TOSHIBA TLP285-4

TLP285-4
TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRANSISTOR
TLP285-4
Programmable Controllers
Power Supplies
Hybrid ICs
Unit in mm
TLP 285 -4
The Toshiba TLP285-4 consists of photo transistor, optically coupled to a
gallium arsenide infrared emitting diode. TLP285-4 is housed in the SOP16
package, very small and thin coupler.
Since TLP285-4 are guaranteed wide operating temperature (Ta=-55 to 110
˚C) and high isolation voltage (3750Vrms), it’s suitable for high-density
surface mounting applications such as programmable controllers and hybrid
ICs.
z Collector-Emitter Voltage
: 80 V (min)
z Current Transfer Ratio
Rank GB
: 50% (min)
: 100% (min)
z Isolation Voltage
: 3750 Vrms (min)
z Guaranteed performance over -55 to 110 ˚C
z UL Recognized
cUL Recognized
z BSI (under application)
: UL1577 , File No. E67349
: CSA Component Acceptance Service No.5A
: BS EN 60065: 2002,
: BS EN 60950-1: 2006
Pin Configuration
z Option (V4)
VDE approved
: EN60747-5-2
Maximum operating insulation voltage : 707 Vpk
Highest permissible over voltage
: 6000 Vpk
( Note ) When a EN60747-5-2 approved type is needed,
please designate the “Option(V4)”
Construction Mechanical Rating
Creepage Distance
Clearance
Insulation Thickness
TOSHIBA
11-10F1
Weight: 0.19 g (typ.)
5.0 mm (min)
5.0 mm (min)
0.4 mm (min)
TLP285-4
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
1,3,5,7
:ANODE
2,4,6,8
:CATHODE
9,11,13,15 :EMITTER
10,12,14,16 :COLLECTOR
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TLP285-4
Current Transfer Ratio
TYPE
TLP285-4
Classification
(Note1)
Current Transfer Ratio (%)
(IC / IF)
Marking of Classification
IF = 5 mA, VCE = 5 V, Ta = 25℃
Min
Max
Blank
50
600
Blank , GB
Rank GB
100
600
GB
Note1: ex. Rank GB: TLP285 (GB)
Application type name for certification test, please use standard product type name, i.e.
TLP285−4 (GB): TLP285-4
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TLP285-4
Absolute Maximum Ratings (Ta = 25℃)
SYMBOL
RATING
UNIT
Forward Current
IF(RMS)
50
mA
Forward Current Derating
∆IF /°C
−0.67 (Ta≥50°C)
mA /°C
IFP
1
A
Reverse Voltage
VR
5
V
Junction Temperature
Tj
125
°C
Collector-Emitter Voltage
VCEO
80
V
Emitter-Collector Voltage
VECO
7
V
IC
50
mA
PC
100
mW
∆PC /°C
−1.0
mW /°C
Junction Temperature
Tj
125
°C
Operating Temperature Range
Topr
−55 to 110
°C
Storage Temperature Range
Tstg
−55 to 125
°C
Lead Soldering Temperature
Tsol
260 (10s)
°C
PT
170
mW
∆PT /°C
−1.7
mW /°C
BVS
3750
Vrms
DETECTOR
LED
CHARACTERISTIC
Pulse Forward Current
(Note2)
Collector Current
Collector Power Dissipation
(1 Circuit)
Collector Power Dissipation
Derating(Ta≥25°C)
(1 Circuit)
Total Package Power Dissipation
(1 Circuit)
Total Package Power Dissipation
(1 Circuit)
Derating (Ta≥25°C)
Isolation Voltage
(Note3)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note2: Pulse width ≤ 100μs, frequency 100Hz
Note3: AC, 1 minute, R.H.≤60%, Device considered a two terminal device : LED side pins shorted together and
DETECTOR side pins shorted together.
Individual Electrical Characteristics (Ta = 25℃)
DETECTOR
LED
CHARACTERISTIC
SYMBOL
TEST CONDITION
MIN
TYP.
