
2 / 14
77
61
Altera Corporation
February 2005
1–7
Stratix GX Device Handbook, Volume 1
FPGA Functional Description
1–8
Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
2. Stratix GX Transceivers
SGX51002-1.1
Transceiver
Blocks
Stratix® GX devices incorporate dedicated embedded circuitry on the
right side of the device, which contains up to 20 high-speed 3.1875-Gbps
serial transceiver channels. Each Stratix GX transceiver block contains
four full-duplex channels and supporting logic to transmit and receive
high-speed serial data streams. The transceiver block uses the channels to
deliver bidirectional point-to-point data transmissions with up to
3.1875 Gbps of data transition per channel.
There are up to 20 transceiver channels available on a single Stratix GX
device. Table 2–1 shows the number of transceiver channels available on
each Stratix GX device.
Table 2–1. Stratix GX Transceiver Channels
Device
Number of Transceiver Channels
EP1SGX10C
4
EP1SGX10D
8
EP1SGX25C
4
EP1SGX25D
8
EP1SGX25F
16
EP1SGX40D
8
EP1SGX40G
20
Figure 2–1 shows the elements of the transceiver block, including the four
channels, supporting logic, and I/O buffers. Each transceiver channel
consists of a receiver and transmitter. The supporting logic contains a
transmitter PLL to generate a high-speed clock used by the four
transmitters. The receiver PLL within each transceiver channel generates
the receiver reference clocks. The supporting logic also contains state
machines to manage rate matching for XAUI and GIGE applications, in
addition to channel bonding for XAUI applications.
Altera Corporation
June 2006
2–1
Figure 2–1. Stratix GX Transceiver Block
Note (1)
Receiver Channel 0
PLD
Logic
Array
Receiver Pins
Channel 0
Transmitter Channel 0
Transmitter Pins
Receiver Channel 1
PLD
Logic
Array
Receiver Pins
Channel 1
Transmitter Channel 1
PLD
Logic
Array
XAUI
Receiver
State
Machine
XAUI
Transmitter
State
Machine
Channel
Aligner
State
Machine
Receiver Channel 2
PLD
Logic
Array
Transmitter
PLL
PLD
Logic
Array
(2)
Receiver Pins
Channel 2
Transmitter Channel 2
Receiver Channel 3
PLD
Logic
Array
Transmitter Pins
Transmitter Pins
Receiver Pins
Channel 3
Transmitter Channel 3
Transmitter Pins
Notes to Figure 2–1:
(1)
(2)
Each receiver channel has its own PLL and CRU, which are not shown in this diagram. For more information, refer
to the section “Receiver Path” on page 2–13.
For possible transmitter PLL clock inputs, refer to the section “Transmitter Path” on page 2–5.
2–2
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
Stratix GX Transceivers
Each Stratix GX transceiver channel consists of a transmitter and receiver.
The transmitter contains the following:
■
■
■
■
■
■
Transmitter PLL
Transmitter phase compensation FIFO buffer
Byte serializer
8B/10B encoder
Serializer (parallel to serial converter)
Transmitter output buffer
The receiver contains the following:
■
■
■
■
■
■
■
Input buffer
Clock recovery unit (CRU)
Deserializer
Pattern detector and word aligner
Rate matcher and channel aligner
8B/10B decoder
Receiver logic array interface
You can set all the Stratix GX transceiver functions through the Quartus II
software. You can set programmable pre-emphasis, programmable
equalizer, and programmable VOD dynamically as well. Each Stratix GX
transceiver channel is also capable of BIST generation and verification in
addition to various loopback modes. Figure 2–2 shows the block diagram
for the Stratix GX transceiver channel.
Stratix GX transceivers provide physical coding sublayer (PCS) and
physical media attachment (PMA) implementation for protocols such as
10-gigabit XAUI and GIGE. The PCS portion of the transceiver consists of
the logic array interface, 8B/10B encoder/decoder, pattern detector, word
aligner, rate matcher, channel aligner, and the BIST and pseudo-random
binary sequence pattern generator/verifier. The PMA portion of the
transceiver consists of the serializer/deserializer, the CRU, and the I/O
buffers.
Altera Corporation
June 2006
2–3
Stratix GX Device Handbook, Volume 1
(1)
2–4
Stratix GX Device Handbook, Volume 1
To Channels 1-3
Transmitter
Receiver
Reference
Clock
Receiver
Channel 0
Transmitter
Reference
Clock
Transmitter
PLL
Serializer
Receiver
PLL
Clock
Recovery
Unit
Deserializer
Word
Aligner
Channel
Aligner
8B/10B
Encoder
Rate
Matcher
8B/10B
Decoder
Byte
Serializer
Byte
Deserializer
Phase
Compensation
FIFO
Phase
Compensation
FIFO
Figure 2–2. Stratix GX Transceiver ChanneL
Note (1)
Note to Figure 2–2:
There are four transceiver channels in a transceiver block.
Altera Corporation
June 2006
Stratix GX Transceivers
Transmitter Path
This section describes the data path through the Stratix GX transmitter
(see Figure 2–2). Data travels through the Stratix GX transmitter via the
following modules:
■
■
■
■
■
■
Transmitter PLL
Transmitter phase compensation FIFO buffer
Byte serializer
8B/10B encoder
Serializer (parallel to serial converter)
Transmitter output buffer
Transmitter PLL
Each transceiver block has one transmitter PLL, which receives the
reference clock and generates the following signals:
■
■
■
High-speed serial clock used by the serializer
Slow-speed reference clock used by the receiver
Slow-speed clock used by the logic array (divisible by two for
double-width mode)
The INCLK clock is the input into the transmitter PLL. There is one INCLK
clock per transceiver block. This clock can be fed by either the REFCLKB
pin, PLD routing, or the inter-transceiver routing line. See the section
“Stratix GX Clocking” on page 2–30 for more information about the intertransceiver lines.
The transmitter PLL in each transceiver block clocks the circuits in the
transmit path. The transmitter PLL is also used to train the receiver PLL.
If no transmit channels are used in the transceiver block, the transmitter
PLL can be turned off. Figure 2–3 is a block diagram of the transmitter
PLL.
Altera Corporation
June 2006
2–5
Stratix GX Device Handbook, Volume 1
Low Speed Clock
Note (1)
Up
Down
Dedicated
Local
REFCLKB
Inter Quad Routing (IQ1)
Inter Quad Routing (IQ0)
Global Clks, IO Bus, Gen Routing
÷2
INCLK
PFD
÷m
Charge Pump +
Loop Filter
VCO
Clock
Driver
High Speed Clock
Figure 2–3. Transmitter PLL Block Diagram
Note to Figure 2–3:
(1)
The divider in the PLL divides by 4, 8, 10, 16, or 20.
2–6
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
Stratix GX Transceivers
The transmitter PLL can support up to 3.1875 Mbps. The input clock
frequency for –5 and –6 speed grade devices is limited to 650 MHz if you
use the REFCLKB pin or to 325 MHz if you use the other clock routing
resources. For –7 speed grade devices, the maximum input clock
frequency is 312.5 MHz with the REFCLKB pin, and the maximum is
156.25 MHz for all other clock routing resources. An optional
PLL_LOCKED port is available to indicate whether the transmitter PLL is
locked to the reference clock. The transmitter PLL has a programmable
loop bandwidth that can be set to low or high. The loop bandwidth
parameter can be statically set in the Quartus II software.
Table 2–2 lists the adjustable parameters in the transmitter PLL.
Table 2–2. Transmitter PLL Specifications
Parameter
Specifications
Input reference frequency range
25 MHz to 650 MHz
Data rate support
500 Mbps to 3.1875 Gbps
Multiplication factor (W)
2, 4, 5, 8, 10, 16, or 20 (1)
Bandwidth
Low, high
Note to Table 2–2:
(1)
Multiplication factors 2 and 5 can only be achieved with the use of the pre-divider
on the REFCLKB pin.
Transmitter Phase Compensation FIFO Buffer
The transmitter phase compensation FIFO buffer resides in the
transceiver block at the PLD boundary. This FIFO buffer compensates for
the phase differences between the transmitter reference clock (inclk)
and the PLD interface clock (tx_coreclk). The phase difference
between the two clocks must be less than 360° . The PLD interface clock
must also be frequency locked to the transmitter reference clock. The
phase compensation FIFO buffer is four words deep and cannot be
bypassed.
Byte Serializer
The byte serializer takes double-width words (16 or 20 bits) from the PLD
interface and converts them to a single width word (8 or 10 bits) for use
in the transceiver. The transmit data path after the byte serializer is single
width (8 or 10 bits). The byte serializer is bypassed when single width
mode (8 or 10 bits) is used at the PLD interface.
Altera Corporation
June 2006
2–7
Stratix GX Device Handbook, Volume 1
8B/10B Encoder
The 8B/10B encoder translates 8-bit wide data + 1 control enable bit into
a 10-bit encoded data. The encoded data has a maximum run length of 5.
The 8B/10B encoder can be bypassed. Figure 2–4 diagrams the encoding
process.
Figure 2–4. Encoding Process
7
6
5
4
3
2
1
0
H
G
F
E
D
C
B
A
+
ctrl
8b-10b conversion
j
h
g
f
i
e
d
c
b
a
9
8
7
6
5
4
3
2
1
0
MSB sent last
LSB sent first
Transmit State Machine
The transmit state machine operates in either XAUI mode or in GIGE
mode, depending on the protocol used.
GIGE Mode
In GIGE mode, the transmit state machines convert all idle ordered sets
(/K28.5/, /Dx.y/) to either /I1/ or /I2/ ordered sets. /I1/ consists
of a negative-ending disparity /K28.5/ (denoted by /K28.5/-)
followed by a neutral /D5.6/. /I2/ consists of a positive-ending
disparity /K28.5/ (denoted by /K28.5/+) and a negative-ending
disparity /D16.2/ (denoted by /D16.2/-). The transmit state machines
do not convert any of the ordered sets to match /C1/ or /C2/, which are
the configuration ordered sets. (/C1/ and /C2/ are defined by
(/K28.5/, /D21.5/) and (/K28.5/, /D2.2/), respectively.) Both the
/I1/ and /I2/ ordered sets guarantee a negative-ending disparity after
each ordered set. The GIGE transmit state machine can be statically
disabled in the Quartus II software, even if using the GIGE protocol
mode.
2–8
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
Stratix GX Transceivers
XAUI Mode
The transmit state machine translates the XAUI XGMII code group to the
XAUI PCS code group. Table 2–3 shows the code conversion.
Table 2–3. Code Conversion
XGMII TXC
XGMII TXD
PCS Code-Group
Description
0
00 through FF
Dxx.y
Normal data
1
07
K28.0 or K28.3 or
K28.5
Idle in ||I||
1
07
K28.5
Idle in ||T||
1
9C
K28.4
Sequence
1
FB
K27.7
Start
1
FD
K29.7
Terminate
1
FE
K30.7
1
See IEEE 802.3 See IEEE 802.3
reserved code reserved code groups
groups
Reserved code groups
1
Other value
Invalid XGMII character
Error
K30.7
The XAUI PCS idle code groups, /K28.0/ (/R/) and /K28.5/ (/K/), are
automatically randomized based on a PRBS7 pattern with an x7+x6+1
polynomial. The /K28.3/ (/A/) code group is automatically generated
between 16 and 31 idle code groups. The idle randomization on the /A/,
/K/, and /R/ code groups are done automatically by the transmit state
machine.
Serializer (Parallel-to-Serial Converter)
The serializer converts the parallel 8-bit or 10-bit data into a serial stream,
transmitting the LSB first. The serialized stream is then fed to the transmit
buffer. Figure 2–5 is a diagram of the serializer.
Altera Corporation
June 2006
2–9
Stratix GX Device Handbook, Volume 1
Figure 2–5. Serializer
10
D9
D9
D8
D8
D7
D7
D6
D6
D5
D5
D4
D4
D3
D3
D2
D2
D1
D1
D0
D0
Serial data
out (to output
buffer)
Low-speed
parallel clock
High-speed
serial clock
Transmit Buffer
The Stratix GX transceiver buffers support the 1.5-V pseudo current
mode logic (PCML) I/O standard at a rate up to 3.1875 Gbps, across up to
40 inches of FR4 trace, and across 2 connectors. Additional I/O standards,
LVDS, 3.3-V PCML, LVPECL, can be supported when AC coupled. The
common mode of the output driver is 750 mV.
The output buffer, as shown in Figure 2–6, consists of a programmable
output driver and a programmable pre-emphasis circuit.
2–10
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
Stratix GX Transceivers
Figure 2–6. Output Buffer
Serializer
Output Buffer
Programmable
Pre-Emphasis
Programmable
Termination
Programmable
Output
Driver
Output
Pins
Programmable Output Driver
The programmable output driver can be set to drive out 400 to 1,600 mV.
Table 2–4 shows the available settings for each termination value. The
VOD can be dynamically or statically set. The output driver requires either
internal or external termination at the source.
Table 2–4. Programmable VOD (Differential)
Termination Setting (Ω)
Note (1)
VO D Setting (mV)
100
400, 800, 1000, 1200, 1400, 1600
120
480, 960, 1200, 1440
150
600, 1200, 1500
Note to Table 2–4:
(1)
Altera Corporation
June 2006
VOD differential is measured as VA – VB (see Figure 2–7).
2–11
Stratix GX Device Handbook, Volume 1
Figure 2–7. VOD Differential
Single-Ended Waveform
Positive Channel (p) = VOH
VID
Negative Channel (n) = VOL
VCM
Ground
Differential Waveform
(VID (Differential) = 2 x VID (single-ended))
VID
p−n=0V
VID
Programmable Pre-Emphasis
The programmable pre-emphasis module controls the output driver to
boost the high frequency components, to compensate for losses in the
transmission medium, as shown in Figure 2–8. The pre-emphasis can be
dynamically or statically set. There are five possible pre-emphasis
settings (1 through 5), with 5 being the highest and 0 being no
pre-emphasis.
Figure 2–8. Programmable Pre-Emphasis Model
VPP
VS
VCM
VS(p-p) VPP(p-p)
Bit
Time
2–12
Stratix GX Device Handbook, Volume 1
Bit
Time
Altera Corporation
June 2006
Stratix GX Transceivers
Pre-emphasis percentage is defined as VPP/VS – 1, where VPP is the
differential emphasized voltage (peak-to-peak) and VS is the differential
steady-state voltage (peak-to-peak).
Programmable Transmitter Termination
The programmable termination can be statically set in the Quartus II
software. The values are 100 Ω, 120 Ω, 150 Ω, and off. Figure 2–9 shows the
setup for programmable termination.
Figure 2–9. Programmable Transmitter Termination
50, 60, or 75 9
VCM
Programmable
Output
Driver
Receiver Path
This section describes the data path through the Stratix GX receiver (refer
to Figure 2–2 on page 2–4). Data travels through the Stratix GX receiver
via the following modules:
■
■
■
■
■
■
■
Input buffer
Clock Recovery Unit (CRU)
Deserializer
Pattern detector and word aligner
Rate matcher and channel aligner
8B/10B decoder
Receiver logic array interface
Receiver Input Buffer
The Stratix GX receiver input buffer supports the 1.5-V PCML I/O
standard at a rate up to 3.1875 Gbps. Additional I/O standards, LVDS,
3.3-V PCML, and LVPECL can be supported when AC coupled. The
common mode of the input buffer is 1.1 V. The receiver can support
Stratix GX-to-Stratix GX DC coupling.
Altera Corporation
June 2006
2–13
Stratix GX Device Handbook, Volume 1
Figure 2–10 shows a diagram of the receiver input buffer, which contains:
■
■
Programmable termination
Programmable equalizer
Figure 2–10. Receiver Input Buffer
Programmable
Termination
Input
Pins
Programmable
Equalizer
Differential
Input
Buffer
Programmable Termination
The programmable termination can be statically set in the Quartus II
software. Figure 2–11 shows the setup for programmable receiver
termination.
Figure 2–11. Programmable Receiver Termination
Differential
Input
Buffer
50, 60, or 75 Ω
VCM
50, 60, or 75 Ω
If you use external termination, then the receiver must be externally
terminated and biased to 1.1 V. Figure 2–12 shows an example of an
external termination/biasing circuit.
2–14
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
Stratix GX Transceivers
Figure 2–12. External Termination & Biasing Circuit
Receiver External Termination
and Biasing
Stratix GX Device
VDD
50/60/75-Ω
Termination
Resistance
R1
C1
Receiver
R1/R2 = 1K
VDD × {R2/(R1 + R 2)} = 1.1 V
RXIP
R2
RXIN
Receiver External Termination
and Biasing
Transmission
Line
Programmable Equalizer
The programmable equalizer module boosts the high frequency
components of the incoming signal to compensate for losses in the
transmission medium. There are five possible equalization settings (0, 1,
2, 3, 4) to compensate for 0”, 10”, 20”, 30”, and 40” of FR4 trace. These
settings should be interpreted loosely. The programmable equalizer can
be set dynamically or statically.
Receiver PLL & CRU
Each transceiver block has four receiver PLLs and CRUs, each of which is
dedicated to a receive channel. If the receive channel associated with a
particular receiver PLL or CRU is not used, then the receiver PLL or CRU
is powered down for the channel. Figure 2–13 is a diagram of the receiver
PLL and CRU circuits.
Altera Corporation
June 2006
2–15
Stratix GX Device Handbook, Volume 1
Figure 2–13. Receiver PLL & CRU Circuit
Receiver PLL
÷ m (1)
rx_locked
PFD
Low-Speed TX_PLL_CLK
Inter Transceiver Routing (IQ2)
RX CRUCLK
up
down
up
down
Charge Pump
and Loop Filter
VCO
Global Clks, IO Bus, Gen Routing
Dedicated
Local
REFCLKB
÷2
rx_locktorefclk
rx_freqlocked[]
CRU
rx_locktodata
rx_riv[ ]
High-speed RCVD_CLK
RX_IN
Low-speed RCVD_CLK
Note to Figure 2–13:
(1)
m = 8, 10 16, or 20.
The receiver PLLs and CRUs are capable of supporting up to 3.1875 Gbps.
The input clock frequency for –5 and –6 speed grade devices is limited to
650 MHz if you use the REFCLKB pin or 325 MHz if you use the other
clock routing resources. The maximum input clock frequency for –7 speed
grade devices is 312.5 MHz if you use the REFCLKB pin or 156.25 MHz
with the other clock routing resources. An optional RX_LOCKED port
(active low signal) is available to indicate whether the PLL is locked to the
reference clock. The receiver PLL has a programmable loop bandwidth,
which can be set to low, medium, or high. The loop bandwidth parameter
can be statically set by the Quartus II software.
Table 2–5 lists the adjustable parameters of the receiver PLL and CRU. All
the parameters listed are statically programmable in the Quartus II
software.
Table 2–5. Receiver PLL & CRU Adjustable Parameters (Part 1 of 2)
Parameter
Input reference frequency range
Data rate support
2–16
Stratix GX Device Handbook, Volume 1
Specifications
25 MHz to 650 MHz
500 Mbps to 3.1875 Gbps
Altera Corporation
June 2006
Stratix GX Transceivers
Table 2–5. Receiver PLL & CRU Adjustable Parameters (Part 2 of 2)
2, 4, 5, 8, 10, 16, or 20 (1)
Multiplication factor (W)
PPM detector
125, 250, 500, 1,000
Bandwidth
Low, medium, high
Run length detector
10-bit or 20-bit mode: 5 to 160 in steps of
5
8-bit or 16-bit mode: 4 to 128 in steps of 4
Note to Table 2–5:
(1)
Multiplication factors 2, 4, and 5 can only be achieved with the use of the predivider on the REFCLKB port or if the CRU is trained with the low speed clock
from the transmitter PLL.
The CRU has a built-in switchover circuit to select whether the
voltage-controlled oscillator of the PLL is trained by the reference clock or
the data. The optional port rx_freqlocked monitors when the CRU is
in locked to data mode.
In the automatic mode, the following conditions must be met for the CRU
to switch from locked to reference to locked to data mode:
■
■
The CRU PLL is within the prescribed PPM frequency threshold
setting (125 PPM, 250 PPM, 500 PPM, 1,000 PPM) of the CRU
reference clock.
The reference clock and CRU PLL output are phase matched (phases
are within .08 UI).
The automatic switchover circuit can be overridden by using the optional
ports rx_lockedtorefclk and rx_locktodata. Table 2–6 shows the
possible combinations of these two signals.
Table 2–6. Possible Combinations of rx_lockedtorefclk & rx_locktodata
rx_locktodata
rx_lockedtorefclk
VCO (lock to mode)
0
0
Auto
0
1
Reference CLK
1
x
DATA
If the rx_lockedtorefclk and rx_locktodata ports are not used,
the default is auto mode.
Altera Corporation
June 2006
2–17
Stratix GX Device Handbook, Volume 1
Deserializer (Serial-to-Parallel Converter)
The deserializer converts the serial stream into a parallel 8- or 10-bit data
bus. The deserializer receives the least significant bit first. Figure 2–14 is
a diagram of the deserializer.
Figure 2–14. Deserializer
D9
D9
D8
D8
D7
D7
D6
D6
D5
D5
D4
D4
D3
D3
D2
D2
D1
D1
D0
D0
10
High-speed
serial clock
Low-speed
parallel clock
Word Aligner
The word aligner aligns the incoming data based on the specific byte
boundaries. The word aligner has three customizable modes of operation:
bit-slip mode, 16-bit mode, and 10-bit mode, the last of which is available
for the basic and SONET modes. The word aligner also has two
non-customizable modes of operation, which are the XAUI and GIGE
modes.
Figure 2–15 shows the word aligner in bit-slip mode.
2–18
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
Stratix GX Transceivers
Figure 2–15. Word Aligner in Bit-Slip Mode
Word Aligner
Manual
Alignment
Mode
Patterm Detector
Bit-Slip
Mode
10-Bit
Mode
16-Bit
Mode
A1A2
Mode
7-Bit
Mode
A1A1A2A2
Mode
In the bit-slip mode, the byte boundary can be modified by a barrel shifter
to slip the byte boundary one bit at a time via a user-controlled bit-slip
port. The bit-slip mode supports both 8-bit and 10-bit data paths
operating in a single or double-width mode.
The pattern detector is active in the bit-slip mode, and it detects the
user-defined pattern that is specified in the MegaWizard® Plug-In
Manager.
The bit-slip mode is available only in Custom mode and SONET mode.
Figure 2–16 shows the word aligner in 16-bit mode.
Altera Corporation
June 2006
2–19
Stratix GX Device Handbook, Volume 1
Figure 2–16. Word Aligner in 16-Bit Mode
Word Aligner
Manual
Alignment
Mode
Pattern Detector
16-Bit
Mode
A1A2
Mode
16-Bit
Mode
A1A1A2A2
Mode
A1A2
Mode
A1A1A2A2
Mode
In the 16-bit mode, the word aligner and pattern detector automatically
aligns and detects a user-defined 16-bit alignment pattern. This pattern
can be in the format of A1A2 or A1A1A2A2 (for the SONET protocol). The
re-alignment of the byte boundary can be done via a user-controlled port.
The 16-bit mode supports only the 8-bit data path in a single-width or
double-width mode.
The 16-bit mode is available only for the Custom mode and SONET
mode. The A1A1A2A2 word alignment pattern option is available only
for the SONET mode and cannot be used in the Custom mode.
Figure 2–17 shows the word aligner in 10-bit mode.
2–20
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
Stratix GX Transceivers
Figure 2–17. Word Aligner in 10-Bit Mode
Word Aligner
Manual
Alignment
Mode
Pattern Detector
10-Bit
Mode
7-Bit
Mode
10-Bit
Mode
In the 10-bit mode, the word aligner automatically aligns the user’s
predefined 10-bit alignment pattern. The pattern detector can detect the
full 10-bit pattern or only the lower seven bits of the pattern. The word
aligner and pattern detector detect both the positive and the negative
disparity of the pattern. A user-controlled enable port is available for the
word aligner.
The 10-bit mode is available only for the Custom mode.
Figure 2–18 shows the word aligner in XAUI mode.
Altera Corporation
June 2006
2–21
Stratix GX Device Handbook, Volume 1
Figure 2–18. Word Aligner in XAUI Mode
Word Aligner
Synchronization
State Machines
GigE
Mode
XAUI
Mode
In the XAUI and GIGE modes, the word alignment is controlled by a state
machine that adheres to the IEEE 802.3ae standard for XAUI and the
IEEE 802.3 standard for GIGE. The alignment pattern is predefined to be
a /K28.5/ code group.
The XAUI mode is available only for the XAUI protocol, and the GIGE
mode is available only for the GIGE protocol.
Channel Aligner
The channel aligner is available only in XAUI mode and bonds all four
channels within a transceiver. The channel aligner adheres to the
IEEE 802.3ae, clause 48 specification for channel bonding.
The channel aligner is a 16-word deep FIFO buffer with a state machine
overlooking the channel bonding process. The state machine looks for an
/A/ (/K28.3/) in each channel and aligns all the /A/s in the transceiver.
When four columns of /A/ (denoted by //A//) are detected, the
rx_channelalign port goes high, signifying that all the channels in the
transceiver have been bonded. The reception of four consecutive
misaligned /A/s restarts the channel alignment sequence and de-asserts
rx_channelalign.
Figure 2–19 shows misaligned channels before the channel aligner and
the channel alignment after the channel aligner.
2–22
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
Stratix GX Transceivers
Figure 2–19. Before & After the Channel Aligner
Lane 0
K
K
R
A
K
R
R
K
K
R
K
R
K
K
R
A
K
R
R
K
K
R
K
K
R
A
K
R
R
K
K
R
K
R
Lane 0
Lane 0
K
Lane 0
K
K
R
A
K
R
R
K
K
R
K
Lane 0
K
K
R
A
K
R
R
K
K
R
K
R
Lane 0
K
K
R
A
K
R
R
K
K
R
K
R
Lane 0
K
K
R
A
K
R
R
K
K
R
K
R
Lane 0
K
K
R
A
K
R
R
K
K
R
K
R
R
R
Rate Matcher
The rate matcher, which is available only in XAUI and GIGE modes,
consists of a 12-word deep FIFO buffer and a FIFO controller. The rate
matcher is bypassed when the device is not in XAUI or GIGE mode.
In a multi-crystal environment, the rate matcher compensates for up to a
100-ppm difference between the source and receiver clocks.
GIGE Mode
In the GIGE mode, the rate matcher adheres to the specifications in
clause 36 of the IEEE 802.3 documentation, for idle additions or removals.
The rate matcher performs clock compensation only on /I2/ ordered
sets, composing a /K28.5/+ followed by a /D16.2/-. The rate matcher
does not perform a clock compensation on any other ordered set
combinations. An /I2/ is added or deleted automatically based on the
number of words in the FIFO buffer. A 9’h19C is given at the control and
data ports when the FIFO is in an overflow or underflow condition.
Altera Corporation
June 2006
2–23
Stratix GX Device Handbook, Volume 1
XAUI Mode
In XAUI mode, the rate matcher adheres to clause 48 of the IEEE 802.3ae
specification for clock rate compensation. The rate matcher performs
clock compensation on columns of /R/ (/K28.0/), denoted by //R//.
An //R// is added or deleted automatically based on the number of
words in the FIFO buffer.
8B/10B Decoder
The 8B/10B decoder converts the 10-bit encoded code group into 8-bit
data and 1 control bit. The 8B/10B decoder can be bypassed. The
following is a diagram of the conversion from a 10-bit encoded code
group into 8-bit data + 1-bit control.
Figure 2–20. 8B/10B Decoder Conversion
j
h
g
f
i
e
d
c
b
a
9
8
7
6
5
4
3
2
1
0
MSB received last
LSB received first
8b-10b conversion
Parallel data
7
6
5
4
3
2
1
0
H
G
F
E
D
C
B
A
+
ctrl
There are two optional error status ports available in the 8B/10B decoder,
rx_errdetect and rx_disperr. Table 2–7 shows the values of the
ports from a given error. These status signals are aligned with the code
group in which the error occurred.
Table 2–7. Error Signal Values
Types of Errors
rx_errdetect
rx_disperr
No errors
1’b0
1’b0
Invalid code groups
1’b1
1’b0
Disparity errors
1’b1
1’b1
2–24
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
Stratix GX Transceivers
Receiver State Machine
The receiver state machine operates in GIGE and XAUI modes. In GIGE
mode, the receiver state machine replaces invalid code groups with
9’h1FE. In XAUI mode, the receiver state machine translates the XAUI
PCS code group to the XAUI XGMII code group. Table 2–8 shows the
code conversion. The conversion adheres to the IEEE 802.3ae
specification.
Table 2–8. Code Conversion
XGMII RXC
XGMII RXD
PCS code-group
Description
0
00 through FF
Dxx.y
Normal Data
1
07
K28.0 or K28.3 or K28.5
Idle in ||I||
1
07
K28.5
Idle in ||T||
1
9C
K28.4
Sequence
1
FB
K27.7
Start
1
FD
K29.7
Terminate
1
FE
K30.7
Error
1
FE
Invalid code group
Invalid XGMII character
1
See IEEE 802.3 reserved code
groups
See IEEE 802.3 reserved
code groups
Reserved code groups
Byte Deserializer
The byte deserializer takes a single width word (8 or 10 bits) from the
transceiver logic and converts it into double-width words (16 or 20 bits)
to the phase compensation FIFO buffer. The byte deserializer is bypassed
when single width mode (8 or 10 bits) is used at the PLD interface.
Phase Compensation FIFO Buffer
The receiver phase compensation FIFO buffer resides in the transceiver
block at the programmable logic device (PLD) boundary. This buffer
compensates for the phase difference between the recovered clock within
the transceiver and the recovered clock after it has transferred to the PLD
core. The phase compensation FIFO buffer is four words deep and cannot
be bypassed.
Altera Corporation
June 2006
2–25
Stratix GX Device Handbook, Volume 1
Loopback Modes
The Stratix GX transceiver has built-in loopback modes to aid in debug
and testing. The loopback modes are set in the Stratix GX MegaWizard
Plug-In Manager in the Quartus II software. Only one loopback mode can
be set at any single instance of the transceiver block. The loopback mode
applies to all used channels in a transceiver block.
The available loopback modes are:
■
■
■
Serial loopback
Parallel loopback
Reverse serial loopback
Serial Loopback
Serial loopback exercises all the transceiver logic except for the output
buffer and input buffer. The loopback function is dynamically switchable
through the rx_slpbk port on a channel by channel basis. The VOD of the
output reduced. If you select 400 mV, the output is tri-stated when the
serial loopback option is selected. Figure 2–21 shows the data path in
serial loopback mode.
Figure 2–21. Data Path in Serial Loopback Mode
BIST PRBS
Verifier
Word
Aligner
Deserializer
BIST
Incremental
Verifier
Channel
Aligner
Rate
Matcher
Clock
Recovery
Unit
Serializer
Active Path
Non-Active Path
8B/10B
Encoder
8B/10B
Decoder
Byte
Serializer
Byte
Deserializer
Phase
Compensation
FIFO
Phase
Compensation
FIFO
BIST
Generator
BIST PRBS
Generator
2–26
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
Stratix GX Transceivers
Parallel Loopback
The parallel loopback mode exercises the digital logic portion of the
transceiver data path. The analog portions are not use in the loopback
path. The received data is not retimed. Figure 2–22 shows the data path in
parallel loopback mode. This option is not dynamically switchable.
Reception of an external signal is not possible in this mode.
Figure 2–22. Data Path in Parallel Loopback Mode
BIST PRBS
Verifier
Word
Aligner
Deserializer
BIST
Incremental
Verifier
Channel
Aligner
Rate
Matcher
Clock
Recovery
Unit
Serializer
Active Path
Non-Active Path
8B/10B
Encoder
8B/10B
Decoder
Byte
Serializer
Byte
Deserializer
Phase
Compensation
FIFO
Phase
Compensation
FIFO
BIST
Generator
BIST PRBS
Generator
Reverse Serial Loopback
The reverse serial loopback exercises the analog portion of the
transceiver. This loopback mode is dynamically switchable through the
tx_srlpbk port on a channel by channel basis. Asserting
rxanalogreset in reverse serial loopback mode powers down the
receiver buffer and CRU, preventing data loopback. Figure 2–23 shows
the data path in reverse serial loopback mode.
Altera Corporation
June 2006
2–27
Stratix GX Device Handbook, Volume 1
Figure 2–23. Data Path in Reverse Serial Loopback Mode
BIST PRBS
Verifier
Deserializer
Word
Aligner
Channel
Aligner
BIST
Incremental
Verifier
Rate
Matcher
Clock
Recovery
Unit
Serializer
8B/10B
Encoder
Active Path
8B/10B
Decoder
Byte
Serializer
Byte
Deserializer
Phase
Compensation
FIFO
Phase
Compensation
FIFO
BIST
Generator
BIST PRBS
Generator
Non-Active Path
BIST (Built-In Self Test)
The Stratix GX transceiver has built-in self test modes to aid in debug and
testing. The BIST modes are set in the Stratix GX MegaWizard Plug-In
Manager in the Quartus II software. Only one BIST mode can be set for
any single instance of the transceiver block. The BIST mode applies to all
channels used in a transceiver.
The following is a list of the available BIST modes:
■
■
■
■
■
PRBS generator and verifier
Incremental mode generator and verifier
High-frequency generator
Low-frequency generator
Mixed-frequency generator
Figures 2–24 and 2–25 are diagrams of the BIST PRBS data path and the
BIST incremental data path, respectively.
2–28
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
Stratix GX Transceivers
Figure 2–24. BIST PRBS Data Path
BIST PRBS
Verifier
Word
Aligner
Deserializer
BIST
Incremental
Verifier
Channel
Aligner
Rate
Matcher
Clock
Recovery
Unit
Serializer
Byte
Deserializer
Phase
Compensation
FIFO
Phase
Compensation
FIFO
Byte
Serializer
8B/10B
Encoder
Active Path
8B/10B
Decoder
BIST
Generator
BIST PRBS
Generator
Non-active Path
Figure 2–25. BIST Incremental Data Path
BIST PRBS
Verifier
Word
Aligner
Deserializer
BIST
Incremental
Verifier
Channel
Aligner
Rate
Matcher
Clock
Recovery
Unit
Serializer
8B/10B
Encoder
Active Path
8B/10B
Decoder
Byte
Deserializer
Phase
Compensation
FIFO
Phase
Compensation
FIFO
Byte
Serializer
BIST
Generator
BIST PRBS
Generator
Non-active Path
Table 2–9 shows the BIST data output and verifier alignment pattern.
Table 2–9. BIST Data Output & Verifier Alignment Pattern (Part 1 of 2)
BIST Mode
Output
Polynomials
Verifier Word Alignment Pattern
PRBS 8-bit
28 – 1
x8 + x7 + x5 + x3 + 1
1000000011111111
PRBS 10-bit
210 – 1
x10 + x7 + 1
1111111111
Altera Corporation
June 2006
2–29
Stratix GX Device Handbook, Volume 1
Table 2–9. BIST Data Output & Verifier Alignment Pattern (Part 2 of 2)
BIST Mode
Output
Polynomials
Verifier Word Alignment Pattern
PRBS 16-bit
28 – 1
x8 + x7 + x5 + x3 + 1
1000000011111111
PRBS 20-bit
210 – 1
x10 + x7 + 1
1111111111
Incremental 10-bit
K28.5, K27.7, Data (00-FF
incremental), K28.0, K28.1,
K28.2, K28.3, K28.4, K28.6,
K28.7, K23.7, K30.7, K29.7 (1)
0101111100 (K28.5)
Incremental 20-bit
K28.5, K27.7, Data (00-FF
incremental), K28.0, K28.1,
K28.2, K28.3, K28.4, K28.6,
K28.7, K23.7, K30.7, K29.7 (1)
0101111100 (K28.5)
High frequency
1010101010
Low frequency
0011111000
Mixed frequency
0011111010 or 1100000101
Note to Table 2–9:
(1)
This output repeats.
Stratix GX Clocking
The Stratix GX global clock can be driven by certain REFCLKB pins, all
transmitter PLL outputs, and all receiver PLL outputs. The REFCLKB pins
(except for transceiver block 0 and transceiver block 4) can drive intertransceiver and global clock lines as well as feed the transmitter and
receiver PLLs. The output of the transmitter PLL can only feed global
clock lines and the reference clock port of the receiver PLL.
Figures 2–26 and 2–27 are diagrams of the Inter-Transceiver line
connections as well as the global clock connections for the EP1SGX25F
and EP1SGX40G devices. For devices with fewer transceivers, ignore the
information about the unavailable transceiver blocks.
2–30
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
Stratix GX Transceivers
Figure 2–26. EP1SGX25F Device Inter-Transceiver & Global Clock Connections
Note (1)
Transceiver Block 0
IQ0
IQ1
Global Clocks, I/O Bus, General Routing
Transmitter
PLL
refclkb
/2
IQ0
IQ1
IQ2
IQ2
Global Clocks, I/O Bus, General Routing
4
Receiver
PLLs
4
Transceiver Block 1
IQ0
IQ1
Global Clocks, I/O Bus, General Routing
Transmitter
PLL
refclkb
(2)
/2
IQ2
Global Clocks, I/O Bus, General Routing
4
Receiver
PLLs
4
16
Transceiver Block 2
PLD Global Clocks
IQ0
IQ1
Global Clocks, I/O Bus, General Routing
Transmitter
PLL
refclkb
(2)
/2
IQ2
Global Clocks, I/O Bus, General Routing
4
Receiver
PLLs
4
Transceiver Block 3
IQ0
IQ1
Global Clocks, I/O Bus, General Routing
refclkb
Transmitter
PLL
(2)
/2
IQ2
Global Clocks, I/O Bus, General Routing
4
Receiver
PLLs
4
Notes to Figure 2–26:
(1)
(2)
(3)
IQ lines are inter-transceiver block lines.
If the /2 pre-divider is used, the path to drive the PLD logic array, local, or global clocks is not allowed.
There are four receiver PLLs in each transceiver block.
Altera Corporation
June 2006
2–31
Stratix GX Device Handbook, Volume 1
Figure 2–27. EP1SGX40G Device Inter-Transceiver & Global Clock Connections
Note (1)
Transceiver Block 0
IQ0
IQ1
Global Clks, I/O Bus, Gen Routing
TX PLL
refclkb
/2
IQ2
Global Clks, I/O Bus, Gen Routing
4
Receiver
PLLs
4
Transceiver Block 1
IQ0
IQ1
IQ2
IQ0
IQ1
Global Clks, I/O Bus, Gen Routing
TX PLL
refclkb
(2)
/2
IQ2
Global Clks, I/O Bus, Gen Routing
4
Receiver
PLLs
4
PLD
Global
Clocks
Transceiver Block 4
IQ0
IQ1
Global Clks, I/O Bus, Gen Routing
TX PLL
16
refclkb
/2
IQ2
Global Clks, I/O Bus, Gen Routing
4
Receiver
PLLs
4
Transceiver Block 2
IQ0
IQ1
Global Clks, I/O Bus, Gen Routing
TX PLL
refclkb
(2)
/2
IQ2
Global Clks, I/O Bus, Gen Routing
4
Receiver
PLLs
4
Transceiver Block 3
IQ0
IQ1
Global Clks, I/O Bus, Gen Routing
TX PLL
refclkb
(2)
/2
IQ2
Global Clks, I/O Bus, Gen Routing
4
Receiver
PLLS
4
Notes to Figure 2–27:
(1)
(2)
(3)
IQ lines are inter-transceiver block lines.
If the /2 pre-divider is used, the path to drive the PLD logic array, local, or global clocks is not allowed.
There are four receiver PLLs in each transceiver block.
2–32
Stratix GX Device Handbook, Volume 1
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June 2006
Stratix GX Transceivers
The receiver PLL can also drive the fast regional, regional clocks, and
local routing adjacent to the associated transceiver block. Figures 2–28
through 2–31 show which fast regional and regional clock resource can be
used by the recovered clock.
In the EP1SGX25 device, the receiver PLL recovered clocks from
transceiver blocks 0 and 1 drive RCLK[1..0] while transceiver blocks 2
and 3 drive RCLK[7..6]. The regional clocks feed logic in their
associated regions.
Figure 2–28. EP1SGX25 Receiver PLL Recovered Clock to Regional Clock
Connection
PLD
Stratix GX
Transceiver Blocks
Block 0
RCLK[11..10]
Block 1
Block 2
RCLK[9..8]
Block 3
In addition, the receiver PLL’s recovered clocks can drive fast regional
lines (FCLK) as shown Figure 2–29. The fast regional clocks can feed logic
in their associated regions.
Altera Corporation
June 2006
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Stratix GX Device Handbook, Volume 1
Figure 2–29. EP1SGX25 Receiver PLL Recovered Clock to Fast Regional Clock
Connection
PLD
FCLK[1..0]
Stratix GX
Transceiver Blocks
Block 0
Block 1
Block 2
Block 3
FCLK[1..0]
In the EP1SGX40 device, the receiver PLL recovered clocks from
transceivers 0 and 1 drive RCLK[1..0] while transceivers 2, 3, and 4
drive RCLK[7..6]. The regional clocks feed logic in their associated
regions.
2–34
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
Stratix GX Transceivers
Figure 2–30. EP1SGX40 Receiver PLL Recovered Clock to Regional Clock
Connection
PLD
Stratix GX
Transceiver Blocks
Block 0
RCLK[11..10]
Block 1
Block 4
Block 2
RCLK[9..8]
Block 3
Figure 2–31 shows the possible recovered clock connection to the fast
regional clock resource. The fast regional clocks can drive logic in their
associated regions.
Altera Corporation
June 2006
2–35
Stratix GX Device Handbook, Volume 1
Figure 2–31. EP1SGX40 Receiver PLL Recovered Clock to Fast Regional Clock
Connection
Stratix GX
FCLK[1..0] Transceiver Blocks
PLD
Block 0
Block 1
Block 4
Block 2
Block 3
FCLK[1..0]
Table 2–10 summarizes the possible clocking connections for the
transceivers.
Table 2–10. Possible Clocking Connections for Transceivers (Part 1 of 2)
Destination
Source
REFCLKB
Transmitter
PLL
Receiver
PLL
GCLK
RCLK
v
v (1)
v
v
v
v
v
v
v
v
v
Transmitter PLL
Receiver PLL
GCLK
v
v
RCLK
v
v
FCLK
v
v
2–36
Stratix GX Device Handbook, Volume 1
FCLK
IQ Lines
v (1)
Altera Corporation
June 2006
Stratix GX Transceivers
Table 2–10. Possible Clocking Connections for Transceivers (Part 2 of 2)
Destination
Source
IQ lines
Transmitter
PLL
Receiver
PLL
v (2)
v (2)
GCLK
RCLK
FCLK
IQ Lines
Notes to Table 2–10:
(1)
(2)
REFCLKB from transceiver block 0 and transceiver block 4 does not drive the inter-transceiver lines or the GCLK
lines.
Inter-transceiver line 0 and inter-transceiver line 1 drive the transmitter PLL, while inter-transceiver line 2 drives
the receiver PLLs.
Other
Transceiver
Features
Other important features of the Stratix GX transceivers are the power
down and reset capabilities, the external voltage reference and bias
circuitry, and hot swapping.
Individual Power-Down & Reset for the Transmitter & Receiver
Stratix GX transceivers offer a power saving advantage with their ability
to shut off functions that are not needed. The device can individually
reset the receiver and transmitter blocks and the PLLs. The Stratix GX
device can either globally power down and reset the transmitter and
receiver channels or do each channel separately. Table 2–11 shows the
connectivity between the reset signals and the Stratix GX logical blocks.
Altera Corporation
June 2006
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Stratix GX Device Handbook, Volume 1
Other Transceiver Features
Power-down functions are static, in other words., they are implemented
upon device configuration and programmed, through the Quartus II
software, to static values. Resets can be static as well as dynamic inputs
coming from the logic array or pins.
v
rxdigitalreset
v
v
v
v
v
rxanalogreset
txdigitalreset v v
v
v
Receiver Analog Circuits
BIST Verifiers
Receiver XAUI State Machine
Receiver PLL / CRU
Receiver Phase Comp FIFO Module/ Byte Deserializer
Receiver 8B/10B Decoder
Receiver Rate Matcher
Receiver Deskew FIFO Module
Receiver Word Aligner
Receiver Deserializer
BIST Generators
Transmitter Analog Circuits
Transmitter XAUI State Machine
Transmitter PLL
Transmitter Analog Circuits
Transmitter Serializer
Transmitter 8B/10B Encoder
Reset Signal
Transmitter Phase Compensation FIFO Module/ Byte Serializer
Table 2–11. Reset Signal Map to Stratix GX Blocks
v
v
v
v
pll_areset
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
pllenable
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
Voltage Reference Capabilities
Stratix GX transceivers provide voltage reference and bias circuitry. To
set-up internal bias for controlling the transmitter output drivers’ voltage
swing—as well as to provide voltage/current biasing for other analog
circuitry—use the internal bandgap voltage reference at 0.7 V. To provide
bias for internal pull-up PMOS resistors for I/O termination at the serial
interface of receiver and transmitter channels (independent of power
supply drift, process changes, or temperature variation) an external
resistor, which is connected to the external low voltage power supply, is
2–38
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
Stratix GX Transceivers
accurately tracked by the internal bias circuit. Moreover, the reference
voltage and internal resistor bias current is generated and replicated to
the analog circuitry in each channel.
