TCR2EN series
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
TCR2EN series
200 mA CMOS Low Drop-Out Regulator in ultra small package
The TCR2EN series are CMOS general-purpose single-output
voltage regulators with an on/off control input, featuring low dropout
voltage, low quiescent bias current and fast load transient response.
These voltage regulators are available in fixed output voltages
between 1.0 V and 3.6 V and capable of driving up to 200 mA. They
feature overcurrent protection and an Auto-discharge function.
The TCR2EN series is offered in the ultra small plastic mold
package SDFN4 ( 0.8 mm x 0.8 mm x 0.38 mm). It has a low
dropout voltage of 160 mV ( 2.5 V output, IOUT = 150 mA) with low
output noise voltage of 35 μδVrms (2.5 V output) and a load transient
response of only ⊿VOUT = ±55 mV ( IOUT = 1 mA⇔150 mA, COUT
=1.0 μF).
As small ceramic input and output capacitors can be used with the
TCR2EN series, these devices are ideal for portable applications
that require high-density board assembly such as cellular phones.
BOTTOM VIEW ILLUSTRATION
SDFN4
Weight : 0.6 mg ( typ.)
Features
•
Low Drop-Out voltage
VIN-VOUT = 160 mV (typ.) at 2.5 V-output, IOUT = 150 mA
VIN-VOUT = 210 mV (typ.) at 1.8 V-output, IOUT = 150 mA
VIN-VOUT = 360 mV (typ.) at 1.2 V-output, IOUT = 150 mA
VIN-VOUT = 490 mV (typ.) at 1.0 V-output, IOUT = 150 mA
•
Low output noise voltage
VNO = 35 μVrms (typ.) at 2.5 V-output, IOUT = 10 mA, 10 Hz < f < 100 kHz
VNO = 30 μVrms (typ.) at 1.8 V-output, IOUT = 10 mA, 10 Hz < f < 100 kHz
VNO = 23 μVrms (typ.) at 1.2 V-output, IOUT = 10 mA, 10 Hz < f < 100 kHz
VNO = 18 μVrms (typ.) at 1.0 V-output, IOUT = 10 mA, 10 Hz < f < 100 kHz
•
Fast load transient response (⊿VOUT = ±55 mV (typ.) at IOUT = 1 ⇔ 150 mA, COUT =1.0 μF )
•
Low quiescent bias current ( IB = 35 μA (typ.) at IOUT = 0 mA )
•
High ripple rejection ( R.R = 73 dB (typ.) at 2.5V-output, IOUT = 10 mA, f =1kHz )
•
Wide range Output Voltage line up ( VOUT = 1.0 to 3.6 V )
•
High VOUT accuracy ±1.0%
•
Overcurrent protection
•
Auto-discharge
•
Pull down connection between CONTROL and GND
( 1.8V <= VOUT )
•
Ceramic capacitors can be used ( CIN = 0.1μF, COUT =1.0 μF )
•
Ultra Small package SDFN4 (0.8 mm x 0.8 mm x 0.38 mm )
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2012-05-23
TCR2EN series
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Input voltage
VIN
5.5
V
Control voltage
VCT
-0.3 to 5.5
V
Output voltage
VOUT
-0.3 to VIN + 0.3
V
Output current
IOUT
200
mA
Power dissipation
PD
300
Operation temperature range
Topr
−40 to 85
°C
Tj
150
°C
Tstg
−55 to 150
°C
Junction temperature
Storage temperature range
(Note1)
mW
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note1:
Rating at mounting on a board
Glass epoxy(FR4) board dimension: 40mm x 40mm x 1.8mm, both sides of board
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole hall: diameter 0.5mm x 24
Pin Assignment (top view)
VIN
CONTROL
4
3
*
1
2
VOUT
GND
*Center electrode should be connected to GND or Open
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2012-05-23
TCR2EN series
List of Products Number, Output voltage and Marking
Product No.
Output voltage(V)
(typ.)
