MOTOROLA MPX5050GSX Operating overview integrated pressure sensor 0 to 50 kpa (0 to 7.25 psi) 0.2 to 4.7 volts output Datasheet

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SEMICONDUCTOR TECHNICAL DATA
!! " !
!" !
OPERATING OVERVIEW
INTEGRATED
PRESSURE SENSOR
0 to 50 kPa (0 to 7.25 psi)
0.2 to 4.7 Volts Output
!
The MPX5050 series piezoresistive transducer is a state–of–the–art monolithic silicon
pressure sensor designed for a wide range of applications, but particularly those
employing a microcontroller or microprocessor with A/D inputs. This patented, single
element transducer combines advanced micromachining techniques, thin–film metallization, and bipolar processing to provide an accurate, high level analog output signal that
is proportional to the applied pressure.
Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller–Based Systems
• Temperature Compensated Over – 40° to +125°C
BASIC CHIP CARRIER
ELEMENT
CASE 867–08, STYLE 1
• Patented Silicon Shear Stress Strain Gauge
• Durable Epoxy Unibody Element
• Easy–to–Use Chip Carrier Option
VS
3
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
X–ducer
SENSING
ELEMENT
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
1
Vout
DIFFERENTIAL PORT OPTION
CASE 867C–05, STYLE 1
NOTE: Pin 1 is the notched pin.
2
PINS 4, 5 AND 6 ARE NO CONNECTS
PIN NUMBER
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
MAXIMUM RATINGS(1)
Symbol
Value
Unit
Overpressure(2) (P1 > P2)
Parametrics
Pmax
200
kPa
Burst Pressure(2) (P1 > P2)
Pburst
700
kPa
Tstg
– 40° to +125°
°C
TA
– 40° to +125°
°C
Storage Temperature
Operating Temperature
1
Vout
4
N/C
2
Grd
5
N/C
3
VS
6
N/C
NOTE: Pins 4, 5, and 6 are internal
device connections. Do not connect
to external circuitry or ground.
1. TC = 25°C unless otherwise noted.
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Senseon and X–ducer are trademarks of Motorola, Inc.
REV 3
Motorola Sensor Device Data
 Motorola, Inc. 1997
1
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
—
50
kPa
Supply Voltage(2)
VS
4.75
5.0
5.25
Vdc
Supply Current
Io
—
7.0
10.0
mAdc
Characteristic
Minimum Pressure Offset(3)
@ VS = 5.0 Volts
(0 to 85°C)
Voff
0.088
0.20
0.313
Vdc
Full Scale Output(4)
@ VS = 5.0 Volts
(0 to 85°C)
VFSO
4.587
4.70
4.813
Vdc
Full Scale Span(5)
@ VS = 5.0 Volts
(0 to 85°C)
VFSS
—
4.50
—
Vdc
—
—
—
"2.5
%VFSS
Accuracy(6)
Sensitivity
V/P
—
90
—
mV/kPa
Response Time(7)
tR
—
1.0
—
mS
Output Source Current at Full Scale Output
Io+
—
0.1
—
mAdc
Warm–Up Time(8)
—
—
20
mSec
Offset Stability(9)
—
—
"0.5
—
—
%VFSS
Symbol
Min
Typ
Max
Unit
Weight, Basic Element (Case 867)
—
—
4.0
—
Grams
Common Mode Line Pressure(10)
—
—
—
690
kPa
Decoupling circuit shown in Figure 4 required to meet electrical specifications.
MECHANICAL CHARACTERISTICS
Characteristic
NOTES:
1. 1.0kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from
minimum or maximum rated pressure at 25°C.
• TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative
to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm–up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
10. Common mode pressures beyond what is specified may result in leakage at the case–to–lead interface.
2
Motorola Sensor Device Data
Figure 3 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX5050 series pressure sensor operating characteristics, and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media, other
than dry air, may have adverse effects on sensor performance and long–term reliability. Contact the factory for in-
formation regarding media compatibility in your application.