Hot-Socketing Capabilities
Each Stratix GX device is capable of hot-socketing. Because Stratix GX
devices can be used in a mixed-voltage environment, they have been
designed specifically to tolerate any possible power-up sequence. Signals
can be driven into Stratix GX devices before and during power-up
without damaging the device. Once operating conditions are reached and
the device is configured, Stratix GX devices operate according to your
specifications. This feature provides the Stratix GX transceiver line card
behavior, so you can insert it into the system without powering the
system down, offering more flexibility.
Applications &
Protocols
Supported with
Stratix GX
Devices
Each Stratix GX transceiver block is designed to operate at any serial bit
rate from 500 Mbps to 3.1875 Gbps per channel. The wide, data rate range
allows Stratix GX transceivers to support a wide variety of standard and
future protocols such as 10-Gigabit Ethernet XAUI, InfiniBand, Fibre
Channel, and Serial RapidIO. Stratix GX devices are ideal for many highspeed communication applications such as high-speed backplanes, chipto-chip bridges, and high-speed serial communications standards
support.
Stratix GX Example Application Support
Stratix GX devices can be used for many applications, including:
■
■
■
Altera Corporation
June 2006
Backplanes for traffic management and quality of service (QOS)
Switch fabric applications for complete set for backplane and switch
fabric transceivers
Chip-to-chip applications such as: 10 Gigabit Ethernet XAUI to
XGMII bridge, 10 Gigabit Ethernet XGMII to POS-PHY4 bridge,
POS-PHY4 to NPSI bridge, or NPSI to backplane bridge
2–39
Stratix GX Device Handbook, Volume 1
Applications & Protocols Supported with Stratix GX Devices
High-Speed Serial Bus Protocols
With wide, serial data rate range, Stratix GX devices can support
multiple, high-speed serial bus protocols. Table 2–12 shows some of the
protocols that Stratix GX devices can support.
Table 2–12. High-Speed Serial Bus Protocols
Stratix GX (Gbps)
(Supports up to 3.1875 Gbps)
Bus Transfer Protocol
SONET backplane
2.488
10 Gigabit Ethernet XAUI
3.125
10 Gigabit fibre channel
3.1875
InfiniBand
2.5
Fibre channel (1G, 2G)
1.0625, 2.125
Serial RapidIO™
1.25, 2.5, 3.125
PCI Express
2.5
SMPTE 292M
1.485
2–40
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
3. Source-Synchronous
Signaling With DPA
SGX51003-1.1
Introduction
Expansion in the telecommunications market and growth in Internet use
requires systems to move more data faster than ever. To meet this
demand, rely on solutions such as differential signaling and emerging
high-speed interface standards including RapidIO, POS-PHY 4, SFI-4, or
XSBI.
These new protocols support differential data rates up to 1 Gbps and
higher. At these high data rates, it becomes more challenging to manage
the skew between the clock and data signals. One solution to this
challenge is to use CDR to eliminate skew between data channels and
clock signals. Another potential solution, DPA, is beginning to be
incorporated into some of these protocols.
The source-synchronous high-speed interface in Stratix GX devices is a
dedicated circuit embedded into the PLD allowing for high-speed
communications. The High-Speed Source-Synchronous Differential I/O
Interfaces in Stratix GX Devices chapter of the Stratix GX Device Handbook,
Volume 2 provides information on the high-speed I/O standard features
and functions of the Stratix GX device.
Stratix GX I/O Banks
Stratix GX devices contain 17 I/O banks. I/O banks one and two support
high-speed LVDS, LVPECL, and 3.3-V PCML inputs and outputs. These
two banks also incorporate an embedded dynamic phase aligner within
the source-synchronous interface (see Figure 3–8 on page 3–10). The
dynamic phase aligner corrects for the phase difference between the clock
and data lines caused by skew. The dynamic phase aligner operates
automatically and continuously without requiring a fixed training
pattern, and allows the source-synchronous circuitry to capture data
correctly regardless of the channel-to-clock skew.
Principles of SERDES Operation
Stratix GX devices support source-synchronous differential signaling up
to 1 Gbps in DPA mode, and up to 840 Mbps in non-DPA mode. Serial
data is transmitted and received along with a low-frequency clock. The
PLL can multiply the incoming low-frequency clock by a factor of 1 to 10.
The SERDES factor J can be 8 or 10 for the DPA mode, or 4, 7, 8, or 10 for
all other modes. The SERDES factor does not have to equal the clock
Altera Corporation
August 2005
3–1
Introduction
multiplication value. The ×1 and ×2 operation is also possible by
bypassing the SERDES. The SERDES DPA cannot support ×1, ×2, or ×4
natively.
On the receiver side, the high-frequency clock generated by the PLL shifts
the serial data through a shift register (also called deserializer). The
parallel data is clocked out to the logic array synchronized with the lowfrequency clock. On the transmitter side, the parallel data from the logic
array is first clocked into a parallel-in, serial-out shift register
synchronized with the low-frequency clock and then transmitted out by
the output buffers.
There are two dedicated fast PLLs each in EP1SGX10 to EP1SGX25
devices, and four in EP1SGX40 devices. These PLLs are used for the
SERDES operations as well as general-purpose use.
Stratix GX Differential I/O Receiver Operation (Non-DPA Mode)
You can configure any of the Stratix GX source synchronous differential
input channels as a receiver channel (see Figure 3–1). The differential
receiver deserializes the incoming high-speed data. The input shift
register continuously clocks the incoming data on the negative transition
of the high-frequency clock generated by the PLL clock (×W).
The data in the serial shift register is shifted into a parallel register by the
RXLOADEN signal generated by the fast PLL counter circuitry on the third
falling edge of the high-frequency clock. However, you can select which
falling edge of the high frequency clock loads the data into the parallel
register, using the data-realignment circuit.
In normal mode, the enable signal RXLOADEN loads the parallel data into
the next parallel register on the second rising edge of the low-frequency
clock. You can also load data to the parallel register through the
TXLOADEN signal when using the data-realignment circuit.
Figure 3–1 shows the block diagram of a single SERDES receiver channel.
Figure 3–2 shows the timing relationship between the data and clocks in
Stratix GX devices in ×10 mode. W is the low-frequency multiplier and J
is the data parallelization division factor.
3–2
Stratix GX Device Handbook, Volume 1
Altera Corporation
August 2005
Source-Synchronous Signaling With DPA
Figure 3–1. Stratix GX High-Speed Interface Deserialized in ×10 Mode
Receiver Circuit
Serial Shift
Registers
RXIN+
RXIN−
Parallel
Registers
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PD8
PD9
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PD8
PD9
×W
RXCLKIN+
RXCLKIN−
Parallel
Registers
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PD8
PD9
Stratix GX
Logic Array
×W/J (1)
Fast RXLOADEN
PLL (2)
TXLOADEN
Notes to Figure 3–1:
(1)
(2)
W = 1, 2, 4, 7, 8, or 10.
J = 4, 7, 8, or 10 for non-DPA (J = 8 or 10 for DPA).
W does not have to equal J. When J = 1 or 2, the deserializer is bypassed. When J = 2, the device uses DDRIO registers.
This figure does not show additional circuitry for clock or data manipulation.
Figure 3–2. Receiver Timing Diagram
Internal ×1 clock
Internal ×10 clock
RXLOADEN
Receiver
data input
n–1
n–0
9
8
7
6
5
4
3
2
1
0
Stratix GX Differential I/O Transmitter Operation
You can configure any of the Stratix GX differential output channels as a
transmitter channel. The differential transmitter serializes outbound
parallel data.
Altera Corporation
August 2005
3–3
Stratix GX Device Handbook, Volume 1
Introduction
The logic array sends parallel data to the SERDES transmitter circuit
when the TXLOADEN signal is asserted. This signal is generated by the
high-speed counter circuitry of the logic array low-frequency clock’s
rising edge. The data is then transferred from the parallel register into the
serial shift register by the TXLOADEN signal on the third rising edge of the
high-frequency clock.
Figure 3–3 shows the block diagram of a single SERDES transmitter
channel and Figure 3–4 shows the timing relationship between the data
and clocks in Stratix GX devices in ×10 mode. W is the low-frequency
multiplier and J is the data parallelization division factor.
Figure 3–3. Stratix GX High-Speed Interface Serialized in ×10 Mode
Transmitter Circuit
Parallel
Register
PD9
PD8
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
Stratix GX
Logic Array
PD9
PD8
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
Serial
Register
TXOUT+
TXOUT−
×W
Fast
PLL
TXLOADEN
Figure 3–4. Transmitter Timing Diagram
Internal ×1 clock
Internal ×10 clock
TXLOADEN
Receiver
data input
n–1
n–0
3–4
Stratix GX Device Handbook, Volume 1
9
8
7
6
5
4
3
2
1
0
Altera Corporation
August 2005
Source-Synchronous Signaling With DPA
DPA Block Overview
Each Stratix GX receiver channel features a DPA block. The block contains
a dynamic phase selector for phase detection and selection, a SERDES, a
synchronizer, and a data realigner circuit. You can bypass the dynamic
phase aligner without affecting the basic source-synchronous operation
of the channel by using a separate deserializer shown in Figure 3–5.
The dynamic phase aligner uses both the source clock and the serial data.
The dynamic phase aligner automatically and continuously tracks
fluctuations caused by system variations and self-adjusts to eliminate the
phase skew between the multiplied clock and the serial data. Figure 3–5
shows the relationship between Stratix GX source-synchronous circuitry
and the Stratix GX source-synchronous circuitry with DPA.
Figure 3–5. Source-Synchronous DPA Circuitry
Receiver Circuit
rx_in+
rx_in-
Deserializer
(1)
Dynamic
Phase
Aligner
Stratix GX
Logic
Array
8
Deserializer (1)
rx_inclock_p
rx_inclock_n
×W
PLL
×1
Note to Figure 3–5:
(1)
Both deserializers are identical. The deserializer operation is described in the “Principles of SERDES Operation”
section.
Altera Corporation
August 2005
3–5
Stratix GX Device Handbook, Volume 1
Introduction
Unlike the de-skew function in APEXTM 20KE and APEX 20KC devices,
you do not have to use a fixed training pattern with DPA in Stratix GX
devices. Table 3–1 shows the differences between source-synchronous
circuitry with DPA and source-synchronous circuitry without DPA
circuitry in Stratix GX devices.
Table 3–1. Source-Synchronous Circuitry With & Without DPA
Source-Synchronous Circuitry
Feature
Without DPA
With DPA
Data rate
300 to 840 Megabits per 300 Mbps to 1 Gbps
second (Mbps)
Deserialization factors
1, 2, 4, 8, 10
8, 10
Clock frequency
10 to 717 MHz
74 to 717 MHz
Interface pins
I/O banks 1 and 2
I/O banks 1 and 2
Receiver pins
Dedicated inputs
Dedicated inputs
DPA Input Support
Stratix GX device I/O banks 1 and 2 contain dedicated circuitry to
support differential I/O standards at speeds up to 1 Gbps with DPA (or
up to 840 Mbps without DPA). Stratix GX device source-synchronous
circuitry supports LVDS, LVPECL, and 3.3-V PCML I/O standards, each
with a supply voltage of 3.3 V. Refer to the High-Speed Source-Synchronous
Differential I/O Interfaces in Stratix GX Devices chapter of the Stratix GX
Device Handbook, Volume 2 for more information on these I/O standards.
Transmitter pins can be either input or output pins for single-ended I/O
standards. Refer to Table 3–2.
Table 3–2. Bank 1 & 2 Input Pins
Input Pin Type
I/O Standard
Receiver Pin
Transmitter Pin
Differential
Differential
Input only
Output only
Single ended
Single ended
Input only
Input or output
Interface & Fast PLL
This section describes the number of channels that support DPA and their
relationship with the PLL in Stratix GX devices. EP1SGX10 and
EP1SGX25 devices have two dedicated fast PLLs and EP1SGX40 devices
3–6
Stratix GX Device Handbook, Volume 1
Altera Corporation
August 2005
Source-Synchronous Signaling With DPA
have four dedicated fast PLLs for clock multiplication. Table 3–3 shows
the maximum number of channels in each Stratix GX device that support
DPA.
Table 3–3. Stratix GX Source-Synchronous Differential I/O Resources
Fast PLLs
Pin Count
Receiver
Channels
(1)
EP1SGX10C
2 (3)
672
22
Device
Transmitter
Channels
(1)
Receiver &
Transmitter
Channel Speed
(Gbps) (2)
LEs
22
1
10,570
EP1SGX10D
2 (3)
672
22
22
1
10,570
EP1SGX25C
2
672
39
39
1
25,660
EP1SGX25D
2
672
39
39
1
25,660
1,020
39
39
1
25,660
EP1SGX25F
2
1,020
39
39
1
25,660
EP1SGX40D
4 (4)
1,020
45
45
1
41,250
EP1SGX40G
4 (4)
1,020
45
45
1
41,250
Notes to Table 3–3:
(1)
(2)
(3)
(4)
This is the number of receiver or transmitter channels in the source-synchronous (I/O bank 1 and 2) interface of
the device.
Receiver channels operate at 1,000 Mbps with DPA. Without DPA, the receiver channels operate at 840 Mbps.
One of the two fast PLLs in EP1SGX10C and EP1SGX10D devices supports DPA.
Two of the four fast PLLs in EP1SGX40D and EP1SGX40G devices support DPA
The receiver and transmitter channels are interleaved so that each I/O
row in I/O banks 1 and 2 of the device has one receiver channel and one
transmitter channel per row. Figures 3–6 and 3–7 show the fast PLL and
channels with DPA layout in EP1SGX10, EP1SGX25, and EP1SGX40
devices. In EP1SGX10 devices, only fast PLL 2 supports DPA operations.
Altera Corporation
August 2005
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Stratix GX Device Handbook, Volume 1
Introduction
Figure 3–6. PLL & Channel Layout in EP1SGX10 & EP1SGX25
Devices
Notes (1), (2)
1 Receiver
1 Transmitter
11 Rows for
EP1SGX10 Devices
& 19 Rows for
EP1SGX25 Devices
8
1 Transmitter
1 Receiver
INCLK0
Fast
PLL 1 (1)
INCLK1
Fast
PLL 2
Eight-Phase
Clock
1 Receiver
1 Transmitter
8
11 Rows for
EP1SGX10 Devices
& 20 Rows for
EP1SGX25 Devices
1 Transmitter
1 Receiver
Notes to Figure 3–6:
(1)
(2)
Fast PLL 1 in EP1SGX10 devices does not support DPA.
Not all eight phases are used by the receiver channel or transmitter channel in
non-DPA mode.
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August 2005
Source-Synchronous Signaling With DPA
Figure 3–7. PLL & Channel Layout in EP1SGX40 Devices
CLKIN
Notes (1), (2), (3)
PLL (1)
1 Receiver
1 Transmitter
22 Rows
8
1 Transmitter
1 Receiver
INCLK0
Fast
PLL 1
INCLK1
Fast
PLL 2
Eight-Phase
Clock
Eight-Phase
Clock
1 Receiver
1 Transmitter
8
23 Rows
1 Transmitter
1 Receiver
CLKIN
PLL (1)
Notes to Figure 3–7:
(1)
(2)
(3)
Altera Corporation
August 2005
Corner PLLs do not support DPA.
Not all eight phases are used by the receiver channel or transmitter channel in
non-DPA mode.
The center PLLs can only clock 20 transceivers in either direction. Using Fast PLL2,
you can clock a total of 40 transceivers, 20 in each direction.
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Stratix GX Device Handbook, Volume 1
Introduction
DPA Operation
The DPA receiver circuitry contains the dynamic phase selector, the
deserializer, the synchronizer, and the data realigner (see Figure 3–8).
This section describes the DPA operation, synchronization and data
realignment. In the SERDES with DPA mode, the source clock is fed to the
fast PLL through the dedicated clock input pins. This clock is multiplied
by the multiplication value W to match the serial data rate.
For information on the deserializer, see “Principles of SERDES
Operation” on page 3–1.
Figure 3–8. DPA Receiver Circuit
DPA Receiver Circuit
Stratix GX Logic Array
Serial Data (1)
dpll_reset
Dynamic
Phase
Selector
rxin+
rxin-
Deserializer
10
Synchronizer
10
Data
Realigner
Parallel
Clock
×W Clock (1)
8
inclk+
inclk -
Fast PLL
GCLK
×1 Clock
RCLK
Reset
Note to Figure 3–8:
(1)
These are phase-matched and retimed high-speed clocks and data.
The dynamic phase selector matches the phase of the high-speed clock
and data before sending them to the deserializer.
The fast PLL supplies eight phases of the same clock (each a separate tap
from a four-stage differential VCO) to all the differential channels
associated with the selected fast PLL. The DPA circuitry inside each
channel locks to a phase closest to the serial data’s phase and sends the
retimed data and the selected clock to the deserializer. The DPA circuitry
automatically performs this operation and is not something you select.
Each channel’s DPA circuit can independently choose a different clock
phase. The data phase detection and the clock phase selection process is
automatic and continuous. The eight phases of the clock give the DPA
circuit a granularity of one eighth of the unit interval (UI) or 125 ps at
1 Gbps. Figure 3–9 illustrates the clocks generated by the fast PLL
circuitry and their relationship to a data stream.
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August 2005
Source-Synchronous Signaling With DPA
Figure 3–9. Fast PLL Clocks & Data Input
Data input
D0
D1
D2
D3
D4
D5
Dn
Clock A
Clock B
Clock C
Clock D
Clock A'
Clock B'
Clock C'
Clock D'
Protocols, Training Pattern & DPA Lock Time
The dynamic phase aligner uses a fast PLL for clock multiplication, and
the dynamic phase selector for the phase detection and alignment. The
dynamic phase aligner uses the high-speed clock out of the dynamic
phase selector to deserialize high-speed data and the receiver's source
synchronous operations.
At each rising edge of the clock, the dynamic phase selector determines
the phase difference between the clock and the data and automatically
compensates for the phase difference between the data and clock.
Altera Corporation
August 2005
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Stratix GX Device Handbook, Volume 1
Introduction
The actual lock time for different data patterns varies depending on the
data’s transition density (how often the data switches between 1 and 0)
and jitter characteristic. The DPA circuitry is designed to lock onto any
data pattern with sufficient transition density, so the circuitry works with
current and future protocols. Experiments and simulations show that the
DPA circuitry locks when the data patterns listed in Table 3–4 are
repeated for the specified number of times. There are other suitable
patterns not shown in Table 3–4 and/or pattern lengths, but the lock time
may vary. The circuit can adjust for any phase variation that may occur
during operation.
Table 3–4. Training Patterns for Different Protocols
Protocols
SPI-4, NPSI
Ten 0’s, ten 1’s
(00000000001111111111)
RapidIO
Four 0’s, four 1’s (00001111) or one 1,
two 0’s, one 1, four 0’s (10010000)
Other designs
Number of
Repetitions
Training Pattern
256
Eight alternating 1’s and 0’s (10101010 or
01010101)
SFI-4, XSBI
Not specified
Phase Synchronizer
Each receiver has its own phase synchronizer. The receiver phase
synchronizer aligns the phase of the parallel data from all the receivers to
one global clock. The synchronizers in each channel consist of a 4-bit deep
and J-bit wide FIFO buffer. The parallel clock writes to the FIFO buffer
and the global clock (GCLK) reads from the FIFO buffer. The global and
parallel clock inputs into the synchronizers must have identical
frequencies and differ only in phase. The FIFO buffer never becomes full
or empty (because the source and receive signals are frequency locked)
when operating within the DPA specifications, and the operation does
not require an empty/full flag or read/write enable signals.
Receiver Data Realignment In DPA Mode
While DPA operation aligns the incoming clock phase to the incoming
data phase, it does not guarantee the parallelization boundary or byte
boundary. When the dynamic phase aligner realigns the data bits, the bits
may be shifted out of byte alignment, as shown in Figure 3–10.
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Altera Corporation
August 2005
Source-Synchronous Signaling With DPA
Figure 3–10. Misaligned Captured Bits
Correct Alignment
0
1
2
3
4
5
6
7
6
7
0
1
2
Incorrect Alignment
3
4
5
The dynamic phase selector and synchronizer align the clock and data
based on the power-up of both communicating devices, and the channel
to channel skew. However, the dynamic phase selector and synchronizer
cannot determine the byte boundary, and the data may need to be
byte-aligned. The dynamic phase aligner’s data realignment circuitry
shifts data bits to correct bit misalignments.
The Stratix GX circuitry contains a data-realignment feature controlled by
the logic array. Stratix GX devices perform data realignment on the
parallel data after the deserialization block. The data realignment can be
performed per channel for more flexibility. The data alignment operation
requires a state machine to recognize a specific pattern. The procedure
requires the bits to be slipped on the data stream to correctly align the
incoming data to the start of the byte boundary.
The DPA uses its realignment circuitry and the global clock for data
realignment. Either a device pin or the logic array asserts the internal
rx_channel_data_align node to activate the DPA data-realignment
circuitry. Switching this node from low to high activates the realignment
circuitry and the data being transferred to the logic array is shifted by
one bit. The data realignment block cannot be bypassed. However, if the
rx_channel_data_align is not turned on (through the altvlds
MegaWizard Plug-In Manager), or when it is not toggled, it only acts as a
register latency.
A state machine and additional logic can monitor the incoming parallel
data and compare it against a known pattern. If the incoming data pattern
does not match the known pattern, you can activate the
rx_channel_data_align node again. Repeat this process until the
realigner detects the desired match between the known data pattern and
incoming parallel data pattern.
Altera Corporation
August 2005
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Stratix GX Device Handbook, Volume 1
Introduction
The DPA data-realignment circuitry allows further realignment beyond
what the J multiplication factor allows. You can set the J multiplication
factor to be 8 or 10. However, because data must be continuously clocked
in on each low-speed clock cycle, the upcoming bit to be realigned and
previous n −1 bits of data are selected each time the data realignment
logic’s counter passes n −1. At this point the data is selected entirely from
bit-slip register 3 (see Figure 3–11) as the counter is reset to 0. The logic
array receives a new valid byte of data on the next divided low speed
clock cycle. Figure 3–11 shows the data realignment logic output
selection from data in the data realignment register 2 and data
realignment register 3 based on its current counter value upon
continuous request of data slipping from the logic array.
Figure 3–11. DPA Data Realigner
Bit Slip
Bit Slip
Register 2 Register 3
Bit Slip
Bit Slip
Register 2 Register 3
Bit Slip
Bit Slip
Register 2 Register 3
Bit Slip
Bit Slip
Register 2 Register 3
Bit Slip
Bit Slip
Register 2 Register 3
D19
D9
D29
D19
D99
D89
D119
D99
D119
D109
D18
D8
D28
D18
D98
D18
D118
D98
D118
D108
D17
D7
D27
D17
D97
D87
D117
D97
D117
D107
D16
D6
D26
D16
D96
D86
D116
D96
D116
D106
One bit
slipped
Seven more
bits slipped
One more
bit slipped
One more
bit slipped
D15
D5
D25
D15
D95
D85
D115
D95
D115
D125
D14
D4
D24
D14
D94
D84
D114
D94
D114
D124
D13
D3
D23
D13
D93
D83
D113
D93
D113
D123
D12
D2
D22
D12
D92
D82
D112
D92
D112
D102
D11
D1
D21
D11
D91
D81
D111
D91
D111
D101
D10
D0
D20
D10
D90
D80
D110
D90
D110
D100
Zero bits slipped.
Counter = 0
D10 is the upcoming
bit to be slipped.
One bit slipped.
Counter = 1
D21 is the upcoming
bit to be slipped.
Eight bits slipped.
Counter = 8
D98 is the upcoming
bit to be slipped.
Nine bits slipped.
Counter = 9
D119 is the upcoming
bit to be slipped.
10 bits slipped.
Counter = 0
Real data will resume
on the next byte.
Use the rx_channel_data_align signal within the device to activate
the data realigner. You can use internal logic or an external pin to control
the rx_channel_data_align signal. To ensure the rising edge of the
rx_channel_data_align signal is latched into the control logic, the
rx_channel_data_align signal should stay high for at least two lowfrequency clock cycles.
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August 2005
Source-Synchronous Signaling With DPA
To manage the alignment procedure, a state machine should be built in
the FPGA logic array to generate the realignment signal. The following
guidelines outline the requirements for this state machine.
■
■
■
■
Altera Corporation
August 2005
The design must include an input synchronizing register to ensure
that data is synchronized to the ×W/J clock.
After the state machine, use another synchronizing register to
capture the generated rx_channel_data_align signal and
synchronize it to the ×W/J clock.
Because the skew in the path from the output of this synchronizing
register to the PLL is undefined, the state machine must generate a
pulse that is high for two W/J clock periods.
To guarantee the state machine does not incorrectly generate
multiple rx_channel_data_align pulses to shift a single bit, the
state machine must hold the rx_channel_data_align signal low
for at least three ×1 clock periods between pulses.
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Introduction
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Altera Corporation
August 2005
4. Stratix GX Architecture
SGX51004-1.0
Logic Array
Blocks
Each LAB consists of 10 LEs, LE carry chains, LAB control signals, local
interconnect, LUT chain, and register chain connection lines. The local
interconnect transfers signals between LEs in the same LAB. LUT chain
connections transfer the output of one LE’s LUT to the adjacent LE for fast
sequential LUT connections within the same LAB. Register chain
connections transfer the output of one LE’s register to the adjacent LE’s
register within an LAB. The Quartus® II Compiler places associated logic
within an LAB or adjacent LABs, allowing the use of local, LUT chain,
and register chain connections for performance and area efficiency.
Figure 4–1 shows the Stratix® GX LAB.
Figure 4–1. Stratix GX LAB Structure
Row Interconnects of
Variable Speed & Length
Direct link
interconnect from
adjacent block
Direct link
interconnect from
adjacent block
Direct link
interconnect to
adjacent block
Direct link
interconnect to
adjacent block
Local Interconnect
LAB
Three-Sided Architecture—Local
Interconnect is Driven from Either Side by
Columns & LABs, & from Above by Rows
Column Interconnects of
Variable Speed & Length
LAB Interconnects
The LAB local interconnect can drive LEs within the same LAB. The LAB
local interconnect is driven by column and row interconnects and LE
outputs within the same LAB. Neighboring LABs, M512 RAM blocks,
Altera Corporation
February 2005
4–1
Logic Array Blocks
M4K RAM blocks, or DSP blocks from the left and right can also drive an
LAB’s local interconnect through the direct link connection. The direct
link connection feature minimizes the use of row and column
interconnects, providing higher performance and flexibility. Each LE can
drive 30 other LEs through fast local and direct link interconnects.
Figure 4–2 shows the direct link connection.
Figure 4–2. Direct Link Connection
Direct link interconnect from
right LAB, TriMatrix memory
block, DSP block, or IOE output
Direct link interconnect from
left LAB, TriMatrix memory
block, DSP block, or IOE output
Direct link
interconnect
to right
Direct link
interconnect
to left
Local
Interconnect
LAB
LAB Control Signals
Each LAB contains dedicated logic for driving control signals to its LEs.
The control signals include two clocks, two clock enables, two
asynchronous clears, synchronous clear, asynchronous preset/load,
synchronous load, and add/subtract control signals. This gives a
maximum of 10 control signals at a time. Although synchronous load and
clear signals are generally used when implementing counters, they can
also be used with other functions.
Each LAB can use two clocks and two clock enable signals. Each LAB’s
clock and clock enable signals are linked. For example, any LE in a
particular LAB using the labclk1 signal also uses labclkena1. If the
LAB uses both the rising and falling edges of a clock, it also uses both
LAB-wide clock signals. De-asserting the clock enable signal turns off the
LAB-wide clock.
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February 2005
Stratix GX Architecture
Each LAB can use two asynchronous clear signals and an asynchronous
load/preset signal. The asynchronous load acts as a preset when the
asynchronous load data input is tied high.
With the LAB-wide addnsub control signal, a single LE can implement a
one-bit adder and subtractor. This saves LE resources and improves
performance for logic functions such as DSP correlators and signed
multipliers that alternate between addition and subtraction depending
on data.
The LAB row clocks [7..0] and LAB local interconnect generate the LABwide control signals. The MultiTrackTM interconnect’s inherent low skew
allows clock and control signal distribution in addition to data. Figure 4–3
shows the LAB control signal generation circuit.
Figure 4–3. LAB-Wide Control Signals
Dedicated
Row LAB
Clocks
8
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Logic Elements
Altera Corporation
February 2005
labclkena2
labclkena1
labclk1
labclk2
labclr2
syncload
asyncload
or labpre
labclr1
addnsub
synclr
The smallest unit of logic in the Stratix GX architecture, the LE, is compact
and provides advanced features with efficient logic utilization. Each LE
contains a four-input LUT, which is a function generator that can
implement any function of four variables. In addition, each LE contains a
programmable register and carry chain with carry select capability. A
single LE also supports dynamic single bit addition or subtraction mode
selectable by an LAB-wide control signal. Each LE drives all types of
interconnects: local, row, column, LUT chain, register chain, and direct
link interconnects. See Figure 4–4.
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Stratix GX Device Handbook, Volume 1
Logic Elements
Figure 4–4. Stratix GX LE
Register chain
routing from
previous LE
LAB-wide
Register Bypass
Synchronous
Load
LAB-wide
Packed
Synchronous
Register Select
Clear
LAB Carry-In
addnsub
Carry-In1
Carry-In0
Programmable
Register
LUT chain
routing to next LE
data1
data2
data3
Look-Up
Table
(LUT)
Carry
Chain
Synchronous
Load and
Clear Logic
PRN/ALD
D
Q
ADATA
Row, column,
and direct link
routing
data4
ENA
CLRN
labclr1
labclr2
labpre/aload
Chip-Wide
Reset
Asynchronous
Clear/Preset/
Load Logic
Row, column,
and direct link
routing
Local Routing
Clock &
Clock Enable
Select
Register
Feedback
Register chain
output
labclk1
labclk2
labclkena1
labclkena2
Carry-Out0
Carry-Out1
LAB Carry-Out
Each LE’s programmable register can be configured for D, T, JK, or SR
operation. Each register has data, true asynchronous load data, clock,
clock enable, clear, and asynchronous load/preset inputs. Global signals,
general-purpose I/O pins, or any internal logic can drive the register’s
clock and clear control signals. Either general-purpose I/O pins or
internal logic can drive the clock enable, preset, asynchronous load, and
asynchronous data. The asynchronous load data input comes from the
data3 input of the LE. For combinatorial functions, the register is
bypassed and the output of the LUT drives directly to the outputs of the
LE.
Each LE has three outputs that drive the local, row, and column routing
resources. The LUT or register output can drive these three outputs
independently. Two LE outputs drive column or row and direct link
routing connections and one drives local interconnect resources. This
allows the LUT to drive one output while the register drives another
output. This feature, called register packing, improves device utilization
because the device can use the register and the LUT for unrelated
functions. Another special packing mode allows the register output to
feed back into the LUT of the same LE so that the register is packed with
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February 2005
Stratix GX Architecture
its own fan-out LUT. This provides another mechanism for improved
fitting. The LE can also drive out registered and unregistered versions of
the LUT output.
LUT Chain & Register Chain
In addition to the three general routing outputs, the LEs within an LAB
have LUT chain and register chain outputs. LUT chain connections allow
LUTs within the same LAB to cascade together for wide input functions.
Register chain outputs allow registers within the same LAB to cascade
together. The register chain output allows an LAB to use LUTs for a single
combinatorial function and the registers to be used for an unrelated shift
register implementation. These resources speed up connections between
LABs while saving local interconnect resources. See “MultiTrack
Interconnect” on page 4–11 for more information on LUT chain and
register chain connections.
addnsub Signal
The LE’s dynamic adder/subtractor feature saves logic resources by
using one set of LEs to implement both an adder and a subtractor. This
feature is controlled by the LAB-wide control signal addnsub. The
addnsub signal sets the LAB to perform either A + B or A – B. The LUT
computes addition, and subtraction is computed by adding the two’s
complement of the intended subtractor. The LAB-wide signal converts to
two’s complement by inverting the B bits within the LAB and setting
carry-in = 1 to add one to the least significant bit (LSB). The LSB of an
adder/subtractor must be placed in the first LE of the LAB, where the
LAB-wide addnsub signal automatically sets the carry-in to 1. The
Quartus II Compiler automatically places and uses the adder/subtractor
feature when using adder/subtractor parameterized functions.
LE Operating Modes
The Stratix GX LE can operate in one of the following modes:
■
■
Normal mode
Dynamic arithmetic mode
Each mode uses LE resources differently. In each mode, eight available
inputs to the LE—the four data inputs from the LAB local interconnect;
carry-in0 and carry-in1 from the previous LE; the LAB carry-in
from the previous carry-chain LAB; and the register chain connection—
are directed to different destinations to implement the desired logic
function. LAB-wide signals provide clock, asynchronous clear,
asynchronous preset load, synchronous clear, synchronous load, and
Altera Corporation
February 2005
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Stratix GX Device Handbook, Volume 1
Logic Elements
clock enable control for the register. These LAB-wide signals are available
in all LE modes. The addnsub control signal is allowed in arithmetic
mode.
The Quartus II software, in conjunction with parameterized functions
such as library of parameterized modules (LPM) functions, automatically
chooses the appropriate mode for common functions such as counters,
adders, subtractors, and arithmetic functions. If required, you can also
create special-purpose functions that specify which LE operating mode to
use for optimal performance.
Normal Mode
The normal mode is suitable for general logic applications and
combinatorial functions. In normal mode, four data inputs from the LAB
local interconnect are inputs to a four-input LUT (see Figure 4–5). The
Quartus II Compiler automatically selects the carry-in or the data3
signal as one of the inputs to the LUT. Each LE can use LUT chain
connections to drive its combinatorial output directly to the next LE in the
LAB. Asynchronous load data for the register comes from the data3
input of the LE. LEs in normal mode support packed registers.
Figure 4–5. LE in Normal Mode
sload
sclear
(LAB Wide) (LAB Wide)
aload
(LAB Wide)
Register chain
connection
addnsub (LAB Wide)
(1)
data1
data2
data3
cin (from cout
of previous LE)
4-Input
LUT
clock (LAB Wide)
ena (LAB Wide)
data4
aclr (LAB Wide)
Register Feedback
ALD/PRE
ADATA Q
D
Row, column, and
direct link routing
ENA
CLRN
Row, column, and
direct link routing
Local routing
LUT chain
connection
Register
chain output
Note to Figure 4–5:
(1)
This signal is only allowed in normal mode if the LE is at the end of an adder/subtractor chain.
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February 2005
Stratix GX Architecture
Dynamic Arithmetic Mode
The dynamic arithmetic mode is ideal for implementing adders, counters,
accumulators, wide parity functions, and comparators. An LE in dynamic
arithmetic mode uses four 2-input LUTs configurable as a dynamic
adder/subtractor. The first two 2-input LUTs compute two summations
based on a possible carry-in of 1 or 0; the other two LUTs generate carry
outputs for the two chains of the carry select circuitry. As shown in
Figure 4–6, the LAB carry-in signal selects either the carry-in0 or
carry-in1 chain. The selected chain’s logic level in turn determines
which parallel sum is generated as a combinatorial or registered output.
For example, when implementing an adder, the sum output is the
selection of two possible calculated sums: data1 + data2 + carry-in0
or data1 + data2 + carry-in1. The other two LUTs use the data1 and
data2 signals to generate two possible carry-out signals—one for a carry
of 1 and the other for a carry of 0. The carry-in0 signal acts as the carry
select for the carry-out0 output and carry-in1 acts as the carry select
for the carry-out1 output. LEs in arithmetic mode can drive out
registered and unregistered versions of the LUT output.
The dynamic arithmetic mode also offers clock enable, counter enable,
synchronous up/down control, synchronous clear, synchronous load,
and dynamic adder/subtractor options. The LAB local interconnect data
inputs generate the counter enable and synchronous up/down control
signals. The synchronous clear and synchronous load options are
LAB-wide signals that affect all registers in the LAB. The Quartus II
software automatically places any registers that are not used by the
counter into other LABs. The addnsub LAB-wide signal controls
whether the LE acts as an adder or subtractor.
Altera Corporation
February 2005
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Stratix GX Device Handbook, Volume 1
Logic Elements
Figure 4–6. LE in Dynamic Arithmetic Mode
LAB Carry-In
sload
sclear
(LAB Wide) (LAB Wide)
Register chain
connection
Carry-In0
Carry-In1
addnsub
(LAB Wide)
(1)
data1
data2
data3
LUT
LUT
LUT
aload
(LAB Wide)
ALD/PRE
ADATA Q
D
Row, column, and
direct link routing
ENA
CLRN
Row, column, and
direct link routing
clock (LAB Wide)
ena (LAB Wide)
Local routing
aclr (LAB Wide)
LUT chain
connection
LUT
Register
chain output
Register Feedback
Carry-Out0 Carry-Out1
Note to Figure 4–6:
(1)
The addnsub signal is tied to the carry input for the first LE of a carry chain only.
Carry-Select Chain
The carry-select chain provides a very fast carry-select function between
LEs in arithmetic mode. The carry-select chain uses the redundant carry
calculation to increase the speed of carry functions. The LE is configured
to calculate outputs for a possible carry-in of 1 and carry-in of 0 in
parallel. The carry-in0 and carry-in1 signals from a lower-order bit
feed forward into the higher-order bit via the parallel carry chain and
feed into both the LUT and the next portion of the carry chain. Carryselect chains can begin in any LE within an LAB.
The speed advantage of the carry-select chain is in the parallel
pre-computation of carry chains. Because the LAB carry-in selects the
precomputed carry chain, not every LE is in the critical path. Only the
propagation delay between LAB carry-in generation (LE 5 and LE 10) are
now part of the critical path. This feature allows the Stratix GX
architecture to implement high-speed counters, adders, multipliers,
parity functions, and comparators of arbitrary width.
Figure 4–7 shows the carry-select circuitry in an LAB for a 10-bit full
adder. One portion of the LUT generates the sum of two bits using the
input signals and the appropriate carry-in bit; the sum is routed to the
output of the LE. The register can be bypassed for simple adders or used
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February 2005
Stratix GX Architecture
for accumulator functions. Another portion of the LUT generates carryout bits. An LAB-wide carry in bit selects which chain to use for the
addition of given inputs. The carry-in signal for each chain, carry-in0
or carry-in1, selects the carry-out to carry forward to the carry-in
signal of the next-higher-order bit. The final carry-out signal is routed to
an LE, where it is fed to local, row, or column interconnects.
The Quartus II Compiler automatically creates carry chain logic during
design processing, or you can create it manually during design entry.
Parameterized functions such as LPM functions automatically take
advantage of carry chains for the appropriate functions.
The Quartus II Compiler creates carry chains longer than 10 LEs by
linking LABs together automatically. For enhanced fitting, a long carry
chain runs vertically allowing fast horizontal connections to TriMatrix™
memory and DSP blocks. A carry chain can continue as far as a full
column.
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February 2005
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Stratix GX Device Handbook, Volume 1
Logic Elements
Figure 4–7. Carry Select Chain
LAB Carry-In
0
1
A1
B1
LE1
A2
B2
LE2
Sum1
LAB Carry-In
Carry-In0
Carry-In1
A3
B3
LE3
A4
B4
LE4
A5
B5
LE5
0
Sum2
Sum3
LUT
data1
data2
Sum
LUT
Sum4
LUT
Sum5
LUT
1
A6
B6
LE6
A7
B7
LE7
A8
B8
LE8
A9
B9
LE9
A10
B10
LE10
Sum6
Carry-Out0
Carry-Out1
Sum7
Sum8
Sum9
Sum10
LAB Carry-Out
Clear & Preset Logic Control
LAB-wide signals control the logic for the register’s clear and preset
signals. The LE directly supports an asynchronous clear and preset
function. The register preset is achieved through the asynchronous load
of a logic high. The direct asynchronous preset does not require a
NOT-gate push-back technique. Stratix GX devices support simultaneous
preset/ asynchronous load, and clear signals. An asynchronous clear
signal takes precedence if both signals are asserted simultaneously. Each
LAB supports up to two clears and one preset signal.
In addition to the clear and preset ports, Stratix GX devices provide a
chip-wide reset pin (DEV_CLRn) that resets all registers in the device. An
option set before compilation in the Quartus II software controls this pin.
This chip-wide reset overrides all other control signals.
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February 2005
Stratix GX Architecture
MultiTrack
Interconnect
In the Stratix GX architecture, connections between LEs, TriMatrix
memory, DSP blocks, and device I/O pins are provided by the
MultiTrack interconnect structure with DirectDriveTM technology. The
MultiTrack interconnect consists of continuous, performance-optimized
routing lines of different lengths and speeds used for inter- and intradesign block connectivity. The Quartus II Compiler automatically places
critical design paths on faster interconnects to improve design
performance.
DirectDrive technology is a deterministic routing technology that ensures
identical routing resource usage for any function regardless of placement
within the device. The MultiTrack interconnect and DirectDrive
technology simplify the integration stage of block-based designing by
eliminating the re-optimization cycles that typically follow design
changes and additions.
The MultiTrack interconnect consists of row and column interconnects
that span fixed distances. A routing structure with fixed length resources
for all devices allows predictable and repeatable performance when
migrating through different device densities. Dedicated row
interconnects route signals to and from LABs, DSP blocks, and TriMatrix
memory within the same row. These row resources include:
■
■
■
■
Direct link interconnects between LABs and adjacent blocks.
R4 interconnects traversing four blocks to the right or left.
R8 interconnects traversing eight blocks to the right or left.
R24 row interconnects for high-speed access across the length of the
device.
The direct link interconnect allows an LAB, DSP block, or TriMatrix
memory block to drive into the local interconnect of its left and right
neighbors and then back into itself. Only one side of a M-RAM block
interfaces with direct link and row interconnects. This provides fast
communication between adjacent LABs and/or blocks without using
row interconnect resources.
The R4 interconnects span four LABs, three LABs and one M512 RAM
block, two LABs and one M4K RAM block, or two LABs and one DSP
block to the right or left of a source LAB. These resources are used for fast
row connections in a four-LAB region. Every LAB has its own set of R4
interconnects to drive either left or right. Figure 4–8 shows R4
interconnect connections from an LAB. R4 interconnects can drive and be
driven by DSP blocks and RAM blocks and horizontal IOEs. For LAB
interfacing, a primary LAB or LAB neighbor can drive a given R4
interconnect. For R4 interconnects that drive to the right, the primary
LAB and right neighbor can drive on to the interconnect. For R4
interconnects that drive to the left, the primary LAB and its left neighbor
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February 2005
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Stratix GX Device Handbook, Volume 1
MultiTrack Interconnect
can drive on to the interconnect. R4 interconnects can drive other R4
interconnects to extend the range of LABs they can drive. R4
interconnects can also drive C4 and C16 interconnects for connections
from one row to another. Additionally, R4 interconnects can drive R24
interconnects.
Figure 4–8. R4 Interconnect Connections
Adjacent LAB can
Drive onto Another
LAB's R4 Interconnect
C4, C8, and C16
Column Interconnects (1)
R4 Interconnect
Driving Right
R4 Interconnect
Driving Left
LAB
Neighbor
Primary
LAB (2)
LAB
Neighbor
Notes to Figure 4–8:
(1)
(2)
C4 interconnects can drive R4 interconnects.
This pattern is repeated for every LAB in the LAB row.
The R8 interconnects span eight LABs, M512 or M4K RAM blocks, or DSP
blocks to the right or left from a source LAB. These resources are used for
fast row connections in an eight-LAB region. Every LAB has its own set
of R8 interconnects to drive either left or right. R8 interconnect
connections between LABs in a row are similar to the R4 connections
shown in Figure 4–8, with the exception that they connect to eight LABs
to the right or left, not four. Like R4 interconnects, R8 interconnects can
drive and be driven by all types of architecture blocks. R8 interconnects
can drive other R8 interconnects to extend their range as well as C8
interconnects for row-to-row connections. One R8 interconnect is faster
than two R4 interconnects connected together.
R24 row interconnects span 24 LABs and provide the fastest resource for
long row connections between LABs, TriMatrix memory, DSP blocks, and
IOEs. The R24 row interconnects can cross M-RAM blocks. R24 row
interconnects drive to other row or column interconnects at every fourth
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February 2005
Stratix GX Architecture
LAB and do not drive directly to LAB local interconnects. R24 row
interconnects drive LAB local interconnects via R4 and C4 interconnects.
R24 interconnects can drive R24, R4, C16, and C4 interconnects.
The column interconnect operates similarly to the row interconnect and
vertically routes signals to and from LABs, TriMatrix memory, DSP
blocks, and IOEs. Each column of LABs is served by a dedicated column
interconnect, which vertically routes signals to and from LABs, TriMatrix
memory and DSP blocks, and horizontal IOEs. These column resources
include:
■
■
■
■
■
LUT chain interconnects within an LAB
Register chain interconnects within an LAB
C4 interconnects traversing a distance of four blocks in up and down
direction
C8 interconnects traversing a distance of eight blocks in up and
down direction
C16 column interconnects for high-speed vertical routing through
the device
Stratix GX devices include an enhanced interconnect structure within
LABs for routing LE output to LE input connections faster using LUT
chain connections and register chain connections. The LUT chain
connection allows the combinatorial output of an LE to directly drive the
fast input of the LE right below it, bypassing the local interconnect. These
resources can be used as a high-speed connection for wide fan-in
functions from LE 1 to LE 10 in the same LAB. The register chain
connection allows the register output of one LE to connect directly to the
register input of the next LE in the LAB for fast shift registers. The
Quartus II Compiler automatically takes advantage of these resources to
improve utilization and performance. Figure 4–9 shows the LUT chain
and register chain interconnects.