Marking
Product No.
Output voltage(V)
(typ.)
Marking
TCR2EN10
1.0
NJ
TCR2EN23*
2.3
NK
TCR2EN105*
1.05
NU
TCR2EN24*
2.4
NL
TCR2EN11
1.1
N2
TCR2EN25
2.5
NM
TCR2EN115*
1.15
NC
TCR2EN26*
2.6
NN
TCR2EN12
1.2
N3
TCR2EN27
2.7
NO
TCR2EN125
1.25
NQ
TCR2EN28
2.8
NP
TCR2EN13
1.3
N4
TCR2EN285*
2.85
N7
TCR2EN14*
1.4
N5
TCR2EN29
2.9
NR
TCR2EN15
1.5
NA
TCR2EN295*
2.95
N6
TCR2EN16*
1.6
NB
TCR2EN30
3.0
NS
TCR2EN17*
1.7
ND
TCR2EN31
3.1
NT
TCR2EN18
1.8
NE
TCR2EN32*
3.2
NV
TCR2EN19*
1.9
NF
TCR2EN33
3.3
NW
TCR2EN20*
2.0
NG
TCR2EN34*
3.4
NX
TCR2EN21
2.1
NH
TCR2EN35*
3.5
NY
TCR2EN22*
2.2
NI
TCR2EN36
3.6
NZ
* Please contact your local Toshiba representative if you are interested in products with * sign
Marking
Example: TCR2EN33 (3.3 V output)
NW
Lot. No.
INDEX
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2012-05-23
TCR2EN series
Electrical Characteristics
(Unless otherwise specified,
VIN = VOUT + 1 V, IOUT = 50 mA, CIN = 0.1 μF, COUT = 1.0 μF, Tj = 25°C)
Characteristics
Output voltage accuracy
Input voltage
Symbol
VOUT
VIN
Test Condition
Min
Typ.
Max
Unit
VOUT <1.8 V
-18
⎯
+18
mV
1.8V <
= VOUT
-1.0
⎯
+1.0
%
IOUT = 1 mA
1.5
⎯
5.5
V
VOUT + 0.5 V <
= VIN <
= 5.5 V,
IOUT = 1 mA
⎯
1
15
mV
IOUT = 50 mA (Note2)
Line regulation
Reg･line
Load regulation
Reg･load 1 mA <
= IOUT <
= 150 mA
⎯
15
30
mV
IOUT = 0 mA
⎯
35
60
μA
VCT = 0 V
⎯
0.1
1.0
μA
⎯
160
210
mV
⎯
75
⎯
ppm/°C
Quiescent current
Stand-by current
Drop-out voltage
Temperature coefficient
IB
IB (OFF)
VIN-VOUT IOUT = 150 mA (Note 3)
TCVO
−40°C <
= Topr <
= 85°C
Output noise voltage
VNO
VIN = VOUT + 1 V, IOUT = 10 mA,
10 Hz <
=f<
= 100 kHz, Ta = 25°C (Note 3)
⎯
35
⎯
μVrms
Ripple rejection ratio
R.R.
VIN = VOUT + 1 V, IOUT = 10 mA,
f = 1 kHz, VRipple = 500 mVp-p,
Ta = 25°C (Note 3)
⎯
73
⎯
dB
Load transient response
⊿VOUT
IOUT = 1⇔150mA, COUT = 1.0 μF
⎯
±55
⎯
mV
Control voltage (ON)
VCT (ON)
⎯
1.0
⎯
5.5
V
Control voltage (OFF)
VCT (OFF)
⎯
0
⎯
0.4
V
Note 2:
Stable state with fixed IOUT condition
Note 3:
The 2.5 V output product
Drop-out voltage for different output voltages
(IOUT = 150 mA, CIN = 0.1 μF, COUT = 1.0 μF, Tj = 25°C)
Output voltages
Min
Typ.