MAX
UNIT
Forward Voltage
VF
IF = 10 mA
1.0
1.15
1.3
V
Reverse Current
IR
VR = 5 V
—
—
10
μA
Capacitance
CT
V = 0, f = 1 MHz
—
30
—
pF
IC = 0.5 mA
80
—
—
V
IE = 0.1 mA
7
—
—
V
—
0.01
(2)
0.1
(10)
μA
—
2
(4)
50
(50)
μA
—
10
—
pF
Collector-Emitter Breakdown Voltage
V(BR) CEO
Emitter-Collector Breakdown Voltage
V(BR) ECO
Collector Dark Current
(Note5)
Capacitance
(Collector to Emitter)
ICEO
CCE
VCE = 48 V,
Ambient Light Below
(100 ℓx)
VCE = 48 V, Ta = 85°C
Ambient Light Below
(100 ℓx)
(Note4)
(Note4)
V = 0, f = 1 MHz
Note.4 : Irradiation to marking side using standard light bulb.
Note 5: Because of the construction,leak current might be increased by ambient light.
Please use photocoupler with less ambient light.
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TLP285-4
Coupled Electrical Characteristics (Ta = 25℃)
CHARACTERISTIC
Current Transfer Ratio
Saturated CTR
Collector-Emitter Saturation Voltage
SYMBOL
IC / IF
IC / IF (sat)
VCE (sat)
TEST CONDITION
MIN
TYP.
MAX
50
—
600
100
—
600
—
60
—
30
—
—
IC = 2.4 mA, IF = 8 mA
—
—
0.4
IC = 0.2 mA, IF = 1 mA
—
0.2
—
—
—
0.4
—
—
10
μA
MIN
TYP.
MAX
UNIT
—
0.8
—
pF
—
Ω
IF = 5 mA, VCE = 5 V
Rank GB
IF = 1 mA, VCE = 0.4 V
Rank GB
Rank GB
Off-State Collector Current
IC (off)
VF = 0.7 V, VCE = 48 V
UNIT
%
%
V
Isolation Characteristics (Ta = 25℃)
CHARACTERISTIC
SYMBOL
Capacitance
(Input to Output)
CS
Isolation Resistance
RS
TEST CONDITION
VS = 0 V, f = 1 MHz
VS = 500 V, R.H.≤60%
1×10
AC , 1 minute
Isolation Voltage
BVS
12
10
14
3750
—
—
AC , 1 second, in OIL
—
10000
—
DC , 1 minute, in OIL
—
10000
—
Vdc
MIN
TYP.
MAX
UNIT
—
2
—
—
3
—
—
3
—
—
3
—
—
2
—
—
25
—
—
40
—
Vrms
Switching Characteristics (Ta = 25℃)
CHARACTERISTIC
SYMBOL
Rise Time
tr
Fall Time
tf
Turn-On Time
ton
Turn-Off Time
toff
Turn-On Time
tON
Storage Time
ts
Turn-Off Time
tOFF
TEST CONDITION
VCC = 10 V, IC = 2 mA
RL = 100Ω
RL = 1.9 kΩ
VCC = 5 V, IF = 16 mA
(Fig.1)
μs
μs
(Fig.1) Switchin Time Test Circuit
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TLP285-4
I F - Ta
P C - Ta
I F (mA)
100
200
180
80
Allowable collector power
Dissipation PC (mW)
160
Allowable forward current
60
120
100
)
40
140
20
80
60
40
20
0
-20
0
20
40
60
Ambient temperature
80
Ta
100
0
120
-20
0
20
Ta
100
120
(˚C)
100
パルス幅≦100μs
(mA)
Ta=25˚C
IF
300
Forward current
IFP
Pulse forward current
(mA)
80
IF-VF
1000
500
100
50
30
10
100˚C
75˚C
50˚C
25˚C
0˚C
-25˚C
-50˚C
1
0.1
10
10-1
10-2
10-3
Duty cycle ratio
100
0.6
DR
0.8
1
1.2
Forward voltage
∆ V F / ∆ Ta - I F
1.4
VF
1.6
(V)
IFP – VFP
1000
(mA)
-3.2
-2.8
IFP
-2.4
-2
Pulse forward current
Forward voltage temperature coefficient
ΔVF /ΔTa (mV/℃)
60
Ambient temperature
(˚C)
IFP-DR
3000
40
-1.6
-1.2
-0.8
100
10
Pulse width≦10μs
Repetitive
Frequency=100Hz
Ta=25℃
1
0.6
-0.4
0.1
0.5
1
Forward current
5
IF
10
1
1.4
1.8
2.2
2.6
3
50
(mA)
Pulse forward voltage
VFP
(V)
*The above graphs show typical characteristic.