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February 2005
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Stratix GX Device Handbook, Volume 1
MultiTrack Interconnect
Figure 4–9. LUT Chain & Register Chain Interconnects
Local Interconnect
Routing Among LEs
in the LAB
LUT Chain
Routing to
Adjacent LE
LE 1
Register Chain
Routing to Adjacent
LE's Register Input
LE 2
Local
Interconnect
LE 3
LE 4
LE 5
LE 6
LE 7
LE 8
LE 9
LE 10
The C4 interconnects span four LABs, M512, or M4K blocks up or down
from a source LAB. Every LAB has its own set of C4 interconnects to drive
either up or down. Figure 4–10 shows the C4 interconnect connections
from an LAB in a column. The C4 interconnects can drive and be driven
by all types of architecture blocks, including DSP blocks, TriMatrix
memory blocks, and vertical IOEs. For LAB interconnection, a primary
LAB or its LAB neighbor can drive a given C4 interconnect.
C4 interconnects can drive each other to extend their range as well as
drive row interconnects for column-to-column connections.
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February 2005
Stratix GX Architecture
Figure 4–10. C4 Interconnect Connections
Note (1)
C4 Interconnect
Drives Local and R4
Interconnects
up to Four Rows
C4 Interconnect
Driving Up
LAB
Row
Interconnect
Adjacent LAB can
drive onto neighboring
LAB's C4 interconnect
Local
Interconnect
C4 Interconnect
Driving Down
Note to Figure 4–10:
(1)
Each C4 interconnect can drive either up or down four rows.
C8 interconnects span eight LABs, M512, or M4K blocks up or down from
a source LAB. Every LAB has its own set of C8 interconnects to drive
either up or down. C8 interconnect connections between the LABs in a
column are similar to the C4 connections shown in Figure 4–10 with the
exception that they connect to eight LABs above and below. The C8
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February 2005
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Stratix GX Device Handbook, Volume 1
MultiTrack Interconnect
interconnects can drive and be driven by all types of architecture blocks
similar to C4 interconnects. C8 interconnects can drive each other to
extend their range as well as R8 interconnects for column-to-column
connections. C8 interconnects are faster than two C4 interconnects.
C16 column interconnects span a length of 16 LABs and provide the
fastest resource for long column connections between LABs, TriMatrix
memory blocks, DSP blocks, and IOEs. C16 interconnects can cross MRAM blocks and also drive to row and column interconnects at every
fourth LAB. C16 interconnects drive LAB local interconnects via C4 and
R4 interconnects and do not drive LAB local interconnects directly.
All embedded blocks communicate with the logic array similar to LABto-LAB interfaces. Each block (that is, TriMatrix memory and DSP blocks)
connects to row and column interconnects and has local interconnect
regions driven by row and column interconnects. These blocks also have
direct link interconnects for fast connections to and from a neighboring
LAB. All blocks are fed by the row LAB clocks, labclk[7..0].
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Stratix GX Architecture
Table 4–1 shows the Stratix GX device’s routing scheme.
Table 4–1. Stratix GX Device Routing Scheme
Direct Link
Interconnect
v
R4 Interconnect
v
R8 Interconnect
v
v
v
v
R24
Interconnect
v
C4 Interconnect
v
C8 Interconnect
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
M4K RAM Block
v
v
v
v
v
v
v
v
M-RAM Block
v
v
Row IOE
v
Altera Corporation
February 2005
v
v
v
v
v
v
v
v
Column IOE
v
v
v
DSP Blocks
v
v
v
v
v
v
M512 RAM
Block
LE
v
v
v
C16
Interconnect
v
v
Row IOE
v
Column IOE
Local
Interconnect
DSP Blocks
v
M-RAM Block
v
Register Chain
M4K RAM Block
LUT Chain
M512 RAM Block
LE
C16 Interconnect
C8 Interconnect
C4 Interconnect
R24 Interconnect
R8 Interconnect
R4 Interconnect
Direct Link Interconnect
Local Interconnect
LUT Chain
Source
Register Chain
Destination
v
v
v
v
v
v
v
v
v
v
v
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TriMatrix Memory
TriMatrix
Memory
TriMatrix memory consists of three types of RAM blocks: M512, M4K,
and M-RAM blocks. Although these memory blocks are different, they
can all implement various types of memory with or without parity,
including true dual-port, simple dual-port, and single-port RAM, ROM,
and FIFO buffers. Table 4–2 shows the size and features of the different
RAM blocks.
Table 4–2. TriMatrix Memory Features (Part 1 of 2)
Memory Feature
Maximum
performance
M512 RAM Block M4K RAM Block
(32 × 18 Bits)
(128 × 36 Bits)
(1)
True dual-port
memory
M-RAM Block
(4K × 144 Bits)
(1)
(1)
v
v
Simple dual-port
memory
v
v
v
Single-port memory
v
v
v
Shift register
v
v
ROM
v
v
(2)
FIFO buffer
v
v
v
v
v
Parity bits
v
v
v
Mixed clock mode
v
v
v
Memory initialization
v
v
Simple dual-port
memory mixed width
support
v
v
v
v
v
Byte enable
True dual-port
memory mixed width
support
Power-up conditions
Outputs cleared
Outputs cleared
Outputs
unknown
Register clears
Input and output
registers
Input and output
registers
Output registers
Mixed-port readduring-write
Unknown
output/old data
Unknown
output/old data
Unknown output
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Stratix GX Architecture
Table 4–2. TriMatrix Memory Features (Part 2 of 2)
Memory Feature
Configurations
M512 RAM Block M4K RAM Block
(32 × 18 Bits)
(128 × 36 Bits)
512 ×1
256 × 2
128 × 4
64 × 8
64 × 9
32 × 16
32 × 18
4K × 1
2K × 2
1K × 4
512 × 8
512 × 9
256 × 16
256 × 18
128 × 32
128 × 36
M-RAM Block
(4K × 144 Bits)
64K × 8
64K × 9
32K × 16
32K × 18
16K × 32
16K × 36
8K × 64
8K × 72
4K × 128
4K × 144
Notes to Table 4–2:
(1)
(2)
See the DC & Switching Characteristics chapter of the Stratix GX Device Handbook,
Volume 1 for maximum performance information.
The M-RAM block does not support memory initializations. However, the
M-RAM block can emulate a ROM function using a dual-port RAM bock. The
Stratix GX device must write to the dual-port memory once and then disable the
write-enable ports afterwards.
Memory Modes
TriMatrix memory blocks include input registers that synchronize writes
and output registers to pipeline designs and improve system
performance. M4K and M-RAM memory blocks offer a true dual-port
mode to support any combination of two-port operations: two reads, two
writes, or one read and one write at two different clock frequencies.
Figure 4–11 shows true dual-port memory.
Figure 4–11. True Dual-Port Memory Configuration
A
dataA[ ]
addressA[ ]
wrenA
clockA
clockenA
qA[ ]
aclrA
B
dataB[ ]
addressB[ ]
wrenB
clockB
clockenB
qB[ ]
aclrB
In addition to true dual-port memory, the memory blocks support simple
dual-port and single-port RAM. Simple dual-port memory supports a
simultaneous read and write and can either read old data before the write
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February 2005
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TriMatrix Memory
occurs or just read the don’t care bits. Single-port memory supports
non-simultaneous reads and writes, but the q[] port outputs the data
once it has been written to the memory (if the outputs are not registered)
or after the next rising edge of the clock (if the outputs are registered). For
more information, see the TriMatrix Embedded Memory Blocks in
Stratix & Stratix GX Devices chapter of the Stratix GX Device Handbook,
Volume 2. Figure 4–12 shows these different RAM memory port
configurations for TriMatrix memory.
Figure 4–12. Simple Dual-Port & Single-Port Memory Configurations
Simple Dual-Port Memory
data[ ]
wraddress[ ]
wren
inclock
inclocken
inaclr
rdaddress[ ]
rden
q[ ]
outclock
outclocken
outaclr
Single-Port Memory (1)
data[ ]
address[ ]
wren
inclock
inclocken
inaclr
q[ ]
outclock
outclocken
outaclr
Note to Figure 4–12:
(1)
Two single-port memory blocks can be implemented in a single M4K block as long
as each of the two independent block sizes is equal to or less than half of the M4K
block size.
The memory blocks also enable mixed-width data ports for reading and
writing to the RAM ports in dual-port RAM configuration. For example,
the memory block can be written in ×1 mode at port A and read out in ×16
mode from port B.
TriMatrix memory architecture can implement pipelined RAM by
registering both the input and output signals to the RAM block. All
TriMatrix memory block inputs are registered providing synchronous
write cycles. In synchronous operation, the memory block generates its
own self-timed strobe write enable (WREN) signal derived from the global
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Stratix GX Architecture
or regional clock. In contrast, a circuit using asynchronous RAM must
generate the RAM WREN signal while ensuring its data and address
signals meet setup and hold time specifications relative to the WREN
signal. The output registers can be bypassed. Flow-through reading is
possible in the simple dual-port mode of M512 and M4K RAM blocks by
clocking the read enable and read address registers on the negative clock
edge and bypassing the output registers.
Two single-port memory blocks can be implemented in a single M4K
block as long as each of the two independent block sizes is equal to or less
than half of the M4K block size.
The Quartus II software automatically implements larger memory by
combining multiple TriMatrix memory blocks. For example, two
256 × 16-bit RAM blocks can be combined to form a 256 × 32-bit RAM
block. Memory performance does not degrade for memory blocks using
the maximum number of words available in one memory block. Logical
memory blocks using less than the maximum number of words use
physical blocks in parallel, eliminating any external control logic that
would increase delays. To create a larger high-speed memory block, the
Quartus II software automatically combines memory blocks with LE
control logic.
Parity Bit Support
The memory blocks support a parity bit for each byte. The parity bit,
along with internal LE logic, can implement parity checking for error
detection to ensure data integrity. You can also use parity-size data words
to store user-specified control bits. In the M4K and M-RAM blocks, byte
enables are also available for data input masking during write operations.
Shift Register Support
You can configure embedded memory blocks to implement shift registers
for DSP applications such as pseudo-random number generators, multichannel filtering, auto-correlation, and cross-correlation functions. These
and other DSP applications require local data storage, traditionally
implemented with standard flip-flops, which can quickly consume many
logic cells and routing resources for large shift registers. A more efficient
alternative is to use embedded memory as a shift register block, which
saves logic cell and routing resources and provides a more efficient
implementation with the dedicated circuitry.
The size of a w × m × n shift register is determined by the input data
width (w), the length of the taps (m), and the number of taps (n). The size
of a w × m × n shift register must be less than or equal to the maximum
number of memory bits in the respective block: 576 bits for the M512
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February 2005
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TriMatrix Memory
RAM block and 4,608 bits for the M4K RAM block. The total number of
shift register outputs (number of taps n × width w) must be less than the
maximum data width of the RAM block (18 for M512 blocks, 36 for M4K
blocks). To create larger shift registers, the memory blocks are cascaded
together.
Data is written into each address location at the falling edge of the clock
and read from the address at the rising edge of the clock. The shift register
mode logic automatically controls the positive and negative edge
clocking to shift the data in one clock cycle. Figure 4–13 shows the
TriMatrix memory block in the shift register mode.
Figure 4–13. Shift Register Memory Configuration
w × m × n Shift Register
m-Bit Shift Register
w
w
m-Bit Shift Register
w
w
n Number
of Taps
m-Bit Shift Register
w
w
m-Bit Shift Register
w
w
Memory Block Size
TriMatrix memory provides three different memory sizes for efficient
application support. The large number of M512 blocks are ideal for
designs with many shallow first-in first-out (FIFO) buffers. M4K blocks
provide additional resources for channelized functions that do not
require large amounts of storage. The M-RAM blocks provide a large
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February 2005
Stratix GX Architecture
single block of RAM ideal for data packet storage. The different-sized
blocks allow Stratix GX devices to efficiently support variable-sized
memory in designs.
The Quartus II software automatically partitions the user-defined
memory into the embedded memory blocks using the most efficient size
combinations. You can also manually assign the memory to a specific
block size or a mixture of block sizes.
M512 RAM Block
The M512 RAM block is a simple dual-port memory block and is useful
for implementing small FIFO buffers, DSP, and clock domain transfer
applications. Each block contains 576 RAM bits (including parity bits).
M512 RAM blocks can be configured in the following modes:
■
■
■
■
■
Simple dual-port RAM
Single-port RAM
FIFO
ROM
Shift register
When configured as RAM or ROM, you can use an initialization file to
pre-load the memory contents.
The memory address depths and output widths can be configured as
512 × 1, 256 × 2, 128 × 4, 64 × 8 (64 × 9 bits with parity), and 32 × 16
(32 × 18 bits with parity). Mixed-width configurations are also possible,
allowing different read and write widths. Table 4–3 summarizes the
possible M512 RAM block configurations.
Table 4–3. M512 RAM Block Configurations (Simple Dual-Port RAM)
Write Port
Read Port
512 × 1
256 × 2
128 × 4
64 × 8
32 × 16
512 × 1
v
v
v
v
v
256 × 2
v
v
v
v
v
128 × 4
v
v
v
64 × 8
v
v
32 × 16
v
v
64 × 9
32 × 18
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February 2005
64 × 9
32 × 18
v
v
v
v
v
v
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TriMatrix Memory
When the M512 RAM block is configured as a shift register block, a shift
register of size up to 576 bits is possible.
The M512 RAM block can also be configured to support serializer and
deserializer applications. By using the mixed-width support in
combination with DDR I/O standards, the block can function as a
SERDES to support low-speed serial I/O standards using global or
regional clocks. See “I/O Structure” on page 4–96 for details on dedicated
SERDES in Stratix GX devices.
M512 RAM blocks can have different clocks on its inputs and outputs.
The wren, datain, and write address registers are all clocked together
from one of the two clocks feeding the block. The read address, rden, and
output registers can be clocked by either of the two clocks driving the
block. This allows the RAM block to operate in read/write or
input/output clock modes. Only the output register can be bypassed. The
eight labclk signals or local interconnect can drive the inclock,
outclock, wren, rden, inclr, and outclr signals. Because of the
advanced interconnect between the LAB and M512 RAM blocks, LEs can
also control the wren and rden signals and the RAM clock, clock enable,
and asynchronous clear signals. Figure 4–14 shows the M512 RAM block
control signal generation logic.
The RAM blocks within Stratix GX devices have local interconnects to
allow LEs and interconnects to drive into RAM blocks. The M512 RAM
block local interconnect is driven by the R4, R8, C4, C8, and direct link
interconnects from adjacent LABs. The M512 RAM blocks can
communicate with LABs on either the left or right side through these row
interconnects or with LAB columns on the left or right side with the
column interconnects. Up to 10 direct link input connections to the M512
RAM block are possible from the left adjacent LABs and another
10 possible from the right adjacent LAB. M512 RAM outputs can also
connect to left and right LABs through 10 direct link interconnects. The
M512 RAM block has equal opportunity for access and performance to
and from LABs on either its left or right side. Figure 4–15 shows the M512
RAM block to logic array interface.
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Stratix GX Architecture
Figure 4–14. M512 RAM Block Control Signals
Dedicated
Row LAB
Clocks
8
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
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February 2005
outclocken
inclocken
inclock
outclock
outclr
wren
rden
inclr
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TriMatrix Memory
Figure 4–15. M512 RAM Block LAB Row Interface
C4 and C8
Interconnects
R4 and R8
Interconnects
10
Direct link
interconnect
to adjacent LAB
Direct link
interconnect
to adjacent LAB
dataout
M512 RAM
Block
Direct link
interconnect
from adjacent LAB
Direct link
interconnect
from adjacent LAB
Control
Signals
datain
address
Clocks
2
8
Small RAM Block Local
Interconnect Region
LAB Row Clocks
M4K RAM Blocks
The M4K RAM block includes support for true dual-port RAM. The M4K
RAM block implements buffers for a wide variety of applications such as
storing processor code, implementing lookup schemes, and
implementing larger memory applications. Each block contains
4,608 RAM bits (including parity bits). M4K RAM blocks can be
configured in the following modes:
■
■
■
■
■
■
True dual-port RAM
Simple dual-port RAM
Single-port RAM
FIFO
ROM
Shift register
When configured as RAM or ROM, you can use an initialization file to
pre-load the memory contents.
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February 2005
Stratix GX Architecture
The memory address depths and output widths can be configured as
4,096 × 1, 2,048 × 2, 1,024 × 4, 512 × 8 (or 512 × 9 bits), 256 × 16 (or
256 × 18 bits), and 128 × 32 (or 128 × 36 bits). The 128 × 32- or 36-bit
configuration is not available in the true dual-port mode. Mixed-width
configurations are also possible, allowing different read and write
widths. Tables 4–4 and 4–5 summarize the possible M4K RAM block
configurations.
Table 4–4. M4K RAM Block Configurations (Simple Dual-Port)
Write Port
Read Port
1K ° 4 512 ° 8
256 ° 16
128 ° 32
512 ° 9
256 ° 18
128 ° 36
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
256 × 16
v
v
v
v
v
v
128 × 32
v
v
v
v
v
v
512 × 9
v
v
v
256 × 18
v
v
v
128 × 36
v
v
v
4K 1
2K × 2
4K × 1
v
v
v
2K × 2
v
v
1K × 4
v
512 × 8
Table 4–5. M4K RAM Block Configurations (True Dual-Port)
Port B
Port A
4K × 1
2K × 2
1K × 4
512 × 8
256 × 16
512 × 9
256 × 18
4K × 1
v
v
v
v
v
2K × 2
v
v
v
v
v
1K × 4
v
v
v
v
v
512 × 8
v
v
v
v
v
256 × 16
v
v
v
v
v
512 × 9
v
v
256 × 18
v
v
When the M4K RAM block is configured as a shift register block, you can
create a shift register up to 4,608 bits (w × m × n).
Altera Corporation
February 2005
4–27
Stratix GX Device Handbook, Volume 1
TriMatrix Memory
M4K RAM blocks support byte writes when the write port has a data
width of 16, 18, 32, or 36 bits. The byte enables allow the input data to be
masked so the device can write to specific bytes. The unwritten bytes
retain the previous written value. Table 4–6 summarizes the byte
selection.
Table 4–6. Byte Enable for M4K Blocks Notes (1), (2)
byteena[3..0]
datain ×18
datain ×36
[0] = 1
[8..0]
[8..0]
[1] = 1
[17..9]
[17..9]
[2] = 1
–
[26..18]
[3] = 1
–
[35..27]
Notes to Table 4–6:
(1)
(2)
Any combination of byte enables is possible.
Byte enables can be used in the same manner with 8-bit words, that is, in ×16 and
×32 modes.
The M4K RAM blocks allow for different clocks on their inputs and
outputs. Either of the two clocks feeding the block can clock M4K RAM
block registers (renwe, address, byte enable, datain, and output
registers). Only the output register can be bypassed. The eight labclk
signals or local interconnects can drive the control signals for the A and B
ports of the M4K RAM block. LEs can also control the clock_a,
clock_b, renwe_a, renwe_b, clr_a, clr_b, clocken_a, and
clocken_b signals, as shown in Figure 4–16.
The R4, R8, C4, C8, and direct link interconnects from adjacent LABs
drive the M4K RAM block local interconnect. The M4K RAM blocks can
communicate with LABs on either the left or right side through these row
resources or with LAB columns on either the right or left with the column
resources. Up to 10 direct link input connections to the M4K RAM Block
are possible from the left adjacent LABs and another 10 possible from the
right adjacent LAB. M4K RAM block outputs can also connect to left and
right LABs through 10 direct link interconnects each. Figure 4–17 shows
the M4K RAM block to logic array interface.
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Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Stratix GX Architecture
Figure 4–16. M4K RAM Block Control Signals
Dedicated
Row LAB
Clocks
8
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
alcr_a
clocken_a
clock_b
renwe_b
Local
Interconnect
Local
Interconnect
clock_a
renwe_a
alcr_b
clocken_b
Figure 4–17. M4K RAM Block LAB Row Interface
C4 and C8
Interconnects
Direct link
interconnect
to adjacent LAB
R4 and R8
Interconnects
10
Direct link
interconnect
to adjacent LAB
dataout
Direct link
interconnect
from adjacent LAB
M4K RAM
Block
Direct link
interconnect
from adjacent LAB
Byte enable
Control
Signals
Clocks
address
datain
8
M4K RAM Block Local
Interconnect Region
Altera Corporation
February 2005
LAB Row Clocks
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Stratix GX Device Handbook, Volume 1
TriMatrix Memory
M-RAM Block
The largest TriMatrix memory block, the M-RAM block, is useful for
applications where a large volume of data must be stored on-chip. Each
block contains 589,824 RAM bits (including parity bits). The M-RAM
block can be configured in the following modes:
■
■
■
■
True dual-port RAM
Simple dual-port RAM
Single-port RAM
FIFO RAM
You cannot use an initialization file to initialize the contents of a M-RAM
block. All M-RAM block contents power up to an undefined value. Only
synchronous operation is supported in the M-RAM block, so all inputs
are registered. Output registers can be bypassed. The memory address
and output width can be configured as 64K × 8 (or 64K × 9 bits), 32K × 16
(or 32K × 18 bits), 16K × 32 (or 16K × 36 bits), 8K × 64 (or 8K × 72 bits), and
4K × 128 (or 4K × 144 bits). The 4K × 128 configuration is unavailable in
true dual-port mode because there are a total of 144 data output drivers
in the block. Mixed-width configurations are also possible, allowing
different read and write widths. Tables 4–7 and 4–8 summarize the
possible M-RAM block configurations:
Table 4–7. M-RAM Block Configurations (Simple Dual-Port)
Write Port
Read Port
64K × 9
32K × 18
16K × 36
8K × 72
64K × 9
v
v
v
v
32K × 18
v
v
v
v
16K × 36
v
v
v
v
8K × 72
v
v
v
v
4K × 144
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Stratix GX Device Handbook, Volume 1
4K × 144
v
Altera Corporation
February 2005
Stratix GX Architecture
Table 4–8. M-RAM Block Configurations (True Dual-Port)
Port B
Port A
64K × 9
32K × 18
16K × 36
8K × 72
64K × 9
v
v
v
v
32K × 18
v
v
v
v
16K × 36
v
v
v
v
8K × 72
v
v
v
v
The read and write operation of the memory is controlled by the WREN
signal, which sets the ports into either read or write modes. There is no
separate read enable (RE) signal.
Writing into RAM is controlled by both the WREN and byte enable
(byteena) signals for each port. The default value for the byteena
signal is high, in which case writing is controlled only by the WREN signal.
The byte enables are available for the ×18, ×36, and ×72 modes. In the
×144 simple dual-port mode, the two sets of byteena signals
(byteena_a and byteena_b) are combined to form the necessary
16 byte enables. Tables 4–9 and 4–10 summarize the byte selection.
Table 4–9. Byte Enable for M-RAM Blocks Notes (1), (2)
Altera Corporation
February 2005
byteena[3..0]
datain ×18
datain ×36
datain ×72
[0] = 1
[8..0]
[8..0]
[8..0]
[1] = 1
[17..9]
[17..9]
[17..9]
[2] = 1
–
[26..18]
[26..18]
[3] = 1
–
[35..27]
[35..27]
[4] = 1
–
–
[44..36]
[5] = 1
–
–
[53..45]
[6] = 1
–
–
[62..54]
[7] = 1
–
–
[71..63]
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Stratix GX Device Handbook, Volume 1
TriMatrix Memory
Table 4–10. M-RAM Combined Byte Selection for ×144 Mode Notes (1), (2)
byteena[15..0]
datain ×144
[0] = 1
[8..0]
[1] = 1
[17..9]
[2] = 1
[26..18]
[3] = 1
[35..27]
[4] = 1
[44..36]
[5] = 1
[53..45]
[6] = 1
[62..54]
[7] = 1
[71..63]
[8] = 1
[80..72]
[9] = 1
[89..81]
[10] = 1
[98..90]
[11] = 1
[107..99]
[12] = 1
[116..108]
[13] = 1
[125..117]
[14] = 1
[134..126]
[15] = 1
[143..135]
Notes to Tables 4–9 and 4–10:
(1)
(2)
Any combination of byte enables is possible.
Byte enables can be used in the same manner with 8-bit words, that is, in ×16, ×32,
×64, and ×128 modes.
Similar to all RAM blocks, M-RAM blocks can have different clocks on
their inputs and outputs. All input registers—renwe, datain, address,
and byte enable registers—are clocked together from either of the two
clocks feeding the block. The output register can be bypassed. The eight
labclk signals or local interconnect can drive the control signals for the
A and B ports of the M-RAM block. LEs can also control the clock_a,
clock_b, renwe_a, renwe_b, clr_a, clr_b, clocken_a, and
clocken_b signals as shown in Figure 4–18.
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February 2005
Stratix GX Architecture
Figure 4–18. M-RAM Block Control Signals
Dedicated
Row LAB
Clocks
8
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
clocken_b
clocken_a
clock_a
clock_b
renwe_b
aclr_b
aclr_a
renwe_a
One of the M-RAM block’s horizontal sides drive the address and control
signal (clock, renwe, byteena, etc.) inputs. Typically, the horizontal side
closest to the device perimeter contains the interfaces. The one exception
is when two M-RAM blocks are paired next to each other. In this case, the
side of the M-RAM block opposite the common side of the two blocks
contains the input interface. The top and bottom sides of any M-RAM
block contain data input and output interfaces to the logic array. The top
side has 72 data inputs and 72 data outputs for port B, and the bottom side
has another 72 data inputs and 72 data outputs for port A. Figure 4–19
shows an example floorplan for the EP1SGX40 device and the location of
the M-RAM interfaces.
Altera Corporation
February 2005
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Stratix GX Device Handbook, Volume 1
TriMatrix Memory
Figure 4–19. EP1SGX40 Device with M-RAM Interface Locations
Independent M-RAM blocks
interface to top, bottom, and side facing
device perimeter for easy access
to horizontal I/O pins.
M-RAM interface to
top, bottom, and side opposite
of block-to-block border.
DSP
Blocks
M512
Blocks
Note (1)
M-RAM
Block
M-RAM
Block
M-RAM
Block
M-RAM
Block
LABs
DSP
Blocks
Note to Figure 4–19:
(1)
Device shown is an EP1SGX40 device. The number and position of M-RAM blocks varies in other devices.
The M-RAM block local interconnect is driven by the R4, R8, C4, C8, and
direct link interconnects from adjacent LABs. For independent M-RAM
blocks, up to 10 direct link address and control signal input connections
to the M-RAM block are possible from the left adjacent LABs for M-RAM
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Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Stratix GX Architecture
blocks facing to the left, and another 10 possible from the right adjacent
LABs for M-RAM blocks facing to the right. For column interfacing, every
M-RAM column unit connects to the right and left column lines, allowing
each M-RAM column unit to communicate directly with three columns of
LABs. Figures 4–20 through 4–22 show the interface between the M-RAM
block and the logic array.
Altera Corporation
February 2005
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Stratix GX Device Handbook, Volume 1
TriMatrix Memory
Figure 4–20. Left-Facing M-RAM to Interconnect Interface
Notes (1), (2)
M512 RAM Block Columns
Row Unit Interface
Allows LAB Rows to
Drive Address and
Control Signals to
M-RAM Block
LABs in Column
M-RAM Boundary
Column Interface Block
Drives to and from
C4 and C8 Interconnects
B1
B2
B3
B4
B5
B6
A4
A5
A6
Port B
R11
R10
R9
R8
R7
M-RAM Block
R6
R5
R4
R3
R2
R1
Port A
A1
A2
A3
Column Interface Block
Allows LAB Columns to
Drive datain and dataout to
and from M-RAM Block
LABs in Row
M-RAM Boundary
LAB Interface
Blocks
Notes to Figure 4–20:
(1)
(2)
Only R24 and C16 interconnects cross the M-RAM block boundaries.
The right-facing M-RAM block has interface blocks on the right side, but none on the left. B1 to B6 and A1 to A6
orientation is clipped across the vertical axis for right-facing M-RAM blocks.
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Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Stratix GX Architecture
Figure 4–21. M-RAM Row Unit Interface to Interconnect
C4 and C8 Interconnects
R4 and R8 Interconnects
M-RAM Block
LAB
10
Direct Link
Interconnects
Up to 24
addressa
addressb
renwe_a
renwe_b
byteenaA[ ]
byteenaB[ ]
clocken_a
clocken_b
clock_a
clock_b
aclr_a
aclr_b
Row Interface Block
M-RAM Block to
LAB Row Interface
Block Interconnect Region
Altera Corporation
February 2005
4–37
Stratix GX Device Handbook, Volume 1
TriMatrix Memory
Figure 4–22. M-RAM Column Unit Interface to Interconnect
C4 and C8 Interconnects
LAB
LAB
LAB
M-RAM Block to
LAB Row Interface
Block Interconnect
Region
Column Interface
Block
12
12
datain
dataout
M-RAM Block
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Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Stratix GX Architecture
Table 4–11 shows the input and output data signal connections for the
column units (B1 to B6 and A1 to A6). It also shows the address and
control signal input connections to the row units (R1 to R11).
Table 4–11. M-RAM Row & Column Interface Unit Signals
Altera Corporation
February 2005
Unit Interface Block
Input SIgnals
R1
addressa[7..0]
R2
addressa[15..8]
R3
byte_enable_a[7..0]
renwe_a
R4
-
R5
-
R6
clock_a
clocken_a
clock_b
clocken_b
R7
-
R8
-
R9
byte_enable_b[7..0]
renwe_b
R10
addressb[15..8]
Output Signals
R11
addressb[7..0]
B1
datain_b[71..60]
dataout_b[71..60]
B2
datain_b[59..48]
dataout_b[59..48]
B3
datain_b[47..36]
dataout_b[47..36]
B4
datain_b[35..24]
dataout_b[35..24]
B5
datain_b[23..12]
dataout_b[23..12]
B6
datain_b[11..0]
dataout_b[11..0]
A1
datain_a[71..60]
dataout_a[71..60]
A2
datain_a[59..48]
dataout_a[59..48]
A3
datain_a[47..36]
dataout_a[47..36]
A4
datain_a[35..24]
dataout_a[35..24]
A5
datain_a[23..12]
dataout_a[23..12]
A6
datain_a[11..0]
dataout_a[11..0]
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Stratix GX Device Handbook, Volume 1
TriMatrix Memory
Independent Clock Mode
The memory blocks implement independent clock mode for true dualport memory. In this mode, a separate clock is available for each port
(ports A and B). Clock A controls all registers on the port A side, while
clock B controls all registers on the port B side. Each port, A and B, also
supports independent clock enables and asynchronous clear signals for
port A and B registers. Figure 4–23 shows a TriMatrix memory block in
independent clock mode.
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Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
(1)
Altera Corporation
February 2005
clockA
clkenA
8
ENA
D
ENA
D
ENA
D
ENA
D
Q
Q
Q
Q
Write
Pulse
Generator
Q
Data Out
Write/Read
Enable
Address A
qA[ ]
B
Data In
qB[ ]
Q
D
ENA
Data Out
Write/Read
Enable
Address B
Byte Enable B
Memory Block
256 ´ 16 (2)
512 ´ 8
1,024 ´ 4
2,048 ´ 2
4,096 ´ 1
Byte Enable A
ENA
D
A
Data In
Write
Pulse
Generator
Q
Q
Q
Q
D
ENA
D
ENA
D
ENA
D
ENA
8
clockB
clkenB
wrenB
addressB[ ]
byteenaB[ ]
dataB[ ]
Figure 4–23. Independent Clock Mode
wrenA
addressA[ ]
byteenaA[ ]
dataA[ ]
8 LAB Row Clocks
Stratix GX Architecture
Note (1)
Note to Figure 4–23:
All registers shown have asynchronous clear ports.
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Stratix GX Device Handbook, Volume 1
TriMatrix Memory
Input/Output Clock Mode
Input/output clock mode can be implemented for both the true and
simple dual-port memory modes. On each of the two ports, A or B, one
clock controls all registers for inputs into the memory block: data input,
wren, and address. The other clock controls the block’s data output
registers. Each memory block port, A or B, also supports independent
clock enables and asynchronous clear signals for input and output
registers. Figures 4–24 and 4–25 show the memory block in input/output
clock mode.
4–42
Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
(1)
Altera Corporation
February 2005
clockA
clkenA
wrenA
addressA[ ]
byteenaA[ ]
dataA[ ]
8
ENA
D
ENA
D
ENA
D
ENA
D
8 LAB Row Clocks
Q
Q
Q
Q
Write
Pulse
Generator
Q
Data Out
Write/Read
Enable
Address A
ENA
D
A
qA[ ]
Data In
B
qB[ ]
Q
D
ENA
Data Out
Write/Read
Enable
Address B
Byte Enable B
Memory Block
256 × 16 (2)
512 × 8
1,024 × 4
2,048 × 2
4,096 × 1
Byte Enable A
Data In
Write
Pulse
Generator
Q
Q
Q
Q
ENA
D
ENA
D
ENA
D
ENA
D
8
clockB
clkenB
wrenB
addressB[ ]
byteenaB[ ]
dataB[ ]
Stratix GX Architecture
Figure 4–24. Input/Output Clock Mode in True Dual-Port Mode
Note (1)
Note to Figure 4–24:
All registers shown have asynchronous clear ports.
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Stratix GX Device Handbook, Volume 1
TriMatrix Memory
Figure 4–25. Input/Output Clock Mode in Simple Dual-Port Mode
Note (1)
8 LAB Row
Clocks
Memory Block
256 ´ 16
512 ´ 8
1,024 ´ 4
2,048 ´ 2
4,096 ´ 1
8
data[ ]
D
Q
ENA
Data In
address[ ]
D
Q
ENA
Read Address
Data Out
byteena[ ]
D
Q
ENA
Byte Enable
wraddress[ ]
D
Q
ENA
Write Address
D
Q
ENA
Read Enable
D
Q
ENA
To MultiTrack
Interconnect
rden
wren
outclken
D
Q
ENA
inclken
wrclock
Write
Pulse
Generator
Write Enable
rdclock
Note to Figure 4–25:
(1)
All registers shown except the rden register have asynchronous clear ports.
Read/Write Clock Mode
The memory blocks implement read/write clock mode for simple dualport memory. You can use up to two clocks in this mode. The write clock
controls the block’s data inputs, wraddress, and wren. The read clock
controls the data output, rdaddress, and rden. The memory blocks
support independent clock enables for each clock and asynchronous clear
signals for the read- and write-side registers. Figure 4–26 shows a
memory block in read/write clock mode.
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Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Stratix GX Architecture
Figure 4–26. Read/Write Clock Mode in Simple Dual-Port Mode
8 LAB Row
Clocks
Memory Block
256 × 16
512 × 8
1,024 × 4
Data In
2,048 × 2
4,096 × 1
8
data[ ]
Note (1)
D
Q
ENA
Data Out
address[ ]
D
Q
ENA
Read Address
wraddress[ ]
D
Q
ENA
Write Address
byteena[ ]
D
Q
ENA
Byte Enable
D
Q
ENA
Read Enable
D
Q
ENA
To MultiTrack
Interconnect
rden
wren
outclken
inclken
D
Q
ENA
wrclock
Write
Pulse
Generator
Write Enable
rdclock
Note to Figure 4–26:
(1)
All registers shown except the rden register have asynchronous clear ports.
Single-Port Mode
The memory blocks also support single-port mode, used when
simultaneous reads and writes are not required. See Figure 4–27. A single
block in a memory block can support up to two single-port mode RAM
blocks in the M4K RAM blocks if each RAM block is less than or equal to
2K bits in size.
Altera Corporation
February 2005
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Stratix GX Device Handbook, Volume 1
Digital Signal Processing Block
Figure 4–27. Single-Port Mode
8 LAB Row
Clocks
RAM/ROM
256 × 16
512 × 8
1,024 × 4
Data In
2,048 × 2
4,096 × 1
8
data[ ]
D
Q
ENA
Data Out
address[ ]
D
Q
ENA
Address
D
Q
ENA
To MultiTrack
Interconnect
wren
Write Enable
outclken
D
Q
ENA
inclken
inclock
Write
Pulse
Generator
outclock
Digital Signal
Processing
Block
The most commonly used DSP functions are finite impulse response (FIR)
filters, complex FIR filters, infinite impulse response (IIR) filters, fast
Fourier transform (FFT) functions, direct cosine transform (DCT)
functions, and correlators. All of these blocks have the same fundamental
building block: the multiplier. Additionally, some applications need
specialized operations such as multiply-add and multiply-accumulate
operations. Stratix GX devices provide DSP blocks to meet the arithmetic
requirements of these functions.
Each Stratix GX device has two columns of DSP blocks to efficiently
implement DSP functions faster than LE-based implementations. Larger
Stratix GX devices have more DSP blocks per column (see Table 4–12).
Each DSP block can be configured to support up to:
■
■
■
Eight 9 × 9-bit multipliers
Four 18 × 18-bit multipliers
One 36 × 36-bit multiplier
As indicated, the Stratix GX DSP block can support one 36 × 36-bit
multiplier in a single DSP block. This is true for any matched sign
multiplications (either unsigned by unsigned or signed by signed), but
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Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Stratix GX Architecture
the capabilities for dynamic and mixed sign multiplications are handled
differently. The following list provides the largest functions that can fit
into a single DSP block.
■
■
■
■
■
■
■
■
■
■
1
36 × 36-bit unsigned by unsigned multiplication
36 × 36-bit signed by signed multiplication
35 × 36-bit unsigned by signed multiplication
36 × 35-bit signed by unsigned multiplication
36 × 35-bit signed by dynamic sign multiplication
35 × 36-bit dynamic sign by signed multiplication
35 × 36-bit unsigned by dynamic sign multiplication
36 × 35-bit dynamic sign by unsigned multiplication
35 × 35-bit dynamic sign multiplication when the sign controls for
each operand are different
36 × 36-bit dynamic sign multiplication when the same sign control
is used for both operands
This list only shows functions that can fit into a single DSP block.
Multiple DSP blocks can support larger multiplication
functions.
Figure 4–28 shows one of the columns with surrounding LAB rows.
Altera Corporation
February 2005
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Stratix GX Device Handbook, Volume 1
Digital Signal Processing Block
Figure 4–28. DSP Blocks Arranged in Columns
DSP Block
Column
8 LAB
Rows
4–48
Stratix GX Device Handbook, Volume 1
DSP Block
Altera Corporation
February 2005
Stratix GX Architecture
Table 4–12 shows the number of DSP blocks in each Stratix GX device.
Table 4–12. DSP Blocks in Stratix GX Devices
Device
Notes (1), (2)
DSP Blocks
Total 9 × 9
Multipliers
Total 18 × 18
Multipliers
Total 36 × 36
Multipliers
6
48
24
6
EP1SGX10
EP1SGX25
10
80
40
10
EP1SGX40
14
112
56
14
Notes to Table 4–12:
(1)
(2)
Each device has either the number of 9 × 9-, 18 × 18-, or 36 × 36-bit multipliers
shown. The total number of multipliers for each device is not the sum of all the
multipliers.
The number of supported multiply functions shown is based on signed/signed
or unsigned/unsigned implementations.
DSP block multipliers can optionally feed an adder/subtractor or
accumulator within the block depending on the configuration. This
makes routing to LEs easier, saves LE routing resources, and increases
performance, because all connections and blocks are within the DSP
block. Additionally, the DSP block input registers can efficiently
implement shift registers for FIR filter applications.
Figure 4–29 shows the top-level diagram of the DSP block configured for
18 × 18-bit multiplier mode. Figure 4–30 shows the 9 × 9-bit multiplier
configuration of the DSP block.
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February 2005
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Digital Signal Processing Block
Figure 4–29. DSP Block Diagram for 18 × 18-Bit Configuration
Optional Serial Shift Register
Inputs from Previous
DSP Block
Multiplier Stage
D
Optional Stage Configurable
as Accumulator or Dynamic
Adder/Subtractor
Q
ENA
CLRN
D
D
ENA
CLRN
Q
Output Selection
Multiplexer
Q
ENA
CLRN
Adder/
Subtractor/
Accumulator
1
D
Q
ENA
CLRN
D
D
ENA
CLRN
Q
Q
ENA
CLRN
Summation
D
Q
ENA
CLRN
D
D
ENA
CLRN
Q
Q
Summation Stage
for Adding Four
Multipliers Together
Optional Output
Register Stage
ENA
CLRN
Adder/
Subtractor/
Accumulator
2
D
Optional Serial
Shift Register
Outputs to
Next DSP Block
in the Column
Q
ENA
CLRN
D
D
ENA
CLRN
Q
ENA
CLRN
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Stratix GX Device Handbook, Volume 1
Q
Optional Pipeline
Register Stage
Optional Input Register
Stage with Parallel Input or
Shift Register Configuration
to MultiTrack
Interconnect
Altera Corporation
February 2005
Stratix GX Architecture
Figure 4–30. DSP Block Diagram for 9 × 9-Bit Configuration
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
Adder/
Subtractor/
1a
CLRN
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
CLRN
Summation
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
Adder/
Subtractor/
1b
CLRN
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
Output
Selection
Multiplexer
CLRN
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
D
Q
ENA
CLRN
Adder/
Subtractor/
2a
CLRN
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
CLRN
Summation
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
Adder/
Subtractor/
2b
CLRN
D
Q
ENA
CLRN
D
Q
ENA
D
Q
ENA
CLRN
CLRN
To MultiTrack
Interconnect
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February 2005
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Digital Signal Processing Block
The DSP block consists of the following elements:
■
■
Multiplier block
Adder/output block
Multiplier Block
The DSP block multiplier block consists of the input registers, a
multiplier, and pipeline register for pipelining multiply-accumulate and
multiply-add/subtract functions as shown in Figure 4–31.
Figure 4–31. Multiplier Sub-Block Within Stratix GX DSP Block
sign_a (1)
sign_b (1)
aclr[3..0]
clock[3..0]
ena[3..0]
shiftin A
shiftin B
D
Data A
Q
ENA
CLRN
D
ENA
Q
CLRN
D
Data B
Q
ENA
Result
to Adder
blocks
Optional
Multiply-Accumulate
and Multiply-Add
Pipeline
CLRN
shiftout B
shiftout A
Note to Figure 4–31:
(1)
These signals can be unregistered or registered once to match data path pipelines if required.
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Stratix GX Architecture
Input Registers
A bank of optional input registers is located at the input of each multiplier
and multiplicand inputs to the multiplier. When these registers are
configured for parallel data inputs, they are driven by regular routing
resources. You can use a clock signal, asynchronous clear signal, and a
clock enable signal to independently control each set of A and B inputs for
each multiplier in the DSP block. You select these control signals from a
set of four different clock[3..0], aclr[3..0], and ena[3..0]
signals that drive the entire DSP block.
You can also configure the input registers for a shift register application.
In this case, the input registers feed the multiplier and drive two
dedicated shift output lines: shiftoutA and shiftoutB. The shift
outputs of one multiplier block directly feed the adjacent multiplier block
in the same DSP block (or the next DSP block) as shown in Figure 4–32, to
form a shift register chain. This chain can terminate in any block, that is,
you can create any length of shift register chain up to 224 registers. You
can use the input shift registers for FIR filter applications. One set of shift
inputs can provide data for a filter, and the other are coefficients that are
optionally loaded in serial or parallel. When implementing 9 × 9- and 18
× 18-bit multipliers, you do not need to implement external shift registers
in LAB LEs. You implement all the filter circuitry within the DSP block
and its routing resources, saving LE and general routing resources for
general logic. External registers are needed for shift register inputs when
using 36 × 36-bit multipliers.
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February 2005
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Digital Signal Processing Block
Figure 4–32. Multiplier Sub-Blocks Using Input Shift Register Connections
Data A
D
Note (1)
Q
ENA
A[n] × B[n]
CLRN
Data B
D
Q
D
ENA
Q
CLRN
ENA
CLRN
Data B
Data A
D
Q
ENA
A[n Ð 1] × B[n Ð 1]
CLRN
D
Q
D
ENA
Q
CLRN
ENA
CLRN
Data B
Data A
D
Q
ENA
A[n Ð 2] × B[n Ð 2]
CLRN
D
Q
D
ENA
Q
CLRN
ENA
CLRN
Note to Figure 4–32:
(1)
Either Data A or Data B input can be set to a parallel input for constant coefficient multiplication.
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Stratix GX Architecture
Table 4–13 shows the summary of input register modes for the DSP block.
Table 4–13. Input Register Modes
9×9
18 × 18
36 × 36
Parallel input
v
v
v
Shift register input
v
v
Register Input Mode
Multiplier
The multiplier supports 9 × 9-, 18 × 18-, or 36 × 36-bit multiplication. Each
DSP block supports eight possible 9 × 9-bit or smaller multipliers. There
are four multiplier blocks available for multipliers larger than 9 × 9 bits
but smaller than 18 × 18 bits. There is one multiplier block available for
multipliers larger than 18 × 18 bits but smaller than or equal to 36 × 36 bits.