Max
1.0 V, 1.05 V
⎯
490
750
1.1 V, 1.15 V
⎯
420
650
1.2 V, 1.25 V
⎯
360
550
1.3 V
⎯
330
450
⎯
290
400
1.5 V <
= VOUT < 1.8 V
⎯
270
370
1.8 V <
= VOUT < 2.5 V
⎯
210
290
2.5 V <
= VOUT < 3.0 V
⎯
160
210
3.0 V <
= VOUT <
= 3.6 V
⎯
130
180
1.4 V
Symbol
VIN-VOUT
4
Unit
mV
2012-05-23
TCR2EN series
Application Note
1.
Recommended Application Circuit
CONTROL
GND
VOUT
VIN
1.0 μF
0.1 μF
CONTROL
voltage
Output
voltage
HIGH
ON
LOW
OFF
OPEN
OFF
The figure above shows the recommended configuration for using a Low-Dropout regulator. Insert a capacitor
at VOUT and VIN pins for stable input/output operation. (Ceramic capacitors can be used).
2. Power Dissipation
Power dissipation is measured on the board condition shown below.
[The Board Condition]
Board material: Glass epoxy(FR4)
Board dimension: 40mm x 40mm (both sides of board)，t=1.8mm
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole: diameter 0.5mm x 24
Power dissipation PD (mW)
400
300
200
100
0
−40
0
40
Ambient temperature Ta
5
80
120
(℃)
2012-05-23
TCR2EN series
Usage Considerations
●
Output Capacitors
Ceramic capacitors can be used for these devices. However, because of the type of the capacitors, there might be
unexpected thermal features. Please consider application condition for selecting capacitors. And Toshiba
recommend the ESR of ceramic capacitor is under 10 Ω.
●
Mounting
The long distance between IC and output capacitor might affect phase assurance by impedance in wire and inductor.
For stable power supply, output capacitor need to mount near IC as much as possible. Also VIN and GND pattern
need to be large and make the wire impedance small as possible.
●
Permissible Loss
Please have enough design patterns for expected maximum permissible loss. And under consideration of
surrounding temperature, input voltage, and output current etc, we recommend proper dissipation ratings for
maximum permissible loss; in general maximum dissipation rating is 70 to 80 percent.
●
Overcurrent Protection Circuit
Overcurrent protection circuit is designed in these products, but this does not assure for the suppression of uprising
device operation. If output pins and GND pins are shorted out, these products might be break down.
In use of these products, please read through and understand dissipation idea for absolute maximum ratings from
the above mention or our ‘Semiconductor Reliability Handbook’. Then use these products under absolute maximum
ratings in any condition. Furthermore, Toshiba recommend inserting failsafe system into the design.
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2012-05-23
TCR2EN series
Representative Typical Characteristics
1) Output Voltage vs. Input Voltage
VOUT=1.8V
VOUT (V)
CIN = 0.1 μF, COUT = 1 μF
IOUT = 1mA
Output voltage
Output voltage
VOUT (V)
VOUT=1.2V