Figure 4 shows a typical decoupling circuit for interfacing
the integrated sensor to the A/D input of a microprocessor.
Proper decoupling of the power supply is recommended.
Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0° to
85°C using the decoupling circuit below. (The output will saturate outside of the specified pressure range.)
OUTPUT (V)
5.0
TRANSFER FUNCTION:
4.5 Vout = VS*(0.018*P+0.04) ± ERROR
4.0 VS = 5.0 Vdc
TEMP = 0 to 85°C
3.5
3.0
TYPICAL
2.5
2.0
1.5
MIN
MAX
1.0
0.5
0
0
5
10
20
25
30
15
35 40
DIFFERENTIAL PRESSURE (kPa)
45
50
55
Figure 2. Output versus Pressure Differential
FLUORO SILICONE
GEL DIE COAT
DIE
STAINLESS STEEL
METAL COVER
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
P1
EPOXY
PLASTIC
CASE
WIRE BOND
LEAD FRAME
DIFFERENTIAL/GAUGE ELEMENT
MPX5050
OUPUT
(PIN 1)
50 pF
A/D
51 k
µ PROCESSOR
DIE
BOND
P2
Figure 3. Cross–Sectional Diagram
(Not to Scale)
Motorola Sensor Device Data
Figure 4. Typical Decoupling Filter for Sensor to
Microprocessor Interface
3
Transfer Function
Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04)
+/– (Pressure Error x Temp. Factor x 0.018 x VS)
VS = 5.0 V ± 0.25 Vdc
Temperature Error Band
MPX5050D Series
4.0
Temp
3.0
Temperature
Error
Factor
Multiplier
– 40
0 to 85
+125
2.0
3
1
3
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
Pressure Error Band
Error Limits for Pressure
3.0
Pressure Error (kPa)
2.0
1.0
0.0
Pressure (in kPa)
0
10
20
30
40
50
60
–1.0
– 2.0
– 3.0
4
Pressure
Error (Max)
0 to 50 kPa
± 1.25 kPa
Motorola Sensor Device Data
PRESSURE (P1) / VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The Motorola MPX
Part Number
pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Pressure (P1)
Side Identifier
Case Type
MPX5050D
867–08
Stainless Steel Cap
MPX5050DP
867C–05
Side with Part Marking
MPX5050GP
867B–04
Side with Port Attached
MPX5050GVP
867D–04
Stainless Steel Cap
MPX5050GS
867E–03
Side with Port Attached
MPX5050GVS
867A–04
Stainless Steel Cap
MPX5050GSX
867F–03
Side with Port Attached
MPX5050GVSX
867G–03
Stainless Steel Cap
ORDERING INFORMATION
The MPX5050 pressure sensor is available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure
connections.
MPX Series
D i T
Device
Type
O i
Options
C
Case
Type
T
Order Number
Device Marking
Basic Element
Differential
867–08
MPX5050D
MPX5050D
Ported Elements
Differential Dual Ports
867C–05
MPX5050DP
MPX5050DP
Gauge
867B–04
MPX5050GP
MPX5050GP
Gauge Vacuum Port
867D–04
MPX5050GVP
MPX5050GVP
Gauge, Axial
867E–03
MPX5050GS
MPX5050D
Gauge Vacuum Axial
867A–04
MPX5050GVS
MPX5050D
Gauge, Axial PC Mount
867F–03
MPX5050GSX
MPX5050D
Gauge Vacuum Axial PC Mount
867G–03
MPX5050GVSX
MPX5050D
Motorola Sensor Device Data
5
PACKAGE DIMENSIONS
C
R
M
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
POSITIVE PRESSURE
(P1)
–A–
N
PIN 1
SEATING
PLANE
1
2
3
4
5
DIM
A
B
C
D
F
G
J
L
M
N
R
S
L
6
–T–
G
J
S
F
D 6 PL
0.136 (0.005)
M
T A
M
INCHES
MIN
MAX
0.595
0.630
0.514
0.534
0.200
0.220