The ability to have several small multipliers is useful in applications such
as video processing. Large multipliers greater than 18 × 18 bits are useful
for applications such as the mantissa multiplication of a single-precision
floating-point number.
The multiplier operands can be signed or unsigned numbers, where the
result is signed if either input is signed as shown in Table 4–14. The
sign_a and sign_b signals provide dynamic control of each operand’s
representation: a logic 1 indicates the operand is a signed number, a logic
0 indicates the operand is an unsigned number. These sign signals affect
all multipliers and adders within a single DSP block and you can register
them to match the data path pipeline. The multipliers are full precision
(that is, 18 bits for the 18-bit multiply, 36-bits for the 36-bit multiply, and
so on), regardless of whether sign_a or sign_b set the operands as
signed or unsigned numbers.
Table 4–14. Multiplier Signed Representation
Altera Corporation
February 2005
Data A
Data B
Result
Unsigned
Unsigned
Unsigned
Unsigned
Signed
Signed
Signed
Unsigned
Signed
Signed
Signed
Signed
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Digital Signal Processing Block
Pipeline/Post Multiply Register
The output of 9 × 9- or 18 × 18-bit multipliers can optionally feed a register
to pipeline multiply-accumulate and multiply-add/subtract functions.
For 36 × 36-bit multipliers, this register pipelines the multiplier function.
Adder/Output Blocks
The result of the multiplier sub-blocks are sent to the adder/output block
which consist of an adder/subtractor/accumulator unit, summation unit,
output select multiplexer, and output registers. The results are used to
configure the adder/output block as a pure output, accumulator, a simple
two-multiplier adder, four-multiplier adder, or final stage of the 36-bit
multiplier. You can configure the adder/output block to use output
registers in any mode, and must use output registers for the accumulator.
The system cannot use adder/output blocks independently of the
multiplier. Figure 4–33 shows the adder and output stages.
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Stratix GX Architecture
Figure 4–33. Adder/Output Blocks
Note (1)
Accumulator Feedback
accum_sload0 (2)
Result A
addnsub1 (2)
overflow0
Adder/
Subtractor/
Accumulator1
Output Selection
Multiplexer
Result B
signa (2)
Summation
Output
Register Block
signb (2)
Result C
addnsub3 (2)
Adder/
Subtractor/
Accumulator2
overflow1
Result D
accum_sload1 (2)
Accumulator Feedback
Notes to Figure 4–33:
(1)
(2)
Adder/output block shown in Figure 4–33 is in 18 × 18-bit mode. In 9 × 9-bit mode, there are four adder/subtractor
blocks and two summation blocks.
These signals are either not registered, registered once, or registered twice to match the data path pipeline.
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February 2005
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Digital Signal Processing Block
Adder/Subtractor/Accumulator
The adder/subtractor/accumulator is the first level of the adder/output
block and can be used as an accumulator or as an adder/subtractor.
Adder/Subtractor
Each adder/subtractor/accumulator block can perform addition or
subtraction using the addnsub independent control signal for each firstlevel adder in 18 × 18-bit mode. There are two addnsub[1..0] signals
available in a DSP block for any configuration. For 9 × 9-bit mode, one
addnsub[1..0] signal controls the top two one-level adders and
another addnsub[1..0] signal controls the bottom two one-level
adders. A high addnsub signal indicates addition, and a low signal
indicates subtraction. The addnsub control signal can be unregistered or
registered once or twice when feeding the adder blocks to match data
path pipelines.
The signa and signb signals serve the same function as the multiplier
block signa and signb signals. The only difference is that these signals
can be registered up to two times. These signals are tied to the same
signa and signb signals from the multiplier and must be connected to
the same clocks and control signals.
Accumulator
When configured for accumulation, the adder/output block output feeds
back to the accumulator as shown in Figure 4–33. The
accum_sload[1..0] signal synchronously loads the multiplier result
to the accumulator output. This signal can be unregistered or registered
once or twice. Additionally, the overflow signal indicates the
accumulator has overflowed or underflowed in accumulation mode. This
signal is always registered and must be externally latched in LEs if the
design requires a latched overflow signal.
Summation
The output of the adder/subtractor/accumulator block feeds to an
optional summation block. This block sums the outputs of the DSP block
multipliers. In 9 × 9-bit mode, there are two summation blocks providing
the sums of two sets of four 9 × 9-bit multipliers. In 18 × 18-bit mode, there
is one summation providing the sum of one set of four 18 × 18-bit
multipliers.
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Stratix GX Architecture
Output Selection Multiplexer
The outputs from the various elements of the adder/output block are
routed through an output selection multiplexer. Based on the DSP block
operational mode and user settings, the multiplexer selects whether the
output from the multiplier, the adder/subtractor/accumulator, or
summation block feeds to the output.
Output Registers
Optional output registers for the DSP block outputs are controlled by four
sets of control signals: clock[3..0], aclr[3..0], and ena[3..0].
Output registers can be used in any mode.
Modes of Operation
The adder, subtractor, and accumulate functions of a DSP block have four
modes of operation:
■
■
■
■
1
Simple multiplier
Multiply-accumulator
Two-multipliers adder
Four-multipliers adder
Each DSP block can only support one mode. Mixed modes in the
same DSP block is not supported.
Simple Multiplier Mode
In simple multiplier mode, the DSP block drives the multiplier sub-block
result directly to the output with or without an output register. Up to four
18 × 18-bit multipliers or eight 9 × 9-bit multipliers can drive their results
directly out of one DSP block. See Figure 4–34.
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Figure 4–34. Simple Multiplier Mode
signa (1)
signb (1)
aclr
clock
ena
shiftin A
shiftin B
D
Data A
Q
Data Out
ENA
CLRN
D
ENA
Q
D
ENA
Q
CLRN
CLRN
D
Data B
Q
ENA
CLRN
shiftout B
shiftout A
Note to Figure 4–34:
(1)
These signals are not registered or registered once to match the data path pipeline.
DSP blocks can also implement one 36 × 36-bit multiplier in multiplier
mode. DSP blocks use four 18 × 18-bit multipliers combined with
dedicated adder and internal shift circuitry to achieve 36-bit
multiplication. The input shift register feature is not available for the
36 × 36-bit multiplier. In 36 × 36-bit mode, the device can use the register
that is normally a multiplier-result-output register as a pipeline stage for
the 36 × 36-bit multiplier. Figure 4–35 shows the 36 × 36-bit multiply
mode.
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Stratix GX Architecture
Figure 4–35. 36 × 36 Multiply Mode
signa (1)
signb (1)
aclr
clock
ena
A[17..0]
D
Q
ENA
CLRN
D
ENA
Q
CLRN
B[17..0]
D
Q
ENA
CLRN
A[35..18]
D
Q
D
ENA
ENA
CLRN
D
ENA
Q
36 × 36
Multiplier
Adder
CLRN
B[35..18]
D
Q
Data Out
CLRN
Q
signa (2)
ENA
signb (2)
CLRN
A[35..18]
D
Q
ENA
CLRN
D
ENA
Q
CLRN
B[17..0]
D
Q
ENA
CLRN
A[17..0]
D
Q
ENA
CLRN
D
ENA
Q
CLRN
B[35..18]
D
Q
ENA
CLRN
Notes to Figure 4–35:
(1)
(2)
These signals are not registered or registered once to match the pipeline.
These signals are not registered, registered once, or registered twice for latency to match the pipeline.
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February 2005
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Digital Signal Processing Block
Multiply-Accumulator Mode
In multiply-accumulator mode (see Figure 4–36), the DSP block drives
multiplied results to the adder/subtractor/accumulator block configured
as an accumulator. You can implement one or two multiply-accumulators
up to 18 × 18 bits in one DSP block. The first and third multiplier subblocks are unused in this mode, since only one multiplier can feed one of
two accumulators. The multiply-accumulator output can be up to 52
bits—a maximum of a 36-bit result with 16 bits of accumulation. The
accum_sload and overflow signals are only available in this mode.
The addnsub signal can set the accumulator for decimation and the
overflow signal indicates underflow condition.
Figure 4–36. Multiply-Accumulate Mode
signa (1)
signb (1)
aclr
clock
ena
Shiftin A
Shiftin B
D
Data A
Q
ENA
D
ENA
CLRN
Q
Accumulator
D
ENA
Q
Data Out
CLRN
CLRN
D
Data B
Q
overflow
ENA
CLRN
Shiftout B
addnsub (2)
signa (2)
signb (2)
accum_sload (2)
Shiftout A
Notes to Figure 4–36:
(1)
(2)
These signals are not registered or registered once to match the data path pipeline.
These signals are not registered, registered once, or registered twice for latency to match the data path pipeline.
Two-Multipliers Adder Mode
The two-multipliers adder mode uses the adder/subtractor/accumulator
block to add or subtract the outputs of the multiplier block, which is
useful for applications such as FFT functions and complex FIR filters. A
single DSP block can implement two sums or differences from two
18 × 18-bit multipliers each or four sums or differences from two 9 × 9-bit
multipliers each.
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Stratix GX Architecture
You can use the two-multipliers adder mode for complex multiplications,
which are written as:
(a + jb) × (c + jd) = [(a × c) – (b × d)] + j × [(a × d) + (b × c)]
The two-multipliers adder mode allows a single DSP block to calculate
the real part [(a × c) – (b × d)] using one subtractor and the imaginary part
[(a × d) + (b × c)] using one adder, for data widths up to 18 bits. Two
complex multiplications are possible for data widths up to 9 bits using
four adder/subtractor/accumulator blocks. Figure 4–37 shows an 18-bit
two-multipliers adder.
Figure 4–37. Two-Multipliers Adder Mode Implementing Complex Multiply
18
DSP Block
18
A
36
18
18
C
18
37
(A × C) − (B × D)
(Real Part)
Subtractor
18
B
36
18
18
D
18
A
36
18
D
37
Adder
18
B
(A × D) + (B × C)
(Imaginary Part)
36
18
C
Four-Multipliers Adder Mode
In the four-multipliers adder mode, the DSP block adds the results of two
first -stage adder/subtractor blocks. One sum of four 18 × 18-bit
multipliers or two different sums of two sets of four 9 × 9-bit multipliers
can be implemented in a single DSP block. The product width for each
multiplier must be the same size. The four-multipliers adder mode is
useful for FIR filter applications. Figure 4–38 shows the four multipliers
adder mode.
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February 2005
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Digital Signal Processing Block
Figure 4–38. Four-Multipliers Adder Mode
signa (1)
signb (1)
aclr
clock
ena
shiftin A
shiftin B
D
Data A
Q
ENA
CLRN
D
ENA
Q
Adder/Subtractor
CLRN
D
Data B
Q
ENA
CLRN
D
Data A
Q
D
ENA
ENA
CLRN
D
ENA
Q
CLRN
D
Data B
Q
addnsub1 (2)
signa (2)
signb (2)
Q
Data Out
Summation
CLRN
addnsub3 (2)
ENA
CLRN
D
Data A
Q
ENA
CLRN
D
ENA
Q
Adder/Subtractor
CLRN
D
Data B
Q
ENA
CLRN
D
Data A
Q
ENA
CLRN
D
ENA
Q
CLRN
D
Data B
Q
ENA
CLRN
shiftout B
shiftout A
Notes to Figure 4–38:
(1)
(2)
These signals are not registered or registered once to match the data path pipeline.
These signals are not registered, registered once, or registered twice for latency to match the data path pipeline.
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Stratix GX Architecture
For FIR filters, the DSP block combines the four-multipliers adder mode
with the shift register inputs. One set of shift inputs contains the filter
data, while the other holds the coefficients loaded in serial or parallel. The
input shift register eliminates the need for shift registers external to the
DSP block (that is, implemented in LEs). This architecture simplifies filter
design since the DSP block implements all of the filter circuitry.
One DSP block can implement an entire 18-bit FIR filter with up to four
taps. For FIR filters larger than four taps, DSP blocks can be cascaded with
additional adder stages implemented in LEs.
Table 4–15 shows the different number of multipliers possible in each
DSP block mode according to size. These modes allow the DSP blocks to
implement numerous applications for DSP including FFTs, complex FIR,
FIR, and 2D FIR filters, equalizers, IIR, correlators, matrix multiplication
and many other functions.
Table 4–15. Multiplier Size & Configurations per DSP block
DSP Block Mode
9×9
18 × 18
36 × 36 (1)
Multiplier
Eight multipliers with
eight product outputs
Four multipliers with four
product outputs
One multiplier with one
product output
Multiply-accumulator
Two multiply and
accumulate (52 bits)
Two multiply and
accumulate (52 bits)
–
Two-multipliers adder
Four sums of two
multiplier products each
Two sums of two
multiplier products each
–
Four-multipliers adder
Two sums of four
multiplier products each
One sum of four multiplier
products each
–
Note to Table 4–15:
(1)
The number of supported multiply functions shown is based on signed/signed or unsigned/unsigned
implementations.
DSP Block Interface
Stratix GX device DSP block outputs can cascade down within the same
DSP block column. Dedicated connections between DSP blocks provide
fast connections between the shift register inputs to cascade the shift
register chains. You can cascade DSP blocks for 9 × 9- or 18 × 18-bit FIR
filters larger than four taps, with additional adder stages implemented in
LEs. If the DSP block is configured as 36 × 36 bits, the adder, subtractor, or
accumulator stages are implemented in LEs. Each DSP block can route the
shift register chain out of the block to cascade two full columns of DSP
blocks.
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February 2005
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Digital Signal Processing Block
The DSP block is divided into eight block units that interface with eight
LAB rows on the left and right. Each block unit can be considered half of
an 18 × 18-bit multiplier sub-block with 18 inputs and 18 outputs. A local
interconnect region is associated with each DSP block. Like an LAB, this
interconnect region can be fed with 10 direct link interconnects from the
LAB to the left or right of the DSP block in the same row. All row and
column routing resources can access the DSP block’s local interconnect
region. The outputs also work similarly to LAB outputs as well. Nine
outputs from the DSP block can drive to the left LAB through direct link
interconnects and nine can drive to the right LAB though direct link
interconnects. All 18 outputs can drive to all types of row and column
routing. Outputs can drive right- or left-column routing. Figures 4–39
and 4–40 show the DSP block interfaces to LAB rows.
Figure 4–39. DSP Block Interconnect Interface
DSP Block
MultiTrack
Interconnect
OA[17..0]
MultiTrack
Interconnect
A1[17..0]
OB[17..0]
B1[17..0]
OC[17..0]
A2[17..0]
OD[17..0]
B2[17..0]
OE[17..0]
A3[17..0]
OF[17..0]
B3[17..0]
OG[17..0]
A4[17..0]
OH[17..0]
B4[17..0]
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Stratix GX Architecture
Figure 4–40. DSP Block Interface to Interconnect
C4 and C8
Interconnects
Direct Link Interconnect
from Adjacent LAB
R4 and R8 Interconnects
Nine Direct Link Outputs
to Adjacent LABs
Direct Link Interconnect
from Adjacent LAB
18
DSP Block
Row Structure
LAB
10
LAB
9
9
10
3
Control
18
18
[17..0]
[17..0]
Row Interface
Block
DSP Block to
LAB Row Interface
Block Interconnect Region
18 Inputs per Row
18 Outputs per Row
A bus of 18 control signals feeds the entire DSP block. These signals
include clock[0..3] clocks, aclr[0..3] asynchronous clears,
ena[1..4] clock enables, signa, signb signed/unsigned control
signals, addnsub1 and addnsub3 addition and subtraction control
signals, and accum_sload[0..1] accumulator synchronous loads. The
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PLLs & Clock Networks
clock signals are routed from LAB row clocks and are generated from
specific LAB rows at the DSP block interface. The LAB row source for
control signals, data inputs, and outputs is shown in Table 4–16.
Table 4–16. DSP Block Signal Sources & Destinations
LAB Row at
Interface
PLLs & Clock
Networks
Control Signals
Generated
Data Inputs
Data Outputs
1
signa
A1[17..0]
OA[17..0]
2
aclr0
accum_sload0
B1[17..0]
OB[17..0]
3
addnsub1
clock0
ena0
A2[17..0]
OC[17..0]
4
aclr1
clock1
ena1
B2[17..0]
OD[17..0]
5
aclr2
clock2
ena2
A3[17..0]
OE[17..0]
6
sign_b
clock3
ena3
B3[17..0]
OF[17..0]
7
clear3
accum_sload1
A4[17..0]
OG[17..0]
8
addnsub3
B4[17..0]
OH[17..0]
Stratix GX devices provide a hierarchical clock structure and multiple
PLLs with advanced features. The large number of clocking resources in
combination with the clock synthesis precision provided by enhanced
and fast PLLs provides a complete clock management solution.
Stratix GX devices contain up to four enhanced PLLs and up to four fast
PLLs. In addition, there are four receiver PLLs and one transmitter PLL
per transceiver block located on the right side of Stratix GX devices.
Global & Hierarchical Clocking
Stratix GX devices provide 16 dedicated global clock networks,
16 regional clock networks (four per device quadrant), 8 dedicated fast
regional clock networks within EP1SGX10 and EP1SGX25, and 16
dedicated fast regional clock networks within EP1SGX40 devices.
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These clocks are organized into a hierarchical clock structure that allows
for up to 22 clocks per device region with low skew and delay. This
hierarchical clocking scheme provides up to 40 unique clock domains
within EP1SGX10 and EP1SGX25 devices, and 48 unique clock domains
within EP1SGX40 devices.
There are 12 dedicated clock pins (CLK[15..12], and CLK[7..0]) to
drive either the global or regional clock networks. Three clock pins drive
the top, bottom, and left side of the device. Enhanced and fast PLL
outputs as well as an I/O interface can also drive these global and
regional clock networks.
There are up to 20 recovered clocks (rxclkout[20..0]) and up to
5 transmitter clock outputs (coreclk_out) which can drive any of the
global clock networks (CLK[15..0]), as shown in Figure 4–41.
Global Clock Network
These clocks drive throughout the entire device, feeding all device
quadrants. The global clock networks can be used as clock sources for all
resources within the device IOEs, LEs, DSP blocks, and all memory
blocks. These resources can also be used for control signals, such as clock
enables and synchronous or asynchronous clears fed from the external
pin. The global clock networks can also be driven by internal logic for
internally generated global clocks and asynchronous clears, clock
enables, or other control signals with large fanout. Figure 4–41 shows the
12 dedicated CLK pins and the transceiver clocks driving global clock
networks.
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Figure 4–41. Global Clock Resources
CLK[15..12]
CLK[3..0]
Global Clock [15..0]
Transceiver
Clocks
CLK[7..4]
Regional Clock Network
There are four regional clock networks RCLK[3..0] within each
quadrant of the Stratix GX device that are driven by the same dedicated
CLK[7..0] and CLK[15..12] input pins, PLL outputs, or transceiver
clocks. The regional clock networks only pertain to the quadrant they
drive into. The regional clock networks provide the lowest clock delay
and skew for logic contained within a single quadrant. The CLK clock pins
symmetrically drive the RCLK networks within a particular quadrant, as
shown in Figure 4–42.
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Figure 4–42. Regional Clocks
RCLK[15..14]
RCLK[13..12]
CLK[15..12]
RCLK[1..0]
RCLK[11..10]
CLK[3..0]
Transceiver
Clocks
RCLK[3..2]
RCLK[9..8]
CLK[7..4]
RCLK[5..4]
RCLK[7..6]
Regional Clocks Only Drive a Device
Quadrant from Specified CLK Pins,
Recovered Clocks, or PLLs within
that Quadrant
Fast Regional Clock Network
In EP1SGX25 and EP1SGX10 devices, there are two fast regional clock
networks, FCLK[1..0], within each quadrant, fed by input pins (see
Figure 4–43). In EP1SGX40 devices, there are two fast regional clock
networks within each half-quadrant (see Figure 4–44). The FCLK[1..0]
clocks can also be used for high fanout control signals, such as
asynchronous clears, presets, clock enables, or protocol control signals
such as TRDY and IRDY for PCI. Dual-purpose FCLK pins drive the fast
clock networks. All devices have eight FCLK pins to drive fast regional
clock networks. Any I/O pin can drive a clock or control signal onto any
fast regional clock network with the addition of a delay. The I/O
interconnect drives this signal.
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Figure 4–43. EP1SGX25 & EP1SGX10 Device Fast Clock Pin Connections to
Fast Regional Clocks
Fast Clock
[3..2]
[1..0]
FCLK[1..0]
FCLK[1..0]
FCLK[1..0]
FCLK[1..0]
[5..4]
Fast Clock
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[7..6]
Fast Clock
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February 2005
Stratix GX Architecture
Figure 4–44. EP1SGX40 Device Fast Regional Clock Pin Connections to Fast
Regional Clocks
Fast Clock
Fast Clock
Fast Clock
Fast Clock
[3]
[2]
[1]
[0]
[4]
[5]
[6]
[7]
Fast Clock
Fast Clock
Fast Clock
Fast Clock
fclk[1..0]
Combined Resources
Within each region, there are 22 distinct dedicated clocking resources
consisting of 16 global clock lines, 4 regional clock lines, and 2 fast
regional clock lines. Multiplexers are used with these clocks to form 8-bit
busses to drive LAB row clocks, column IOE clocks, or row IOE clocks.
Another multiplexer at the LAB level selects two of the eight row clocks
to feed the LE registers within the LAB. See Figure 4–45.
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Figure 4–45. Regional Clock Bus
Clocks Available
to a Quadrant
or Half-Quadrant
Vertical I/O Cell
IO_CLK[7..0]
Global Clock Network [15..0]
Regional Clock Network [3..0]
Clock [21:0]
Lab Row Clock [7..0]
Fast Regional Clock Network [1..0]
Horizontal I/O
Cell IO_CLK[7..0]
IOE clocks have horizontal and vertical block regions that are clocked by
eight I/O clock signals chosen from the 22-quadrant or half-quadrant
clock resources. Figures 4–46 and 4–47 show the quadrant and halfquadrant relationship to the I/O clock regions, respectively. The vertical
regions (column pins) have less clock delay than the horizontal regions
(row pins).
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Figure 4–46. EP1SGX25 & EP1SGX10 Device I/O Clock Groups
IO_CLKA[7:0]
IO_CLKB[7:0]
8
8
I/O Clock Regions
8
13
22 Clocks in
the Quadrant
22 Clocks in
the Quadrant
IO_CLKH[7:0]
14
8
16
IO_CLKG[7:0]
22 Clocks in
the Quadrant
22 Clocks in
the Quadrant
15
8
8
IO_CLKF[7:0]
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Figure 4–47. EP1SGX40 Device I/O Clock Groups
IO_CLKA[7:0]
IO_CLKC[7:0]
IO_CLKB[7:0]
8
8
IO_CLKD[7:0]
8
8
I/O Clock Regions
8
13
IO_CLKP[7:0]
22 Clocks in the
Half-Quadrant
22 Clocks in the
Half-Quadrant
22 Clocks in the
Half-Quadrant
22 Clocks in the
Half-Quadrant
8
14
IO_CLKO[7:0]
8
17
IO_CLKN[7:0]
8
22 Clocks in the
Half-Quadrant
22 Clocks in the
Half-Quadrant
22 Clocks in the
Half-Quadrant
22 Clocks in the
Half-Quadrant
16
15
IO_CLKM[7:0]
8
8
IO_CLKL[7:0]
8
IO_CLKK[7:0]
8
IO_CLKJ[7:0]
IO_CLKI[7:0]
You can use the Quartus II software to control whether a clock input pin
is either global, regional, or fast regional. The Quartus II software
automatically selects the clocking resources if not specified.
Enhanced & Fast PLLs
Stratix GX devices provide robust clock management and synthesis using
up to four enhanced PLLs and four fast PLLs. These PLLs increase
performance and provide advanced clock interfacing and clock frequency
synthesis. With features such as clock switchover, spread spectrum
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clocking, programmable bandwidth, phase and delay control, and
dynamic PLL reconfiguration, the Stratix GX device’s enhanced PLLs
provide you with complete control of your clocks and system timing. The
fast PLLs provide general purpose clocking with multiplication and
phase shifting as well as high-speed outputs for high-speed differential
I/O support. Enhanced and fast PLLs work together with the Stratix GX
high-speed I/O and advanced clock architecture to provide significant
improvements in system performance and bandwidth.
The Quartus II software enables the PLLs and their features without
requiring any external devices. Table 4–17 shows which PLLs are
available for each Stratix GX device and their type. Table 4–18 shows the
enhanced PLL and fast PLL features in Stratix GX devices.
Table 4–17. Stratix GX Device PLL Availability
Fast PLLs
Enhanced PLLs
Device
1
2
EP1SGX10
v
v
EP1SGX25
v
v
EP1SGX40
v
v
3 (1)
4 (1)
7
8
v
9 (1)
10 (1)
v
5 (2)
6 (2)
v
v
v
v
v
v
11 (3) 12 (3)
v
v
Notes to Table 4–17:
(1)
(2)
(3)
PLLs 3, 4, 9, and 10 are not available in Stratix GX devices. However, these PLLs are listed in Table 4–17 because
the Stratix GX PLL numbering scheme is consistent with Stratix devices.
PLLs 5 and 6 each have eight single-ended outputs or four differential outputs.
PLLs 11 and 12 each have one single-ended output.
Table 4–18. Stratix GX Enhanced PLL & Fast PLL Features (Part 1 of 2)
Feature
Notes (1)–(8)
Enhanced PLL
Fast PLL
m/ (n × post-scale counter) (1)
m/(post-scale counter) (2)
Phase shift
Down to 156.25-ps increments (3),
(4)
Down to 125-ps increments (3), (4)
Delay shift
250-ps increments for ±3 ns
Clock multiplication and division
Clock switchover
v
PLL reconfiguration
v
Programmable bandwidth
v
Spread spectrum clocking
v
Programmable duty cycle
v
v
Number of internal clock outputs
6
3 (5)
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Table 4–18. Stratix GX Enhanced PLL & Fast PLL Features (Part 2 of 2)
Feature
Notes (1)–(8)
Enhanced PLL
Fast PLL
Number of external clock outputs
Four differential/eight singled-ended
or one single-ended (6)
(7)
Number of feedback clock inputs
4 (8)
Notes to Table 4–18:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
The maximum count value is 1024, with a 50% duty cycle setting on the counter. The maximum count value for
any other duty cycle setting is 512.
For fast PLLs, m and post-scale counters range from 1 to 32.
The smallest phase shift is determined by the VCO period divided by 8.
For degree increments, Stratix GX devices can shift all output frequencies in increments of at least 45°. Smaller
degree increments are possible depending on the frequency and divide parameters.
PLLs 7 and 8 have two output ports per PLL. PLLs 1 and 2 have three output ports per PLL.
Every Stratix GX device has two enhanced PLLs (PLLs 5 and 6) with eight single-ended or four differential outputs
each. Two additional enhanced PLLs (PLLs 11 and 12) in EP1SGX40 devices each have one single-ended output.
Fast PLLs can drive to any I/O pin as an external clock. For high-speed differential I/O pins, the device uses a data
channel to generate txclkout.
Every Stratix GX device has two enhanced PLLs with one single-ended or differential external feedback input per
PLL.
Figure 4–48 shows a top-level diagram of the Stratix GX device and the
PLL floorplan.
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Figure 4–48. PLL Floorplan
CLK[15..12]
5
FPLL7CLK
11
High-Speed
Transceivers
7
inclk1
inclk2
CLK[3..0]
1
2
inclk3
inclk4
PLLs
inclk5
FPLL8CLK
8
6
12
CLK[7..4]
Figure 4–49 shows the global and regional clock connections from the
PLL outputs and the CLK pins.
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Figure 4–49. Global & Regional Clock Connections From Side Pins & Fast PLL Outputs
RCLK1
RCLK0
FPLL7CLK
G1
G0
Note (1)
G3
G2
l0
PLL 7 l 1
g0
CLK0
CLK1
l0
PLL 1 l 1
g0
CLK2
CLK3
l 02
PLL 2 l 1
g0
l0
PLL 8 l 1
g0
FPLL8CLK
RCLK2
RCLK3
Global
Clocks
Regional
Clocks
Note to Figure 4–49:
(1)
PLLs 1,2 7, and 8 are fast PLLs. PLLs 7 and 8 do not drive global clocks.
Figure 4–50 shows the global and regional clocking from enhanced PLL
outputs and top CLK pins.
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Figure 4–50. Global & Regional Clock Connections From Top Clock Pins & Enhanced PLL Outputs
Note (1)
PLL5_OUT[3..0] CLK14 (1)
PLL5_FB
CLK15 (2)
CLK12 (1)
CLK13 (2)
E[0..3]
PLL 5
PLL 11 (4)
L0 L1 G0 G1 G2 G3
G0 G1 G2 G3 L0 L1
PLL11_OUT
RCLK10
RCLK11
Regional
Clocks
RCLK2
RCLK3
G12
G13
G14
G15
Global
Clocks
Regional
Clocks
G4
G5
G6
G7
RCLK6
RCLK7
RCLK12
RCLK13
PLL12_OUT
L0 L1 G0 G1 G2 G3
G0 G1 G2 G3 L0 L1
PLL 6
PLL6_OUT[3..0]
PLL 12 (4)
PLL6_FB
CLK4 (1)
CLK6 (1)
CLK7 (2)
CLK5 (2)
Note to Figure 4–50:
(1)
PLLs 5, 6, 11, and 12 are enhanced PLLs.
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Enhanced PLLs
Stratix GX devices contain up to four enhanced PLLs with advanced
clock management features. Figure 4–51 shows a diagram of the
enhanced PLL.
Figure 4–51. Stratix GX Enhanced PLL
Programmable
Time Delay on
Each PLL Port
Post-Scale
Counters
VCO Phase Selection
Selectable at Each
PLL Output Port
From Adjacent PLL
/l0
Δt
/l1
Δt
Regional
Clocks
Clock
Switch-Over
Circuitry
Spread
Spectrum
Phase Frequency
Detector
CLK0
4
Δt
/n
PFD
Charge
Pump
8
Loop
Filter
VCO
CLK1
(1)
FBIN
Δt
/m
/g0
Δt
/g1
Δt
/g2
Δt
/g3
Δt
Global
Clocks
I/O Buffers (2)
to I/O or general
routing
Lock Detect
& Filter
VCO Phase Selection
Affecting All Outputs
/e0
Δt
/e1
Δt
/e2
Δt
/e3
Δt
4
I/O Buffers (3)
Notes to Figure 4–51:
(1)
(2)
(3)
External feedback is available in PLLs 5 and 6.
This external output is available from the g0 counter for PLLs 11 and 12.
These counters and external outputs are available in PLLs 5 and 6.
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Clock Multiplication & Division
Each Stratix GX device enhanced PLL provides clock synthesis for PLL
output ports using m/(n × post-scale counter) scaling factors. The input
clock is divided by a pre-scale divider, n, and is then multiplied by the m
feedback factor. The control loop drives the VCO to match fIN × (m/n).
Each output port has a unique post-scale counter that divides down the
high-frequency VCO. For multiple PLL outputs with different
frequencies, the VCO is set to the least common multiple of the output
frequencies that meets its frequency specifications. Then, the post-scale
dividers scale down the output frequency for each output port. For
example, if output frequencies required from one PLL are 33 and 66 MHz,
set the VCO to 330 MHz (the least common multiple in the VCO’s range).
There is one pre-scale divider, n, and one multiply divider, m, per PLL,
with a range of 1 to 512 on each. There are two post-scale dividers (l) for
regional clock output ports, four counters (g) for global clock output
ports, and up to four counters (e) for external clock outputs, all ranging
from 1 to 512. The Quartus II software automatically chooses the
appropriate scaling factors according to the input frequency,
multiplication, and division values entered.
Clock Switchover
To effectively develop high-reliability network systems, clocking schemes
must support multiple clocks to provide redundancy. For this reason,
Stratix GX device enhanced PLLs support a flexible clock switchover
capability. Figure 4–52 shows a block diagram of the switchover
circuit.The switchover circuit is configurable, so you can define how to
implement it. Clock-sense circuitry automatically switches from the
primary to secondary clock for PLL reference when the primary clock
signal is not present.
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Figure 4–52. Clock Switchover Circuitry
CLK0_BAD
CLK1_BAD
Active Clock
SMCLKSW
Clock
Sense
Switch-Over
State Machine
CLKLOSS
CLKSWITCH
Δt
CLK0
MUXOUT
CLK1
n Counter
PFD
FBCLK
Enhanced PLL
Note to Figure 4–52:
(1)
PFD: phase frequency detector.
There are two possible ways to use the clock switchover feature.
■
■
You can use automatic switchover circuitry for switching between
inputs of the same frequency. For example, in applications that
require a redundant clock with the same frequency as the primary
clock, the switchover state machine generates a signal that controls
the multiplexer select input on the bottom of Figure 4–52. In this case,
the secondary clock becomes the reference clock for the PLL.
You can use the clkswitch input for user- or system-controlled
switch conditions. This is possible for same-frequency switchover or
to switch between inputs of different frequencies. For example, if
inclk0 is 66 MHz and inclk1 is 100 MHz, you must control the
switchover because the automatic clock-sense circuitry cannot
monitor primary and secondary clock frequencies with a frequency
difference of more than ±20%. This feature is useful when clock
sources can originate from multiple cards on the backplane,
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requiring a system-controlled switchover between frequencies of
operation. You can use clkswitch together with the lock signal to
trigger the switch from a clock that is running but becomes unstable
and cannot be locked onto.
During switchover, the PLL VCO continues to run and either slows down
or speeds up, generating frequency drift on the PLL outputs. The clock
switchover transitions without any glitches. After the switch, there is a
finite resynchronization period to lock onto new clock as the VCO ramps
up. The exact amount of time it takes for the PLL to relock relates to the
PLL configuration and may be adjusted by using the programmable
bandwidth feature of the PLL. The preliminary specification for the
maximum time to relock is 100 µs.
f
For more information on clock switchover, see AN313: Implementing
Clock Switchover in Stratix & Stratix GX Devices.
PLL Reconfiguration
The PLL reconfiguration feature enables system logic to change
Stratix GX device enhanced PLL counters and delay elements without
reloading a Programmer Object File (.pof). This provides considerable
flexibility for frequency synthesis, allowing real-time PLL frequency and
output clock delay variation. You can sweep the PLL output frequencies
and clock delay in prototype environments. The PLL reconfiguration
feature can also dynamically or intelligently control system clock speeds
or tCO delays in end systems.
Clock delay elements at each PLL output port implement variable delay.
Figure 4–53 shows a diagram of the overall dynamic PLL control feature
for the counters and the clock delay elements. The configuration time is
less than 20 μs for the enhanced PLL using a input shift clock rate of
25 MHz. The charge pump, loop filter components, and phase shifting
using VCO phase taps cannot be dynamically adjusted.
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February 2005
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Figure 4–53. Dynamically Programmable Counters & Delays in Stratix GX Device Enhanced PLLs
All Output Counters and
Clock Delay Settings can
be Programmed Dynamically
Counters and Clock
Delay Settings are
Programmable
fREF
÷n
Δt
PFD
Charge
Pump
Loop
Filter
VCO
÷g
Δt
÷l
Δt
÷e
Δt
scandata
scanclk
÷m
Δt
scanaclr
PLL reconfiguration data is shifted into serial registers from the logic
array or external devices. The PLL input shift data uses a reference input
shift clock. Once the last bit of the serial chain is clocked in, the register
chain is synchronously loaded into the PLL configuration bits. The shift
circuitry also provides an asynchronous clear for the serial registers.
Programmable Bandwidth
You have advanced control of the PLL bandwidth using the
programmable control of the PLL loop characteristics, including loop
filter and charge pump. The PLL’s bandwidth is a measure of its ability to
track the input clock and jitter. A high-bandwidth PLL can quickly lock
onto a reference clock and react to any changes in the clock. It also allows
a wide band of input jitter spectrum to pass to the output. A
low-bandwidth PLL takes longer to lock, but it attenuates all
high-frequency jitter components. The Quartus II software can adjust
PLL characteristics to achieve the desired bandwidth. The programmable
bandwidth is tuned by varying the charge pump current, loop filter
resistor value, high frequency capacitor value, and m counter value. You
can manually adjust these values if desired. Bandwidth is programmable
from 150 kHz to 2 MHz.
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External Clock Outputs
Enhanced PLLs 5 and 6 each support up to eight single-ended clock
outputs (or four differential pairs). See Figure 4–54.
Figure 4–54. External Clock Outputs for PLLs 5 & 6
From IOE (1)
extclk0_a
(2)
e0 Counter
From IOE (1)
From IOE (1)
extclk0_b
extclk1_a
e1 Counter
4
From IOE (1)
From IOE (1)
extclk1_b
extclk2_a
e2 Counter
extclk2_b
From IOE (1)
From IOE (1)
extclk3_a
e3 Counter
From IOE (1)
extclk3_b
Notes to Figure 4–54:
(1)
(2)
Each external clock output pin can be used as a general purpose output pin from
the logic array. These pins are multiplexed with IOE outputs.
Two single-ended outputs are possible per output counter—either two outputs of
the same frequency and phase or one shifted 180°.
Any of the four external output counters can drive the single-ended or
differential clock outputs for PLLs 5 and 6. This means one counter or
frequency can drive all output pins available from PLL 5 or PLL 6. Each
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pair of output pins (four pins total) has dedicated VCC and GND pins to
reduce the output clock’s overall jitter by providing improved isolation
from switching I/O pins.
For PLLs 5 and 6, each pin of a single-ended output pair can either be in
phase or 180° out of phase. The clock output pin pairs support the same
I/O standards as standard output pins (in the top and bottom banks) as
well as LVDS, LVPECL, 3.3-V PCML, HyperTransport technology,
differential HSTL, and differential SSTL. Table 4–19 shows which I/O
standards the enhanced PLL clock pins support. When in single-ended or
differential mode, the two outputs operate off the same power supply.
Both outputs use the same standards in single-ended mode to maintain
performance. You can also use the external clock output pins as user
output pins if external enhanced PLL clocking is not needed.
Table 4–19. I/O Standards Supported for Enhanced PLL Pins (Part 1 of 2)
Input
Output
I/O Standard
INCLK
FBIN
PLLENABLE
EXTCLK
LVTTL
v
v
v
v
LVCMOS
v
v
v
v
2.5 V
v
v
v
1.8 V
v
v
v
1.5 V
v
v
v
3.3-V PCI
v
v
v
3.3-V PCI-X
v
v
v
LVPECL
v
v
v
3.3-V PCML
v
v
v
LVDS
v
v
v
HyperTransport technology
v
v
Differential HSTL
v
v
v
v
Differential SSTL
3.3-V GTL
v
v
v
3.3-V GTL+
v
v
v
1.5-V HSTL class I
v
v
v
1.5-V HSTL class II
v
v
v
SSTL-18 class I
v
v
v
SSTL-18 class II
v
v
v
SSTL-2 class I
v
v
v
SSTL-2 class II
v
v
v
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Table 4–19. I/O Standards Supported for Enhanced PLL Pins (Part 2 of 2)
Input
Output
I/O Standard
INCLK
FBIN
PLLENABLE
EXTCLK
SSTL-3 class I
v
v
v
SSTL-3 class II
v
v
v
AGP (1× and 2× )
v
v
v
CTT
v
v
v
Enhanced PLLs 11 and 12 support one single-ended output each (see
Figure 4–55). These outputs do not have their own VCC and GND signals.
Therefore, to minimize jitter, do not place switching I/O pins next to this
output pin.
Figure 4–55. External Clock Outputs for Enhanced PLLs 11 & 12
g0
Counter
CLK13n, I/O, PLL11_OUT
or CLK6n, I/O, PLL12_OUT (1)
From Internal
Logic or IOE
Note to Figure 4–55:
(1)
For PLL 11, this pin is CLK13n; for PLL 12 this pin is CLK7n.
Stratix GX devices can drive any enhanced PLL driven through the global
clock or regional clock network to any general I/O pin as an external
output clock. The jitter on the output clock is not guaranteed for these
cases.
Clock Feedback
The following four feedback modes in Stratix GX device enhanced PLLs
allow multiplication and/or phase and delay shifting:
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February 2005
■
Zero delay buffer: The external clock output pin is phase-aligned
with the clock input pin for zero delay.
■
External feedback: The external feedback input pin, FBIN, is
phase-aligned with the clock input, CLK, pin. Aligning these clocks
allows you to remove clock delay and skew between devices. This
mode is only possible for PLLs 5 and 6. PLLs 5 and 6 each support
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feedback for one of the dedicated external outputs, either one
single-ended or one differential pair. In this mode, one e counter
feeds back to the PLL FBIN input, becoming part of the feedback
loop.
■
Normal mode: If an internal clock is used in this mode, it is
phase-aligned to the input clock pin. The external clock output pin
has a phase delay relative to the clock input pin if connected in this
mode. You define which internal clock output from the PLL should
be phase-aligned to the internal clock pin.
■
No compensation: In this mode, the PLL does not compensate for
any clock networks or external clock outputs.
Phase & Delay Shifting
Stratix GX device enhanced PLLs provide advanced programmable
phase and clock delay shifting. For phase shifting, you can specify a
phase shift (in degrees or time units) for each PLL clock output port or for
all outputs together in one shift. Phase-shifting values in time units are
allowed with a resolution range of 160 to 420 ps. This resolution is a
function of frequency input and the multiplication and division factors.
In other words, it is a function of the VCO period equal to one-eighth of
the VCO period. Each clock output counter can choose a different phase
of the VCO period from up to eight taps. You can use this clock output
counter along with an initial setting on the post-scale counter to achieve
a phase-shift range for the entire period of the output clock. The phase tap
feedback to the m counter can shift all outputs to a single phase or delay.
The Quartus II software automatically sets the phase taps and counter
settings according to the phase shift entered.
In addition to the phase-shift feature, the fine tune clock delay shift
feature provides advanced time delay shift control on each of the four
PLL outputs. Each PLL output shifts in 250-ps increments for a range of
–3.0 ns to +3.0 ns between any two outputs using discrete delay elements.
Total delay shift between any two PLL outputs must be less than 3 ns. For
example, shifts on outputs of –1 and +2 ns is allowed, but not –1 and
+2.5 ns. There is some delay variation due to process, voltage, and
temperature. Only the clock delay shift blocks can be controlled during
system operation for dynamic clock delay control.
Spread-Spectrum Clocking
The Stratix GX device’s enhanced PLLs use spread-spectrum technology
to reduce electromagnetic interference generation from a system by
distributing the energy over a broader frequency range. The enhanced
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PLL typically provides 0.5% down spread modulation using a triangular
profile. The modulation frequency is programmable. Enabling spread
spectrum for a PLL affects all of its outputs.
Lock Detect
The lock output indicates that there is a stable clock output signal in
phase with the reference clock. Without any additional circuitry, the lock
signal may toggle as the PLL begins tracking the reference clock. You may
need to gate the lock signal for use as a system control. The lock signal
from the locked port can drive the logic array or an output pin.
Whenever the PLL loses lock for any reason (be it excessive inclk jitter,
clock switchover, PLL reconfiguration, power supply noise etc.), the PLL
must be reset with the areset signal for correct phase shift operation. If
the phase relationship between the input clock versus output clock, and
between different output clocks from the PLL is not important in the
design, then the PLL need not be reset.
f
See the Stratix GX FPGA Errata Sheet for more information on
implementing the gated lock signal in the design.
Programmable Duty Cycle
The programmable duty cycle allows enhanced PLLs to generate clock
outputs with a variable duty cycle. This feature is supported on each
enhanced PLL post-scale counter (g0..g3, l0..l3, e0..e3). The duty cycle
setting is achieved by a low and high time count setting for the post-scale
dividers. The Quartus II software uses the frequency input and the
required multiply or divide rate to determine the duty cycle choices.
Advanced Clear & Enable Control
There are several control signals for clearing and enabling PLLs and their
outputs. You can use these signals to control PLL resynchronization and
gate PLL output clocks for low-power applications.
The pllenable pin is a dedicated pin that enables/disables PLLs. When
the pllenable pin is low, the clock output ports are driven by GND and
all the PLLs go out of lock. When the pllenable pin goes high again, the
PLLs relock and resynchronize to the input clocks. You can choose which
PLLs are controlled by the pllenable signal by connecting the
pllenable input port of the altpll megafunction to the common
pllenable input pin.
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February 2005
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The areset signals are reset/resynchronization inputs for each PLL. The
areset signal should be asserted every time the PLL loses lock to
guarantee correct phase relationship between the PLL output clocks.
Users should include the areset signal in designs if any of the following
conditions are true:
■
■
PLL Reconfiguration or Clock switchover enables in the design.
Phase relationships between output clocks need to be maintained
after a loss of lock condition
The device input pins or logic elements (LEs) can drive these input
signals. When driven high, the PLL counters resets, clearing the PLL
output and placing the PLL out of lock. The VCO sets back to its nominal
setting (~700 MHz). When driven low again, the PLL resynchronizes to
its input as it relocks. If the target VCO frequency is below this nominal
frequency, then the output frequency starts at a higher value than desired
as the PLL locks. If the system cannot tolerate this, the clkena signal can
disable the output clocks until the PLL locks.
The pfdena signals control the phase frequency detector (PFD) output
with a programmable gate. If you disable the PFD, the VCO operates at
its last set value of control voltage and frequency with some long-term
drift to a lower frequency. The system continues running when the PLL
goes out of lock or the input clock is disabled. By maintaining the last
locked frequency, the system has time to store its current settings before
shutting down. You can either use your own control signal or a clkloss
status signal to trigger pfdena.
