PHILIPS BTA204X-800E Three quadrant triacs guaranteed commutation Datasheet

TO
-2
20F
BTA204X series D, E and F
Three quadrant triacs guaranteed commutation
Rev. 5 — 3 November 2011
Product data sheet
1. Product profile
1.1 General description
Passivated guaranteed commutation triacs in a plastic full pack package. These devices
balance the requirements of commutation performance and gate sensitivity. The ‘sensitive
gate’ E series and ‘logic level’ D series are intended for interfacing with low power drivers,
including microcontrollers.
1.2 Features and benefits
 Suitable for interfacing with low power
drivers, including microcontrollers
 Isolated mounting base
1.3 Applications
 Motor control
 High inductive loads
1.4 Quick reference data




VDRM  600 V (BTA204X-600D)
VDRM  600 V (BTA204X-600E)
VDRM  600 V (BTA204X-600F)
VDRM  800 V (BTA204X-800E)




IT(RMS)  4 A
IGT  5 mA (BTA204X-600D)
IGT  10 mA (BTA204X-600E)
IGT  25 mA (BTA204X-600F)
2. Pinning information
Table 1.
Pinning
Pin
Description
Simplified outline
Symbol
1
main terminal 1 (T1)
2
main terminal 2 (T2)
T2
3
gate (G)
sym051
mb
mounting base (isolated)
mb
T1
G
1 2 3
SOT186A (TO-220F)
BTA204X series D, E and F
NXP Semiconductors
Three quadrant triacs guaranteed commutation
3. Ordering information
Table 2.
Ordering information
Type number
Package
BTA204X-600D
Name
Description
Version
TO-220F
plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 3 lead TO-220 ‘full pack’
SOT186A
BTA204X-600E
BTA204X-600F
BTA204X-800E
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VDRM
repetitive peak off-state voltage
Max
Unit
BTA204X-600D
[1]
-
600
V
BTA204X-600E
[1]
-
600
V
BTA204X-600F
[1]
-
600
V
-
800
V
-
4
A
t = 20 ms
-
25
A
t = 16.7 ms
-
27
A
t = 10 ms
-
3.1
A2S
ITM = 6 A; IG = 0.2 A;
dIG/dt = 0.2 A/s
-
100
A/s
-
2
A
BTA204X-800E
IT(RMS)
RMS on-state current
full sine wave; Ths  92 C;
Figure 4 and Figure 5
ITSM
non-repetitive peak on-state current
full sine wave;
Tj = 25 C prior to surge;
Figure 2 and Figure 3
I2t
I2t
dlT/dt
repetitive rate of rise of on-state
current after triggering
IGM
peak gate current
for fusing
PGM
peak gate power
PG(AV)
average gate power
Tstg
Tj
[1]
Min
-
5
W
-
0.5
W
storage temperature
40
+150
C
junction temperature
-
125
C
over any 20 ms period
Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The
rate of rise of current should not exceed 6 A/s.
BTA204X_SER_D_E_F
Product data sheet
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BTA204X series D, E and F
NXP Semiconductors
Three quadrant triacs guaranteed commutation
001aac329
8
81
Ths(max)
(°C)
Ptot
(W)
α=
180
6
92
120
90
60
4
103
30
114
2
α
α
0
125
0
1
2
3
4
5
IT(RMS) (A)
 = conduction angle
Fig 1.
Total power dissipation as a function of RMS on-state current; maximum values
001aac331
30
IT
ITSM
(A)
ITSM
t
T
Tj(init) = 25 °C max
20
10
0
1
102
10
103
n
f = 50 Hz
Fig 2.
Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
BTA204X_SER_D_E_F
Product data sheet
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BTA204X series D, E and F
NXP Semiconductors
Three quadrant triacs guaranteed commutation
001aac330
103
ITSM
IT
t
ITSM
(A)
T
Tj(init) = 25 °C max
102
(1)
(2)
10
10−5
10−4
10−3
10−2
10−1
t (s)
tp  20 ms
(1) dIT/dt limit
(2) T2 G+ quadrant
Fig 3.
Non-repetitive peak on-state current as a function of pulse width; maximum values
001aac333
12
001aac332
5
IT(RMS)
(A) 4
IT(RMS)
(A)
92 °C
8
3
2
4
1
0
10−2
10−1
0
−50
1
10
surge duration (s)
0
50
100
Ths (°C)
150
f = 50 Hz; Th  92 C
Fig 4.
RMS on-state current as a function of surge
duration; maximum values
BTA204X_SER_D_E_F
Product data sheet
Fig 5.