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TLP285-4
IC-VCE
IC-VCE
30
40
50
30
30
20
15
20
10
10
IF=5mA
0
0
5
Collector-emitter voltage
Ta=25˚C
(mA)
Ta=25˚C
25
20
Collector current
Collector current
IC
(mA)
PC (max)
IC
50
15
20
15
10
10
5
5
I F= 2 m A
0
0
10
VCE
50
30
0.5
Collector-emitter voltage
(V)
IC-IF
(V)
101
Collector dark current ID (ICEO) (μA)
(mA)
IC
VCE
I C E O - Ta
100
Collector current
1
10
SAMPLE A
SAMPLE B
1
VCE=10V
VCE=5V
VCE=0.4V
0.1
0.1
1
Forward current
10
IF
100
10-1
VCE=48V
10-2
24V
10V
5V
10-3
10-4
0
100
(mA)
20
40
60
Ambient temperature
80
Ta
100
120
(℃)
IC/IF -IF
1000
VCE=10V
Current transfer ratio
IC / IF (%)
VCE=5V
VCE=0.4V
SAMPLE A
100
SAMPLE B
10
0.1
1
Forward current
10
IF
100
(mA)
*The above graphs show typical characteristic.
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TLP285-4
V C E ( s a t ) - Ta
I C - Ta
100
0.28
25
(mA)
10
0.2
Collector current IC
collector-Emitter saturation
Voltage VCE(sat) (V)
0.24
0.16
0.12
0.08
IF=8mA, IC=2.4mA
0.04
IF=1mA, IC=0.2mA
0
20
40
60
Ambient temperature
1
1
IF=0.5mA
0.1
0.01
80 100 120
Ta
5
VCE=5V
0
-40 -20
10
-40
(℃)
-20
0
20
40
60
Ambient temperature
Switching time - RL
80
Ta
100
120
(℃)
S w i t c h i n g t i m e - Ta
100
1000
Ta=25˚C
IF=16mA
tOFF
VCC=5V
ts
10
(μs)
100
ts
Switching time
Switching time
(μs)
tOFF
10
tON
1
IF=16mA
VCC=5V
RL=1.9kΩ
tON
0.1
1
1
10
Load resistance
-60
100
-40
-20
0
20
40
Ambient temperature
RL (kΩ)
60
Ta
80
100
120
(℃)
*The above graphs show typical characteristic.
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TLP285-4
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
·Temperature profile example of lead (Pb) solder
(°C)
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
Package surface temperature
240
210
160
140
less than 30s
60 to 120s
Time
(s)
·Temperature profile example of using lead (Pb)-free solder
(°C)
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
Package surface temperature
260
230
190
180
60 to 120s
30 to 50s
Time
(s)
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
・Please preheat it at 150°C between 60 and 120 seconds.
・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
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TLP285-4
2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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TLP285-4
Option:Specification for Embossed-Tape Packing
(TP) for Mini-Flat Coupler
1. Applicable Package
Package Name
Product Type
SOP16
Mini-Flat Coupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
（Example）
ＴＬＰ２８５－４（ＧＢ－ＴＰ，Ｆ
[[G]]/RoHS COMPATIBLE (Note6)
Tape type
CTR rank
Device name
3. Tape Dimensions
3.1 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Tape feed
TLP285－4
Figure１
Device Orientation
3.2 Tape Packing Quantity：2500 devices per reel
3.3 Empty Device Recesses are as Shown in Table 1.
Table１
Occurrences of 2 or more
successive empty device
recesses
Single empty device
recesses
Empty Device Recesses
Standard
Remarks
0
Within any given 40-mm section of
tape, not including leader and trailer
6 device (max) per reel
Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two
empty turns only for a cover tape.
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TLP285-4
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2.
2.0 ± 0.1
+0.1
φ1.5 −0
F
G
K0
16.0 ± 0.3
B
D
E
0.3 ± 0.05
A
φ1.5 ± 0.1
2.4 ± 0.2
Figure2 Tape Forms
Table2 Tape Dimensions
Unit: mm
Unless otherwise specified: ±0.1
Symbol
Dimension
Remark
A
7.5
―
B
10.5
―
D
7.5
Center line of indented square hole and sprocket hole
E
1.75
F
12.0
G
4.0
K0
2.2
Distance between tape edge and hole center
+0.1
Cumulative error -0.3 (max) per 10 feed holes
Cumulative error +0.1 (max) per 10 feed holes
-0.3
Internal space
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TLP285-4
3.6
Reel
(1)
(2)
Material: Plastic
Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.