The clkena signals control the enhanced PLL regional and global
outputs. Each regional and global output port has its own clkena signal.
The clkena signals synchronously disable or enable the clock at the PLL
output port by gating the outputs of the g and l counters. The clkena
signals are registered on the falling edge of the counter output clock to
enable or disable the clock without glitches. Figure 4–56 shows the
waveform example for a PLL clock port enable. The PLL can remain
locked independent of the clkena signals since the loop-related counters
are not affected. This feature is useful for applications that require a low
power or sleep mode. Upon re-enabling, the PLL does not need a
resynchronization or relock period. The clkena signal can also disable
clock outputs if the system is not tolerant to frequency overshoot during
resynchronization.
The extclkena signals work in the same way as the clkena signals, but
they control the external clock output counters (e0, e1, e2, and e3). Upon
re-enabling, the PLL does not need a resynchronization or relock period
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unless the PLL is using external feedback mode. In order to lock in
external feedback mode, the external output must drive the board trace
back to the FBIN pin.
Figure 4–56. extclkena Signals
COUNTER
OUTPUT
CLKENA
CLKOUT
Fast PLLs
Stratix GX devices contain up to four fast PLLs with high-speed serial
interfacing ability, along with general-purpose features. Figure 4–57
shows a diagram of the fast PLL.
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February 2005
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PLLs & Clock Networks
Figure 4–57. Stratix GX Device Fast PLL
Post-Scale
Counters
diffioclk1 (2)
÷l0
VCO Phase Selection
Selectable at each PLL
Output Port
Global or
regional clock (1)
Clock
Input
Phase
Frequency
Detector
Global or
regional clock
txload_en
rxload_en
÷l1
Global or
regional clock
diffioclk2 (2)
PFD
Charge
Pump
8
Loop
Filter
VCO
÷g0
Global or
regional clock
m
÷
Notes to Figure 4–57:
(1)
(2)
In high-speed differential I/O support mode, this high-speed PLL clock feeds the SERDES. Stratix GX devices only
support one rate of data transfer per fast PLL in high-speed differential I/O support mode.
This signal is a high-speed differential I/O support SERDES control signal.
Clock Multiplication & Division
The Stratix GX device’s fast PLLs provide clock synthesis for PLL output
ports using m/(post scaler) scaling factors. The input clock is multiplied
by the m feedback factor. Each output port has a unique post scale counter
to divide down the high-frequency VCO. There is one multiply divider,
m, per fast PLL with a range of 1 to 32. There are two post scale L dividers
for regional and/or LVDS interface clocks, and g0 counter for global clock
output port; all range from 1 to 32.
In the case of a high-speed differential interface, you can set the output
counter to 1 to allow the high-speed VCO frequency to drive the SERDES.
External Clock Outputs
Each fast PLL supports differential or single-ended outputs for
source-synchronous transmitters or for general-purpose external clocks.
There are no dedicated external clock output pins. Any I/O pin can be
driven by the fast PLL global or regional outputs as an external output
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pin. The I/O standards supported by any particular bank determines
what standards are possible for an external clock output driven by the fast
PLL in that bank.
Table 4–20 shows the I/O standards supported by fast PLL input pins.
Table 4–20. Fast PLL Port Input Pin I/O Standards
Input
I/O Standard
INCLK
PLLENABLE
LVTTL
v
v
LVCMOS
v
v
2.5 V
v
1.8 V
v
1.5 V
v
3.3-V PCI
3.3-V PCI-X
LVPECL
v
3.3-V PCML
v
LVDS
v
HyperTransport technology
v
Differential HSTL
v
Differential SSTL
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February 2005
3.3-V GTL
v
3.3-V GTL+
v
1.5V HSTL class I
v
1.5V HSTL class II
v
SSTL-18 class I
v
SSTL-18 class II
v
SSTL-2 class I
v
SSTL-2 class II
v
SSTL-3 class I
v
SSTL-3 class II
v
AGP (1× and 2× )
v
CTT
v
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Phase Shifting
Stratix GX device fast PLLs have advanced clock shift capability that
enables programmable phase shifts. You can enter a phase shift (in
degrees or time units) for each PLL clock output port or for all outputs
together in one shift. You can perform phase shifting in time units with a
resolution range of 150 to 400 ps. This resolution is a function of the VCO
period.
Control Signals
The fast PLL has the same lock output, pllenable input, and areset
input control signals as the enhanced PLL.
For more information on high-speed differential I/O support, see the
High-Speed Source-Synchronous Differential I/O Interfaces in Stratix GX
Devices chapter of the Stratix GX Device Handbook, Volume 2.
I/O Structure
IOEs provide many features, including:
■
■
■
■
■
■
■
■
■
■
■
■
■
■
■
Dedicated differential and single-ended I/O buffers
3.3-V, 64-bit, 66-MHz PCI compliance
3.3-V, 64-bit, 133-MHz PCI-X 1.0 compliance
Joint Test Action Group (JTAG) boundary-scan test (BST) support
Differential on-chip termination for LVDS I/O standard
Programmable pull-up during configuration
Output drive strength control
Slew-rate control
Tri-state buffers
Bus-hold circuitry
Programmable pull-up resistors
Programmable input and output delays
Open-drain outputs
DQ and DQS I/O pins
Double-data rate (DDR) Registers
The IOE in Stratix GX devices contains a bidirectional I/O buffer, six
registers, and a latch for a complete embedded bidirectional single data
rate or DDR transfer. Figure 4–58 shows the Stratix GX IOE structure. The
IOE contains two input registers (plus a latch), two output registers, and
two output enable registers. The design can use both input registers and
the latch to capture DDR input and both output registers to drive DDR
outputs. Additionally, the design can use the output enable (OE) register
for fast clock-to-output enable timing. The negative edge-clocked OE
register is used for DDR SDRAM interfacing. The Quartus II software
automatically duplicates a single OE register that controls multiple
output or bidirectional pins.
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Figure 4–58. Stratix GX IOE Structure
Logic Array
OE Register
D
OE
Q
OE Register
D
Q
Output Register
Output A
D
Q
CLK
Output Register
Output B
D
Q
Input Register
D
Q
Input A
Input B
Input Register
D
Q
Input Latch
D
Q
ENA
The IOEs are located in I/O blocks around the periphery of the Stratix GX
device. There are up to four IOEs per row I/O block and six IOEs per
column I/O block. The row I/O blocks drive row, column, or direct link
interconnects. The column I/O blocks drive column interconnects.
Figure 4–59 shows how a row I/O block connects to the logic array.
Figure 4–60 shows how a column I/O block connects to the logic array.
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February 2005
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Figure 4–59. Row I/O Block Connection to the Interconnect
R4, R8 & R24
Interconnects
C4, C8 & C16
Interconnects
I/O Interconnect
I/O Block Local
Interconnect
16 Control Signals
from I/O Interconnect (1)
16
28 Data & Control
Signals from
Logic Array (2)
28
LAB
Horizontal
I/O Block
io_dataouta[3..0]
io_dataoutb[3..0]
Direct Link
Interconnect
to Adjacent LAB
Direct Link
Interconnect
to Adjacent LAB
io_clk[7:0]
LAB Local
Interconnect
Horizontal I/O
Block Contains
up to Four IOEs
Notes to Figure 4–59:
(1)
(2)
The 16 control signals are composed of four output enables io_boe[3..0], four clock enables io_bce[3..0],
four clocks io_clk[3..0], and four clear signals io_bclr[3..0].
The 28 data and control signals consist of eight data out lines: four lines each for DDR applications
io_dataouta[3..0] and io_dataoutb[3..0], four output enables io_coe[3..0], four input clock enables
io_cce_in[3..0], four output clock enables io_cce_out[3..0], four clocks io_cclk[3..0], and four clear
signals io_cclr[3..0].
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Figure 4–60. Column I/O Block Connection to the Interconnect
42 Data &
Control Signals
from Logic Array (2)
16 Control
Signals from I/O
Interconnect (1)
Vertical I/O
Block Contains
up to Six IOEs
Vertical I/O Block
16
42
io_clk[7..0]
IO_datain[3:0]
I/O Block
Local Interconnect
I/O Interconnect
R4, R8 & R24
Interconnects
LAB
LAB Local
Interconnect
LAB
LAB
C4, C8 & C16
Interconnects
Notes to Figure 4–60:
(1)
(2)
The 16 control signals are composed of four output enables io_boe[3..0], four clock enables io_bce[3..0],
four clocks io_bclk[3..0], and four clear signals io_bclr[3..0].
The 42 data and control signals consist of 12 data out lines; six lines each for DDR applications
io_dataouta[5..0] and io_dataoutb[5..0], six output enables io_coe[5..0], six input clock enables
io_cce_in[5..0], six output clock enables io_cce_out[5..0], six clocks io_cclk[5..0], and six clear
signals io_cclr[5..0].
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Stratix GX devices have an I/O interconnect similar to the R4 and C4
interconnect to drive high-fanout signals to and from the I/O blocks.
There are 16 signals that drive into the I/O blocks composed of four
output enables io_boe[3..0], four clock enables io_bce[3..0], four
clocks io_bclk[3..0], and four clear signals io_bclr[3..0]. The
pin’s datain signals can drive the IO interconnect, which in turn drives
the logic array or other I/O blocks. In addition, the control and data
signals can be driven from the logic array, providing a slower but more
flexible routing resource. The row or column IOE clocks, io_clk[7..0],
provide a dedicated routing resource for low-skew, high-speed clocks.
I/O clocks are generated from regional, global, or fast regional clocks (see
“PLLs & Clock Networks” on page 4–68). Figure 4–61 illustrates the
signal paths through the I/O block.
Figure 4–61. Signal Path Through the I/O Block
Row or Column
io_clk[7..0]
io_boe[3..0]
From I/O
Interconnect
To Other
IOEs
io_bce[3..0]
io_bclk[3..0]
io_bclr[3..0]
To Logic
Array
io_datain0
io_datain1
oe
ce_in
ce_out
io_coe
io_cce_in
Control
Signal
Selection
aclr/preset
IOE
sclr
io_cce_out
From Logic
Array
clk_in
io_cclr
clk_out
io_cclk
io_dataout0
io_dataout1
Each IOE contains its own control signal selection for the following
control signals: oe, ce_in, ce_out, aclr/preset, sclr/preset,
clk_in, and clk_out. Figure 4–62 illustrates the control signal
selection.
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Figure 4–62. Control Signal Selection per IOE
io_bclk[3..0]
io_bce[3..0]
io_bclr[3..0]
io_boe[3..0]
Dedicated I/O
Clock [7..0]
I/O Interconnect
[15..0]
Local
Interconnect
io_coe
Local
Interconnect
io_cclr
Local
Interconnect
io_cce_out
Local
Interconnect
io_cce_in
Local
Interconnect
io_cclk
ce_out
clk_out
clk_in
ce_in
sclr/preset
aclr/preset
oe
In normal bidirectional operation, the input register can be used for input
data requiring fast setup times. The input register can have its own clock
input and clock enable separate from the OE and output registers. The
output register can be used for data requiring fast clock-to-output
performance. The OE register can be used for fast clock-to-output enable
timing. The OE and output register share the same clock source and the
same clock enable source from local interconnect in the associated LAB,
dedicated I/O clocks, and the column and row interconnects. Figure 4–63
shows the IOE in bidirectional configuration.
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February 2005
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Figure 4–63. Stratix GX IOE in Bidirectional I/O Configuration
Column or Row
Interconnect
Note (1)
ioe_clk[7..0]
I/O Interconnect
[15..0]
OE
OE Register
D
Output
tZX Delay
Q
clkout
Output
Enable Clock
Enable Delay
ce_out
ENA
CLRN/PRN
OE Register
tCO Delay
VCCIO
Output Clock
Enable Delay
Optional
PCI Clamp
VCCIO
Programmable
Pull-Up
Resistor
aclr/prn
Chip-Wide Reset
Logic Array
to Output
Register Delay
Output Register
D
sclr/preset
Q
ENA
CLRN/PRN
Output
Pin Delay
Drive Strength Control
Open-Drain Output
Slew Control
Input Pin to
Logic Array Delay
Input Register
D
clkin
ce_in
Input Clock
Enable Delay
Input Pin to
Input Register Delay
Bus-Hold
Circuit
Q
ENA
CLRN/PRN
Note to Figure 4–63:
(1)
All input signals to the IOE can be inverted at the IOE.
The Stratix GX device IOE includes programmable delays that can be
activated to ensure zero hold times, input IOE register-to-logic array
register transfers, or logic array-to-output IOE register transfers.
A path in which a pin directly drives a register may require the delay to
ensure zero hold time, whereas a path in which a pin drives a register
through combinatorial logic may not require the delay. Programmable
delays exist for decreasing input-pin-to-logic-array and IOE input
register delays. The Quartus II Compiler can program these delays to
automatically minimize setup time while providing a zero hold time.
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Programmable delays can increase the register-to-pin delays for output
and/or output enable registers. A programmable delay exists to increase
the tZX delay to the output pin, which is required for ZBT interfaces.
Table 4–21 shows the programmable delays for Stratix GX devices.
Table 4–21. Stratix GX Programmable Delay Chain
Programmable Delays
Quartus II Logic Option
Input pin to logic array delay
Decrease input delay to internal cells
Input pin to input register delay
Decrease input delay to input register
Output pin delay
Increase delay to output pin
Output enable register tCO delay
Increase delay to output enable pin
Output tZX delay
Increase tZX delay to output pin
Output clock enable delay
Increase output clock enable delay
Input clock enable delay
Increase input clock enable delay
Logic array to output register delay
Decrease input delay to output register
Output enable clock enable delay
Increase output enable clock enable delay
The IOE registers in Stratix GX devices share the same source for clear or
preset. You can program preset or clear for each individual IOE. You can
also program the registers to power up high or low after configuration is
complete. If programmed to power up low, an asynchronous clear can
control the registers. If programmed to power up high, an asynchronous
preset can control the registers. This feature prevents the inadvertent
activation of another device’s active-low input upon power-up. If one
register in an IOE uses a preset or clear signal then all registers in the IOE
must use that same signal if they require preset or clear. Additionally, a
synchronous reset signal is available for the IOE registers.
Double-Data Rate I/O Pins
Stratix GX devices have six registers in the IOE, which support DDR
interfacing by clocking data on both positive and negative clock edges.
The IOEs in Stratix GX devices support DDR inputs, DDR outputs, and
bidirectional DDR modes.
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When using the IOE for DDR inputs, the two input registers clock double
rate input data on alternating edges. An input latch is also used within the
IOE for DDR input acquisition. The latch holds the data that is present
during the clock high times. This allows both bits of data to be
synchronous with the same clock edge (either rising or falling).
Figure 4–64 shows an IOE configured for DDR input. Figure 4–65 shows
the DDR input timing diagram.
Figure 4–64. Stratix GX IOE in DDR Input I/O Configuration
Column or Row
Interconnect
Note (1)
VCCIO
ioe_clk[7..0] (1)
I/O Interconnect
[15..0] (1)
To DQS Local
Bus (3)
DQS Local
Bus (1), (2)
Optional
PCI Clamp
VCCIO
Programmable
Pull-Up
Resistor
Input Pin to
Input Register Delay
sclr
Input Register
D
Q
clkin
Output Clock
Enable Delay
ENA
CLRN/PRN
Bus-Hold
Circuit
aclr/prn
Chip-Wide Reset
Latch
Input Register
D
Q
ENA
CLRN/PRN
D
Q
ENA
CLRN/PRN
Notes to Figure 4–64:
(1)
(2)
(3)
All input signals to the IOE can be inverted at the IOE.
This signal connection is only allowed on dedicated DQ function pins.
This signal is for dedicated DQS function pins only.
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Figure 4–65. Input Timing Diagram in DDR Mode
Data at
input pin
A0
B1
A1
B2
A2
B3
A3
B4
CLK
A'
A1
A2
A3
B'
B1
B2
B3
Input To
Logic Array
When using the IOE for DDR outputs, the two output registers are
configured to clock two data paths from LEs on rising clock edges. These
output registers are multiplexed by the clock to drive the output pin at a
×2 rate. One output register clocks the first bit out on the clock high time,
while the other output register clocks the second bit out on the clock low
time. Figure 4–66 shows the IOE configured for DDR output. Figure 4–67
shows the DDR output timing diagram.
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February 2005
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Figure 4–66. Stratix GX IOE in DDR Output I/O Configuration
Column or Row
Interconnect
Notes (1), (2)
IOE_CLK[7..0]
I/O Interconnect
[15..0]
OE Register
D
Q
Output
tZX Delay
clkout
ENA
CLRN/PRN
OE Register
tCO Delay
Output
Enable Clock
Enable Delay
Output Clock
Enable Delay
aclr/prn
VCCIO
Optional
PCI Clamp
Chip-Wide Reset
OE Register
D
VCCIO
Q
sclr
ENA
CLRN/PRN
Logic Array
to Output
Register Delay
Programmable
Pull-Up
Resistor
Output Register
D
Q
Output
Pin Delay
ENA
CLRN/PRN
Logic Array
to Output
Register Delay
Used for
DDR SDRAM
Output Register
D
clk
Drive Strength Control
Open-Drain Output
Slew Control
Q
ENA
CLRN/PRN
Bus-Hold
Circuit
Notes to Figure 4–66:
(1)
(2)
All input signals to the IOE can be inverted at the IOE.
The tristate is by default active high. It can, however, be designed to be active low.
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Figure 4–67. Output Timing Diagram in DDR Mode
CLK
A
A1
A2
A3
A4
B
B1
B2
B3
B4
From Internal
Registers
B1
DDR output
A1
B2
A2
B3
A3
The Stratix GX IOE operates in bidirectional DDR mode by combining the
DDR input and DDR output configurations. Stratix GX device I/O pins
transfer data on a DDR bidirectional bus to support DDR SDRAM. The
negative-edge-clocked OE register holds the OE signal inactive until the
falling edge of the clock. This is done to meet DDR SDRAM timing
requirements.
External RAM Interfacing
Stratix GX devices support DDR SDRAM at up to 200 MHz (400-Mbps
data rate) through dedicated phase-shift circuitry, QDR and QDRII
SRAM interfaces up to 167 MHz, and ZBT SRAM interfaces up to 200
MHz. Stratix GX devices also provide preliminary support for reduced
latency DRAM II (RLDRAM II) at rates up to 200 MHz through the
dedicated phase-shift circuitry.
1
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February 2005
In addition to the required signals for external memory
interfacing, Stratix GX devices offer the optional clock enable
signal. By default the Quartus II software sets the clock enable
signal high, which tells the output register to update with new
values. The output registers hold their own values if the design
sets the clock enable signal low. See Figure 4–63.
To find out more about the DDR SDRAM specification, see the JEDEC
web site (www.jedec.org). For information on memory controller
megafunctions for Stratix GX devices, see the Altera web site
(www.altera.com). See AN 342: Interfacing DDR SDRAM with Stratix &
Stratix GX Devices for more information on DDR SDRAM interface in
Stratix GX. Also see AN 349: QDR SRAM Controller Reference Design for
Stratix & Stratix GX Devices and AN 329: ZBT SRAM Controller Reference
Design for Stratix & Stratix GX Devices.
4–107
Stratix GX Device Handbook, Volume 1
I/O Structure
Table 4–22 shows the performance specification for DDR SDRAM,
RLDRAM II, QDR SRAM, QDRII SRAM, and ZBT SRAM interfaces in
EP1SGX10 through EP1SGX40 devices. The DDR SDRAM and QDR
SRAM numbers in Table 4–22 have been verified with hardware
characterization with third-party DDR SDRAM and QDR SRAM devices
over temperature and voltage extremes.
Table 4–22. External RAM Support in EP1SGX10 Through EP1SGX40 Devices
Maximum Clock Rate (MHz)
DDR Memory Type
I/O Standard
-5 Speed Grade -6 Speed Grade
-7 Speed
Grade
DDR SDRAM (1), (2)
SSTL-2
200
167
133
DDR SDRAM - side banks (2), (3),
(4)
SSTL-2
150
133
133
RLDRAM II (4)
1.8-V HSTL
200
(5)
(5)
QDR SRAM (6)
1.5-V HSTL
167
167
133
QDRII SRAM (6)
1.5-V HSTL
200
167
133
ZBT SRAM (7)
LVTTL
200
200
167
Notes to Table 4–22:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
These maximum clock rates apply if the Stratix GX device uses DQS phase-shift circuitry to interface with DDR
SDRAM. DQS phase-shift circuitry is only available in the top and bottom I/O banks (I/O banks 3, 4, 7, and 8).
For more information on DDR SDRAM, see AN 342: Interfacing DDR SDRAM with Stratix & Stratix GX Devices.
DDR SDRAM is supported on the Stratix GX device side I/O banks (I/O banks 1, 2, 5, and 6) without dedicated
DQS phase-shift circuitry. The read DQS signal is ignored in this mode.
These performance specifications are preliminary.
This device does not support RLDRAM II.
For more information on QDR or QDRII SRAM, see AN 349: QDR SRAM Controller Reference Design for Stratix &
Stratix GX Devices.
For more information on ZBT SRAM, see AN 329: ZBT SRAM Controller Reference Design for Stratix & Stratix GX
Devices.
In addition to six I/O registers and one input latch in the IOE for
interfacing to these high-speed memory interfaces, Stratix GX devices
also have dedicated circuitry for interfacing with DDR SDRAM. In every
Stratix GX device, the I/O banks at the top (I/O banks 3 and 4) and
bottom (I/O banks 7 and 8) of the device support DDR SDRAM up to 200
MHz. These pins support DQS signals with DQ bus modes of ×8, ×16, or
×32.
4–108
Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Stratix GX Architecture
Table 4–23 shows the number of DQ and DQS buses that are supported
per device.
Table 4–23. DQS & DQ Bus Mode Support
Device
Package
Note (1)
Number of ×8
Groups
Number of ×16
Groups
Number of ×32
Groups
EP1SGX10
672-pin FineLine BGA
12 (2)
0
0
EP1SGX25
672-pin FineLine BGA
EP1SGX40
16 (3)
8
4
1,020-pin FineLine BGA
20
8
4
1,020-pin FineLine BGA
20
8
4
Notes to Table 4–23:
(1)
(2)
(3)
See the Selectable I/O Standards in Stratix & Stratix GX Devices chapter of the Stratix GX Device Handbook,
Volume 2 for VREF guidelines.
These packages have six groups in I/O banks 3 and 4 and six groups in I/O banks 7 and 8.
These packages have eight groups in I/O banks 3 and 4 and eight groups in I/O banks 7 and 8.
A compensated delay element on each DQS pin automatically aligns
input DQS synchronization signals with the data window of their
corresponding DQ data signals. The DQS signals drive a local DQS bus in
the top and bottom I/O banks. This DQS bus is an additional resource to
the I/O clocks and clocks DQ input registers with the DQS signal.
Two separate single phase-shifting reference circuits are located on the
top and bottom of the Stratix GX device. Each circuit is driven by a system
reference clock through the CLK pins that is the same frequency as the
DQS signal. Clock pins CLK[15..12]p feed the phase-shift circuitry on
the top of the device and clock pins CLK[7..4]p feed the phase-shift
circuitry on the bottom of the device. The phase-shifting reference circuit
on the top of the device controls the compensated delay elements for all
10 DQS pins located at the top of the device. The phase-shifting reference
circuit on the bottom of the device controls the compensated delay
elements for all 10 DQS pins located on the bottom of the device. All
10 delay elements (DQS signals) on either the top or bottom of the device
shift by the same degree amount. For example, all 10 DQS pins on the top
of the device can be shifted by 90° and all 10 DQS pins on the bottom of
the device can be shifted by 72°. The reference circuits require a maximum
of 256 system reference clock cycles to set the correct phase on the DQS
delay elements. Figure 4–68 illustrates the phase-shift reference circuit
control of each DQS delay shift on the top of the device. This same circuit
is duplicated on the bottom of the device.
Altera Corporation
February 2005
4–109
Stratix GX Device Handbook, Volume 1
I/O Structure
Figure 4–68. Simplified Diagram of the DQS Phase-Shift Circuitry
Input
Reference
Clock
Phase
Comparator
Up/Down
Counter
Delay Chains
6
Control Signals
to DQS Pins
See the External Memory Interfaces chapter of the Stratix GX Device
Handbook, Volume 2 for more information on external memory interfaces.
Programmable Drive Strength
The output buffer for each Stratix GX device I/O pin has a programmable
drive strength control for certain I/O standards. The LVTTL and
LVCMOS standard has several levels of drive strength that the user can
control. SSTL-3 class I and II, SSTL-2 class I and II, HSTL class I and II, and
3.3-V GTL+ support a minimum setting, the lowest drive strength that
guarantees the IOH/IOL of the standard. Using minimum settings
provides signal slew rate control to reduce system noise and signal
overshoot.
4–110
Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Stratix GX Architecture
Table 4–24 shows the possible settings for the I/O standards with drive
strength control.
Table 4–24. Programmable Drive Strength
I/O Standard
IOH / IOL Current Strength Setting (mA)
3.3-V LVTTL
24 (1), 16, 12, 8, 4
3.3-V LVCMOS
24 (2), 12 (1), 8, 4, 2
2.5-V LVTTL/LVCMOS
16 (1), 12, 8, 2
1.8-V LVTTL/LVCMOS
12 (1), 8, 2
1.5-V LVCMOS
8 (1), 4, 2
GTL/GTL+
1.5-V HSTL class I and II
1.8-V HSTL class I and II
SSTL-3 class I and II
SSTL-2 class I and II
SSTL-18 class I and II
Support maximum and minimum strength
Notes to Table 4–24:
(1)
(2)
This is the Quartus II software default current setting.
I/O banks 1 and 2 do not support this setting.
The Quartus II software, beginning with version 4.2, reports current
strength as “PCI Compliant” for 3.3-V PCI, 3.3-V PCI-X 1.0, and Compact
PCI I/O standards.
Stratix GX devices support series on-chip termination (OCT) using
programmable drive strength. For more information, contact your Altera
Support Representative.
Open-Drain Output
Stratix GX devices provide an optional open-drain (equivalent to an
open-collector) output for each I/O pin. This open-drain output enables
the device to provide system-level control signals (that is, interrupt and
write-enable signals) that can be asserted by any of several devices.
Altera Corporation
February 2005
4–111
Stratix GX Device Handbook, Volume 1
I/O Structure
Slew-Rate Control
The output buffer for each Stratix GX device I/O pin has a programmable
output slew-rate control that can be configured for low-noise or highspeed performance. A faster slew rate provides high-speed transitions for
high-performance systems. However, these fast transitions may
introduce noise transients into the system. A slow slew rate reduces
system noise, but adds a nominal delay to rising and falling edges. Each
I/O pin has an individual slew-rate control, allowing you to specify the
slew rate on a pin-by-pin basis. The slew-rate control affects both the
rising and falling edges.
Bus Hold
Each Stratix GX device I/O pin provides an optional bus-hold feature.
The bus-hold circuitry can weakly hold the signal on an I/O pin at its lastdriven state. Since the bus-hold feature holds the last-driven state of the
pin until the next input signal is present, an external pull-up or pull-down
resistor is not needed to hold a signal level when the bus is tri-stated.
Table 4–25 shows bus hold support for different pin types.
Table 4–25. Bus Hold Support
Pin Type
I/O pins
Bus Hold
v
CLK[15..0]
CLK[0,1,2,3,8,9,10,11]
FCLK
v
FPLL[7..10]CLK
The bus-hold circuitry also pulls undriven pins away from the input
threshold voltage where noise can cause unintended high-frequency
switching. You can select this feature individually for each I/O pin. The
bus-hold output drives no higher than VCCIO to prevent overdriving
signals. If the bus-hold feature is enabled, the programmable pull-up
option cannot be used. Disable the bus-hold feature when using opendrain outputs with the GTL+ I/O standard or when the I/O pin has been
configured for differential signals.
4–112
Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Stratix GX Architecture
The bus-hold circuitry uses a resistor with a nominal resistance (RBH) of
approximately 7 kΩ to weakly pull the signal level to the last-driven state.
The chapter DC & Switching Characteristics of the Stratix GX Device
Handbook, Volume 1 gives the specific sustaining current driven through
this resistor and the overdrive current used to identify the next-driven
input level. This information is provided for each VCCIO voltage level.
The bus-hold circuitry is active only after configuration. When going into
user mode, the bus-hold circuit captures the value on the pin present at
the end of configuration.
Programmable Pull-Up Resistor
Each Stratix GX device I/O pin provides an optional programmable pullup resistor during user mode. If this feature is enabled for an I/O pin, the
pull-up resistor (typically 25 kΩ) weakly holds the output to the VCCIO
level of the output pin’s bank. Table 4–26 shows which pin types support
the weak pull-up resistor feature.
Table 4–26. Programmable Weak Pull-Up Resistor Support
Pin Type
I/O pins
Programmable Weak Pull-Up Resistor
v
CLK[15..0]
FCLK
v
FPLL[7..10]CLK
Configuration pins
JTAG pins
v (1)
Note to Table 4–26:
(1)
TDO pins do not support programmable weak pull-up resistors.
Advanced I/O Standard Support
Stratix GX device IOEs support the following I/O standards:
■
■
■
■
■
■
■
■
Altera Corporation
February 2005
LVTTL
LVCMOS
1.5 V
1.8 V
2.5 V
3.3-V PCI
3.3-V PCI-X 1.0
3.3-V AGP (1× and 2×)
4–113
Stratix GX Device Handbook, Volume 1
I/O Structure
■
■
■
■
■
■
■
■
■
■
■
■
■
LVDS
LVPECL
3.3-V PCML
HyperTransport
Differential HSTL (on input/output clocks only)
Differential SSTL (on output column clock pins only)
GTL/GTL+
1.5-V HSTL class I and II
1.8-V HSTL Class I and II
SSTL-3 class I and II
SSTL-2 class I and II
SSTL-18 class I and II
CTT
Table 4–27 describes the I/O standards supported by Stratix GX devices.
Table 4–27. Stratix GX Supported I/O Standards (Part 1 of 2)
Type
Input Reference
Voltage (VREF)
(V)
Output Supply
Voltage (VCCIO)
(V)
Board
Termination
Voltage (VTT)
(V)
LVTTL
Single-ended
N/A
3.3
N/A
LVCMOS
Single-ended
N/A
3.3
N/A
2.5 V
Single-ended
N/A
2.5
N/A
1.8 V
Single-ended
N/A
1.8
N/A
1.5 V
Single-ended
N/A
1.5
N/A
3.3-V PCI
Single-ended
N/A
3.3
N/A
3.3-V PCI-X 1.0
I/O Standard
Single-ended
N/A
3.3
N/A
LVDS
Differential
N/A
3.3
N/A
LVPECL
Differential
N/A
3.3
N/A
3.3-V PCML
Differential
N/A
3.3
N/A
HyperTransport
Differential
N/A
2.5
N/A
Differential HSTL (1)
Differential
0.75
1.5
0.75
Differential
1.25
2.5
1.25
Voltage-referenced
0.8
N/A
1.20
Differential SSTL (2)
GTL
GTL+
Voltage-referenced
1.0
N/A
1.5
1.5-V HSTL class I and II
Voltage-referenced
0.75
1.5
0.75
1.8-V HSTL class I and II
Voltage-referenced
0.9
1.8
0.9
SSTL-18 class I and II
Voltage-referenced
0.90
1.8
0.90
SSTL-2 class I and II
Voltage-referenced
1.25
2.5
1.25
4–114
Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Stratix GX Architecture
Table 4–27. Stratix GX Supported I/O Standards (Part 2 of 2)
I/O Standard
Type
Input Reference
Voltage (VREF)
(V)
Output Supply
Voltage (VCCIO)
(V)
Board
Termination
Voltage (VTT)
(V)
SSTL-3 class I and II
Voltage-referenced
1.5
3.3
1.5
AGP (1× and 2×)
Voltage-referenced
1.32
3.3
N/A
CTT
Voltage-referenced
1.5
3.3
1.5
Notes to Table 4–27:
(1)
(2)
This I/O standard is only available on input and output clock pins.
This I/O standard is only available on output column clock pins.
f
For more information on I/O standards supported by Stratix GX
devices, see the Selectable I/O Standards in Stratix & Stratix GX Devices
chapter of the Stratix GX Device Handbook, Volume 2.
Stratix GX devices contain eight I/O banks in addition to the four
enhanced PLL external clock out banks, as shown in Figure 4–69. The four
I/O banks on the right and left of the device contain circuitry to support
high-speed differential I/O for LVDS, LVPECL, 3.3-V PCML, and
HyperTransport inputs and outputs. These banks support all I/O
standards listed in Table 4–27 except PCI I/O pins or PCI-X 1.0, GTL,
SSTL-18 Class II, and HSTL Class II outputs. The top and bottom I/O
banks support all single-ended I/O standards. Additionally, Stratix GX
devices support four enhanced PLL external clock output banks,
allowing clock output capabilities such as differential support for SSTL
and HSTL. Table 4–28 shows I/O standard support for each I/O bank.
Altera Corporation
February 2005
4–115
Stratix GX Device Handbook, Volume 1
I/O Structure
Figure 4–69. Stratix GX I/O Banks
DQST9
PLL7
DQST8
DQST7
DQST6
Notes (1), (2), (3)
DQST5
9
DQST4
PLL11
DQST3
DQST2
DQST1
DQST0
VREF1B4 VREF2B4 VREF3B4 VREF4B4 VREF5B4
10
Bank 4
I/O Bank 13 (5)
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (3)
Bank 2
VREF1B2 VREF2B2 VREF3B2 VREF4B2
Bank 3
(4)
I/O Banks 3, 4, 9 & 10 Support
All Single-Ended I/O Standards (2)
I/O Banks 1 and 2 Support All
Single-Ended I/O Standards Except
Differential HSTL Output Clocks,
Differential SSTL-2 Output Clocks,
HSTL Class II, GTL, SSTL-18 Class II,
PCI, PCI-X, and AGP 1×/2×
PLL1
Bank 1
PLL2
VREF1B1 VREF2B1 VREF3B1 VREF4B1
PLL5
VREF1B3 VREF2B3 VREF3B3 VREF4B3 VREF5B3
I/O Bank 17 (5)
1.5-V PCML (5)
I/O Bank 16 (5)
I/O Banks 7, 8, 11 & 12 Support
All Single-Ended I/O Standards (2)
(4)
LVDS, LVPECL, 3.3-V PCML,
and HyperTransport I/O Block
and Regular I/O Pins (3)
I/O Bank 15 (5)
Bank 8
PLL8
I/O Bank 14 (5)
11
VREF5B8 VREF4B8 VREF3B8 VREF2B8 VREF1B8
DQSB9
DQSB8
DQSB7
DQSB6
DQSB5
12
PLL6
Bank 7
PLL12
VREF5B7 VREF4B7 VREF3B7 VREF2B7 VREF1B7
DQSB4
DQSB3
DQSB2
DQSB1
DQSB0
Notes to Figure 4–69:
(1)
(2)
(3)
(4)
(5)
Figure 4–69 is a top view of the Stratix GX silicon die.
Banks 9 through 12 are enhanced PLL external clock output banks.
If the high-speed differential I/O pins are not used for high-speed differential signaling, they can support all of the
I/O standards except HSTL class I and II, GTL, SSTL-18 Class II, PCI, PCI-X, and AGP 1×/2×.
For guidelines for placing single-ended I/O pads next to differential I/O pads, see the Selectable I/O Standards in
Stratix & Stratix GX Devices chapter in the Stratix GX Device Handbook, Volume 2.
These I/O banks in Stratix GX devices also support the LVDS, LVPECL, and 3.3-V PCML I/O standards on reference
clocks and receiver input pins (AC coupled)
4–116
Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Stratix GX Architecture
Table 4–28 shows I/O standard support for each I/O bank.
Table 4–28. I/O Support by Bank (Part 1 of 2)
Top & Bottom Banks
(3, 4, 7 & 8)
Left Banks
(1 & 2)
Enhanced PLL External
Clock Output Banks
(9, 10, 11 & 12)
LVTTL
v
v
v
LVCMOS
v
v
v
2.5 V
v
v
v
1.8 V
v
v
v
1.5 V
v
v
v
3.3-V PCI
v
3.3-V PCI-X 1.0
v
I/O Standard
v
v
LVPECL
v
v
3.3-V PCML
v
v
LVDS
v
v
HyperTransport technology
v
v
Differential HSTL (clock
inputs)
v
v
Differential HSTL (clock
outputs)
v
Differential SSTL (clock
outputs)
v
3.3-V GTL
v
3.3-V GTL+
v
v
v
v
1.5-V HSTL class I
v
v
v
1.5-V HSTL class II
v
1.8-V HSTL class I
v
1.8-V HSTL class II
v
SSTL-18 class I
v
SSTL-18 class II
v
SSTL-2 class I
v
v
v
v
v
v
v
v
v
SSTL-2 class II
v
v
v
SSTL-3 class I
v
v
v
Altera Corporation
February 2005
v
4–117
Stratix GX Device Handbook, Volume 1
I/O Structure
Table 4–28. I/O Support by Bank (Part 2 of 2)
Top & Bottom Banks
(3, 4, 7 & 8)
Left Banks
(1 & 2)
Enhanced PLL External
Clock Output Banks
(9, 10, 11 & 12)
SSTL-3 class II
v
v
v
AGP (1× and 2×)
v
CTT
v
I/O Standard
v
v
v
Each I/O bank has its own VCCIO pins. A single device can support 1.5-,
1.8-, 2.5-, and 3.3-V interfaces; each bank can support a different standard
independently. Each bank also has dedicated VREF pins to support any
one of the voltage-referenced standards (such as SSTL-3) independently.
Each I/O bank can support multiple standards with the same VCCIO for
input and output pins. Each bank can support one voltage-referenced
I/O standard. For example, when VCCIO is 3.3 V, a bank can support
LVTTL, LVCMOS, 3.3-V PCI, and SSTL-3 for inputs and outputs.
Differential On-Chip Termination
Stratix GX devices provide differential on-chip termination (LVDS I/O
standard) to reduce reflections and maintain signal integrity. Differential
on-chip termination simplifies board design by minimizing the number
of external termination resistors required. Termination can be placed
inside the package, eliminating small stubs that can still lead to
reflections. The internal termination is designed using transistors in the
linear region of operation.
Stratix GX devices support internal differential termination with a
nominal resistance value of 137.5 Ω for LVDS input receiver buffers.
LVPECL signals require an external termination resistor. Figure 4–70
shows the device with differential termination.
4–118
Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Stratix GX Architecture
Figure 4–70. LVDS Input Differential On-Chip Termination
Transmitting
Device
Receiving Device with
Differential Termination
Z0
+
+
RD
Ð
Ð
Z0
I/O banks on the left and right side of the device support LVDS receiver
(far-end) differential termination.
Table 4–29 shows the Stratix GX device differential termination support.
Table 4–29. Differential Termination Supported by I/O Banks
Differential Termination Support
I/O Standard Support
Differential termination (1), (2)
Top & Bottom
Banks (3, 4, 7 & 8)
Left Banks (1 & 2)
v
LVDS
Notes to Table 4–29:
(1)
(2)
Clock pin CLK0, CLK2, CLK9, CLK11, and pins FPLL[7..10]CLK do not support differential termination.
Differential termination is only supported for LVDS because of a 3.3-V VC C I O .
Table 4–30 shows the termination support for different pin types.
Table 4–30. Differential Termination Support Across Pin Types
RD
Pin Type
Top and bottom I/O banks (3, 4, 7, and 8)
v
DIFFIO_RX[]
CLK[0,2,9,11],CLK[4-7],CLK[12-15]
CLK[1,3,8,10]
v
FCLK
FPLL[7..10]CLK
The differential on-chip resistance at the receiver input buffer is
118 Ω ±20 %.
Altera Corporation
February 2005
4–119
Stratix GX Device Handbook, Volume 1
I/O Structure
However, there is additional resistance present between the device ball
and the input of the receiver buffer, as shown in Figure 4–71. This
resistance is because of package trace resistance (which can be calculated
as the resistance from the package ball to the pad) and the parasitic layout
metal routing resistance (which is shown between the pad and the
intersection of the on-chip termination and input buffer).
Figure 4–71. Differential Resistance of LVDS Differential Pin Pair (RD)
Pad
Package Ball
0.3 Ω
9.3 Ω
0.3 Ω
9.3 Ω
LVDS
Input Buffer
RD
Package Ball
Differential On-Chip
Termination Resistor
Pad
Table 4–31 defines the specification for internal termination resistance for
commercial devices.
Table 4–31. Differential On-Chip Termination
Resistance
Symbol
RD (2)
Description
Internal differential termination for LVDS
Conditions
Unit
Min
Typ
Max
Commercial (1), (3)
110
135
165
Ω
Industrial (2), (3)
100
135
170
Ω
Notes to Table 4–31:
(1)
(2)
(3)
Data measured over minimum conditions (Tj = 0 C, VC C I O +5%) and maximum conditions (Tj = 85 C,
VCCIO = –5%).
Data measured over minimum conditions (Tj = –40 C, VCCIO +5%) and maximum conditions (Tj = 100 C,
VCCIO = –5%).
LVDS data rate is supported for 840 Mbps using internal differential termination.
MultiVolt I/O Interface
The Stratix GX architecture supports the MultiVolt I/O interface feature,
which allows Stratix GX devices in all packages to interface with systems
of different supply voltages.
The Stratix GX VCCINT pins must always be connected to a 1.5-V power
supply. With a 1.5-V VCCINT level, input pins are 1.5-V, 1.8-V, 2.5-V, and
3.3-V tolerant. The VCCIO pins can be connected to either a 1.5-V, 1.8-V,
4–120
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February 2005
Stratix GX Architecture
2.5-V, or 3.3-V power supply, depending on the output requirements.
The output levels are compatible with systems of the same voltage as the
power supply (for example, when VCCIO pins are connected to a 1.5-V
power supply, the output levels are compatible with 1.5-V systems).
When VCCIO pins are connected to a 3.3-V power supply, the output high
is 3.3 V and is compatible with 3.3-V or 5.0-V systems.
Table 4–32 summarizes Stratix GX MultiVolt I/O support.
Table 4–32. Stratix GX MultiVolt I/O Support
Note (1)
Input Signal (5)
VCCIO (V)
Output Signal (6)
1.5 V
1.8 V
2.5 V
3.3 V
5.0 V
1.5
v
v
v (2)
v (2)
v
1.8
v (2)
v
v (2)
v (2)
v (3)
v
2.5
v
v
v (3)
v (3)
v
3.3
v (2)
v
v (3)
v (3)
v (3)
v (4)
1.5 V
1.8 V
2.5 V
3.3 V
5.0 V
v
v
Notes to Table 4–32:
(1)
(2)
(3)
(4)
(5)
(6)
To drive inputs higher than VCCIO but less than 4.1 V, disable the PCI clamping diode. However, to drive 5.0-V
inputs to the device, enable the PCI clamping diode to prevent VI from rising above 4.0 V.
The input pin current may be slightly higher than the typical value.
Although VCCIO specifies the voltage necessary for the Stratix GX device to drive out, a receiving device powered
at a different level can still interface with the Stratix GX device if it has inputs that tolerate the VCCIO value.
Stratix GX devices can be 5.0-V tolerant with the use of an external resistor and the internal PCI clamp diode.
This is the external signal that is driving the Stratix GX device.
This represents the system voltage that Stratix GX supports when a VCCIO pin is connected to a specific voltage
level. For example, when VCCIO is 3.3 V and if the I/O standard is LVTTL/LVCMOS, the output high of the signal
coming out from Stratix GX is 3.3 V and is compatible with 3.3-V or 5.0-V systems.
Power
Sequencing &
Hot Socketing
Because Stratix GX devices can be used in a mixed-voltage environment,
they have been designed specifically to tolerate any possible power-up
sequence. Therefore, the VCCIO and VCCINT power supplies may be
powered in any order.
Signals can be driven into Stratix GX devices before and during power up
without damaging the device. In addition, Stratix GX devices do not
drive out during power up. Once operating conditions are reached and
the device is configured, Stratix GX devices operate as specified by the
user. For more information, see the Selectable I/O Standards in Stratix &
Stratix GX Devices chapter of the Stratix GX Device Handbook, Volume 2.
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February 2005
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IEEE Std. 1149.1 (JTAG) Boundary-Scan Support
IEEE Std. 1149.1
(JTAG)
Boundary-Scan
Support
All Stratix GX devices provide JTAG BST circuitry that complies with the
IEEE Std. 1149.1a-1990 specification. JTAG boundary-scan testing can be
performed either before or after, but not during configuration. Stratix GX
devices can also use the JTAG port for configuration together with either
the Quartus II software or hardware using either Jam Files (.jam) or Jam
Byte-Code Files (.jbc).
Stratix GX devices support IOE I/O standard setting reconfiguration
through the JTAG BST chain. The JTAG chain can update the I/O
standard for all input and output pins any time before or during user
mode. You can use this ability for JTAG testing before configuration when
some of the Stratix GX pins drive or receive from other devices on the
board using voltage-referenced standards. Because the Stratix GX device
may not be configured before JTAG testing, the I/O pins may not be
configured for appropriate electrical standards for chip-to-chip
communication. Programming those I/O standards via JTAG allows you
to fully test I/O connection to other devices.