RMS on-state current as a function of heatsink
temperature; maximum values
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Rev. 5 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
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BTA204X series D, E and F
NXP Semiconductors
Three quadrant triacs guaranteed commutation
5. Thermal characteristics
Table 4.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-hs)
thermal resistance from junction to full or half cycle with
heatsink
heatsink compound;
Figure 6
full or half cycle without
heatsink compound;
Figure 6
thermal resistance from junction to in free air
ambient
Rth(j-a)
Min
Typ
Max
Unit
-
-
5.5
K/W
-
-
7.2
K/W
-
55
-
K/W
001aac339
10
(1)
Zth(j-hs)
(K/W)
(2)
(3)
1
(4)
10−1
PD
tp
t
10−2
10−5
10−4
10−3
10−2
10−1
1
10
tp (s)
(1) Unidirectional without heatsink compound
(2) Unidirectional with heatsink compound
(3) Bidirectional without heatsink compound
(4) Bidirectional with heatsink compound
Fig 6.
Transient thermal impedance as a function of pulse width
6. Isolation characteristics
Table 5.
Isolation limiting values and characteristics
Ths = 25 C unless otherwise specified.
Symbol
Parameter
Visol
Cisol
Min
Typ
Max
Unit
RMS isolation voltage f = 50 Hz to 60 Hz; sinusoidal
from all three
waveform; R.H.  65 %; clean
terminals to external
and dust free
heatsink
-
-
2500
V
capacitance from
pin 2 to external
heatsink
-
10
-
pF
BTA204X_SER_D_E_F
Product data sheet
Conditions
f = 1 MHz
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
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BTA204X series D, E and F
NXP Semiconductors
Three quadrant triacs guaranteed commutation
7. Static characteristics
Table 6.
Static characteristics
Tj = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
BTA204X-600D
Min
IGT
IL
gate trigger
current
latching current
Typ
BTA204X-600E
Max
Min
Typ
BTA204X-600F
Max
Min
Typ
Unit
Max
VD = 12 V;
IT = 0.1 A;
Figure 8
T2+ G+
-
-
5
-
-
10
-
-
25
mA
T2+ G
-
-
5
-
-
10
-
-
25
mA
T2 G
-
-
5
-
-
10
-
-
25
mA
T2+ G+
-
-
6
-
-
12
-
-
20
mA
T2+ G
-
-
9
-
-
18
-
-
30
mA
T2 G
-
-
6
-
-
12
-
-
20
mA
VD = 12 V;
IGT = 0.1 A;
Figure 11
-
-
6
-
-
12
-
-
20
mA
VD = 12 V;
IGT = 0.1 A;
Figure 10
IH
holding current
VT
on-state voltage IT = 5 A;
Figure 9
-
1.4
1.7
-
1.4
1.7
-
1.4
1.7
V
VGT
gate trigger
voltage
VD = 12 V;
IT = 0.1 A;
Figure 7
-
0.7
1.5
-
0.7
1.5
-
0.7
1.5
V
VD = 400 V;
IT = 0.1 A;
Tj = 125 C
0.25
0.4
-
0.25
0.4
-
0.25
0.4
-
V
-
0.1
0.5
-
0.1
0.5
-
0.1
0.5
ID
off-state
leakage current
BTA204X_SER_D_E_F
Product data sheet
VD = VDRM(max);
Tj = 125 C
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 3 November 2011
mA
© NXP B.V. 2011. All rights reserved.
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BTA204X series D, E and F
NXP Semiconductors
Three quadrant triacs guaranteed commutation
8. Dynamic characteristics
Table 7.
Dynamic characteristics
Symbol Parameter
Conditions
BTA204X-600D
Min
Typ
BTA204X-600E
Max
Min
Typ
BTA204X-600F
Max
Min
Typ
Unit
Max
dVD/dt
critical rate of VDM = 67 %
rise of off-state VDRM(max);
voltage
Tj = 125 C;
exponential
waveform; gate
open circuit
20
-
-
30
-
-
50
-
-
V/s
dIcom/dt
critical rate of
change of
commutating
current
VDM = 400 V;
Tj = 125 C;
IT(RMS) = 4 A;
dVcom/dt = 10 V/s;
gate open circuit
1.1
-
-
2.1
-
-
3
-
-
A/s
VDM = 400 V;
Tj = 125 C;
IT(RMS) = 4 A;
dVcom/dt = 0.1 V/s;
gate open circuit
4.5
-
-
8
-
-
15
-
-
A/s
-
2
-
-
2
-
-
2
-
s
tgt
gate controlled ITM = 20 A;
turn-on time
VD = VDRM(max);
IG = 0.1 A;
dIG/dt = 5 A/s
001aac334
1.6
001aac335
3
VGT
IGT(Tj)
VGT (25°C)
IGT(25°C)
1.2
(1)
2
(2)
(3)
0.8
1
0.4
−50
0
50
100
0
−50
150
Tj (°C)
0
50
100
150
Tj (°C)
(1) T2 G
(2) T2+ G
(3) T2+ G+
Fig 7.