IOUT = 50mA
IOUT = 150mA
Input voltage
VIN (V)
CIN = 0.1 μF, COUT = 1 μF
IOUT = 1mA
IOUT = 50mA
IOUT = 150mA
Input voltage
VOUT=2.5V
VOUT=3.0V
VOUT (V)
CIN = 0.1 μF, COUT = 1 μF
IOUT = 1mA
Output voltage
Output voltage
VOUT (V)
CIN = 0.1 μF, COUT = 1 μF
IOUT = 50mA
IOUT = 150mA
Input voltage
VIN (V)
VIN (V)
IOUT = 1mA
IOUT = 50mA
IOUT = 150mA
Input voltage
VIN (V)
2) Output Voltage vs. Output Current
VOUT=1.8V
VIN = 2.8 V,
CIN = 0.1 μF, COUT = 1 μF
CIN = 0.1 μF, COUT = 1 μF
Output voltage
VOUT (V)
VIN = 2.2 V,
Output voltage
VOUT (V)
VOUT=1.2V
Output current
IOUT
(mA)
Output current
7
IOUT
(mA)
2012-05-23
VOUT=3.0V
VIN = 3.5 V,
VIN = 4.0 V,
CIN = 0.1 μF, COUT = 1 μF
CIN = 0.1 μF, COUT = 1 μF
Output voltage
VOUT (V)
VOUT=2.5V
Output voltage
VOUT (V)
TCR2EN series
Output current
IOUT
Output current
(mA)
IOUT
(mA)
3) Output Voltage vs. Ambient Temperature
VOUT=1.8V
VOUT=1.2V
VIN = 2.8 V,
VOUT (V)
CIN = 0.1 μF, COUT = 1 μF
Ambient temperature
Ta
Ambient temperature
(℃)
VOUT=2.5V
Ta
(℃)
VOUT=3.0V
VIN = 4.0 V,
VIN = 3.5 V,
VOUT (V)
CIN = 0.1 μF, COUT = 1 μF
IOUT = 50mA
CIN = 0.1 μF, COUT = 1 μF
IOUT = 50mA
Output voltage
Output voltage
VOUT (V)
CIN = 0.1 μF, COUT = 1 μF
IOUT = 50mA
Output voltage
IOUT = 50mA
Output voltage
VOUT (V)
VIN = 2.2 V,
Ambient temperature
Ta
Ambient temperature
(℃)
8
Ta
(℃)
2012-05-23
TCR2EN series
4) Dropout Voltage vs. Output Current
VOUT=1.8V
Dropout voltage VIN - VOUT (mV)
Dropout voltage VIN - VOUT (mV)
VOUT=1.2V
CIN = 0.1 μF, COUT = 1 μF
Output current
IOUT
(mA)
Output current
CIN = 0.1 μF, COUT = 1 μF
IOUT
IOUT
(mA)
VOUT=3.0V
Dropout voltage VIN - VOUT (mV)
Dropout voltage VIN - VOUT (mV)
VOUT=2.5V
Output current
CIN = 0.1 μF, COUT = 1 μF
(mA)
CIN = 0.1 μF, COUT = 1 μF
Output current
IOUT
(mA)
5) Quiescent Current vs. Input Voltage
VOUT=1.8V
IB (μA)
CIN = 0.1 μF, COUT = 1 μF
CIN = 0.1 μF, COUT = 1 μF
IOUT = 0mA
Quiescent current
IOUT = 0mA
Quiescent current
IB (μA)
VOUT=1.2V
Input voltage
VIN (V)
Input voltage
9
VIN (V)
2012-05-23
TCR2EN series
VOUT=2.5V
VOUT=3.0V
IB (μA)
CIN = 0.1 μF, COUT = 1 μF
IOUT = 0mA
Quiescent current
Quiescent current
IB (μA)
CIN = 0.1 μF, COUT = 1 μF
IOUT = 0mA
Input voltage
VIN (V)
Input voltage
VIN (V)
6) Quiescent Current vs. Ambient Temperature
VOUT=1.8V
IB (μA)
VIN = 2.2 V
CIN = 0.1 μF, COUT = 1 μF
Ambient temperature
Ta
CIN = 0.1 μF, COUT = 1 μF
IOUT = 0mA
Ambient temperature
(℃)
Ta
(℃)
VOUT=3.0V
VOUT=2.5V
VIN = 4.0V
IB (μA)
VIN = 3.5 V
CIN = 0.1 μF, COUT = 1 μF
CIN = 0.1 μF, COUT = 1 μF
IOUT = 0mA
Quiescent current
IOUT = 0mA
Quiescent current
IB (μA)
VIN = 2.8V
Quiescent current
IOUT = 0mA
Quiescent current
IB (μA)
VOUT=1.2V
Ambient temperature
Ta
(℃)
Ambient temperature
10
Ta
(℃)
2012-05-23
TCR2EN series
7) Output Voltage vs. Output Current
VOUT=1.8V
VOUT=1.2V