The enhanced PLL reconfiguration bits are part of the JTAG chain before
configuration and after power-up. After device configuration, the PLL
reconfiguration bits are not part of the JTAG chain.
Stratix GX devices also use the JTAG port to monitor the logic operation
of the device with the SignalTap® embedded logic analyzer. Stratix GX
devices support the JTAG instructions shown in Table 4–33.
Table 4–33. Stratix GX JTAG Instructions (Part 1 of 2)
JTAG Instruction
Description
SAMPLE/PRELOAD Allows a snapshot of signals at the device pins to be captured and examined during
normal device operation, and permits an initial data pattern to be output at the device pins.
Also used by the SignalTap® embedded logic analyzer.
EXTEST (1)
Allows the external circuitry and board-level interconnects to be tested by forcing a test
pattern at the output pins and capturing test results at the input pins.
BYPASS
Places the 1-bit bypass register between the TDI and TDO pins, which allows the BST data
to pass synchronously through selected devices to adjacent devices during normal device
operation.
USERCODE
Selects the 32-bit USERCODE register and places it between the TDI and TDO pins,
allowing the USERCODE to be serially shifted out of TDO.
IDCODE
Selects the IDCODE register and places it between TDI and TDO, allowing the IDCODE
to be serially shifted out of TDO.
HIGHZ (1)
Places the 1-bit bypass register between the TDI and TDO pins, which allows the BST data
to pass synchronously through selected devices to adjacent devices during normal device
operation, while tri-stating all of the I/O pins.
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February 2005
Stratix GX Architecture
Table 4–33. Stratix GX JTAG Instructions (Part 2 of 2)
JTAG Instruction
Description
CLAMP (1)
Places the 1-bit bypass register between the TDI and TDO pins, which allows the BST data
to pass synchronously through selected devices to adjacent devices during normal device
operation while holding I/O pins to a state defined by the data in the boundary-scan
register.
ICR instructions
Used when configuring a Stratix GX device through the JTAG port with a MasterBlasterTM
or ByteBlasterMVTM download cable, or when using a .jam file or .jbc file with an
embedded processor.
PULSE_NCONFIG
Emulates pulsing the nCONFIG pin low to trigger reconfiguration even though the physical
pin is unaffected.
CONFIG_IO
Allows the IOE standards to be configured through the JTAG chain. Stops configuration if
executed during configuration. Can be executed before or after configuration.
SignalTap
instructions
Monitors internal device operation with the SignalTap embedded logic analyzer.
Note to Table 4–33:
(1)
Bus hold and weak pull-up resistor features override the high-impedance state of HIGHZ, CLAMP, and EXTEST.
The Stratix GX device instruction register length is 10 bits, and the
USERCODE register length is 32 bits. Tables 4–34 and 4–35 show the
boundary-scan register length and IDCODE information for Stratix GX
devices.
Table 4–34. Stratix GX Boundary-Scan Register Length
Device
Boundary-Scan Register Length
EP1SGX10
1,029
EP1SGX25
1,665
EP1SGX40
1,941
Table 4–35. 32-Bit Stratix GX Device IDCODE (Part 1 of 2)
IDCODE (32 Bits) (1)
Device
Version (4 Bits)
Part Number (16 Bits)
Manufacturer Identity
(11 Bits)
LSB (1 Bit) (2)
EP1SGX10
0000
0010 0000 0100 0001
000 0110 1110
1
EP1SGX25
0000
0010 0000 0100 0011
000 0110 1110
1
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February 2005
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IEEE Std. 1149.1 (JTAG) Boundary-Scan Support
Table 4–35. 32-Bit Stratix GX Device IDCODE (Part 2 of 2)
IDCODE (32 Bits) (1)
Device
Version (4 Bits)
Part Number (16 Bits)
Manufacturer Identity
(11 Bits)
LSB (1 Bit) (2)
0000
0010 0000 0100 0101
000 0110 1110
1
EP1SGX40
Notes to Table 4–35:
(1)
(2)
The most significant bit (MSB) is at the left end of the string.
The IDCODE’s least significant bit (LSB) is always 1.
Figure 4–72 shows the timing requirements for the JTAG signals.
Figure 4–72. Stratix GX JTAG Waveforms
TMS
TDI
t JCP
t JCH
t JCL
t JPSU
t JPH
TCK
tJPZX
t JPXZ
t JPCO
TDO
tJSH
tJSSU
Signal
to Be
Captured
Signal
to Be
Driven
tJSCO
tJSZX
tJSXZ
Table 4–36 shows the JTAG timing parameters and values for Stratix GX
devices.
Table 4–36. Stratix GX JTAG Timing Parameters & Values (Part 1 of 2)
Symbol
Parameter
Min (ns) Max (ns)
tJ C P
TCK clock period
100
tJ C H
TCK clock high time
50
tJ C L
TCK clock low time
50
tJ P S U
JTAG port setup time
20
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February 2005
Stratix GX Architecture
Table 4–36. Stratix GX JTAG Timing Parameters & Values (Part 2 of 2)
Symbol
Altera Corporation
February 2005
Parameter
Min (ns) Max (ns)
tJ P H
JTAG port hold time
45
tJ P C O
JTAG port clock to output
25
tJ P Z X
JTAG port high impedance to valid output
25
tJ P X Z
JTAG port valid output to high impedance
25
tJ S S U
Capture register setup time
20
tJ S H
Capture register hold time
45
tJ S C O
Update register clock to output
35
tJ S Z X
Update register high impedance to valid output
35
tJ S X Z
Update register valid output to high impedance
35
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IEEE Std. 1149.1 (JTAG) Boundary-Scan Support
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February 2005
5. Configuration & Testing
SGX51005-1.0
SignalTap
Embedded Logic
Analyzer
Stratix® GX devices feature the SignalTap® embedded logic analyzer,
which monitors design operation over a period of time through the
IEEE Std. 1149.1 (JTAG) circuitry. You can analyze internal logic at speed
without bringing internal signals to the I/O pins. This feature is
particularly important for advanced packages, such as FineLine BGA®
packages, because it can be difficult to add a connection to a pin during
the debugging process after a board is designed and manufactured.
Configuration
The logic, circuitry, and interconnects in the Stratix GX architecture are
configured with CMOS SRAM elements. Stratix GX devices are
reconfigurable and are 100% tested prior to shipment. As a result, you do
not have to generate test vectors for fault coverage purposes, and can
instead focus on simulation and design verification. In addition, you do
not need to manage inventories of different ASIC designs. Stratix GX
devices can be configured on the board for the specific functionality
required.
Stratix GX devices are configured at system power-up with data stored in
an Altera serial configuration device or provided by a system controller.
Altera offers in-system programmability (ISP)-capable configuration
devices that configure Stratix GX devices via a serial data stream.
Stratix GX devices can be configured in under 100 ms using 8-bit parallel
data at 100 MHz. The Stratix GX device’s optimized interface allows
microprocessors to configure it serially or in parallel, and synchronously
or asynchronously. The interface also enables microprocessors to treat
Stratix GX devices as memory and configure them by writing to a virtual
memory location, making reconfiguration easy. After a Stratix GX device
has been configured, it can be reconfigured in-circuit by resetting the
device and loading new data. Real-time changes can be made during
system operation, enabling innovative reconfigurable computing
applications.
Operating Modes
The Stratix GX architecture uses SRAM configuration elements that
require configuration data to be loaded each time the circuit powers up.
The process of physically loading the SRAM data into the device is called
configuration. During initialization, which occurs immediately after
configuration, the device resets registers, enables I/O pins, and begins to
operate as a logic device. The I/O pins are tri-stated during power up,
Altera Corporation
February 2005
5–1
Configuration
and before and during configuration. Together, the configuration and
initialization processes are called command mode. Normal device
operation is called user mode.
A built-in weak pull-up resistor pulls all user I/O pins to VCCIO before
and during device configuration.
SRAM configuration elements allow Stratix GX devices to be
reconfigured in-circuit by loading new configuration data into the device.
With real-time reconfiguration, the device is forced into command mode
with a device pin. The configuration process loads different configuration
data, reinitializes the device, and resumes user-mode operation. You can
perform in-field upgrades by distributing new configuration files either
within the system or remotely.
Configuration Schemes
You can load the configuration data for a Stratix GX device with one of
five configuration schemes (see Table 5–1), chosen on the basis of the
target application. You can use a configuration device, intelligent
controller, or the JTAG port to configure a Stratix GX device. A
configuration device can automatically configure a Stratix GX device at
system power-up.
You can configure multiple Stratix GX devices in any of five
configuration schemes by connecting the configuration enable (nCE) and
configuration enable output (nCEO) pins on each device.
Table 5–1. Data Sources for Configuration
Configuration Scheme
Data Source
Configuration device
Enhanced or EPC2 configuration device
Passive serial (PS)
ByteBlasterMV™ or MasterBlaster™ download
cable or serial data source
Passive parallel
asynchronous (PPA)
Parallel data source
Fast passive parallel
Parallel data source
JTAG
MasterBlaster or ByteBlasterMV download cable
or a microprocessor with a Jam or JBC file (.jam
or .jbc)
5–2
Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
Configuration & Testing
Partial Reconfiguration
The enhanced PLLs within the Stratix GX device family support partial
reconfiguration of their multiply, divide, and time delay settings without
reconfiguring the entire device. You can use either serial data from the
logic array or regular I/O pins to program the PLL’s counter settings in a
serial chain. This option provides considerable flexibility for frequency
synthesis, allowing real-time variation of the PLL frequency and delay.
The rest of the device is functional while reconfiguring the PLL. See the
Stratix GX Architecture chapter of the Stratix GX Device Handbook,
Volume 1 for more information on Stratix GX PLLs.
Remote Update Configuration Modes
Stratix GX devices also support remote configuration using an Altera
enhanced configuration device (for example, EPC16, EPC8, and EPC4
devices) with page mode selection. Factory configuration data is stored in
the default page of the configuration device. This is the default
configuration which contains the design required to control remote
updates and handle or recover from errors. You write the factory
configuration once into the flash memory or configuration device.
Remote update data can update any of the remaining pages of the
configuration device. If there is an error or corruption in a remote update
configuration, the configuration device reverts back to the factory
configuration information.
There are two remote configuration modes: remote and local
configuration. You can use the remote update configuration mode for all
three configuration modes: serial, parallel synchronous, and parallel
asynchronous. Configuration devices (for example, EPC16 devices) only
support serial and parallel synchronous modes. Asynchronous parallel
mode allows remote updates when an intelligent host is used to configure
the Stratix GX device. This host must support page mode settings similar
to an EPC16 device.
Remote Update Mode
When the Stratix GX device is first powered-up in remote update
programming mode, it loads the configuration located at page
address 000. The factory configuration should always be located at page
address 000, and should never be remotely updated. The factory
configuration contains the required logic to perform the following
operations:
■
■
Altera Corporation
February 2005
Determine the page address/load location for the next application’s
configuration data
Recover from a previous configuration error
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Stratix GX Device Handbook, Volume 1
Configuration
■
Receive new configuration data and write it into the configuration
device
The factory configuration is the default and takes control if an error
occurs while loading the application configuration.
While in the factory configuration, the factory-configuration logic
performs the following operations:
■
■
■
Loads a remote update-control register to determine the page
address of the new application configuration
Determines whether to enable a user watchdog timer for the
application configuration
Determines what the watchdog timer setting should be if it is
enabled
The user watchdog timer is a counter that must be continually reset
within a specific amount of time in the user mode of an application
configuration to ensure that valid configuration occurred during a
remote update. Only valid application configurations designed for
remote update can reset the user watchdog timer in user mode. If a valid
application configuration does not reset the user watchdog timer in a
specific amount of time, the timer updates a status register and loads the
factory configuration. The user watchdog timer is automatically disabled
for factory configurations.
If an error occurs in loading the application configuration, the
configuration logic writes a status register to specify the cause of the
reconfiguration. Once this occurs, the Stratix GX device automatically
loads the factory configuration, which reads the status register and
determines the reason for reconfiguration. Based on the reason, the
factory configuration takes appropriate steps and writes the remote
update control register to specify the next application configuration page
to be loaded.
When the Stratix GX device successfully loads the application
configuration, it enters into user mode. The Stratix GX device then
executes the main application of the user. Intellectual property (IP), such
as a Nios® embedded processor, can help the Stratix GX device determine
when remote update is coming. The Nios embedded processor or user
logic receives incoming data, writes it to the configuration device, and
loads the factory configuration. The factory configuration reads the
remote update status register and determine the valid application
configuration to load. Figure 5–1 shows the Stratix GX remote update.
Figure 5–2 shows the transition diagram for remote update mode.
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Stratix GX Device Handbook, Volume 1
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February 2005
Configuration & Testing
Figure 5–1. Stratix GX Device Remote Update
(1)
Watchdog
Timer
New Remote
Configuration Data
Configuration
Device
Application Configuration
Page 7
Application Configuration
Stratix GX Device
Factory Configuration
Page 6
Page 0
Configuration Device Updates
Stratix GX Device with Factory
Configuration (to Handle Update)
or New Application Configuration
Note to Figure 5–1:
(1)
When the Stratix GX device is configured with the factory configuration, it can handle update data from EPC16,
EPC8, or EPC4 configuration device pages and point to the next page in the configuration device.
Altera Corporation
February 2005
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Stratix GX Device Handbook, Volume 1
Configuration
Figure 5–2. Remote Update Transition Diagram
Notes (1), (2)
Application 1
Configuration
Power-Up
Configuration
Error
Configuration
Error
Reload an
Application
Factory
Configuration
Reload an
Application
Configuration
Error
Application n
Configuration
Notes to Figure 5–2:
(1)
(2)
Remote update of application configuration is controlled by a Nios embedded processor or user logic programmed
in the factory or application configurations.
Up to seven pages can be specified allowing up to seven different configuration applications.
5–6
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February 2005
Configuration & Testing
Local Update Mode
Local update mode is a simplified version of the remote update. This
feature is intended for simple systems that need to load a single
application configuration immediately upon power-up without loading
the factory configuration first. Local update designs have only one
application configuration to load, so it does not require a factory
configuration to determine which application configuration to use.
Figure 5–3 shows the transition diagram for local update mode.
Figure 5–3. Local Update Transition Diagram
Power-Up
or nCONFIG
nCONFIG
Application
Configuration
Configuration
Error
Configuration
Error
nCONFIG
Factory
Configuration
Stratix GX
Automated
Single Event
Upset (SEU)
Detection
Stratix GX devices offer on-chip circuitry for automated checking of
single event upset (SEU) detection. Some applications that require the
device to operate error free at high elevations or in close proximity to
earth’s North or South Pole require periodic checks to ensure continued
data integrity. The error detection cyclic redundancy code (CRC) feature
controlled by the Device & Pin Options dialog box in the Quartus II
software uses a 32-bit CRC circuit to ensure data reliability and is one of
the best options for mitigating SEU.
Altera Corporation
February 2005
5–7
Stratix GX Device Handbook, Volume 1
Temperature-Sensing Diode
You can implement the error detection CRC feature with existing
circuitry in Stratix GX devices, eliminating the need for external logic. For
Stratix GX devices, the CRC is computed by Quartus II and downloaded
into the device as a part of the configuration bit stream. The CRC_ERROR
pin reports a soft error when configuration SRAM data is corrupted,
triggering device reconfiguration.
Custom-Built Circuitry
Dedicated circuitry is built into Stratix GX devices to perform error
detection automatically. This error detection circuitry constantly checks
for errors in the configuration SRAM cells while the device is in user
mode. You can monitor one external pin for the error and use it to trigger
a reconfiguration cycle. You can select the desired time between checks
by adjusting a built-in clock divider.
Software Interface
In the Quartus II software version 4.1 and later, you can turn on the
automated error detection CRC feature in the Device & Pin Options
dialog box. This dialog box allows you to enable the feature and set the
internal frequency of the CRC between 400 kHz to 100 MHz. This
controls the rate that the CRC circuitry verifies the internal configuration
SRAM bits in the FPGA device.
For more information on CRC, refer to AN 357: Error Detection Using CRC
in Altera FPGA Devices.
TemperatureSensing Diode
Stratix GX devices include a diode-connected transistor for use as a
temperature sensor in power management. This diode is used with an
external digital thermometer device such as a MAX1617A or MAX1619
from MAXIM Integrated Products. These devices steer bias current
through the Stratix GX diode, measuring forward voltage and converting
this reading to temperature in the form of an 8-bit signed number (7 bits
plus sign). The external device’s output represents the package
temperature of the Stratix GX device and can be used for intelligent
power management.
The diode requires two pins (tempdiodep and tempdioden) on the
Stratix GX device to connect to the external temperature-sensing device,
as shown in Figure 5–4. The temperature-sensing diode is a passive
element and therefore can be used before the Stratix GX device is
powered.
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Stratix GX Device Handbook, Volume 1
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February 2005
Configuration & Testing
Figure 5–4. External Temperature-Sensing Diode
Stratix GX Device
Temperature-Sensing
Device
tempdiodep
tempdioden
Table 5–2 shows the specifications for bias voltage and current of the
Stratix GX temperature-sensing diode.
Table 5–2. Temperature-Sensing Diode Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Units
IB I A S high
80
100
120
μA
IB I A S low
8
10
12
μA
VB P – VB N
VB N
Series resistance
0.3
0.9
0.7
V
V
3
W
The temperature-sensing diode works for the entire operating range
shown in Figure 5–5.
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February 2005
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Stratix GX Device Handbook, Volume 1
Temperature-Sensing Diode
Figure 5–5. Temperature Versus Temperature-Sensing Diode Voltage
0.95
0.90
100 μA Bias Current
10 μA Bias Current
0.85
0.80
0.75
Voltage
(Across Diode)
0.70
0.65
0.60
0.55
0.50
0.45
0.40
–55
–30
–5
20
45
70
95
120
Temperature ( C)
5–10
Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005
6. DC & Switching
Characteristics
SGX51006-1.2
Operating
Conditions
Stratix® GX devices are offered in both commercial and industrial grades.
However, industrial-grade devices may have limited speed-grade
availability.
Tables 6–1 through 6–12 provide information on absolute maximum
ratings, recommended operating conditions, DC operating conditions,
and transceiver block absolute maximum ratings. Notes for Tables 6–1
through 6–6 immediately follow Table 6–6, notes for Table 6–7
immediately follow that table, and notes for Tables 6–8 through 6–12
immediately follow Table 6–12.
Table 6–1. Stratix GX Device Absolute Maximum Ratings
Symbol
VCCINT
Parameter
Notes (1), (2)
Conditions
With respect to ground (3)
Supply voltage
VCCIO
Minimum
Maximum
Unit
–0.5
2.4
V
–0.5
4.6
V
–0.5
4.6
V
VI
DC input voltage
IOUT
DC output current, per pin
–25
25
mA
TSTG
Storage temperature
No bias
–65
150
° C
TAMB
Ambient temperature
Under bias
–65
135
° C
TJ
Junction temperature
BGA packages under bias
135
° C
Table 6–2. Stratix GX Device Recommended Operating Conditions (Part 1 of 2)
Symbol
Parameter
Conditions
Minimum
Maximum
Unit
1.425
1.575
V
3.00 (3.135)
3.60 (3.465)
V
Supply voltage for output buffers, (4)
2.5-V operation
2.375
2.625
V
Supply voltage for output buffers, (4)
1.8-V operation
1.71
1.89
V
Supply voltage for output buffers, (4)
1.5-V operation
1.4
1.6
V
–0.5
4.1
V
(4)
VCCINT
Supply voltage for internal logic
and input buffers
VCCIO
Supply voltage for output buffers, (4), (5)
3.3-V operation
VI
Note (7), (12), (13)
Input voltage
Altera Corporation
June 2006
(3), (6)
6–1
Operating Conditions
Table 6–2. Stratix GX Device Recommended Operating Conditions (Part 2 of 2)
Symbol
Parameter
Conditions
VO
Output voltage
TJ
Operating junction temperature
For commercial
use
For industrial use
Table 6–3. Stratix GX Device DC Operating Conditions
Symbol
Parameter
Note (7), (12), (13)
Minimum
Maximum
Unit
0
VCCIO
V
0
85
° C
–40
100
° C
Note (12)
Conditions
Minimum
Typical
Maximum
Unit
II
Input pin leakage
current
VI = VC C I O m a x to 0 V
(8)
–10
10
μA
IOZ
Tri-stated I/O pin
leakage current
VO = VC C I O m a x to 0 V
(8)
–10
10
μA
RCONF
Value of I/O pin pull- VCCIO = 3.0 V (9)
up resistor before
VCCIO = 2.375 V (9)
and during
VCCIO = 1.71 V (9)
configuration
20
50
kΩ
30
80
kΩ
60
150
kΩ
Table 6–4. Stratix GX Transceiver Block Absolute Maximum Ratings
Symbol
Parameter
Conditions
Minimum Maximum
Units
VC C A
Transceiver block supply
voltage
Commercial and
industrial
–0.5
4.6
V
VC C P
Transceiver block supply
voltage
Commercial and
industrial
–0.5
2.4
V
VC C R
Transceiver block supply
Voltage
Commercial and
industrial
–0.5
2.4
V
VC C T
Transceiver block supply
voltage
Commercial and
industrial
–0.5
2.4
V
VC C G
Transceiver block supply
voltage
Commercial and
industrial
–0.5
2.4
V
Receiver input
voltage
VI C M ±VI D single / 2
Commercial and
industrial
1.675
(10), (13)
V
refclkb input
VI C M ±VI D single / 2
Commercial and
industrial
1.675
(10), (13)
V
voltage
6–2
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–5. Stratix GX Transceiver Block Operating Conditions
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VC C A
Transceiver block supply
voltage
Commercial
and industrial
3.135
3.3
3.465
V
VC C P
Transceiver block supply
voltage
Commercial
and industrial
1.425
1.5
1.575
V
VC C R
Transceiver block supply
voltage
Commercial
and industrial
1.425
1.5
1.575
V
VC C T
Transceiver block supply
voltage
Commercial
and industrial
1.425
1.5
1.575
V
VC C G
Transceiver block supply
voltage
Commercial
and industrial
1.425
1.5
1.575
V
VI D
(differential p-p)
Receiver input differential
voltage swing
Commercial
and industrial
170
2,000
mV
refclkb input differential
voltage swing
Commercial
and industrial
400
2,000
mV
VI C M
Receiver input common
mode voltage
Commercial
and industrial
1,025
1,175
mV
VO D
(differential p-p)
Transmitter output differential Commercial
voltage
and industrial
1,600
mV
VO C M
Transmitter output common
mode voltage
Commercial
and industrial
RR E F (11)
Reference resistor
Commercial
and industrial
1,100
350
750
2K –1%
2K
mV
2K +1%
Ω
Table 6–6. Stratix GX Transceiver Block On-Chip Termination (Part 1 of 2)
Symbol
Rx
Tx
Parameter
Receiver termination
Transmitter termination
Altera Corporation
June 2006
Conditions
Min
Typ
Max
Units
Commercial and industrial, 100-Ω setting
103
108
113
Ω
Commercial and industrial, 120-Ω setting
120
128
134
Ω
Commercial and industrial, 150-Ω setting
149
158
167
Ω
Commercial and industrial, 100-Ω setting
103
108
113
Ω
Commercial and industrial, 120-Ω setting
120
128
134
Ω
Commercial and industrial, 150-Ω setting
149
158
167
Ω
6–3
Stratix GX Device Handbook, Volume 1
Operating Conditions
Table 6–6. Stratix GX Transceiver Block On-Chip Termination (Part 2 of 2)
Symbol
Refclkb
Parameter
Dedicated transceiver
clock termination
Conditions
Min
Typ
Max
Units
Commercial and industrial, 100-Ω setting
103
108
113
Ω
Commercial and industrial, 120-Ω setting
120
128
134
Ω
Commercial and industrial, 150-Ω setting
149
158
167
Ω
Notes to Tables 6–1 through 6–6:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
See the Operating Requirements for Altera Devices Data Sheet.
Conditions beyond those listed in Table 6–1 may cause permanent damage to a device. Additionally, device
operation at the absolute maximum ratings for extended periods of time may have adverse affects on the device.
Minimum DC input is –0.5 V. During transitions, the inputs may undershoot to –2.0 V or overshoot to 4.6 V for
input currents less than 100 mA and periods shorter than 20 ns. (The information in this note does not include the
transceiver pins. See note 13 for information about the transient voltage on the transceiver pins.)
Maximum VCC rise time is 100 ms, and VCC must rise monotonically.
VCCIO maximum and minimum conditions for LVPECL, LVDS, and 3.3-V PCML are shown in parentheses.
All pins, including dedicated inputs, clock, I/O, and JTAG pins, may be driven before VCCINT and VCCIO are
powered.
Typical values are for TA = 25° C, VCCINT = 1.5 V, and VCCIO = 1.5 V, 1.8 V, 2.5 V, and 3.3 V.
This value is specified for normal device operation. The value may vary during power-up. This applies for all VCCIO
settings (3.3, 2.5, 1.8, and 1.5 V).
Pin pull-up resistance values decrease if an external source drives the pin higher than VCCIO.
The device can tolerate prolonged operation at this absolute maximum, as long as the maximum specification is
not violated.
Each usable quad requires its own RREF resistor path to ground. For example, the “D” in the EP1SGX25DC1020
device code means it has two usable quad so two different RREF pins must be connected to a RREF resistor each to
ground. The DC signal on the RREF pin must be as clean as possible. Ensure that no noise is coupled to this pin.
The Stratix GX device’s recommended operating conditions do not include the transceiver. Refer to Tables 6–4 to
6–7.
Minimum DC input to the transceiver pins is –0.5 V. During transitions, the transceiver pins may undershoot to
–0.5 V or overshoot to 3.5 V for input currents less than 100 mA and periods shorter than 20 ns.
Table 6–7. Stratix GX Transceiver Block AC Specification (Part 1 of 7)
Symbol /
Description
Conditions
-5 Commercial
Speed Grade (1)
Min
Power per
quadrant
(PCS +
PMA)
3.125 Gbps, 400mV Vo d
0 pre-emphasis
6–4
Stratix GX Device Handbook, Volume 1
Typ
450
Max
-6 Commercial &
Industrial Speed
Grade
(1)
Min
Typ
450
Max
-7 Commercial &
Industrial Speed
Grade
(1)
Min
Typ
Unit
Max
mW
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–7. Stratix GX Transceiver Block AC Specification (Part 2 of 7)
Symbol /
Description
Conditions
-5 Commercial
Speed Grade (1)
Min
Typ
Max
-6 Commercial &
Industrial Speed
Grade
(1)
Min
Typ
Max
-7 Commercial &
Industrial Speed
Grade
(1)
Min
Typ
Unit
Max
Reference Clock
Jitter
tolerance
(peak-topeak)
Reference
input clock
frequency
Jitter
components
<20 MHz
20
20
20
ps
Wideband
50
50
50
ps
Dedicated
25
650
25
650
25
312.5
MHz
PLD clock
resources
25
325
25
325
25
156.25
MHz
Serial data
rate
(general)
Commercial /
industrial
614
3,187.5
614
3,187.5
614
2,500
Mbps
Serial data
rate (8B/10B
encoded)
Commercial /
industrial
500
3,187.5
500
3,187.5
500
2,500
Mbps
20
398.4
20
375
20
312.5
MHz
±100
ppm
refclkb pins
Receiver
Parallel
transceiver/
logic array
interface
speed
Rate
matching
frequency
tolerance
XAUI mode only
±100
8B/10B Custom Receiver Jitter Tolerance using Encoded CJPAT
±100
Note (2)
Deterministic 500 Mbps
jitter
0.45
0.45
0.45
UI
Total jitter
0.71
0.71
0.71
UI
500 Mbps
Fibre Channel Receiver Jitter Tolerance using 8B/10B Encoded CJTPAT
Note (2)
Deterministic 1.0625 Gbps
jitter
0.37
0.37
0.37
UI
Total jitter
0.68
0.68
0.68
UI
1.0625 Gbps
Altera Corporation
June 2006
6–5
Stratix GX Device Handbook, Volume 1
Operating Conditions
Table 6–7. Stratix GX Transceiver Block AC Specification (Part 3 of 7)
Symbol /
Description
Conditions
-5 Commercial
Speed Grade (1)
Min
Sinusoidal
jitter
Typ
Max
-6 Commercial &
Industrial Speed
Grade
(1)
Min
Typ
Max
-7 Commercial &
Industrial Speed
Grade
(1)
Min
Typ
Unit
Max
f = 42.5 kHz at
1.0625 Gbps
1.5
1.5
1.5
UI
f = 637 kHz at
1.0625 Gbps
0.1
0.1
0.1
UI
Deterministic 2.125 Gbps
jitter
0.33
0.33
0.33
UI
Total jitter
2.125 Gbps
0.62
0.62
0.62
UI
Sinusoidal
jitter
f = 85 kHz at
2.125 Gbps
1.5
1.5
1.5
UI
f = 1,274 kHz at
2.125 Gbps
0.1
0.1
0.1
UI
Serial Rapid I/O Receiver Jitter Tolerance using 8B/10B Encoded CJPAT
Deterministic 1.25 Gbps
Note (2)
0.45
0.45
0.45
UI
1.25 Gbps
0.71
0.71
0.71
UI
Deterministic 2.5 Gbps
jitter
0.41
0.41
0.41
UI
Total jitter
0.65
0.65
0.65
UI
Deterministic 3.125 Gbps
jitter
0.36
0.36
N/A
UI
Total jitter
0.60
0.60
N/A
UI
1.5
1.5
1.5
UI
0.15
0.15
0.15
UI
jitter
Total jitter
2.5 Gbps
3.125 Gbps
SONET Receiver Jitter Tolerance using PRBS23
Sinusoidal
jitter
f = 6 kHz at 2.48832
Gbps
f = 1 MHz at
2.48832 Gbps
Note (2)
XAUI Receiver Jitter Tolerance using 8B/10B Encoded CJPAT
Note (2)
Deterministic 3.125 Gbps
jitter
0.37
0.37
N/A
UI
Total jitter
0.65
0.65
N/A
UI
3.125 Gbps
6–6
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–7. Stratix GX Transceiver Block AC Specification (Part 4 of 7)
Symbol /
Description
Conditions
-5 Commercial
Speed Grade (1)
Min
Sinusoidal
jitter
Max
Min
Typ
Max
-7 Commercial &
Industrial Speed
Grade
(1)
Min
Typ
8.5
8.5
N/A
f = 1.875 MHz at
3.125 Gbps
0.1
0.1
N/A
f = 20 MHz at
3.125 Gbps
0.1
0.1
N/A
10-12
10-12
10-12
Single width
7
32
7
32
7
Double width
5
19
5
19
5
40
XAUI mode /
Channel to
inter-quadrant
channel bit
only
skew
tolerance (5),
(6)
40
Unit
Max
f = 22.1 kHz at
3.125 Gbps
BER (12)
Receive
latency (4)
Typ
-6 Commercial &
Industrial Speed
Grade
(1)
32
(3)
19
(3)
N/A
UI (7)
Run-length
(8)
80
80
80
UI
Receive
return loss
(differential)
100 MHz to
2.5 Ghz
–10
–10
–10
dB
Receive
return loss
(common
mode)
100 MHz to
2.5 Ghz
–6
–6
–6
dB
Transmitter
Serial data
rate
Commercial /
industrial
Parallel
transceiver/
core
interface
speed
500
3,187.5
500
3,187.5
500
2,500
Mbps
20
398.4
20
375
20
312.5
MHz
8B/10B Custom Transmitter Jitter using Encoded CRPAT
Deterministic 500 Mbps
jitter
Pre-emphasis = 1
VOD = 1,400 mV
Total jitter
Altera Corporation
June 2006
Note (9)
0.11
0.11
0.11
UI
0.18
0.18
0.18
UI
6–7
Stratix GX Device Handbook, Volume 1
Operating Conditions
Table 6–7. Stratix GX Transceiver Block AC Specification (Part 5 of 7)
Symbol /
Description
Conditions
-5 Commercial
Speed Grade (1)
Min
Typ
Max
-6 Commercial &
Industrial Speed
Grade
(1)
Min
Fibre Channel Transmitter Jitter using 8B/10B Encoded CRPAT
Typ
Max
-7 Commercial &
Industrial Speed
Grade
(1)
Min
Typ
Unit
Max
Note (9)
Deterministic 1.0625 Gbps
jitter
Pre-emphasis = 0
VOD = 1,200 mV
Total jitter
0.09
0.09
0.09
UI
0.17
0.17
0.17
UI
Deterministic 2.125 Gbps
jitter
Pre-emphasis= 1
VOD = 1,200 mV
Total jitter
0.16
0.16
0.16
UI
0.33
0.33
0.33
UI
Serial Rapid I/O Short Run Transmitter Jitter using 8B/10B Encoded CRPAT
Note (9)
1.25 Gbps
0.09
0.09
0.09
UI
Pre-emphasis = 1
VOD = 1,600 mV
0.17
0.17
0.17
UI
Deterministic 2.5 Gbps
jitter
Pre-emphasis = 1
VOD = 800 mV
Total jitter
0.15
0.15
0.15
UI
0.32
0.32
0.32
UI
Deterministic 3.125 Gbps
jitter
Pre-emphasis = 1
VOD = 800 mV
Total jitter
0.15
0.15
N/A
UI
0.32
0.32
N/A
UI
Deterministic
jitter
Total jitter
Serial Rapid I/O Long Run Transmitter Jitter using 8B/10B Encoded CRPAT
Note (9)
Deterministic 1.25 Gbps
Pre-emphasis = 1
jitter
VOD = 1,600 mV
Total jitter
0.09
0.09
0.09
UI
0.17
0.17
0.17
UI
Deterministic 2.5 Gbps
Pre-emphasis = 2
jitter
VOD = 1,400 mV
Total jitter
0.18
0.18
0.18
UI
0.35
0.35
0.35
UI
Deterministic 3.125 Gbps
Pre-emphasis = 2
jitter
VOD = 1,400 mV
Total jitter
0.20
0.20
N/A
UI
0.37
0.37
N/A
UI
0.20
0.20
0.20
UI
SONET Transmitter Jitter PRBS23
Total jitter
Note (9)
2.48832 Gbps
Pre-emphasis = 1
VOD = 800 mV
6–8
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–7. Stratix GX Transceiver Block AC Specification (Part 6 of 7)
Symbol /
Description
Conditions
-5 Commercial
Speed Grade (1)
Min
Typ
Max
XAUI Transmitter Jitter using 8B/10B Encoded CJPAT
Deterministic 3.125 Gbps
Pre-emphasis = 0
jitter
VOD = 1,200 mV
Total jitter
-6 Commercial &
Industrial Speed
Grade
(1)
Min
Typ
Max
-7 Commercial &
Industrial Speed
Grade
(1)
Min
Typ
Unit
Max
Note (9)
0.15
0.15
N/A
UI
0.32
0.32
N/A
UI
3
3
N/A
MHz
High bandwidth
setting at
3.125 Gbps
4.7
4.7
N/A
MHz
Low bandwidth
setting at
2.5 Gbps
3.2
3.2
3.2
MHz
High bandwidth
setting at
2.5 Gbps
4.3
4.3
4.3
MHz
Jitter transfer Low bandwidth
setting at
bandwidth
3.125 Gbps
(10)
Output tR I S E
20% to 80%
60
130
60
130
60
130
ps
Output tFA L L
80% to 20%
60
130
60
130
60
130
ps
Transmit
latency (11)
Single width
3
8
3
8
3
8
(3)
Double width
3
7
3
7
3
7
(3)
Intra
differential
pair skew
Channel to
channel
skew
Within a single
quadrant
Altera Corporation
June 2006
10
10
10
ps
50
50
50
ps
6–9
Stratix GX Device Handbook, Volume 1
Operating Conditions
Table 6–7. Stratix GX Transceiver Block AC Specification (Part 7 of 7)
Symbol /
Description
-5 Commercial
Speed Grade (1)
Conditions
Min
Output return 100 MHz to
loss
2.5 GHz
Typ
–10
Max
-6 Commercial &
Industrial Speed
Grade
(1)
Min
Typ
-7 Commercial &
Industrial Speed
Grade
(1)
Max
–10
Min
Typ
Unit
Max
–10
dB
Notes to Table 6–7:
(1)
All numbers for the -6 and -7 speed grades are for both commercial and industrial unless specified otherwise in the
Conditions column. Speed grade -5 is available only for commercial specifications.
(2) Not all VID and equalizer values will get the same results. The condition for the specification was that the VID before
jitter was added is 1,000 mV and the equalizer was set to the maximum condition of 111 (equalizer control setting
= 4 in the MegaWizard Plug-In Manager).
(3) Number of parallel clocks.
(4) Receive latency delay from serial receiver indata to parallel receiver data.
(5) Per IEEE Standard 802.3ae @ 3.125 for –5 and –6.
(6) The specification is for channel aligner tolerance.
(7) UI = Unit Interval.
(8) Run-length conditions are true for all data rates, but the average transition density must be enough to keep the
receiver phase aligned and the overall data must be DC balanced.
(9) Not all combinations of VOD and pre-emphasis will get the same results.
(10) The numbers are for 3.125-Gbps data rate for –5 and –6 devices and 2.5 Gbps for –7 devices.
(11) Transmitter latency delay from parallel transceiver data to serial transceiver out data.
(12) The receiver operates with a BER of better than 10-12 in the presence of an input signal as defined in the XAUI driver
template for 3.125 Gbps and in the PCI Exp transmitter eye mask for 2.5 Gbps.
Table 6–8. LVTTL Specifications
Symbol
Parameter
Conditions
Minimum
Maximum
Units
3.0
3.6
V
VCCIO
Output supply voltage
VI H
High-level input voltage
1.7
4.1
V
VIL
Low-level input voltage
–0.5
0.7
V
VOH
High-level output voltage
IOH = –4 to –24 mA (1)
VOL
Low-level output voltage
IOL = 4 to 24 mA (1)
2.4
V
0.45
V
Minimum
Maximum
Units
3.0
3.6
V
Table 6–9. LVCMOS Specifications
Symbol
VCCIO
Parameter
Output supply voltage
Conditions
VIH
High-level input voltage
1.7
4.1
V
VIL
Low-level input voltage
–0.5
0.7
V
6–10
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–9. LVCMOS Specifications
Symbol
Parameter
Conditions
Minimum
VOH
High-level output voltage
VCCIO = 3.0,
IOH = –0.1 mA
VCCIO – 0.2
VOL
Low-level output voltage
VCCIO = 3.0,
IOL = 0.1 mA
Table 6–10. 2.5-V I/O Specifications
Symbol
Maximum
Units
V
0.2
V
Minimum
Maximum
Units
Note (1)
Parameter
Conditions
VCCIO
Output supply voltage
2.375
2.625
V
VIH
High-level input voltage
1.7
4.1
V
VIL
Low-level input voltage
–0.5
0.7
V
VOH
High-level output voltage
VOL
Low-level output voltage
IOH = –0.1 mA
2.1
V
IOH = –1 mA
2.0
V
IOH = –2 to –16 mA (1)
1.7
V
IOL = 0.1 mA
0.2
V
IOH = 1 mA
0.4
V
IOH = 2 to 16 mA (1)
0.7
V
Maximum
Units
Table 6–11. 1.8-V I/O Specifications
Symbol
Parameter
Conditions
Minimum
VCCIO
Output supply voltage
1.65
1.95
V
VI H
High-level input voltage
0.65 × VCCIO 2.25
V
VIL
Low-level input voltage
–0.3
V
VOH
High-level output voltage
IOH = –2 to –8 mA (1)
VOL
Low-level output voltage
IOL = 2 to 8 mA (1)
0.35 × VCCIO
VCCIO – 0.45
V
0.45
V
Table 6–12. 1.5-V I/O Specifications (Part 1 of 2)
Symbol
Parameter
Conditions
Minimum
Maximum
Output supply voltage
1.4
VI H
High-level input voltage
0.65 × VCCIO VCCIO + 0.3
V
VIL
Low-level input voltage
–0.3
V
VOH
High-level output voltage
Altera Corporation
June 2006
IOH = –2 mA (1)
0.75 × VCCIO
1.6
Units
VCCIO
0.35 × VCCIO
V
V
6–11
Stratix GX Device Handbook, Volume 1
Operating Conditions
Table 6–12. 1.5-V I/O Specifications (Part 2 of 2)
Symbol
VOL
Parameter
Conditions
Minimum
IOL = 2 mA (1)
Low-level output voltage
Maximum
Units
0.25 × VCCIO
V
Note to Tables 6–8 through 6–12:
(1)
Drive strength is programmable according to values in found in the Stratix GX Architecture chapter of the
Stratix GX Device Handbook, Volume 1.
Figures 6–1 through 6–3 show receiver input and transmitter output
waveforms, respectively, for all differential I/O standards (LVDS, 3.3-V
PCML, LVPECL, and HyperTransport technology).
Figure 6–1. Receiver Input Waveforms for Differential I/O Standards
Single-Ended Waveform
Positive Channel (p) = VOH
VID
Negative Channel (n) = VOL
VCM
Ground
Differential Waveform
(VID (Differential) = 2 x VID (single-ended))
VID
p−n=0V
VID
6–12
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Figure 6–2. Receiver Input Waveform Example with Values
Single-Ended Waveform:
What is Applied
to the Pin (2)
Positive
Channel (p)
VID = 1 V
Negative
Channel (n)
VIH = 1.175 V + 0.5 V = 1.675 V
VICM = 1.175 V (3)
VIL = 1.175 V - 0.5 V = 0.675 V
Ground
Differential Waveform:
As Seen by the Buffer
or by Subtraction on an Oscilloscope
VID = 1 V
p-n=0V
VID = 1 V
Differential VID = 2 * VID (Single-Ended) = 2 V
Notes to Figure 6–2:
(1)
(2)
(3)
The values in this figure are for example only.
These values must meet the voltages specified in the section “Operating Conditions” on page 6–1.
If internal termination is used, the common mode is generated after the pins.
Figure 6–3. Transmitter Output Waveforms for Differential I/O Standards
Single-Ended Waveform
Positive Channel (p) = VOH
VID
Negative Channel (n) = VOL
VCM
Ground
Differential Waveform
(VID (Differential) = 2 x VID (single-ended))
VID
p−n=0V
VID
Altera Corporation
June 2006
6–13
Stratix GX Device Handbook, Volume 1
Operating Conditions
Tables 6–13 through 6–33 provide information about specifications and
bus hold parameters for 1.5-V Stratix GX devices. Notes for Tables 6–14
through 6–33 immediately follow Table 6–33.
