ABC MH201212NJL Multilayer chip inductor Datasheet

REF :
PAGE: 1
PROD.
NAME
ABC'S DWG NO.
MULTILAYER CHIP INDUCTOR
MH2012□□□□L□-□□□
ABC'S ITEM NO.
Ⅰ﹒CONFIGURATION & DIMENSIONS:
C
B
A
A
:
2.00±0.20
m/m
B
:
1.20±0.20
m/m
C
:
0.85±0.20
m/m
D
:
0.50±0.30
m/m
D
Ⅱ﹒SCHEMATIC DIAGRAM:
Ⅲ﹒FEATURES:
a﹒Monolithic structure ensuring high performance and reliability.
b﹒High frequency applications up to 6GHz.
c﹒Terminal:Ag/Cu/Ni/Sn
d﹒Remark:Products comply with RoHS' requirements
Ⅳ﹒APPLICATIONS:
a﹒RF modules for telecommunication systems including
GSM, PCS,DECT,WLAN,Bluetooth,etc.
Peak Temp:260℃ max.
Max time above 230℃ :50sec max.
Max time above 200℃ :70sec max.
Ⅴ﹒GENERAL SPECIFICATION:
Temperature
Rising Area
Preheat Area
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)℃ / sec max.
a﹒Storage temp.:-55℃---- +125℃
b﹒Operating temp.:-55℃ ---- +125℃
50sec max.
Temperature ( ℃ )
c﹒Solderability:Preheat 150℃. 60 sec
Solder:H63A
Solder temp.:230±5℃
Flux:Rosin
Dip time:4±1 sec
230℃
200
150
70sec max.
100
50
0
AR-001A
Peak Temperature:
260℃
250
50
100
150
Time ( seconds )
200
250
SPECIFICATION FOR APPROVAL
REF :
PAGE: 2
PROD.
NAME
ABC'S DWG NO.
MULTILAYER CHIP INDUCTOR
MH2012□□□□L□-□□□
ABC'S ITEM NO.
Ⅵ﹒ELECTRICAL CHARACTERISTICS :
DWG No.
MH20121N2DL□-□□□
MH20121N5DL□-□□□
MH20121N8DL□-□□□
MH20122N2DL□-□□□
MH20122N7DL□-□□□
MH20123N3DL□-□□□
MH20123N9DL□-□□□
MH20124N7DL□-□□□
MH20125N6DL□-□□□
MH20126N8JL□-□□□
MH20128N2JL□-□□□
MH201210NJL□-□□□
MH201212NJL□-□□□
MH201215NJL□-□□□
MH201218NJL□-□□□
MH201222NJL□-□□□
MH201227NJL□-□□□
MH201233NJL□-□□□
MH201239NJL□-□□□
MH201247NJL□-□□□
MH201256NJL□-□□□
MH201268NJL□-□□□
MH201282NJL□-□□□
MH2012R10JL□-□□□
MH2012R12JL□-□□□
MH2012R15JL□-□□□
MH2012R18JL□-□□□
MH2012R22JL□-□□□
MH2012R27JL□-□□□
MH2012R33JL□-□□□
Inductance
( nH )
1.2 ± 0.3
1.5 ± 0.3
1.8 ± 0.3
2.2 ± 0.3
2.7 ± 0.3
3.3 ± 0.3
3.9 ± 0.3
4.7 ± 0.3
5.6 ± 0.3
6.8 ± 5%
8.2 ± 5%
10.0 ± 5%
12.0 ± 5%
15.0 ± 5%
18.0 ± 5%
22.0 ± 5%
27.0 ± 5%
33.0 ± 5%
39.0 ± 5%
47.0 ± 5%
56.0 ± 5%
68.0 ± 5%
82.0 ± 5%
100.0 ± 5%
120.0 ± 5%
150.0 ± 5%
180.0 ± 5%
220.0 ± 5%
270.0 ± 5%
330.0 ± 5%
Q
min
10
10
10
10
12
12
12
12
12
15
15
15
15
15
15
15
15
15
18
18
18
18
18
18
13
13
13
12
12
12
L/Q
Test Freq.