Normalized gate trigger voltage as a function
of junction temperature
BTA204X_SER_D_E_F
Product data sheet
Fig 8.
Normalized gate trigger current as a function
of junction temperature
All information provided in this document is subject to legal disclaimers.
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BTA204X series D, E and F
NXP Semiconductors
Three quadrant triacs guaranteed commutation
001aac338
12
(1) (2)
IT
(A)
001aac336
3
IL
(3)
IL(25°C)
8
2
4
1
0
−50
0
0
1
2
3
0
50
100
150
Tj (°C)
VT (V)
VO = 1.27 V
RS = 0.091 
(1) Tj = 125 C; typical values
(2) Tj = 25 C; maximum values
(3) Tj = 125 C; maximum values
Fig 9.
On-state current as a function of on-state
voltage
Fig 10. Normalized latching current as a function of
junction temperature
001aac337
3
IH
IH(25°C)
2
1
0
−50
0
50
100
150
Tj (°C)
Fig 11. Normalized holding current as a function of junction temperature
9. Package information
Refer to mounting instructions for F-pack packages. Epoxy meets UL94 V-0 at 1⁄8 inch.
BTA204X_SER_D_E_F
Product data sheet
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Rev. 5 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
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BTA204X series D, E and F
NXP Semiconductors
Three quadrant triacs guaranteed commutation
10. Package outline
Plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 3-lead TO-220 'full pack'
SOT186A
E
A
A1
P
q
D1
mounting
base
T
D
j
L2
L1
K
Q
b1
L
b2
1
2
3
b
c
w M
e
e1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
UNIT
A
A1
b
b1
b2
c
D
D1
E
e
e1
j
K
mm
4.6
4.0
2.9
2.5
0.9
0.7
1.1
0.9
1.4
1.0
0.7
0.4
15.8
15.2
6.5
6.3
10.3
9.7
2.54
5.08
2.7
1.7
0.6
0.4
L
L1
14.4 3.30
13.5 2.79
L2
max.
P
Q
q
3
3.2
3.0
2.6
2.3
3.0
2.6
(2)
T
2.5
w
0.4
Notes
1. Terminal dimensions within this zone are uncontrolled.
2. Both recesses are ∅ 2.5 × 0.8 max. depth
OUTLINE
VERSION
SOT186A
REFERENCES
IEC
JEDEC
JEITA
3-lead TO-220F
EUROPEAN
PROJECTION
ISSUE DATE
02-04-09
06-02-14
Fig 12. Package outline SOT186A (TO-220F)
BTA204X_SER_D_E_F
Product data sheet
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Three quadrant triacs guaranteed commutation
11. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice Supersedes
BTA204X_SER_D_E_F v.5
20111103
Product data sheet
-
Modifications:
BTA204X_SER_D_E_F v.4
BTA204X_SER_D_E_F v.4
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
Legal texts have been adapted to the new company name where appropriate.
Product data sheet
-
BTA204X_SERIES_D_E_F v.3
BTA204X_SERIES_D_E_F v.3 20030501
Product specification
-
BTA204X_SERIES_D_E_F v.2
BTA204X_SERIES_D_E_F v.2 19981201
Product specification
-
BTA204X_SERIES_D_E_F v.1
BTA204X_SERIES_D_E_F v.1 19971001
Product specification
-
-
BTA204X_SER_D_E_F
Product data sheet
20050317
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NXP Semiconductors
Three quadrant triacs guaranteed commutation
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
BTA204X_SER_D_E_F
Product data sheet
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BTA204X series D, E and F
NXP Semiconductors
Three quadrant triacs guaranteed commutation
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BTA204X_SER_D_E_F
Product data sheet
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Rev. 5 — 3 November 2011
© NXP B.V. 2011. All rights reserved.
12 of 13
NXP Semiconductors
BTA204X series D, E and F
Three quadrant triacs guaranteed commutation
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 5
Isolation characteristics . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Package information . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 3 November 2011
Document identifier: BTA204X_SER_D_E_F
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