Table 6–13. 3.3-V LVDS I/O Specifications
Symbol
Parameter
VCCIO
I/O supply voltage
VI D (1)
Input differential voltage
swing (single-ended)
VI C M (1)
Input common-mode
voltage
Conditions
Minimum
Typical
Maximum
Units
3.135
3.3
3.465
V
0.1 V < VC M < 1.1 V
W = 1 through 10
300
1,000
mV
1.1 V < VC M < 1.6 V
W=1
200
1,000
mV
1.1 V < VC M < 1.6 V
W = 2 through 10
100
1,000
mV
1.6 V < VC M < 1.8 V
W = 1 through 10
300
1,000
mV
LVDS
0.3 V < VI D < 1.0 V
W = 1 through 10
100
1,100
mV
LVDS
0.3 V < VI D < 1.0 V
W = 1 through 10
1,600
1,800
mV
LVDS
0.2 V < VI D < 1.0 V
W=1
1,100
1,600
mV
LVDS
0.1 V < VI D < 1.0 V
W = 2 through 10
1,100
1,600
mV
550
mV
50
mV
1,375
mV
50
mV
110
Ω
VOD
Differential output voltage
(single ended)
RL = 100 Ω
ΔVOD
Change in VOD between
high and low
RL = 100 Ω
VOCM
Output common-mode
voltage
RL = 100 Ω
ΔVOCM
Change in VOCM between
high and low
RL = 100 Ω
RL
Receiver differential input
resistor, external
250
1,125
90
375
1,200
100
Note to Table 6–13:
(1)
For up to 1 Gbps in DPA mode and 840 Mbps in non-DPA mode
6–14
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–14. 3.3-V PCML Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
3.135
3.3
3.465
V
VCCIO
I/O supply voltage
VID
Input differential voltage
swing (single-ended)
300
600
mV
VICM
Input common mode
voltage
1.5
3.465
V
VOD
Output differential voltage
(single-ended)
300
500
mV
ΔVOD
Change in VO D between
high and low
50
mV
VO C M
Output common mode
voltage
3.3
V
ΔVO C M
Change in VO C M between
high and low
50
mV
VT
Output termination voltage
R1
Output external pull-up
resistors
45
50
55
Ω
R2
Output external pull-up
resistors
45
50
55
Ω
Minimum
Typical
Maximum
Units
3.135
3.3
2.5
370
2.85
VC C I O
V
Table 6–15. LVPECL Specifications
Symbol
Parameter
Conditions
VCCIO
I/O supply voltage
VID
Input differential voltage
swing (single-ended)
VICM
Input common mode
voltage
VOD
Differential output voltage
(single ended)
RL = 100 Ω
525
VO C M
Output common mode
voltage
RL = 100 Ω
RL
Receiver differential input
resistor, external
Altera Corporation
June 2006
3.465
V
300
1,000
mV
1
2
V
700
970
mV
1.5
1.7
1.9
V
90
100
110
Ω
6–15
Stratix GX Device Handbook, Volume 1
Operating Conditions
Table 6–16. HyperTransport Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
2.375
2.5
2.625
V
380
485
820
mV
50
mV
780
mV
50
mV
VCCIO
I/O supply voltage
VOD
Differential output voltage
(single ended)
RL = 100 Ω
ΔVO D
Change in between high
and low
RL = 100 Ω
VOCM
Output common mode
voltage
RL = 100 Ω
ΔVO C M
Change in between high
and low
RL = 100 Ω
VID
Differential input voltage
swing (single-ended)
300
900
mV
VICM
Input common mode
voltage
300
900
mV
RL
Receiver differential input
resistor, external
90
100
110
Ω
Minimum
Typical
Maximum
Units
440
650
Table 6–17. 3.3-V PCI Specifications
Symbol
Parameter
Conditions
VCCIO
Output supply voltage
3.0
3.6
V
VIH
High-level input voltage
0.5 ×
VCCIO
3.3
VCCIO +
0.5
V
VIL
Low-level input voltage
–0.5
0.3 ×
VCCIO
V
VOH
High-level output voltage
IOUT = –500 μA
VOL
Low-level output voltage
IOUT = 1,500 μA
0.9 ×
VCCIO
V
0.1 ×
VCCIO
V
Maximum
Units
Table 6–18. PCI-X Specifications (Part 1 of 2)
Symbol
Parameter
Conditions
Minimum
Typical
VCCIO
Output supply voltage
3.0
3.6
V
VIH
High-level input voltage
0.5 ×
VCCIO
VCCIO +
0.5
V
VIL
Low-level input voltage
–0.5
0.35 ×
VCCIO
V
6–16
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–18. PCI-X Specifications (Part 2 of 2)
Symbol
Parameter
Conditions
VIPU
Input pull-up voltage
VO H
High-level output voltage
IO U T = –500 μA
VO L
Low-level output voltage
IO U T = 1,500 μA
Minimum
Typical
Maximum
Units
0.7 ×
VCCIO
V
0.9 ×
VC C I O
V
0.1 ×
VC C I O
V
Table 6–19. GTL+ I/O Specifications
Typical
Maximum
Units
VTT
Symbol
Termination voltage
Parameter
Conditions
1.35
Minimum
1.5
1.65
V
VREF
Reference voltage
0.88
1.0
1.12
V
VIH
High-level input voltage
VREF + 0.1
VIL
Low-level input voltage
VOL
Low-level output voltage
V
IOL = 36 mA (1)
VR E F –
0.1
V
0.65
V
Table 6–20. GTL I/O Specifications
Symbol
Parameter
VTT
Termination voltage
VREF
Reference voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VOL
Low-level output voltage
Conditions
Minimum
Typical
Maximum
Units
1.14
1.2
1.26
V
0.74
0.8
0.86
V
VREF +
0.05
V
IOL = 40 mA (1)
VR E F –
0.05
V
0.4
V
Table 6–21. SSTL-18 Class I Specifications (Part 1 of 2)
Symbol
Parameter
Conditions
Minimum
VCCIO
Output supply voltage
VREF
Reference voltage
0.8
VTT
Termination voltage
VR E F – 0.04
VIH(DC)
High-level DC input voltage
VR E F +
0.125
Altera Corporation
June 2006
1.65
Typical
Maximum
Units
1.8
1.95
V
0.9
1.0
V
VR E F
VR E F + 0.04
V
V
6–17
Stratix GX Device Handbook, Volume 1
Operating Conditions
Table 6–21. SSTL-18 Class I Specifications (Part 2 of 2)
Symbol
Parameter
Conditions
VIL(DC)
Low-level DC input voltage
VIH(AC)
High-level AC input voltage
VIL(AC)
Low-level AC input voltage
VOH
High-level output voltage
IOH = –6.7 mA
(1)
VOL
Low-level output voltage
IOL = 6.7 mA (1)
Minimum
Typical
Maximum
Units
VR E F –
0.125
V
VR E F +
0.275
V
VR E F –
0.275
VTT + 0.475
V
V
VT T – 0.475
V
Maximum
Units
Table 6–22. SSTL-18 Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
VCCIO
Output supply voltage
1.65
1.8
1.95
V
VREF
Reference voltage
0.8
0.9
1.0
V
VTT
Termination voltage
VR E F – 0.04
VR E F + 0.04
V
VIH(DC)
High-level DC input voltage
VR E F +
0.125
VIL(DC)
Low-level DC input voltage
VIH(AC)
High-level AC input voltage
VIL(AC)
Low-level AC input voltage
VOH
High-level output voltage
IOH = –13.4 mA
(1)
VOL
Low-level output voltage
IOL = 13.4 mA (1)
VR E F
V
VR E F –
0.125
VR E F +
0.275
V
V
VR E F –
0.275
VTT + 0.630
V
V
VT T – 0.630
V
Maximum
Units
Table 6–23. SSTL-2 Class I Specifications (Part 1 of 2)
Symbol
Parameter
Conditions
Minimum
Typical
VCCIO
Output supply voltage
2.375
2.625
V
VTT
Termination voltage
VR E F – 0.04
VR E F
VR E F + 0.04
V
VREF
Reference voltage
1.15
1.25
1.35
V
VIH
High-level input voltage
VR E F + 0.18
3.0
V
VIL
Low-level input voltage
–0.3
VR E F – 0.18
V
6–18
Stratix GX Device Handbook, Volume 1
2.5
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–23. SSTL-2 Class I Specifications (Part 2 of 2)
Symbol
Parameter
Conditions
VOH
High-level output voltage
IOH = –8.1 mA
(1)
VOL
Low-level output voltage
IOL = 8.1 mA (1)
Minimum
Typical
Maximum
VTT + 0.57
Units
V
VT T – 0.57
V
Table 6–24. SSTL-2 Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCIO
Output supply voltage
2.3
2.5
2.7
V
VTT
Termination voltage
VR E F – 0.04
VR E F
VR E F + 0.04
V
VREF
Reference voltage
1.15
1.25
1.35
V
VIH
High-level input voltage
VR E F + 0.18
VCCIO + 0.3
V
–0.3
VR E F – 0.18
V
VIL
Low-level input voltage
VOH
High-level output voltage
IOH = –16.4 mA
(1)
VOL
Low-level output voltage
IOL = 16.4 mA (1)
VTT + 0.76
V
VT T – 0.76
V
Maximum
Units
Table 6–25. SSTL-3 Class I Specifications
Symbol
Parameter
Conditions
Minimum
Typical
VCCIO
Output supply voltage
3.0
3.6
V
VTT
Termination voltage
VR E F – 0.05 VR E F
3.3
VR E F + 0.05
V
VREF
Reference voltage
1.3
1.7
V
1.5
VIH
High-level input voltage
VR E F + 0.2
VCCIO + 0.3
V
VIL
Low-level input voltage
–0.3
VR E F – 0.2
V
VOH
High-level output voltage
IOH = –8 mA (1)
VOL
Low-level output voltage
IOL = 8 mA (1)
VTT + 0.6
V
VT T – 0.6
V
Table 6–26. SSTL-3 Class II Specifications (Part 1 of 2)
Symbol
Parameter
Conditions
Minimum
Typical
Output supply voltage
3.0
VTT
Termination voltage
VR E F – 0.05 VR E F
VR E F + 0.05
V
VREF
Reference voltage
1.3
1.7
V
VIH
High-level input voltage
VR E F + 0.2
VCCIO + 0.3
V
1.5
3.6
Units
VCCIO
Altera Corporation
June 2006
3.3
Maximum
V
6–19
Stratix GX Device Handbook, Volume 1
Operating Conditions
Table 6–26. SSTL-3 Class II Specifications (Part 2 of 2)
Symbol
Parameter
Conditions
Minimum
VIL
Low-level input voltage
VOH
High-level output voltage
IOH = –16 mA (1) VT T + 0.8
VOL
Low-level output voltage
IOL = 16 mA (1)
Typical
–0.3
Maximum
VR E F – 0.2
Units
V
V
VT T – 0.8
V
Table 6–27. 3.3-V AGP 2× Specifications
Symbol
Parameter
Conditions
Minimum
VCCIO
Output supply voltage
3.15
VREF
Reference voltage
VIH
High-level input voltage (2)
VIL
Low-level input voltage (2)
VOH
High-level output voltage
IOUT = –0.5 mA
VOL
Low-level output voltage
IOUT = 1.5 mA
Typical
3.3
Maximum
Units
3.45
V
0.39 ×
VC C I O
0.41 ×
VC C I O
V
0.5 × VC C I O
VCCIO + 0.5
V
0.3 × VC C I O
V
3.6
V
0.1 × VC C I O
V
Maximum
Units
0.9 × VC C I O
Table 6–28. 3.3-V AGP 1× Specifications
Symbol
Parameter
Conditions
Minimum
VCCIO
Output supply voltage
3.15
VIH
High-level input voltage (2)
0.5 × VC C I O
VIL
Low-level input voltage (2)
VOH
High-level output voltage
IOUT = –0.5 mA
VOL
Low-level output voltage
IOUT = 1.5 mA
Typical
3.3
0.9 × VC C I O
3.45
V
VCCIO + 0.5
V
0.3 × VC C I O
V
3.6
V
0.1 × VC C I O
V
Maximum
Units
Table 6–29. 1.5-V HSTL Class I Specifications (Part 1 of 2)
Symbol
Parameter
Conditions
Minimum
Typical
VCCIO
Output supply voltage
1.4
1.5
1.6
V
VREF
Input reference voltage
0.68
0.75
0.9
V
VTT
Termination voltage
0.7
0.75
0.8
V
VIH (DC)
DC high-level input voltage
VR E F + 0.1
VIL (DC)
DC low-level input voltage
–0.3
VIH (AC)
AC high-level input voltage
VR E F + 0.2
VIL (AC)
AC low-level input voltage
6–20
Stratix GX Device Handbook, Volume 1
V
VR E F – 0.1
V
V
VR E F – 0.2
V
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–29. 1.5-V HSTL Class I Specifications (Part 2 of 2)
Symbol
Parameter
Conditions
VOH
High-level output voltage
IO H = 8 mA (1)
VOL
Low-level output voltage
IO H = –8 mA (1)
Minimum
Typical
Maximum
VC C I O – 0.4
Units
V
0.4
V
Table 6–30. 1.5-V HSTL Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCIO
Output supply voltage
1.4
1.5
1.6
V
VREF
Input reference voltage
0.68
0.75
0.9
V
VTT
Termination voltage
0.7
0.75
0.8
V
VIH (DC)
DC high-level input voltage
VR E F + 0.1
VIL (DC)
DC low-level input voltage
–0.3
VR E F + 0.2
VIH (AC)
AC high-level input voltage
VIL (AC)
AC low-level input voltage
VOH
High-level output voltage
IOH = 16 mA (1)
VOL
Low-level output voltage
IO H = –16 mA (1)
V
VR E F – 0.1
V
V
VR E F – 0.2
VC C I O – 0.4
V
V
0.4
V
Table 6–31. 1.5-V Differential HSTL Specifications
Symbol
Parameter
Conditions
Minimum
VCCIO
I/O supply voltage
1.4
VDIF (DC)
DC input differential
voltage
0.2
VCM (DC)
DC common mode input
voltage
0.68
VDIF (AC)
AC differential input
voltage
0.4
Typical
1.5
Maximum
1.6
Units
V
V
0.9
V
V
Table 6–32. CTT I/O Specifications (Part 1 of 2)
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCIO
Output supply voltage
3.0
3.3
3.6
V
VT T /VREF
Termination and input
reference voltage
1.35
1.5
1.65
V
VIH
High-level input voltage
VR E F + 0.2
VIL
Low-level input voltage
Altera Corporation
June 2006
V
VR E F – 0.2
V
6–21
Stratix GX Device Handbook, Volume 1
Power Consumption
Table 6–32. CTT I/O Specifications (Part 2 of 2)
Symbol
Parameter
Conditions
VOH
High-level output voltage
IOH = –8 mA
VOL
Low-level output voltage
IOL = 8 mA
IO
Output leakage current
(when output is high Z)
GND ≤VO U T ≤
VC C I O
Minimum
Typical
Maximum
VR E F + 0.4
Units
V
–10
VR E F – 0.4
V
10
μA
Table 6–33. Bus Hold Parameters
VC C I O Level
Parameter
Conditions
1.5 V
Min
1.8 V
Max
Min
Max
2.5 V
Min
Units
3.3 V
Max
Min
Max
VIN > VIL
(maximum)
25
30
50
70
μA
High sustaining VIN < VIH
current
(minimum)
–25
–30
–50
–70
μA
Low sustaining
current
Low overdrive
current
0 V < VIN <
VCCIO
160
200
300
500
μA
High overdrive
current
0 V < VIN <
VCCIO
–160
–200
–300
–500
μA
2.0
V
Bus-hold trip
point
0.5
1.0
0.68
1.07
0.7
1.7
0.8
Notes to Tables 6–14 through 6–33:
(1)
(2)
Drive strength is programmable according to values in the Stratix GX Architecture chapter of the Stratix GX Device
Handbook, Volume 1.
VR E F specifies the center point of the switching range.
Power
Consumption
Detailed power consumption information for Stratix GX devices will be
released when available.
Timing Model
The DirectDrive™ technology and MultiTrack™ interconnect ensure
predictable performance, accurate simulation, and accurate timing
analysis across all Stratix GX device densities and speed grades. This
section describes and specifies the performance, internal, external, and
PLL timing specifications.
All specifications are representative of worst-case supply voltage and
junction temperature conditions.
6–22
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Preliminary & Final Timing
Timing models can have either preliminary or final status. The
Quartus® II software displays an informational message during the
design compilation if the timing models are preliminary. Table 6–34
shows the status of the Stratix GX device timing models.
Preliminary status means the timing model is subject to change. Initially,
timing numbers are created using simulation results, process data, and
other known parameters. These tests are used to make the preliminary
numbers as close to the actual timing parameters as possible.
Final timing numbers are based on actual device operation and testing.
These numbers reflect the actual performance of the device under
worst-case voltage and junction temperature conditions.
Table 6–34. Stratix GX Device Timing Model Status
Device
Preliminary
Final
EP1SGX10
—
v
EP1SGX25
—
v
EP1SGX40
—
v
Performance
Table 6–35 shows Stratix GX device performance for some common
designs. All performance values were obtained with Quartus II software
compilation of LPM, or MegaCore® functions for the FIR and FFT
designs.
Table 6–35. Stratix GX Device Performance (Part 1 of 3)
Notes (1), (2)
Resources Used
Applications
LE
Performance
TriMatrix
-5
DSP
LEs Memory
Speed
Blocks
Blocks
Grade
-6
Speed
Grade
-7
Speed
Grade
Units
16-to-1 multiplexer (1)
22
0
0
407.83
324.56
288.68
MHz
32-to-1 multiplexer (3)
46
0
0
318.26
255.29
242.89
MHz
16-bit counter
16
0
0
422.11
422.11
390.01
MHz
64-bit counter
64
0
0
321.85
290.52
261.23
MHz
Altera Corporation
June 2006
6–23
Stratix GX Device Handbook, Volume 1
Timing Model
Table 6–35. Stratix GX Device Performance (Part 2 of 3)
Notes (1), (2)
Resources Used
Applications
Simple dual-port RAM 32 × 18
TriMatrix
memory
bit
M512 block
FIFO 32 × 18 bit
TriMatrix
memory
M4K block
TriMatrix
memory
M-RAM
block
Simple dual-port RAM 128 × 36
bit
Performance
TriMatrix
-5
DSP
LEs Memory
Speed
Blocks
Blocks
Grade
-6
Speed
Grade
-7
Speed
Grade
Units
0
1
0
317.76
277.62
241.48
MHz
30
1
0
319.18
278.86
242.54
MHz
0
1
0
290.86
255.55
222.27
MHz
True dual-port RAM 128 × 18 bit
0
1
0
290.86
255.55
222.27
MHz
FIFO 128 × 36 bit
34
1
0
290.86
255.55
222.27
MHz
Single port
RAM 4K × 144 bit
1
1
0
255.95
223.06
194.06
MHz
Simple dual-port
RAM 4K × 144 bit
0
1
0
255.95
233.06
194.06
MHz
True dual-port
RAM 4K × 144 bit
0
1
0
255.95
233.06
194.06
MHz
Single port
RAM 8K × 72 bit
0
1
0
278.94
243.19
211.59
MHz
Simple dual-port
RAM 8K × 72 bit
0
1
0
255.95
223.06
194.06
MHz
True dual-port
RAM 8K × 72 bit
0
1
0
255.95
223.06
194.06
MHz
Single port
RAM 16K × 36 bit
0
1
0
280.66
254.32
221.28
MHz
Simple dual-port
RAM 16K × 36 bit
0
1
0
269.83
237.69
206.82
MHz
6–24
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–35. Stratix GX Device Performance (Part 3 of 3)
Notes (1), (2)
Resources Used
Applications
TriMatrix
memory
M-RAM
block
DSP block
Larger
Designs
Performance
TriMatrix
-5
DSP
LEs Memory
Speed
Blocks
Blocks
Grade
-6
Speed
Grade
-7
Speed
Grade
Units
True dual-port
RAM 16K × 36 bit
0
1
0
269.83
237.69
206.82
MHz
Single port
RAM 32K × 18 bit
0
1
0
275.86
244.55
212.76
MHz
Simple dual-port
RAM 32K × 18 bit
0
1
0
275.86
244.55
212.76
MHz
True dual-port
RAM 32K × 18 bit
0
1
0
275.86
244.55
212.76
MHz
Single port
RAM 64K × 9 bit
0
1
0
287.85
253.29
220.36
MHz
Simple dual-port
RAM 64K × 9 bit
0
1
0
287.85
253.29
220.36
MHz
True dual-port
RAM 64K × 9 bit
0
1
0
287.85
253.29
220.36
MHz
9 × 9-bit multiplier (3)
0
0
1
335.0
293.94
255.68
MHz
18 × 18-bit multiplier (4)
0
0
1
278.78
237.41
206.52
MHz
36 × 36-bit multiplier (4)
0
0
1
148.25
134.71
117.16
MHz
36 × 36-bit multiplier (5)
0
0
1
278.78
237.41
206.52
MHz
18-bit, 4-tap FIR filter
0
0
1
278.78
237.41
206.52
MHz
8-bit, 16-tap parallel FIR filter
58
0
4
141.26
133.49
114.88
MHz
8-bit, 1,024-point FFT function
870
5
1
261.09
235.51
205.21
MHz
Notes to Table 6–35:
(1)
(2)
(3)
(4)
(5)
These design performance numbers were obtained using the Quartus II software.
Numbers not listed will be included in a future version of the data sheet.
This application uses registered inputs and outputs.
This application uses registered multiplier input and output stages within the DSP block.
This application uses registered multiplier input, pipeline, and output stages within the DSP block.
Altera Corporation
June 2006
6–25
Stratix GX Device Handbook, Volume 1
Timing Model
Internal Timing Parameters
Internal timing parameters are specified on a speed grade basis
independent of device density. Tables 6–36 through 6–42 describe the
Stratix GX device internal timing microparameters for LEs, IOEs,
TriMatrix™ memory structures, DSP blocks, and MultiTrack
interconnects.
Table 6–36. LE Internal Timing Microparameter Descriptions
Symbol
Parameter
tSU
LE register setup time before clock
tH
LE register hold time after clock
tCO
LE register clock-to-output delay
tLUT
LE combinational LUT delay for data-in to data-out
tCLR
Minimum clear pulse width
tPRE
Minimum preset pulse width
tCLKHL
Minimum clock high or low time
Table 6–37. IOE Internal Timing Microparameter Descriptions
Symbol
Parameter
tSU
IOE input and output register setup time before clock
tH
IOE input and output register hold time after clock
tCO
IOE input and output register clock-to-output delay
tPIN2COMBOUT_R
Row input pin to IOE combinational output
tPIN2COMBOUT_C
Column input pin to IOE combinational output
tCOMBIN2PIN_R
Row IOE data input to combinational output pin
tCOMBIN2PIN_C
Column IOE data input to combinational output pin
tCLR
Minimum clear pulse width
tPRE
Minimum preset pulse width
tCLKHL
Minimum clock high or low time
6–26
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–38. DSP Block Internal Timing Microparameter Descriptions
Symbol
Parameter
tSU
Input, pipeline, and output register setup time before clock
tH
Input, pipeline, and output register hold time after clock
tCO
Input, pipeline, and output register clock-to-output delay
tINREG2PIPE9
Input register to DSP block pipeline register in 9 × 9-bit mode
tINREG2PIPE18
Input register to DSP block pipeline register in 18 × 18-bit
mode
tPIPE2OUTREG2ADD
DSP block pipeline register to output register delay in twomultipliers adder mode
tPIPE2OUTREG4ADD
DSP Block Pipeline Register to output register delay in fourmultipliers adder mode
tPD9
Combinational input to output delay for 9 × 9-bit mode
tPD18
Combinational input to output delay for 18 × 18-bit mode
tPD36
Combinational input to output delay for 36 × 36-bit mode
tCLR
Minimum clear pulse width
tCLKHL
Minimum clock high or low time
Table 6–39. M512 Block Internal Timing Microparameter Descriptions
Symbol
Altera Corporation
June 2006
Parameter
tM512RC
Synchronous read cycle time
tM512WC
Synchronous write cycle time
tM512WERESU
Write or read enable setup time before clock
tM512WEREH
Write or read enable hold time after clock
tM512DATASU
Data setup time before clock
tM512DATAH
Data hold time after clock
tM512WADDRSU
Write address setup time before clock
tM512WADDRH
Write address hold time after clock
tM512RADDRSU
Read address setup time before clock
tM512RADDRH
Read address hold time after clock
tM512DATACO1
Clock-to-output delay when using output registers
tM512DATACO2
Clock-to-output delay without output registers
tM512CLKHL
Minimum clock high or low time
tM512CLR
Minimum clear pulse width
6–27
Stratix GX Device Handbook, Volume 1
Timing Model
Table 6–40. M4K Block Internal Timing Microparameter Descriptions
Symbol
Parameter
tM4KRC
Synchronous read cycle time
tM4KWC
Synchronous write cycle time
tM4KWERESU
Write or read enable setup time before clock
tM4KWEREH
Write or read enable hold time after clock
tM4KBESU
Byte enable setup time before clock
tM4KBEH
Byte enable hold time after clock
tM4KDATAASU
A port data setup time before clock
tM4KDATAAH
A port data hold time after clock
tM4KADDRASU
A port address setup time before clock
tM4KADDRAH
A port address hold time after clock
tM4KDATABSU
B port data setup time before clock
tM4KDATABH
B port data hold time after clock
tM4KADDRBSU
B port address setup time before clock
tM4KADDRBH
B port address hold time after clock
tM4KDATACO1
Clock-to-output delay when using output registers
tM4KDATACO2
Clock-to-output delay without output registers
tM4KCLKHL
Minimum clock high or low time
tM4KCLR
Minimum clear pulse width
Table 6–41. M-RAM Block Internal Timing Microparameter
Descriptions (Part 1 of 2)
Symbol
Parameter
tM R A M R C
Synchronous read cycle time
tMRAMWC
Synchronous write cycle time
tMRAMWERESU
Write or read enable setup time before clock
tMRAMWEREH
Write or read enable hold time after clock
tMRAMBESU
Byte enable setup time before clock
tMRAMBEH
Byte enable hold time after clock
tMRAMDATAASU
A port data setup time before clock
tMRAMDATAAH
A port data hold time after clock
tMRAMADDRASU
A port address setup time before clock
tMRAMADDRAH
A port address hold time after clock
6–28
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–41. M-RAM Block Internal Timing Microparameter
Descriptions (Part 2 of 2)
Symbol
Parameter
tMRAMDATABSU
B port setup time before clock
tMRAMDATABH
B port hold time after clock
tMRAMADDRBSU
B port address setup time before clock
tMRAMADDRBH
B port address hold time after clock
tMRAMDATACO1
Clock-to-output delay when using output registers
tMRAMDATACO2
Clock-to-output delay without output registers
tMRAMCLKHL
Minimum clock high or low time
tMRAMCLR
Minimum clear pulse width
Table 6–42. Routing Delay Internal Timing Microparameter Descriptions
Symbol
Parameter
tR4
Delay for an R4 line with average loading; covers a distance
of four LAB columns
tR8
Delay for an R8 line with average loading; covers a distance
of eight LAB columns
tR24
Delay for an R24 line with average loading; covers a distance
of 24 LAB columns
tC4
Delay for an C4 line with average loading; covers a distance
of four LAB rows
tC8
Delay for an C8 line with average loading; covers a distance
of eight LAB rows
tC16
Delay for an C16 line with average loading; covers a distance
of 16 LAB rows
tLOCAL
Local interconnect delay
Table 6–43. Stratix GX Reset & PLL Lock Time Parameter Descriptions
(Part 1 of 2)
Symbol
Altera Corporation
June 2006
Parameter
tA N A L O G R E S E T P W
Pulse width to power down analog circuits.
tD I G I T A L R E S E T P W
Pulse width to reset digital circuits
tT X _ P L L _ L O C K
The time it takes the tx_pll to lock to the
reference clock.
6–29
Stratix GX Device Handbook, Volume 1
Timing Model
Table 6–43. Stratix GX Reset & PLL Lock Time Parameter Descriptions
(Part 2 of 2)
Symbol
Parameter
tR X _ F R E Q L O C K
The time until the clock recovery unit (CRU)
switches to data mode from lock to reference
mode.
tR X _ F R E Q L O C K 2 P H A S E L O C K The time until CRU phase locks to data after
switching from lock to data mode.
Figure 6–4 shows the TriMatrix memory waveforms for the M512, M4K,
and M-RAM timing parameters shown in Tables 6–39 through 6–41.
Figure 6–4. Dual-Port RAM Timing Microparameter Waveform
wrclock
tWEREH
tWERESU
wren
tWADDRH
tWADDRSU
wraddress
an-1
an
a0
a1
a2
a3
a4
a5
a6
din4
din5
din6
tDATAH
data-in
din-1
din
tDATASU
rdclock
tWEREH
tWERESU
rden
tRC
rdaddress
bn
b1
b0
b2
b3
tDATACO1
reg_data-out
doutn-2
doutn-1
doutn
dout0
tDATACO2
unreg_data-out
doutn-1
doutn
6–30
Stratix GX Device Handbook, Volume 1
dout0
Altera Corporation
June 2006
DC & Switching Characteristics
Figure 6–5. Stratix GX Transceiver Reset & PLL Lock Time Waveform Note (1)
tWEREH
tWERESU
rden
tRC
rdaddress
bn
b0
tDATACO1
reg_data-out
doutn-1
doutn-2
doutn
tDATACO2
unreg_data-out
doutn
doutn-1
Note to Figure 6–5:
(1)
Waveforms are for minimum pulse width timing and output timing only. Please refer to the Stratix GX Transceiver
User Guide for the complete reset sequence.
Tables 6–44 through 6–50 show the internal timing microparameters for
all Stratix GX devices.
Table 6–44. LE Internal Timing Microparameters
-5 Speed Grade -6 Speed Grade -7 Speed Grade
Symbol
Unit
Min
Altera Corporation
June 2006
tSU
10
tH
100
Max
Min
Max
10
Min
Max
11
100
ps
114
ps
tCO
156
176
202
ps
tLUT
366
459
527
ps
tCLR
100
100
114
ps
tPRE
100
100
114
ps
tCLKHL
100
100
114
ps
6–31
Stratix GX Device Handbook, Volume 1
Timing Model
Table 6–45. IOE Internal Timing Microparameters
-5 Speed Grade -6 Speed Grade -7 Speed Grade
Symbol
Unit
Min
tSU
64
tH
76
tCO
tPIN2COMBOUT_R
tPIN2COMBOUT_C
Max
Min
Max
68
Min
Max
68
80
ps
80
ps
162
171
171
ps
1,038
1,093
1,256
ps
927
976
1,122
ps
tCOMBIN2PIN_R
2,944
3,099
3,563
ps
tCOMBIN2PIN_C
3,189
3,357
3,860
ps
tCLR
262
276
317
ps
tPRE
262
276
317
ps
tCLKHL
90
95
109
ps
Table 6–46. DSP Block Internal Timing Microparameters
Symbol
-5 Speed
Grade
Min
Max
-6 Speed
Grade
Min
Max
-7 Speed
Grade
Min
Unit
Max
tSU
0
0
0
ps
tH
67
75
86
ps
tCO
142
158
181
ps
tINREG2PIPE18
2,613
2,982
3,429
ps
tINREG2PIPE9
3,390
3,993
4,591
ps
tPIPE2OUTREG2ADD
2,002
2,203
2,533
ps
tPIPE2OUTREG4ADD
2,899
3,189
3,667
ps
tPD9
3,709
4,081
4,692
ps
tPD18
4,795
5,275
6,065
ps
tPD36
7,495
8,245
9,481
ps
tCLR
tCLKHL
6–32
Stratix GX Device Handbook, Volume 1
450
500
575
ps
1,350
1,500
1,724
ps
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–47. M512 Block Internal Timing Microparameters
-5 Speed Grade -6 Speed Grade -7 Speed Grade
Symbol
Unit
Min
tM512RC
Max
Min
3,340
tM512WC
Max
Min
3,816
3,318
Max
4,387
3,590
4,128
ps
ps
tM512WERESU
110
123
141
ps
tM512WERH
34
38
43
ps
tM512DATASU
110
123
141
ps
tM512DATAH
34
38
43
ps
tM512WADDRASU
110
123
141
ps
tM512WADDRH
34
38
43
ps
tM512DATACO1
424
472
541
ps
tM512DATACO2
3,366
3,846
4,421
ps
tM512CLKHL
150
167
192
ps
tM512CLR
170
189
217
ps
Table 6–48. M4K Block Internal Timing Microparameters (Part 1 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Symbol
Unit
Min
Altera Corporation
June 2006
Max
Min
Max
Min
Max
tM4KRC
3,807
4,320
4,967
ps
tM4KWC
2,556
2,840
3,265
ps
tM4KWERESU
131
149
171
ps
tM4KWERH
34
38
43
ps
tM4KDATASU
131
149
171
ps
tM4KDATAH
34
38
43
ps
tM4KWADDRASU
131
149
171
ps
tM4KWADDRH
34
38
43
ps
tM4KRADDRASU
131
149
171
ps
tM4KRADDRH
34
38
43
ps
tM4KDATABSU
131
149
171
ps
tM4KDATABH
34
38
43
ps
tM4KADDRBSU
131
149
171
ps
tM4KADDRBH
34
38
43
ps
6–33
Stratix GX Device Handbook, Volume 1
Timing Model
Table 6–48. M4K Block Internal Timing Microparameters (Part 2 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Symbol
Unit
Min
Max
tM4KDATACO1
Min
Max
571
tM4KDATACO2
Min
Max
635
3,984
729
4,507
5,182
ps
ps
tM4KCLKHL
150
167
192
ps
tM4KCLR
170
189
255
ps
Table 6–49. M-RAM Block Internal Timing Microparameters
-5
-6
-7
Symbol
Unit
Min
Max
Min
Max
Min
Max
tMRAMRC
4,364
4,838
5,562
ps
tMRAMWC
3,654
4,127
4,746
ps
tMRAMWERESU
25
25
28
ps
tMRAMWERH
18
20
23
ps
tMRAMDATASU
25
25
28
ps
tMRAMDATAH
18
20
23
ps
tMRAMWADDRASU
25
25
28
ps
tMRAMWADDRH
18
20
23
ps
tMRAMRADDRASU
25
25
28
ps
tMRAMRADDRH
18
20
23
ps
tMRAMDATABSU
25
25
28
ps
tMRAMDATABH
18
20
23
ps
tMRAMADDRBSU
25
25
28
ps
tMRAMADDRBH
18
20
23
ps
tMRAMDATACO1
1,038
1,053
1,210
ps
tMRAMDATACO2
4,362
4,939
5,678
ps
tMRAMCLKHL
270
300
345
ps
tMRAMCLR
135
150
172
ps
6–34
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–50. Stratix GX Transceiver Reset & PLL Lock Time Parameters
Symbol
Min
Typ
Max
Units
tA N A L O G R E S E T P W (5)
1
mS
tD I G I TA L R E S E T P W (5)
4
Parallel clock
cycle
tT X _ P L L _ L O C K (3)
10
µS
tR X _ F R E Q L O C K (4)
5
mS
tR X _ F R E Q L O C K 2 P H A S E L O C K (2)
5
µS
Notes to Table 6–50:
(1)
(2)
(3)
(4)
(5)
The minimum pulse width specified is associated with the power-down of circuits.
The clock recovery unit (CRU) phase locked-to-data time is based on a data rate of 500 Mbps and 8B/10B encoded
data.
After #pll_areset, pll_enable, or PLL power-up, the time required for the transceiver PLL to lock to the
reference clock.
After #rx_analogreset, the time for the CRU to switch to lock-to-data mode.
There is no maximum pulse width specification. The GXB can be held in reset indefinitely.
Routing delays vary depending on the load on a specific routing line. The
Quartus II software reports the routing delay information when running
the timing analysis for a design. Contact Altera Applications Engineering
for more details.
External Timing Parameters
External timing parameters are specified by device density and speed
grade. Figure 6–6 shows the timing model for bidirectional IOE pin
timing. All registers are within the IOE.
Altera Corporation
June 2006
6–35
Stratix GX Device Handbook, Volume 1
Timing Model
Figure 6–6. External Timing in Stratix GX Devices
OE Register
Dedicated
Clock
D
PRN
Q
tINSU
tINH
tOUTCO
CLRN
Output Register
D
PRN
Q
Bidirectional
Pin
CLRN
Input Register
PRN
D
Q
CLRN
All external I/O timing parameters shown are for 3.3-V LVTTL or
LVCMOS I/O standards with the maximum current strength. For
external I/O timing using standards other than LVTTL or LVCMOS use
the I/O standard input and output delay adders in Tables 6–72 through
6–76.
Table 6–51 shows the external I/O timing parameters when using fast
regional clock networks.
Table 6–51. Stratix GX Fast Regional Clock External I/O Timing Parameters
Symbol
Parameter
tINSU
Setup time for input or bidirectional pin using column IOE
input register with fast regional clock fed by FCLK pin
tINH
Hold time for input or bidirectional pin using column IOE
input register with fast regional clock fed by FCLK pin
tOUTCO
Clock-to-output delay output or bidirectional pin using
column IOE output register with fast regional clock fed by
FCLK pin
Notes (1), (2)
Conditions
CL O A D = 10 pF
Notes to Table 6–51:
(1)
(2)
These timing parameters are sample-tested only.
These timing parameters are for column IOE pins. Row IOE pins are 100- to 250-ps slower depending on device
and speed grade and whether it is tCO or tSU. You should use the Quartus II software to verify the external timing
for any pin.
6–36
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–52 shows the external I/O timing parameters when using
regional clock networks.
Table 6–52. Stratix GX Regional Clock External I/O Timing Parameters
Symbol
Notes (1), (2)
Parameter
Conditions
tINSU
Setup time for input or bidirectional pin using column IOE
input register with regional clock fed by CLK pin
tINH
Hold time for input or bidirectional pin using column IOE
input register with regional clock fed by CLK pin
tOUTCO
Clock-to-output delay output or bidirectional pin using
column IOE output register with regional clock fed by CLK
pin
tINSUPLL
Setup time for input or bidirectional pin using column IOE
input register with regional clock fed by Enhanced PLL with
default phase setting
tINHPLL
Hold time for input or bidirectional pin using column IOE
input register with regional clock fed by Enhanced PLL with
default phase setting
tOUTCOPLL
Clock-to-output delay output or bidirectional pin using
column IOE output register with regional clock Enhanced
PLL with default phase setting
CL O A D = 10 pF
CL O A D = 10 pF
Notes to Table 6–52:
(1)
(2)
These timing parameters are sample-tested only.
These timing parameters are for column IOE pins. Row IOE pins are 100- to 250-ps slower depending on device,
speed grade, and the specific parameter in question. You should use the Quartus II software to verify the external
timing for any pin.
Table 6–53 shows the external I/O timing parameters when using global
clock networks.
Table 6–53. Stratix GX Global Clock External I/O Timing Parameters (Part 1 of 2)
Symbol
Parameter
Notes (1), (2)
Conditions
tINSU
Setup time for input or bidirectional pin using column IOE
input register with global clock fed by CLK pin
tINH
Hold time for input or bidirectional pin using column IOE
input register with global clock fed by CLK pin
tOUTCO
CL O A D = 10 pF
Clock-to-output delay output or bidirectional pin using
column IOE output register with global clock fed by CLK pin
tINSUPLL
Setup time for input or bidirectional pin using column IOE
input register with global clock fed by Enhanced PLL with
default phase setting
Altera Corporation
June 2006
6–37
Stratix GX Device Handbook, Volume 1
Timing Model
Table 6–53. Stratix GX Global Clock External I/O Timing Parameters (Part 2 of 2)
Symbol
Parameter
Notes (1), (2)
Conditions
tINHPLL
Hold time for input or bidirectional pin using column IOE
input register with global clock fed by enhanced PLL with
default phase setting
tOUTCOPLL
Clock-to-output delay output or bidirectional pin using
column IOE output register with global clock enhanced PLL
with default phase setting
CL O A D = 10 pF
Notes to Table 6–53:
(1)
(2)
These timing parameters are sample-tested only.
These timing parameters are for column IOE pins. Row IOE pins are 100- to 250-ps slower depending on device,
speed grade, and the specific parameter in question. You should use the Quartus II software to verify the external
timing for any pin.
Tables 6–54 through 6–59 show the external timing parameters on column
and row pins for EP1SGX10 devices.
Table 6–54. EP1SGX10 Column Pin Fast Regional Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
tINSU
2.245
tINH
0.000
tOUTCO
2.000
Max
Max
2.332
2.666
0.000
4.597
2.000
Max
ns
0.000
4.920
2.000
ns
5.635
ns
Table 6–55. EP1SGX10 Column Pin Regional Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
Max
Max
2.218
Max
tINSU
2.114
2.348
tINH
0.000
tOUTCO
2.000
tINSUPLL
1.035
0.941
1.070
ns
tINHPLL
0.000
0.000
0.000
ns
tOUTCOPLL
0.500
0.000
4.728
2.629
6–38
Stratix GX Device Handbook, Volume 1
2.000
0.500
ns
0.000
5.078
2.769
2.000
0.500
ns
6.004
3.158
ns
ns
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–56. EP1SGX10 Column Pin Global Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
tINSU
1.785
tINH
0.000
tOUTCO
2.000
tINSUPLL
0.988
tINHPLL
0.000
tOUTCOPLL
0.500
Max
Max
1.814
2.087
0.000
5.057
2.000
2.000
ns
6.214
1.066
0.000
0.500
ns
0.000
5.438
0.936
2.634
Max
ns
0.000
2.774
0.500
ns
ns
3.162
ns
Table 6–57. EP1SGX10 Row Pin Fast Regional Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
tINSU
2.194
tINH
0.000
tOUTCO
2.000
Max
Max
2.384
2.727
0.000
4.956
2.000
Max
ns
0.000
4.971
2.000
ns
5.463
ns
Table 6–58. EP1SGX10 Row Pin Regional Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
Max
Max
Max
tINSU
2.244
2.413
2.574
ns
tINH
0.000
0.000
0.000
ns
tOUTCO
2.000
tINSUPLL
1.126
1.186
1.352
ns
tINHPLL
0.000
0.000
0.000
ns
tOUTCOPLL
0.500
4.906
2.804
2.000
0.500
4.942
2.627
2.000
0.500
5.616
2.765
ns
ns
Table 6–59. EP1SGX10 Row Pin Global Clock External I/O Timing Parameters (Part 1 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
Max
Max
Max
tINSU
1.919
2.062
2.368
ns
tINH
0.000
0.000
0.000
ns
Altera Corporation
June 2006
6–39
Stratix GX Device Handbook, Volume 1
Timing Model
Table 6–59. EP1SGX10 Row Pin Global Clock External I/O Timing Parameters (Part 2 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Max
Min
Max
Min
Max
tOUTCO
2.000
5.231
2.000
5.293
2.000
5.822
tINSUPLL
1.126
1.186
1.352
ns
tINHPLL
0.000
0.000
0.000
ns
tOUTCOPLL
0.500
Symbol
Unit
2.804
0.500
2.627
0.500
2.765
ns
ns
Tables 6–60 through 6–65 show the external timing parameters on column
and row pins for EP1SGX25 devices.
Table 6–60. EP1SGX25 Column Pin Fast Regional Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
Max
Max
Max
tINSU
2.418
2.618
3.014
ns
tINH
0.000
0.000
0.000
ns
tOUTCO
2.000
4.524
2.000
4.834
2.000
5.538
ns
Table 6–61. EP1SGX25 Column Pin Regional Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
Max
Max
Max
tINSU
1.713
1.838
2.069
ns
tINH
0.000
0.000
0.000
ns
tOUTCO
2.000
tINSUPLL
1.061
tINHPLL
0.000
tOUTCOPLL
0.500
5.229
2.000
5.614
1.155
6–40
Stratix GX Device Handbook, Volume 1
0.500
6.432
1.284
0.000
2.661
2.000
ns
0.000
2.799
0.500
ns
ns
3.195
ns
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–62. EP1SGX25 Column Pin Global Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
tINSU
1.790
tINH
0.000
tOUTCO
2.000
tINSUPLL
1.046
tINHPLL
0.000
tOUTCOPLL
0.500
Max
Max
1.883
2.120
0.000
5.194
2.000
2.000
ns
6.381
1.220
0.000
0.500
ns
0.000
5.569
1.141
2.676
Max
ns
0.000
2.813
0.500
ns
ns
3.208
ns
Table 6–63. EP1SGX25 Row Pin Fast Regional Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Symbol
Unit
Min
tINSU
2.394
tINH
0.000
tOUTCO
2.000
Max
Min
Max
2.594
2.000
Max
2.936
0.000
4.456
Min
ns
0.000
4.761
2.000
ns
5.454
ns
Table 6–64. EP1SGX25 Row Pin Regional Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
Max
Max
Max
tINSU
1.970
2.109
2.377
ns
tINH
0.000
0.000
0.000
ns
tOUTCO
2.000
tINSUPLL
1.326
1.386
1.552
ns
tINHPLL
0.000
0.000
0.000
ns
tOUTCOPLL
0.500
4.880
2.304
2.000
0.500
5.246
2.427
2.000
0.500
6.013
2.765
ns
ns
Table 6–65. EP1SGX25 Row Pin Global Clock External I/O Timing Parameters (Part 1 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
Max
Max
Max
tINSU
1.963
2.108
2.379
ns
tINH
0.000
0.000
0.000
ns
Altera Corporation
June 2006
6–41
Stratix GX Device Handbook, Volume 1
Timing Model
Table 6–65. EP1SGX25 Row Pin Global Clock External I/O Timing Parameters (Part 2 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Max
Min
Max
Min
Max
tOUTCO
2.000
4.887
2.000
5.247
2.000
6.011
tINSUPLL
1.326
1.386
1.552
ns
tINHPLL
0.000
0.000
0.000
ns
tOUTCOPLL
0.500
Symbol
Unit
2.304
0.500
2.427
0.500
2.765
ns
ns
Tables 6–66 through 6–71 show the external timing parameters on column
and row pins for EP1SGX40 devices.
Table 6–66. EP1SGX40 Column Pin Fast Regional Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
Max
Max
Max
tINSU
2.704
2.912
3.235
ns
tINH
0.000
0.000
0.000
ns
tOUTCO
2.000
5.060
2.000
5.432
2.000
6.226
ns
Table 6–67. EP1SGX40 Column Pin Regional Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
Max
Max
Max
tINSU
2.467
2.671
3.011
ns
tINH
0.000
0.000
0.000
ns
tOUTCO
2.000
tINSUPLL
1.254
tINHPLL
0.000
tOUTCOPLL
0.500
5.255
2.000
5.673
1.259
6–42
Stratix GX Device Handbook, Volume 1
0.500
6.501
1.445
0.000
2.610
2.000
ns
0.000
2.751
0.500
ns
ns
3.134
ns
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–68. EP1SGX40 Column Pin Global Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
tINSU
2.033
tINH
0.000
tOUTCO
2.000
tINSUPLL
1.228
tINHPLL
0.000
tOUTCOPLL
0.500
Max
Max
2.184
2.451
0.000
5.689
2.000
2.000
ns
7.010
1.415
0.000
0.500
ns
0.000
6.116
1.278
2.594
Max
ns
0.000
2.732
0.500
ns
ns
3.113
ns
Table 6–69. EP1SGX40 Row Pin Fast Regional Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
tINSU
2.450
tINH
0.000
tOUTCO
2.000
Max
Max
2.662
3.046
0.000
4.880
2.000
Max
ns
0.000
5.241
2.000
ns
6.004
ns
Table 6–70. EP1SGX40 Row Pin Regional Clock External I/O Timing Parameters
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
Max
Max
Max
tINSU
2.398
2.567
2.938
ns
tINH
0.000
0.000
0.000
ns
tOUTCO
2.000
tINSUPLL
1.126
1.186
1.352
ns
tINHPLL
0.000
0.000
0.000
ns
tOUTCOPLL
0.500
4.932
2.304
2.000
0.500
5.336
2.427
2.000
0.500
6.112
2.765
ns
ns
Table 6–71. EP1SGX40 Row Pin Global Clock External I/O Timing Parameters (Part 1 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Symbol
Unit
Max
Max
Max
tINSU
1.965
2.128
2.429
ns
tINH
0.000
0.000
0.000
ns
Altera Corporation
June 2006
6–43
Stratix GX Device Handbook, Volume 1
Timing Model
Table 6–71. EP1SGX40 Row Pin Global Clock External I/O Timing Parameters (Part 2 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Max
Min
Max
Min
Max
tOUTCO
2.000
5.365
2.000
5.775
2.000
6.621
tINSUPLL
1.126
1.186
1.352
ns
tINHPLL
0.000
0.000
0.000
ns
tOUTCOPLL
0.500
Symbol
Unit
2.304
0.500
2.427
0.500
2.765
ns
ns
External I/O Delay Parameters
External I/O delay timing parameters, both for I/O standard input and
output adders and programmable input and output delays, are specified
by speed grade, independent of device density.