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
30 _NOM
0.475
0.495
0.430
0.450
0.090
0.105
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
CASE 867–08
ISSUE N
MILLIMETERS
MIN
MAX
15.11
16.00
13.06
13.56
5.08
5.59
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.40
17.65
18.42
30 _NOM
12.07
12.57
10.92
11.43
2.29
2.66
VOUT
GROUND
VCC
V1
V2
VEX
BASIC ELEMENT (D)
A
C
–B–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
POSITIVE
PRESSURE
(P1)
V
DIM
A
B
C
D
E
F
G
J
K
N
S
V
PIN 1
PORT #2
VACUUM
(P2)
1
K
J
N
E
–T–
2
3
4
5
6
S
G
F
D 6 PL
0.13 (0.005)
M
T B
M
INCHES
MIN
MAX
0.690
0.720
0.245
0.255
0.780
0.820
0.027
0.033
0.178
0.186
0.048
0.064
0.100 BSC
0.014
0.016
0.345
0.375
0.300
0.310
0.220
0.240
0.182
0.194
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
MILLIMETERS
MIN
MAX
17.53
18.28
6.22
6.48
19.81
20.82
0.69
0.84
4.52
4.72
1.22
1.63
2.54 BSC
0.36
0.41
8.76
9.53
7.62
7.87
5.59
6.10
4.62
4.93
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867A–04
ISSUE E
VACUUM SIDE PORTED (GVS)
6
Motorola Sensor Device Data
PACKAGE DIMENSIONS–CONTINUED
–T–
A
U
L
SEATING
PLANE
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
PORT #1
POSITIVE
PRESSURE (P1)
V
–Q–
N
B
K
1
2
3
4
5
6
PIN 1
–P–
C
0.25 (0.010)
J
M
T Q
S
G
M
D 6 PL
0.13 (0.005)
F
M
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.305
0.325
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.230
0.250
0.220
0.240
0.910 BSC
0.182
0.194
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
T P
Q
S
S
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
CASE 867B–04
ISSUE E
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
7.75
8.26
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
5.84
6.35
5.59
6.10
23.11 BSC
4.62
4.93
VOUT
GROUND
VCC
V1
V2
VEX
PRESSURE SIDE PORTED (GP)
P
0.25 (0.010)
M
T Q
M
U
W
X
R
PORT #1
POSITIVE
PRESSURE
(P1)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
–A–
L
V
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PRESSURE (P1)
N
–Q–
PORT #2
VACUUM
(P2)
B
PIN 1
1
2
3
4
5
K
6
C
SEATING
PLANE
–T–
–T–
S
SEATING
PLANE
J
D 6 PL
G
F
0.13 (0.005)
M
A
M
CASE 867C–05
ISSUE F
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
W
X
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.405
0.435
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.063
0.083
0.220
0.240
0.910 BSC
0.182
0.194
0.310
0.330
0.248
0.278
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
10.29
11.05
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
1.60
2.11
5.59
6.10
23.11 BSC
4.62
4.93
7.87
8.38
6.30
7.06
VOUT
GROUND
VCC
V1
V2
VEX
PRESSURE AND VACUUM SIDES PORTED (DP)
Motorola Sensor Device Data
7
PACKAGE DIMENSIONS–CONTINUED
0.25 (0.010)
–P–
T Q M
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A
U
–T–
SEATING
PLANE
PORT #2
VACUUM (P2)
L
V
R
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
POSITIVE PRESSURE (P1)
–Q–
N
B
PIN 1
1
2
3
4
5
K
6
S
C
G
D 6 PL
J
F
0.13 (0.005)
M
T P
S
Q
INCHES
MIN
MAX
1.145
1.175
0.685
0.715