(MHz)
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
50
50
50
50
50
50
1). □:Packaging Information… A:Bulk B:Taping Reel
2)."-
AR-001A
□□□ ":Reference code
SRF
( MHz )
nom
>6000
>6000
>6000
>6000
>6000
>6000
5600
5500
4700
3900
3200
3100
2800
2400
2100
2000
1800
1700
1400
1200
1000
900
900
700
600
500
430
400
340
320
RDC
(Ω)
max
0.10
0.10
0.10
0.10
0.12
0.13
0.15
0.20
0.23
0.25
0.28
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.80
0.85
0.90
0.95
1.00
1.10
1.20
1.30
1.50
IDC
( mA )
max
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
SPECIFICATION FOR APPROVAL
REF :
PAGE: 3
PROD.
NAME
MULTILAYER CHIP INDUCTOR
ABC'S DWG NO.
MH2012□□□□L□-□□□
ABC'S ITEM NO.
Ⅶ﹒L / Q VS. FREQ. CURVE:
L vs. Frequency
1000
R15
Inductance ( nH )
100
R10
56N
27N
12N
10
4N7
2N2
1
1.0 e-02
10
Frequency ( GHz )
Q vs. Frequency
150
2N2
120
Q
90
4N7
60
12N
27N
56N
R15
30
0
R10
1.0 e-02
10
Frequency ( GHz )
AR-001A
SPECIFICATION FOR APPROVAL
REF :
PAGE: 4
PROD.
ABC'S DWG NO.
MULTILAYER CHIP INDUCTOR
NAME
MH2012□□□□L□-□□□
ABC'S ITEM NO.
Ⅷ﹒PACKAGING INFORMATION:
( 1 ) Configuration
T
Cover Tape
N
A
B
2.0±0.5
∮C
∮C
D
G
Emobossed Carrier
※ Carrier tape width : D
P:4 m/m
4 m/m
End
Start
Leader
no component
200 m/m min.
Trailer
no component
400 m/m min.
Components
User direction of feed
Unit:m/m
( 2 ) Dimensions
Style
A
07 - 08
178
B
21±0.8
C
D
G
N
T
13
8
10 +0
50 -0
12.5
( 3 ) Q'TY & G.W. Per package
Inner : Reel
Series
MH2012
AR-001A
Q'TY (pcs)
4,000
G.W. (gw)
120
Outer : Carton
Style
07 - 08
Q'TY (pcs)
200,000
G.W. (Kg)
8.5
Size (cm)
41 x 39 x 22
SPECIFICATION FOR APPROVAL
REF :
PAGE: 5
PROD.
ABC'S DWG NO.
MH2012□□□□L□-□□□
MULTILAYER CHIP INDUCTOR
NAME
ABC'S ITEM NO.
( 4 ) TYPE DIMENSIONS
4±0.1
(0.157 ±0.004)
φ1.55±0.05
2±0.05
(0.079 ±0.002) (0.061 ±0.002)
T max.
B±0 .1(0.004)
F±0.05
(0.002)
W±0.2
(0.008)
1.75 ±0.1
(0.069 ±0.004)
Fig 1.
P±0.1
(0.004)
A±0.1
(0.004)
Unit:m/m
AR-001A
Type
A
B
F
P
T
W
Fig
MH2012
1.50
2.30
3.50
4.0
1.10
8.0
1
SPECIFICATION FOR APPROVAL
REF :
PAGE: 6
PROD.
NAME
MULTILAYER CHIP INDUCTOR
ABC'S DWG NO.
MH2012□□□□L□-□□□
ABC'S ITEM NO.
Ⅸ﹒DWGING NUMBER EXPRESSION:
M H
2
0
1
2
Reference code
Appendix code 2 : Package
Appendix code 1 : Classification
Tolerance code
Electrical code
Dimension code
Type code
Appendix code 1:Product Classification
L:Lead Free Standard products comply with RoHS' requirements
1 ~ 9:Lead Free Special products comply with RoHS' requirements
Appendix code 2:Package Information
Code
AR-001A
Inner package
A
T.B.D.
B
T / R ( Reel package )
Inner package Q'TY
T.B.D.
4000
pcs
Remark
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