TOSHIBA MT6L55E

MT6L55E
Preliminary
TOSHIBA Transistor
Silicon NPN Epitaxial Planar Type
MT6L55E
VHF-UHF Band Low Noise Amplifier Application
VHF-UHF Band Oscillator Application
•
Unit: mm
Two devices are built into the super-thin and ultra-super-mini (6-pin)
ES6 package.
Mounted Devices
Three-pin (SSM/TESM) product No.
Q1: SSM (TESM)
Q2: TESM
MT3S07S
(MT3S07T)
MT3S05T
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Q1
Q2
Unit
Collector-base voltage
VCBO
10
10
V
Collector-emitter voltage
VCEO
5
5
V
JEDEC
―
Emitter-base voltage
VEBO
1.5
2
V
JEITA
―
Collector current
IC
25
40
mA
Base current
IB
10
10
mA
Collector power dissipation
Junction temperature
Storage temperature range
Note:
PC (Note 1)
150
mW
Tj
125
°C
Tstg
−55~125
°C
TOSHIBA
2-2N1C
Weight: 3 mg (typ.)
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Total power dissipation of Q1 and Q2 mounted on the circuit board
Marking
Pin Connections
6
5
4
B1
A R
1
2
E2
Q1
3
C1
1
B2
Q2
E1
C2
2007-11-01
MT6L55E
Electrical Characteristics Q1-Side (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Collector cut-off current
ICBO
VCB = 5 V, IE = 0
⎯
⎯
0.1
μA
Emitter cut-off current
IEBO
VEB = 1 V, IC = 0
⎯
⎯
1
μA
DC current gain
hFE
VCE = 1 V, IC = 5 mA
70
⎯
140
⎯
fT
GHz
Transition frequency
Insertion gain
Noise figure
Reverse transfer capacitance
VCE = 3 V, IC = 10 mA
10
12
⎯
2
VCE = 1 V, IC = 5 mA, f = 2 GHz
⎯
6.5
⎯
⎪S21e⎪ (2)
2
VCE = 3 V, IC = 15 mA, f = 2 GHz
4
7
⎯
NF (1)
VCE = 1 V, IC = 5 mA, f = 2 GHz
⎯
1.6
3
NF (2)
VCE = 3 V, IC = 5 mA, f = 2 GHz
⎯
1.5
3
⎯
0.45
0.85
pF
Min
Typ.
Max
Unit
⎪S21e⎪ (1)
Cre
VCB = 1 V, IE = 0, f = 1 MHz
(Note 2)
dB
dB
Electrical Characteristics Q2-Side (Ta = 25°C)
Characteristics
Symbol
Test Condition
Collector cut-off current
ICBO
VCB = 5 V, IE = 0
⎯
⎯
0.1
μA
Emitter cut-off current
IEBO
VEB = 1 V, IC = 0
⎯
⎯
1
μA
DC current gain
hFE
VCE = 1 V, IC = 5 mA
80
⎯
140
⎯
fT
GHz
VCE = 1 V, IC = 5 mA
2
4.5
⎯
2
VCE = 1 V, IC = 5 mA, f = 1 GHz
⎯
7.5
⎯
2
⎪S21e⎪ (2)
VCE = 3 V, IC = 20 mA, f = 1 GHz
7.5
10.5
⎯
Noise figure
NF
VCE = 1 V, IC = 5 mA, f = 1 GHz
⎯
1.4
2.2
dB
Reverse transfer capacitance
Cre
VCB = 1 V, IE = 0, f = 1 MHz
⎯
0.95
1.15
pF
Transition frequency
Insertion gain
⎪S21e⎪ (1)
(Note 2)
dB
Note 2: Cre is measured by 3 terminal method with capacitance bridge.
Handling Precaution
When handling individual devices (which are not yet mounted on a circuit board), be sure that the environment
is protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other
objects that come into direct contact with devices should be made of anti-static materials.
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MT6L55E
RESTRICTIONS ON PRODUCT USE
20070701-EN GENERAL
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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