Pulse width = 1 ms
Output voltage
Output voltage
VOUT (V)
VOUT (V)
Pulse width = 1 ms
VIN = 5.5V
VIN = 2.2V
Output current
IOUT
VIN = 5.5V
VIN = 2.8V
Output current
(mA)
(mA)
VOUT=3.0V
VOUT=2.5V
Pulse width = 1 ms
VOUT (V)
VOUT (V)
Pulse width = 1 ms
VIN = 5.5V
Output voltage
Output voltage
IOUT
VIN = 3.5V
Output current
IOUT
VIN = 5.5V
VIN = 4.0V
Output current
(mA)
IOUT
(mA)
8) Ripple Rejection Ratio vs. Frequency
VOUT=3.0V
Ripple rejection
Ripple rejection
(dB)
(dB)
VOUT=1.2V
VIN = 2.2 V ,Vripple = 500 mVp−p
CIN = none, COUT = 1μF
IOUT = 10 mA, Ta = 25°C
Frequency f
VIN = 4.0 V ,Vripple = 500 mVp−p
CIN = none, COUT = 1μF
IOUT = 10 mA, Ta = 25°C
Frequency f
(Hz)
11
(Hz)
2012-05-23
TCR2EN series
9) Control Transient Response
VIN = 2.2 V,
CIN = 0.1 μF, COUT = 1 μF
Control voltage
2.0
VOUT=1.8V
1.0
0
IOUT = 1mA
2.0
Output voltage
Output voltage
Control voltage
VOUT=1.2V
1.0
0
IOUT = 50mA
IOUT = 150mA
2.0
1.0
0
1.0
0
Control voltage
2.0
VIN = 4.0 V,
CIN = 0.1 μF, COUT = 1 μF
1.0
0
0
IOUT = 1mA
3.0
IOUT = 1mA
Output voltage
Control voltage
VIN = 3.5 V,
CIN = 0.1 μF, COUT = 1 μF
3.0
Output voltage
IOUT = 150mA
VOUT=3.0V
1.0
2.0
0
IOUT = 50mA
Time t (25 μs/div)
VOUT=2.5V
1.0
IOUT = 1mA
2.0
Time t (25 μs/div)
2.0
VIN = 2.8 V,
CIN = 0.1 μF, COUT = 1 μF
IOUT = 50mA
IOUT = 150mA
Time t (25 μs/div)
2.0
1.0
IOUT = 50mA
0
IOUT = 150mA
Time t (25 μs/div)
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2012-05-23
TCR2EN series
10) Load Transient Response
VIN = 2.2 V,
CIN = 0.1 μF, COUT = 1 μF
Output current
400
VOUT=1.8V
(IOUT = 1mA ⇔ 150mA)
200
0
Output voltage
1.3
1.2
1.1
200
0
1.9
1.8
1.7
Time t (25 μs/div)
VOUT=2.5V
(IOUT = 1mA ⇔ 150mA)
VOUT=3.0V
(IOUT = 1mA ⇔ 150mA)
VIN = 3.5 V,
CIN = 0.1 μF, COUT = 1 μF
Output current
400
400
VIN = 2.8 V,
CIN = 0.1 μF, COUT = 1 μF
Time t (25 μs/div)
200
0
2.6
Output voltage
Output voltage
Output current
Output voltage
Output current
VOUT=1.2V
(IOUT = 1mA ⇔ 150mA)
2.5
2.4
Time t (25 μs/div)
400
VIN = 4.0 V,
CIN = 0.1 μF, COUT = 1 μF
200
0
3.1
3.0
2.9
Time t (25 μs/div)
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TCR2EN series
Package Dimensions
SDFN4
Unit:mm
0.04 mm (typ.) unevenness exists along the edges of the back electrode to increase shear after soldering.
Weight : 0.6 mg ( typ.)
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2012-05-23
TCR2EN series
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
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TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
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• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
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including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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2012-05-23