Tables 6–72 through 6–77 show the adder delays associated with column
and row I/O pins. If an I/O standard is selected other than LVTTL 24 mA
with a fast slew rate, add the selected delay to the external tCO and tSU I/O
parameters.
Table 6–72. Stratix GX I/O Standard Column Pin Input Delay Adders (Part 1 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
I/O Standard
Unit
Max
Max
Max
LVCMOS
0
0
0
ps
3.3-V LVTTL
0
0
0
ps
2.5-V LVTTL
30
31
35
ps
1.8-V LVTTL
150
157
180
ps
1.5-V LVTTL
210
220
252
ps
GTL
220
231
265
ps
GTL+
220
231
265
ps
0
0
0
ps
3.3-V PCI
3.3-V PCI-X 1.0
0
0
0
ps
Compact PCI
0
0
0
ps
AGP 1×
0
0
0
ps
AGP 2×
0
0
0
ps
CTT
120
126
144
ps
SSTL-3 class I
–30
–32
–37
ps
SSTL-3 class II
–30
–32
–37
ps
6–44
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–72. Stratix GX I/O Standard Column Pin Input Delay Adders (Part 2 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
I/O Standard
Unit
Max
Max
Max
SSTL-2 class I
–70
–74
–86
ps
SSTL-2 class II
–70
–74
–86
ps
SSTL-18 class I
180
189
217
ps
SSTL-18 class II
180
189
217
ps
1.5-V HSTL class I
120
126
144
ps
1.5-V HSTL class II
120
126
144
ps
1.8-V HSTL class I
70
73
83
ps
1.8-V HSTL class II
70
73
83
ps
Table 6–73. Stratix GX I/O Standard Row Pin Input Delay Adders (Part 1 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
I/O Standard
Unit
Max
Max
Max
LVCMOS
0
0
0
ps
3.3-V LVTTL
0
0
0
ps
2.5-V LVTTL
30
31
35
ps
1.8-V LVTTL
150
157
180
ps
1.5-V LVTTL
210
220
252
ps
GTL
0
0
0
ps
GTL+
220
231
265
ps
0
0
0
ps
3.3-V PCI
3.3-V PCI-X 1.0
0
0
0
ps
Compact PCI
0
0
0
ps
AGP 1×
0
0
0
ps
AGP 2×
0
0
0
ps
CTT
80
84
96
ps
SSTL-3 class I
–30
–32
–37
ps
SSTL-3 class II
–30
–32
–37
ps
SSTL-2 class I
–70
–74
–86
ps
SSTL-2 class II
–70
–74
–86
ps
SSTL-18 class I
180
189
217
ps
SSTL-18 class II
1.5-V HSTL class I
Altera Corporation
June 2006
0
0
0
ps
130
136
156
ps
6–45
Stratix GX Device Handbook, Volume 1
Timing Model
Table 6–73. Stratix GX I/O Standard Row Pin Input Delay Adders (Part 2 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
I/O Standard
Unit
Max
Max
Max
1.5-V HSTL class II
0
0
0
ps
1.8-V HSTL class I
70
73
83
ps
1.8-V HSTL class II
70
73
83
ps
LVDS (1)
40
42
48
ps
LVPECL (1)
–50
–53
–61
ps
3.3-V PCML (1)
330
346
397
ps
HyperTransport (1)
80
84
96
ps
Table 6–74. Stratix GX I/O Standard Output Delay Adders for Fast Slew Rate on Column Pins (Part 1 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Standard
LVCMOS
3.3-V LVTTL
2.5-V LVTTL
1.8-V LVTTL
1.5-V LVTTL
Unit
Max
Max
Max
2 mA
570
599
689
ps
4 mA
570
599
689
ps
8 mA
350
368
423
ps
12 mA
130
137
157
ps
24 mA
0
0
0
ps
4 mA
570
599
689
ps
8 mA
350
368
423
ps
12 mA
130
137
157
ps
16 mA
70
74
85
ps
24 mA
0
0
0
ps
2 mA
830
872
1,002
ps
8 mA
250
263
302
ps
12 mA
140
147
169
ps
16 mA
100
105
120
ps
2 mA
420
441
507
ps
8 mA
350
368
423
ps
12 mA
350
368
423
ps
2 mA
1,740
1,827
2,101
ps
4 mA
1,160
1,218
1,400
ps
8 mA
GTL
6–46
Stratix GX Device Handbook, Volume 1
690
725
833
ps
–150
–157
–181
ps
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–74. Stratix GX I/O Standard Output Delay Adders for Fast Slew Rate on Column Pins (Part 2 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Standard
Unit
Max
Max
Max
GTL+
–110
–115
–133
ps
3.3-V PCI
–230
–241
–277
ps
3.3-V PCI-X 1.0
–230
–241
–277
ps
Compact PCI
–230
–241
–277
ps
AGP 1×
–30
–31
–36
ps
AGP 2×
–30
–31
–36
ps
CTT
50
53
61
ps
SSTL-3 class I
90
95
109
ps
SSTL-3 class II
–50
–52
–60
ps
SSTL-2 class I
100
105
120
ps
SSTL-2 class II
20
21
24
ps
SSTL-18 class I
230
242
278
ps
SSTL-18 class II
0
0
0
ps
1.5-V HSTL class I
380
399
459
ps
1.5-V HSTL class II
190
200
230
ps
1.8-V HSTL class I
380
399
459
ps
1.8-V HSTL class II
390
410
471
ps
Table 6–75. Stratix GX I/O Standard Output Delay Adders for Fast Slew Rate on Row Pins (Part 1 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Standard
LVCMOS
3.3-V LVTTL
Altera Corporation
June 2006
Unit
Max
Max
Max
2 mA
570
599
689
ps
4 mA
570
599
689
ps
8 mA
350
368
423
ps
12 mA
130
137
157
ps
24 mA
0
0
0
ps
4 mA
570
599
689
ps
8 mA
350
368
423
ps
12 mA
130
137
157
ps
16 mA
70
74
85
ps
24 mA
0
0
0
ps
6–47
Stratix GX Device Handbook, Volume 1
Timing Model
Table 6–75. Stratix GX I/O Standard Output Delay Adders for Fast Slew Rate on Row Pins (Part 2 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Standard
2.5-V LVTTL
1.8-V LVTTL
1.5-V LVTTL
Unit
Max
Max
Max
2 mA
830
872
1,002
ps
8 mA
250
263
302
ps
12 mA
140
147
169
ps
16 mA
100
105
120
ps
2 mA
1,510
1,586
1,824
ps
8 mA
420
441
507
ps
12 mA
350
368
423
ps
2 mA
1,740
1,827
2,101
ps
4 mA
1,160
1,218
1,400
ps
8 mA
690
725
833
ps
CTT
50
53
61
ps
SSTL-3 class I
90
95
109
ps
SSTL-3 class II
–50
–52
–60
ps
SSTL-2 class I
100
105
120
ps
SSTL-2 class II
20
21
24
ps
LVDS (1)
–20
–21
–24
ps
LVPECL (1)
40
42
48
ps
PCML (1)
–60
–63
–73
ps
HyperTransport Technology (1)
70
74
85
ps
Table 6–76. Stratix GX I/O Standard Output Delay Adders for Slow Slew Rate on Column Pins (Part 1 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
I/O Standard
LVCMOS
Unit
Max
Max
Max
2 mA
1,911
2,011
2,312
ps
4 mA
1,911
2,011
2,312
ps
8 mA
1,691
1,780
2,046
ps
12 mA
1,471
1,549
1,780
ps
24 mA
1,341
1,412
1,623
ps
6–48
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–76. Stratix GX I/O Standard Output Delay Adders for Slow Slew Rate on Column Pins (Part 2 of 2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
I/O Standard
3.3-V LVTTL
2.5-V LVTTL
1.8-V LVTTL
1.5-V LVTTL
GTL
Unit
Max
Max
Max
4 mA
1,993
2,097
2,411
ps
8 mA
1,773
1,866
2,145
ps
12 mA
1,553
1,635
1,879
ps
16 mA
1,493
1,572
1,807
ps
24 mA
1,423
1,498
1,722
ps
2 mA
2,631
2,768
3,182
ps
8 mA
2,051
2,159
2,482
ps
12 mA
1,941
2,043
2,349
ps
16 mA
1,901
2,001
2,300
ps
2 mA
4,632
4,873
5,604
ps
8 mA
3,542
3,728
4,287
ps
12 mA
3,472
3,655
4,203
ps
2 mA
6,620
6,964
8,008
ps
4 mA
6,040
6,355
7,307
ps
8 mA
5,570
5,862
6,740
ps
1,191
1,255
1,442
ps
GTL+
1,231
1,297
1,90
ps
3.3-V PCI
1,111
1,171
1,346
ps
3.3-V PCI-X 1.0
1,111
1,171
1,346
ps
Compact PCI
1,111
1,171
1,346
ps
AGP 1×
1,311
1,381
1,587
ps
AGP 2×
1,311
1,381
1,587
ps
CTT
1,391
1,465
1,684
ps
SSTL-3 class I
1,431
1,507
1,732
ps
SSTL-3 class II
1,291
1,360
1,563
ps
SSTL-2 class I
1,912
2,013
2,314
ps
SSTL-2 class II
1,832
1,929
2,218
ps
SSTL-18 class I
3,097
3,260
3,748
ps
SSTL-18 class II
2,867
3,018
3,470
ps
1.5-V HSTL class I
4,916
5,174
5,950
ps
1.5-V HSTL class II
4,726
4,975
5,721
ps
1.8-V HSTL class I
3,247
3,417
3,929
ps
1.8-V HSTL class II
3,257
3,428
3,941
ps
Altera Corporation
June 2006
6–49
Stratix GX Device Handbook, Volume 1
Timing Model
Table 6–77. Stratix GX I/O Standard Output Delay Adders for Slow Slew Rate on Row Pins
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
I/O Standard
LVCMOS
3.3-V LVTTL
2.5-V LVTTL
1.8-V LVTTL
1.5-V LVTTL
Unit
Max
Max
Max
2 mA
1,930
2,031
2,335
ps
4 mA
1,930
2,031
2,335
ps
8 mA
1,710
1,800
2,069
ps
12 mA
1,490
1,569
1,803
ps
4 mA
1,953
2,055
2,363
ps
8 mA
1,733
1,824
2,097
ps
12 mA
1,513
1,593
1,831
ps
16 mA
1,453
1,530
1,759
ps
2 mA
2,632
2,769
3,183
ps
8 mA
2,052
2,160
2,483
ps
12 mA
1,942
2,044
2,350
ps
16 mA
1,902
2,002
2,301
ps
2 mA
4,537
4,773
5,489
ps
8 mA
3,447
3,628
4,172
ps
12 mA
3,377
3,555
4,088
ps
2 mA
6,575
6,917
7,954
ps
4 mA
5,995
6,308
7,253
ps
8 mA
5,525
5,815
6,686
ps
CTT
1,410
1,485
1,707
ps
SSTL-3 class I
1,450
1,527
1,755
ps
SSTL-3 class II
1,310
1,380
1,586
ps
SSTL-2 class I
1,797
1,892
2,175
ps
SSTL-2 class II
1,717
1,808
2,079
ps
LVDS (1)
1,340
1,411
1,622
ps
LVPECL (1)
1,400
1,474
1,694
ps
3.3-V PCML (1)
1,300
1,369
1,573
ps
HyperTransport technology (1)
1,430
1,506
1,731
ps
Note to Tables 6–72 through 6–77:
(1)
These parameters are only available on the left side row I/O pins.
6–50
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Tables 6–78 and 6–79 show the adder delays for the column and row IOE
programmable delays, respectively. These delays are controlled with the
Quartus II software logic options listed in the Parameter column.
Table 6–78. Stratix GX IOE Programmable Delays on Column Pins
-5 Speed Grade
Parameter
-7 Speed Grade
Unit
Min
Decrease input delay to
internal cells
-6 Speed Grade
Setting
Max
Min
Max
Min
Max
Off
3,970
4,367
5,022
ps
On
3,390
3,729
4,288
ps
Small
2,810
3,091
3,554
ps
212
224
257
ps
Medium
Large
212
224
257
ps
Decrease input delay to
input register
Off
3900
4,290
4,933
ps
On
0
0
0
ps
Decrease input delay to
output register
Off
1,240
1,364
1,568
ps
On
0
0
0
ps
Increase delay to output
pin
Off
0
0
0
ps
On
377
397
456
ps
Increase delay to output
enable pin
Off
0
0
0
ps
On
338
372
427
ps
Increase output clock
enable delay
Off
0
0
0
ps
On
540
594
683
ps
Small
1,016
1,118
1,285
ps
Large
1,016
1,118
1,285
ps
0
0
0
ps
Increase input clock enable Off
delay
On
Increase output enable
clock enable delay
Altera Corporation
June 2006
540
594
683
ps
Small
1,016
1,118
1,285
ps
Large
1,016
1,118
1,285
ps
0
0
0
ps
Off
On
540
594
683
ps
Small
1,016
1,118
1,285
ps
Large
1,016
1,118
1,285
ps
6–51
Stratix GX Device Handbook, Volume 1
Timing Model
Table 6–79. Stratix GX IOE Programmable Delays on Row Pins
-5 Speed Grade
Parameter
-7 Speed Grade
Unit
Min
Decrease input delay to
internal cells
-6 Speed Grade
Setting
Max
Min
Max
Min
Max
Off
3,970
4,367
5,022
ps
On
3,390
3,729
4,288
ps
Small
2,810
3,091
3,554
ps
164
173
198
ps
Medium
Large
164
173
198
ps
3,900
4,290
4,933
ps
Decrease input delay to
input register
Off
On
0
0
0
ps
Decrease input delay to
output register
Off
1,240
1,364
1,568
ps
On
0
0
0
ps
Increase delay to output
pin
Off
0
0
0
ps
On
377
397
456
ps
Increase delay to output
enable pin
Off
0
0
0
ps
On
348
383
441
ps
Increase output clock
enable delay
Off
0
0
0
ps
On
180
198
227
ps
Small
260
286
328
ps
Large
260
286
328
ps
0
0
0
ps
Increase input clock enable Off
delay
On
Increase output enable
clock enable delay
180
198
227
ps
Small
260
286
328
ps
Large
260
286
328
ps
0
0
0
ps
Off
On
540
594
683
ps
Small
1,016
1,118
1,285
ps
Large
1,016
1,118
1,285
ps
6–52
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
The scaling factors for output pin timing in Table 6–80 are shown in units
of time per pF unit of capacitance (ps/pF). Add this delay to the
combinational timing path for output or bidirectional pins in addition to
the “I/O Adder” delays shown in Tables 6–72 through 6–77 and the “IOE
Programmable Delays” in Tables 6–78 and 6–79.
Table 6–80. Output Delay Adder for Loading on LVTTL/LVCMOS Output Buffers
LVTTL/LVCMOS Standards
Conditions
Parameter
Drive Strength
Output Pin Adder Delay (ps/pF)
Value
3.3-V LVTTL
2.5-V LVTTL
1.8-V LVTTL
1.5-V LVTTL
LVCMOS
24 mA
15
–
–
-
8
16 mA
25
18
–
–
–
12 mA
30
25
25
–
15
8 mA
50
35
40
35
20
4 mA
60
–
–
80
30
2 mA
–
75
120
160
60
SSTL/HSTL Standards
Output Pin Adder Delay (ps/pF)
Conditions
Class I
Class II
SSTL-3
SSTL-2
SSTL-1.8
1.5-V HSTL
1.8-V HSTL
25
25
25
25
25
25
20
25
20
20
GTL+/GTL/CTT/PCI Standards
Conditions
Output Pin Adder Delay (ps/pF)
Parameter
Value
GTL+
GTL
CTT
PCI
AGP
VC C I O voltage
level
3.3 V
18
18
25
20
20
2.5 V
15
18
-
-
-
Altera Corporation
June 2006
6–53
Stratix GX Device Handbook, Volume 1
Timing Model
Maximum Input & Output Clock Rates
Tables 6–81 through 6–83 show the maximum input clock rate for column
and row pins in Stratix GX devices.
Table 6–81. Stratix GX Maximum Input Clock Rate for CLK[7..4] & CLK[15..12] Pins
I/O Standard
-5 Speed Grade -6 Speed Grade -7 Speed Grade
Unit
LVTTL
422
422
390
MHz
2.5 V
422
422
390
MHz
1.8 V
422
422
390
MHz
1.5 V
422
422
390
MHz
LVCMOS
422
422
390
MHz
GTL
300
250
200
MHz
GTL+
300
250
200
MHz
SSTL-3 class I
400
350
300
MHz
SSTL-3 class II
400
350
300
MHz
SSTL-2 class I
400
350
300
MHz
SSTL-2 class II
400
350
300
MHz
SSTL-18 class I
400
350
300
MHz
SSTL-18 class II
400
350
300
MHz
1.5-V HSTL class I
400
350
300
MHz
1.5-V HSTL class II
400
350
300
MHz
1.8-V HSTL class I
400
350
300
MHz
1.8-V HSTL class II
400
350
300
MHz
3.3-V PCI
422
422
390
MHz
3.3-V PCI-X 1.0
422
422
390
MHz
Compact PCI
422
422
390
MHz
AGP 1×
422
422
390
MHz
AGP 2×
422
422
390
MHz
CTT
300
250
200
MHz
Differential HSTL
400
350
300
MHz
LVDS
645
645
622
MHz
LVPECL
645
645
622
MHz
PCML
300
275
275
MHz
HyperTransport technology
500
500
450
MHz
6–54
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–82. Stratix GX Maximum Input Clock Rate for CLK[0, 2, 9, 11] Pins & FPLL[8..7]CLK Pins
I/O Standard
-5 Speed Grade -6 Speed Grade -7 Speed Grade
Unit
LVTTL
422
422
390
MHz
2.5 V
422
422
390
MHz
1.8 V
422
422
390
MHz
1.5 V
422
422
390
MHz
LVCMOS
422
422
390
MHz
GTL
300
250
200
MHz
GTL+
300
250
200
MHz
SSTL-3 class I
400
350
300
MHz
SSTL-3 class II
400
350
300
MHz
SSTL-2 class I
400
350
300
MHz
SSTL-2 class II
400
350
300
MHz
SSTL-18 class I
400
350
300
MHz
SSTL-18 class II
400
350
300
MHz
1.5-V HSTL class I
400
350
300
MHz
1.5-V HSTL class II
400
350
300
MHz
1.8-V HSTL class I
400
350
300
MHz
1.8-V HSTL class II
400
350
300
MHz
3.3-V PCI
422
422
390
MHz
3.3-V PCI-X 1.0
422
422
390
MHz
Compact PCI
422
422
390
MHz
AGP 1×
422
422
390
MHz
AGP 2×
422
422
390
MHz
CTT
300
250
200
MHz
Differential HSTL
400
350
300
MHz
LVDS
717
717
640
MHz
LVPECL
717
717
640
MHz
PCML
400
375
350
MHz
HyperTransport technology
717
717
640
MHz
Table 6–83. Stratix GX Maximum Input Clock Rate for CLK[1, 3, 8, 10] Pins (Part 1 of 2)
I/O Standard
-5 Speed Grade -6 Speed Grade -7 Speed Grade
Unit
LVTTL
422
422
390
MHz
2.5 V
422
422
390
MHz
Altera Corporation
June 2006
6–55
Stratix GX Device Handbook, Volume 1
Timing Model
Table 6–83. Stratix GX Maximum Input Clock Rate for CLK[1, 3, 8, 10] Pins (Part 2 of 2)
I/O Standard
-5 Speed Grade -6 Speed Grade -7 Speed Grade
1.8 V
422
422
Unit
390
MHz
1.5 V
422
422
390
MHz
LVCMOS
422
422
390
MHz
GTL
300
250
200
MHz
GTL+
300
250
200
MHz
SSTL-3 class I
400
350
300
MHz
SSTL-3 class II
400
350
300
MHz
SSTL-2 class I
400
350
300
MHz
SSTL-2 class II
400
350
300
MHz
SSTL-18 class I
400
350
300
MHz
SSTL-18 class II
400
350
300
MHz
1.5-V HSTL class I
400
350
300
MHz
1.5-V HSTL class II
400
350
300
MHz
1.8-V HSTL class I
400
350
300
MHz
1.8-V HSTL class II
400
350
300
MHz
3.3-V PCI
422
422
390
MHz
3.3-V PCI-X 1.0
422
422
390
MHz
Compact PCI
422
422
390
MHz
AGP 1×
422
422
390
MHz
AGP 2×
422
422
390
MHz
CTT
300
250
200
MHz
Differential HSTL
400
350
300
MHz
LVDS
645
645
640
MHz
LVPECL
645
645
640
MHz
PCML
300
275
275
MHz
HyperTransport technology
645
645
640
MHz
Tables 6–84 and 6–85 show the maximum output clock rate for column
and row pins in Stratix GX devices.
Table 6–84. Stratix GX Maximum Output Clock Rate for PLL[5, 6, 11, 12] Pins (Part 1 of 2)
I/O Standard
-5 Speed Grade -6 Speed Grade -7 Speed Grade
Unit
LVTTL
350
300
250
MHz
2.5 V
350
300
300
MHz
6–56
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–84. Stratix GX Maximum Output Clock Rate for PLL[5, 6, 11, 12] Pins (Part 2 of 2)
I/O Standard
1.8 V
-5 Speed Grade -6 Speed Grade -7 Speed Grade
250
250
Unit
250
MHz
1.5 V
225
200
200
MHz
LVCMOS
350
300
250
MHz
GTL
200
167
125
MHz
GTL+
200
167
125
MHz
SSTL-3 class I
167
150
133
MHz
SSTL-3 class II
167
150
133
MHz
SSTL-2 class I
200
200
167
MHz
SSTL-2 class II
200
200
167
MHz
SSTL-18 class I
150
133
133
MHz
SSTL-18 class II
150
133
133
MHz
1.5-V HSTL class I
250
225
200
MHz
1.5-V HSTL class II
225
200
200
MHz
1.8-V HSTL class I
250
225
200
MHz
1.8-V HSTL class II
225
200
200
MHz
3.3-V PCI
350
300
250
MHz
3.3-V PCI-X 1.0
350
300
250
MHz
Compact PCI
350
300
250
MHz
AGP 1×
350
300
250
MHz
AGP 2×
350
300
250
MHz
CTT
200
200
200
MHz
Differential HSTL
225
200
200
MHz
Differential SSTL-2
200
200
167
MHz
LVDS
500
500
500
MHz
LVPECL
500
500
500
MHz
PCML
350
350
350
MHz
HyperTransport technology
350
350
350
MHz
Table 6–85. Stratix GX Maximum Output Clock Rate (Using I/O Pins) for PLL[1, 2] Pins (Part 1 of 2)
I/O Standard
-5 Speed Grade -6 Speed Grade -7 Speed Grade
Unit
LVTTL
400
350
300
MHz
2.5 V
400
350
300
MHz
1.8 V
400
350
300
MHz
Altera Corporation
June 2006
6–57
Stratix GX Device Handbook, Volume 1
High-Speed I/O Specification
Table 6–85. Stratix GX Maximum Output Clock Rate (Using I/O Pins) for PLL[1, 2] Pins (Part 2 of 2)
I/O Standard
-5 Speed Grade -6 Speed Grade -7 Speed Grade
Unit
1.5 V
350
300
300
MHz
LVCMOS
400
350
300
MHz
GTL
200
167
125
MHz
GTL+
200
167
125
MHz
SSTL-3 class I
167
150
133
MHz
SSTL-3 class II
167
150
133
MHz
SSTL-2 class I
150
133
133
MHz
SSTL-2 class II
150
133
133
MHz
SSTL-18 class I
150
133
133
MHz
SSTL-18 class II
150
133
133
MHz
HSTL class I
250
225
200
MHz
HSTL class II
225
225
200
MHz
3.3-V PCI
250
225
200
MHz
3.3-V PCI-X 1.0
225
225
200
MHz
Compact PCI
400
350
300
MHz
AGP 1×
400
350
300
MHz
AGP 2×
400
350
300
MHz
CTT
300
250
200
MHz
Differential HSTL
225
225
200
MHz
LVDS
717
717
500
MHz
LVPECL
717
717
500
MHz
PCML
420
420
420
MHz
HyperTransport technology
420
420
420
MHz
High-Speed I/O
Specification
Table 6–86 provides high-speed timing specifications definitions.
Table 6–86. High-Speed Timing Specifications & Definitions (Part 1 of 2)
High-Speed Timing Specification
Definitions
tC
High-speed receiver/transmitter input and output clock period.
fHSCLK
High-speed receiver/transmitter input and output clock frequency.
tRISE
Low-to-high transmission time.
6–58
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–86. High-Speed Timing Specifications & Definitions (Part 2 of 2)
High-Speed Timing Specification
Definitions
tFALL
High-to-low transmission time.
Timing unit interval (TUI)
The timing budget allowed for skew, propagation delays, and data
sampling window. (TUI = 1/(Receiver Input Clock Frequency ×
Multiplication Factor) = tC/w).
fHSDR
Maximum/minimum LVDS data transfer rate (fHSDR = 1/TUI), non-DPA.
fHSDRDPA
Maximum/minimum LVDS data transfer rate (fHSDRDPA = 1/TUI), DPA.
Channel-to-channel skew (TCCS)
The timing difference between the fastest and slowest output edges,
including tCO variation and clock skew. The clock is included in the TCCS
measurement.
Sampling window (SW)
The period of time during which the data must be valid in order to capture
it correctly. The setup and hold times determine the ideal strobe position
within the sampling window.
SW = tSW (max) – tSW (min).
Input jitter (peak-to-peak)
Peak-to-peak input jitter on high-speed PLLs.
Output jitter (peak-to-peak)
Peak-to-peak output jitter on high-speed PLLs.
tDUTY
Duty cycle on high-speed transmitter output clock.
tLOCK
Lock time for high-speed transmitter and receiver PLLs.
Table 6–87 shows the high-speed I/O timing specifications for Stratix GX
devices.
Table 6–87. High-Speed I/O Specifications (Part 1 of 4)
Symbol
fHSCLK (Clock
frequency)
(LVDS,
LVPECL,
HyperTransport
technology)
fHSCLK =
fHSDR / W
Notes (1), (2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Max
Min
Max
Min
10
717
10
717
10
624
MHz
74
717
74
717
74
717
MHz
Conditions
W = 1 to 30 for ≤717
Mbps
W = 2 to 30 for > 717
Mbps
fHSCLK_DPA
Altera Corporation
June 2006
Unit
Typ
Typ
Typ
Max
6–59
Stratix GX Device Handbook, Volume 1
High-Speed I/O Specification
Table 6–87. High-Speed I/O Specifications (Part 2 of 4)
Symbol
fHSDR Device
operation
(LVDS,
LVPECL,
HyperTransport
technology)
Notes (1), (2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Conditions
Unit
Typ
Max
Typ
Max
Typ
Max
J = 10
300
840
300
840
300
840
Mbps
J=8
300
840
300
840
300
840
Mbps
J=7
300
840
300
840
300
840
Mbps
J=4
300
840
300
840
300
840
Mbps
J=2
100
624
100
624
100
462
Mbps
J = 1 (LVDS and
LVPECL only)
100
462
100
462
100
462
Mbps
300
1000
300
840
300
840
Mbps
840
Mbps
fHSDRDPA (LVDS, J=10
LVPECL)
J=8
300
1000
300
840
300
fHSCLK (Clock
frequency)
(PCML)
fHSCLK =
fHSDR / W
W = 1 to 30
10
400
10
400
10
fHSDR Device
operation
(PCML)
J = 10
300
400
300
400
300
311
Mbps
J=8
300
400
300
400
300
311
Mbps
J=7
300
400
300
400
300
311
Mbps
J=4
300
400
300
400
300
311
Mbps
J=2
100
400
100
400
100
300
Mbps
J=1
100
250
100
250
100
DPA Run
Length
DPA Jitter
Tolerance(p-p)
all data rates
DPA Minimum
Eye opening
(p-p)
0.56
DPA Receiver
Latency
5
6–60
Stratix GX Device Handbook, Volume 1
311
MHz
200
Mbps
6400
6400
6400
UI
0.44
0.44
0.44
UI
0.56
9
5
0.56
9
5
UI
9
(3)
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–87. High-Speed I/O Specifications (Part 3 of 4)
Symbol
DPA Lock Time
Notes (1), (2)
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Min
Conditions
Standard Train
ing
Patt
ern
Unit
Typ
Max
Typ
Max
Typ
Max
Trans
ition
Density
0000 10%
0000
0011
1111
1111
256
256
256
(4)
Rapid IO 0000 25%
1111
256
256
256
(4)
1001 50%
0000
256
256
256
(4)
1010 100
1010 %
256
256
256
(4)
0101
0101
256
256
256
(4)
SPI-4,
CSIX
Misc
TCCS
All
200
200
300
ps
SW
PCML (J = 4, 7, 8, 10)
750
750
800
ps
PCML (J = 2)
900
900
1,200
ps
PCML (J = 1)
1,500
1,500
1,700
ps
LVDS and LVPECL
(J = 1)
500
500
550
ps
LVDS, LVPECL,
HyperTransport
technology (J = 2
through 10)
440
440
500
ps
Input jitter
tolerance
(peak-to-peak)
All
250
250
250
ps
Output jitter
(peak-to-peak)
All
160
160
200
ps
Output tRISE
LVDS
80
110
120
80
110
120
80
110
120
ps
HyperTransport
technology
110
170
200
110
170
200
120
170
200
ps
LVPECL
90
130
150
90
130
150
100
135
150
ps
PCML
80
110
135
80
110
135
80
110
135
ps
Altera Corporation
June 2006
6–61
Stratix GX Device Handbook, Volume 1
High-Speed I/O Specification
Table 6–87. High-Speed I/O Specifications (Part 4 of 4)
Symbol
Output tFALL
tDUTY
-5 Speed Grade
-6 Speed Grade
-7 Speed Grade
Min
Min
Typ
Max
Min
Typ
Max
Conditions
Unit
Typ
Max
LVDS
80
110
120
80
110
120
80
110
120
ps
HyperTransport
technology
110
170
200
110
170
200
110
170
200
ps
LVPECL
90
130
160
90
130
160
100
135
160
ps
PCML
105
140
175
105
140
175
110
145
175
ps
LVDS (J = 2 through
10)
47.5
50
52.5
47.5
50
52.5
47.5
50
52.5
%
45
50
55
45
50
55
45
50
55
%
100
μs
LVDS (J =1) and
LVPECL, PCML,
HyperTransport
technology
tLOCK
Notes (1), (2)
All
100
100
Notes to Table 6–87:
(1)
(2)
(3)
(4)
When J = 4, 7, 8, and 10, the SERDES block is used.
When J = 2 or J = 1, the SERDES is bypassed.
Number of parallel CLK cycles.
Number of repetitions.
PLL Timing
Tables 6–88 through 6–90 describe the Stratix GX device enhanced PLL
specifications.
Table 6–88. Enhanced PLL Specifications for -5 Speed Grades (Part 1 of 2)
Max
Unit
fIN
Symbol
Input clock frequency
Parameter
3 (1)
684
MHz
fINDUTY
Input clock duty cycle
40
60
%
fEINDUTY
External feedback clock input duty
cycle
40
60
%
tINJITTER
Input clock period jitter
±200 (2)
ps
tEINJITTER
External feedback clock period jitter
±200 (2)
ps
tFCOMP
External feedback clock compensation
time (3)
6
ns
fOUT
Output frequency for internal global or
regional clock
0.3
500
MHz
fOUT_EXT
Output frequency for external clock (2)
0.3
526
MHz
6–62
Stratix GX Device Handbook, Volume 1
Min
Typ
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–88. Enhanced PLL Specifications for -5 Speed Grades (Part 2 of 2)
Symbol
Parameter
Min
Typ
Max
Unit
55
%
±100 ps for >200 MHz outclk
±20 mUI for <200 MHz outclk
ps or
mUI
tOUTDUTY
Duty cycle for external clock output
(when set to 50%)
45
tJITTER
Period jitter for external clock output (5)
tCONFIG5,6
Time required to reconfigure the scan
chains for PLLs 5 and 6
289/fSCANCLK
tCONFIG11,12
Time required to reconfigure the scan
chains for PLLs 11 and 12
193/fSCANCLK
tSCANCLK
scanclk frequency (4)
22
MHz
tDLOCK
Time required to lock dynamically (after
switchover or reconfiguring any nonpost-scale counters/delays) (6)
100
μs
tLOCK
Time required to lock from end of
device configuration
10
400
μs
300
800 (7)
MHz
fVCO
PLL internal VCO operating range
tLSKEW
Clock skew between two external clock
outputs driven by the same counter
±50
ps
tSKEW
Clock skew between two external clock
outputs driven by the different counters
with the same settings
±75
ps
fSS
Spread spectrum modulation frequency
30
% spread
Percentage spread for spread
spectrum frequency (9)
0.4
tARESET
Minimum pulse width on areset
signal
10
0.5
Table 6–89. Enhanced PLL Specifications for -6 Speed Grades
Symbol
Parameter
150
kHz
0.6
%
ns
(Part 1 of 2)
Min Typ
Max
Unit
fIN
Input clock frequency
3 (1)
650
MHz
fINDUTY
Input clock duty cycle
40
60
%
fEINDUTY
External feedback clock input duty
cycle
40
60
%
tINJITTER
Input clock period jitter
±200 (2)
ps
tEINJITTER
External feedback clock period jitter
±200 (2)
ps
tFCOMP
External feedback clock compensation
time (3)
6
ns
Altera Corporation
June 2006
6–63
Stratix GX Device Handbook, Volume 1
High-Speed I/O Specification
Table 6–89. Enhanced PLL Specifications for -6 Speed Grades
Symbol
Parameter
(Part 2 of 2)
Min Typ
Max
Unit
fOUT
Output frequency for internal global or
regional clock
0.3
450
MHz
fOUT_EXT
Output frequency for external clock (2)
0.3
500
MHz
tOUTDUTY
Duty cycle for external clock output
(when set to 50%)
45
55
%
tJITTER
Period jitter for external clock output (5)
±100 ps for >200 MHz outclk
±20 mUI for <200 MHz outclk
ps or
mUI
tCONFIG5,6
Time required to reconfigure the scan
chains for PLLs 5 and 6
289/fSCANCLK
tCONFIG11,12
Time required to reconfigure the scan
chains for PLLs 11 and 12
193/fSCANCLK
tSCANCLK
scanclk frequency (4)
tDLOCK
Time required to lock dynamically (after
switchover or reconfiguring any nonpost-scale counters/delays) (6) (10)
tLOCK
22
MHz
(8)
100
μs
Time required to lock from end of
device configuration (10)
10
400
μs
fVCO
PLL internal VCO operating range
300
800 (7)
MHz
tLSKEW
Clock skew between two external clock
outputs driven by the same counter
±50
ps
tSKEW
Clock skew between two external clock
outputs driven by the different counters
with the same settings
±75
ps
fSS
Spread spectrum modulation frequency
30
% spread
Percentage spread for spread
spectrum frequency (9)
0.4
tARESET
Minimum pulse width on areset
signal
10
0.5
150
kHz
0.6
%
ns
Table 6–90. Enhanced PLL Specifications for -7 Speed Grade (Part 1 of 3)
Symbol
Parameter
Min
Typ
Max
Unit
fIN
Input clock frequency
3 (1)
565
MHz
fINDUTY
Input clock duty cycle
40
60
%
fEINDUTY
External feedback clock input duty
cycle
40
60
%
tINJITTER
Input clock period jitter
±200 (2)
ps
tEINJITTER
External feedback clock period jitter
±200 (2)
ps
6–64
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–90. Enhanced PLL Specifications for -7 Speed Grade (Part 2 of 3)
Symbol
Parameter
Min
Typ
Max
Unit
6
ns
tFCOMP
External feedback clock compensation
time (3)
fOUT
Output frequency for internal global or
regional clock
0.3
420
MHz
fOUT_EXT
Output frequency for external clock (2)
0.3
434
MHz
tOUTDUTY
Duty cycle for external clock output
(when set to 50%)
45
55
%
tJITTER
Period jitter for external clock output (5)
±100 ps for >200 MHz outclk
±20 mUI for <200 MHz outclk
ps or
mUI
tCONFIG5,6
Time required to reconfigure the scan
chains for PLLs 5 and 6
289/fSCANCLK
tCONFIG11,12
Time required to reconfigure the scan
chains for PLLs 11 and 12
193/fSCANCLK
tSCANCLK
scanclk frequency (4)
tDLOCK
Time required to lock dynamically (after
switchover or reconfiguring any nonpost-scale counters/delays) (6) (10)
tLOCK
fVCO
22
MHz
(8)
100
μs
Time required to lock from end of
device configuration (10)
10
400
μs
PLL internal VCO operating range
300
600 (7)
MHz
Altera Corporation
June 2006
6–65
Stratix GX Device Handbook, Volume 1
High-Speed I/O Specification
Table 6–90. Enhanced PLL Specifications for -7 Speed Grade (Part 3 of 3)
Symbol
Parameter
Min
Typ
Max
Unit
tLSKEW
Clock skew between two external clock
outputs driven by the same counter
±50
ps
tSKEW
Clock skew between two external clock
outputs driven by the different counters
with the same settings
±75
ps
fSS
Spread spectrum modulation frequency
30
150
kHz
% spread
Percentage spread for spread
spectrum frequency (9)
0.5
0.6
%
tARESET
Minimum pulse width on areset
signal
10
ns
Notes to Tables 6–88 through 6–90:
(1)
(2)
(3)
(4)
The minimum input clock frequency to the PFD (fIN/N) must be at least 3 MHz for Stratix device enhanced PLLs.
See “Maximum Input & Output Clock Rates” on page 6–54.
tFCOMP can also equal 50% of the input clock period multiplied by the pre-scale divider n (whichever is less).
This parameter is timing analyzed by the Quartus II software because the scanclk and scandata ports can be
driven by the logic array.
(5) Actual jitter performance may vary based on the system configuration.
(6) Total required time to reconfigure and lock is equal to tDLOCK + tCONFIG. If only post-scale counters and delays are
changed, then tDLOCK is equal to 0.
(7) The VCO range is limited to 500 to 800 MHz when the spread spectrum feature is selected.
(8) Lock time is a function of PLL configuration and may be significantly faster depending on bandwidth settings or
feedback counter change increment.
(9) Exact, user-controllable value depends on the PLL settings.
(10) The LOCK circuit on Stratix PLLs does not work for industrial devices below -20C unless the PFD frequency > 200
MHz. See the Stratix FPGA Errata Sheet for more information on the PLL.
6–66
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
DC & Switching Characteristics
Table 6–91 describes the Stratix GX device fast PLL specifications.
Table 6–91. Fast PLL Specifications for -5 & -6 Speed Grade Devices
Symbol
Parameter
Min
Max
Unit
CLKIN frequency (for m = 1) (1)
300
717
MHz
CLKIN frequency (for m = 2 to 19)
300/
m
1,000/m
MHz
CLKIN frequency (for m = 20 to 32)
10
1,000/m
MHz
fOUT
Output frequency for internal global or
regional clock (2)
9.4
420
MHz
fOUT_EXT
Output frequency for external clock
9.375
717
MHz
fVCO
VCO operating frequency
300
1,000
MHz
tINDUTY
CLKIN duty cycle
40
60
%
±200
ps
55
%
±80
ps
±100 ps for >200-MHz outclk
±20 mUI for <200-MHz outclk
ps or
mUI
fIN
tINJITTER
Period jitter for CLKIN pin
tDUTY
Duty cycle for DFFIO 1× CLKOUT pin (3)
tJITTER
Period jitter for DIFFIO clock out (3)
45
Period jitter for internal global or
regional clock
tLOCK
Time required for PLL to acquire lock
10
100
μs
m
Multiplication factors for m counter (3)
1
32
Integer
l0, l1, g0
Multiplication factors for l0, l1, and g0
counter (4), (5)
1
32
Integer
tARESET
Minimum pulse width on areset
signal
10
ns
Table 6–92. Fast PLL Specifications for -7 & -8 Speed Grades (Part 1 of 2)
Symbol
fIN
Min
Max
Unit
CLKIN frequency (for m = 1) (1),
Parameter
300
640
MHz
CLKIN frequency (for m = 2 to 19)
300/
m
700/m
MHz
CLKIN frequency (for m = 20 to 32)
10
700/m
MHz
9.375
420
MHz
Output frequency for external clock
9.4
500
MHz
fVCO
VCO operating frequency
300
700
MHz
tINDUTY
CLKIN duty cycle
40
60
%
tINJITTER
Period jitter for CLKIN pin
±200
ps
fOUT
Output frequency for internal global or
regional clock (2)
fOUT_EXT
Altera Corporation
June 2006
6–67
Stratix GX Device Handbook, Volume 1
DLL Jitter
Table 6–92. Fast PLL Specifications for -7 & -8 Speed Grades (Part 2 of 2)
Symbol
Parameter
Min
Max
Unit
tDUTY
Duty cycle for DFFIO 1× CLKOUT pin (3)
45
55
%
tJITTER
Period jitter for DIFFIO clock out (3)
±80
ps
±100 ps for >200 MHz outclk
±20 mUI for <200 MHz outclk
ps or
mUI
Period jitter for internal global or
regional clock
tLOCK
Time required for PLL to acquire lock
10
100
μs
m
Multiplication factors for m counter (4)
1
32
Integer
l0, l1, g0
Multiplication factors for l0, l1, and g0
counter (4), (5)
1
32
Integer
tARESET
Minimum pulse width on areset
signal
10
ns
Notes to Tables 6–91 & 6–92:
(1)
(2)
(3)
(4)
(5)
See “Maximum Input & Output Clock Rates” on page 6–54.
When using the SERDES, high-speed differential I/O mode supports a maximum output frequency of 210 MHz
to the global or regional clocks (that is, the maximum data rate 840 Mbps divided by the smallest SERDES J factor
of 4).
This parameter is for high-speed differential I/O mode only.
These counters have a maximum of 32 if programmed for 50/50 duty cycle. Otherwise, they have a maximum
of 16.
High-speed differential I/O mode supports W = 1 to 16 and J = 4, 7, 8, or 10.
DLL Jitter
Table 6–93 reports the jitter for the DLL in the DQS phase-shift reference
circuit.
Table 6–93. DLL Jitter for DQS Phase Shift Reference Circuit
Frequency (MHz)
DLL Jitter (ps)
197 to 200
± 100
160 to 196
± 300
100 to 159
± 500
6–68
Stratix GX Device Handbook, Volume 1
Altera Corporation
June 2006
7. Reference & Ordering
Information
SGX51007-1.0
Software
Stratix® GX devices are supported by the Altera® Quartus® II design
software, which provides a comprehensive environment for system-on-aprogrammable-chip (SOPC) design. The Quartus II software includes
hardware description language and schematic design entry, compilation
and logic synthesis, full simulation and advanced timing analysis,
SignalTap® logic analysis, and device configuration. See the Design
Software Selector Guide for more details on the Quartus II software
features.
The Quartus II software supports the Windows 2000/NT/98, Sun Solaris,
Linux Red Hat v6.2 and HP-UX operating systems. It also supports
seamless integration with industry-leading EDA tools through the
NativeLink® interface.
Device Pin-Outs
Device pin-outs for Stratix GX devices will be released on the Altera web
site (www.altera.com).
Ordering
Information
Figure 7–1 describes the ordering codes for Stratix GX devices.
Figure 7–1. Stratix GX Device Packaging Ordering Information
EP1SGX
40
G
F
1020
C
7
N
Family Signature
Optional Suffix
Indicates specific device options or
shipment method.
N: Lead free
ES: Engineering sample
EP1SGX: Stratix GX
Device Type
10
25
40
Speed Grade
5, 6, or 7, with 5 being the fastest
Number of
Transceiver
Channels
C:
D:
F:
G:
Operating Temperature
4
8
16
20
Package Type
F: FineLine BGA
Altera Corporation
February 2005
C: Commercial temperature (tj = 0˚ C to 85˚ C )
I:
Industrial temperature (tj = -40˚ C to 100˚ C )
Pin Count
Number of pins for a particular FineLine BGA package
7–1
Ordering Information
7–2
Stratix GX Device Handbook, Volume 1
Altera Corporation
February 2005