0.305
0.325
0.027
0.033
0.048
0.064
0.100 BSC
0.014
0.016
0.695
0.725
0.290
0.300
0.420
0.440
0.153
0.159
0.153
0.159
0.230
0.250
0.220
0.240
0.910 BSC
0.182
0.194
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
S
CASE 867D–04
ISSUE F
MILLIMETERS
MIN
MAX
29.08
29.85
17.40
18.16
7.75
8.26
0.68
0.84
1.22
1.63
2.54 BSC
0.36
0.41
17.65
18.42
7.37
7.62
10.67
11.18
3.89
4.04
3.89
4.04
5.84
6.35
5.59
6.10
23.11 BSC
4.62
4.93
VOUT
GROUND
VCC
V1
V2
VEX
VACUUM SIDE PORTED (GVP)
C
–B–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A
DIM
A
B
C
D
E
F
G
J
K
N
S
V
V
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
6
K
J
N
5
–T–
3
2
1
S
G
F
E
4
D
6 PL
0.13 (0.005)
M
T B
M
INCHES
MIN
MAX
0.690
0.720
0.245
0.255
0.780
0.820
0.027
0.033
0.178
0.186
0.048
0.064
0.100 BSC
0.014
0.016
0.345
0.375
0.300
0.310
0.220
0.240
0.182
0.194
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
MILLIMETERS
MIN
MAX
17.53
18.28
6.22
6.48
19.81
20.82
0.69
0.84
4.52
4.72
1.22
1.63
2.54 BSC
0.36
0.41
8.76
9.53
7.62
7.87
5.59
6.10
4.62
4.93
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867E–03
ISSUE D
PRESSURE SIDE PORTED (AS, GS)
8
Motorola Sensor Device Data
PACKAGE DIMENSIONS–CONTINUED
–T–
C
A
U
E
–Q–
N
V
B
R
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
–P–
0.25 (0.010)
T Q
M
6
M
5
4
3
2
1
S
K
J
0.13 (0.005)
M
T P
S
D 6 PL
Q S
G
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V
INCHES
MIN
MAX
1.080
1.120
0.740
0.760
0.630
0.650
0.027
0.033
0.160
0.180
0.048
0.064
0.100 BSC
0.014
0.016
0.220
0.240
0.070
0.080
0.150
0.160
0.150
0.160
0.440
0.460
0.695
0.725
0.840
0.860
0.182
0.194
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
F
MILLIMETERS
MIN
MAX
27.43
28.45
18.80
19.30
16.00
16.51
0.68
0.84
4.06
4.57
1.22
1.63
2.54 BSC
0.36
0.41
5.59
6.10
1.78
2.03
3.81
4.06
3.81
4.06
11.18
11.68
17.65
18.42
21.34
21.84
4.62
4.93
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867F–03
ISSUE D
PRESSURE SIDE PORTED (GSX)
–T–
C
A
U
E
–Q–
POSITIVE
PRESSURE
(P1)
N
V
B
R
PORT #2
VACUUM
(P2)
PIN 1
–P–
0.25 (0.010)
M
T Q
M
1
2
3
4
5
6
S
K
J
0.13 (0.005)
M
T P
S
D 6 PL
Q S
G
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V
INCHES
MIN
MAX
1.080
1.120
0.740
0.760
0.630
0.650
0.027
0.033
0.160
0.180
0.048
0.064
0.100 BSC
0.014
0.016
0.220
0.240
0.070
0.080
0.150
0.160
0.150
0.160
0.440
0.460
0.695
0.725
0.840
0.860
0.182
0.194
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
MILLIMETERS
MIN
MAX
27.43
28.45
18.80
19.30
16.00
16.51
0.68
0.84
4.06
4.57
1.22
1.63
2.54 BSC
0.36
0.41
5.59
6.10
1.78
2.03
3.81
4.06
3.81
4.06
11.18
11.68
17.65
18.42
21.34
21.84
4.62
4.93
VOUT
GROUND
VCC
V1
V2
VEX
CASE 867G–03
ISSUE D
VACUUM SIDE PORTED (GVSX)
Motorola Sensor Device Data
9
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
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10
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Motorola Sensor DeviceMPX5050/D
Data
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