Table 3 Reel Dimensions
Symbol
Dimension
A
φ330 ± 2
B
φ80 ± 1
C
φ13 ± 0.5
E
2.0 ± 0.5
U
4.0 ± 0.5
W1
17.5 ± 0.5
W2
21.5 ± 1.0
A
C
U
B
Unit: mm
E
W1
W2
Figure 3 Reel Forms
4.
Packing
Either one reel or five reels of photocouplers are packed in a shipping carton.
5.
Label Indication
The carton bears a label indicating the product number, the symbol representing classification of
standard, the quantity, the lot number and the Toshiba company name.
6.
Ordering Method
When placing an order, please specify the product number, the CTR rank, the tape type and the quantity
as shown in the following example.
（Example）
TLP285-4(GB-TP,F) 2500 Pcs
Quantity (must be a multiple of 2500)
[[G]]/RoHS COMPATIBLE (Note6)
Tape type
CTR rank
Device name
Note6 : Please contact your TOSHIBA sales representative for details as to environmental matters such as the
RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003
on the restriction of the use of certain hazardous substances in electrical and electronics equipment.
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TLP285-4
TOSHIBA Photocoupler
Option:(V4)
Attachment
: Specifications for EN60747-5-2 option: (V4)
Types
: TLP285-4
Type designations for “option: (V4)”, which are tested under EN60747 requirements.
Ex.: TLP285-4 (V4GB-TP,F
V4 : EN60747 option
GB : CTR rank type
TP : Standard tape & reel type
F : [[G]]/RoHS COMPATIBLE (Note6)
Note: Use TOSHIBA standard type number for safety standard application.
Ex.: TLP285-4 (V4GB-TP,F → TLP285-4
EN60747 Isolation Characteristics
Description
Symbol
Rating
Unit
Application classification
I-IV
I-III
for rated mains voltage ≤ 150Vrms
for rated mains voltage ≤ 300Vrms
Climatic classification
―
55 / 110 / 21
―
2
―
VIORM
707
Vpk
Input to output test voltage, Method A
Vpr=1.5 × VIORM, type and sample test
tp=10s, partial discharge<5pC
Vpr
1060
Vpk
Input to output test voltage, Method B
Vpr=1.875 × VIORM, 100% production test
tp=1s, partial discharge<5pC
Vpr
1325
Vpk
Highest permissible overvoltage
(transient overvoltage, tpr=60s）
VTR
6000
Vpk
Safety limiting values (max. permissible ratings in case of fault,
also refer to thermal derating curve)
current (input current IF, Psi=0)
power (output or total power dissipation)
temperature
Isi
Psi
Tsi
250
400
150
mA
mW
℃
Insulation resistance
Rsi
≥10
Pollution degree
Maximum operating insulation voltage
VIO=500V, Ta=Tsi
13
9
Ω
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TLP285-4
Insulation Related Specifications
Minimum creepage distance
Cr
5.0mm
Minimum clearance
Cl
5.0mm
Minimum insulation thickness
ti
0.4mm
CTl
175
Comparative tracking index
1. If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value.
(e.g. at a standard distance between soldering eye centers of 3.5mm).
If this is not permissible, the user shall take suitable measures.
2. This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuit.
VDE test sign：Marking on product
for EN60747
Ｖ
：Marking on packing
for EN60747
VDE
Marking Example：TLP285-4(F)
Lot No.
TLP285－4
V
1pin indication
Type name
CTR Rank Marking
Mark for option (V4))
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TLP285-4
Figure
1 Partial discharge measurement procedure according to EN60747
Destructive test for qualification and sampling tests.
Method A
(for type and sampling tests,
destructive tests)
t1, t2
t3, t4
tp(Measuring time for
partial discharge)
tb
tini
Figure
VINITIAL(6kV)
V
Vpr(1060V)
= 1 to 10 s
=1s
VIORM(707V)
= 10 s
= 12 s
= 60 s
0
t1
tini
t3
tP
t2
tb
2 Partial discharge measurement procedure according to EN60747
Non-destructive test for100% inspection.
Method B
Vpr(1325V )
V
(for sample test,nondestructive test)
t3, t4
tp(Measuring time for
partial discharge)
tb
VIORM(707V )
= 0.1 s
=1s
= 1.2 s
Isi
(mA)
t
tP
t3
Figure
t
t4
tb
t4
3 Dependency of maximum safety ratings on ambient temperature
500
500
400
400
300
300
200
100
0
→
Isi ←
0
25
50
Psi
(mW)
200
Psi
100
75
100
125
150
0
175
Ta (°C)
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TLP285-4
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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2009-05-27