ON NCP623DM-5.0R2 Ultra low noise 150 ma low dropout voltage regulator with on/off control Datasheet

NCP623
Ultra Low Noise
150 mA Low Dropout
Voltage Regulator with
ON/OFF Control
Housed in a Micro8 or QFN6 package, the NCP623 delivers up to
150 mA where it exhibits a typical 180 mV dropout. With an
incredible noise level of 25 VRMS (over 100 Hz to 100 kHz, with a
10 nF bypass capacitor), the NCP623 represents the ideal choice for
sensitive circuits, especially in portable applications where noise
performance and space are premium. The NCP623 also excels in
response time and reacts in less than 25 s when receiving an OFF to
ON signal (with no bypass capacitor).
Due to a novel concept, the NCP623 accepts output capacitors without
any restrictions regarding their Equivalent Series Resistance (ESR) thus
offering an obvious versatility for immediate implementation.
With a typical DC ripple rejection better than −90 dB (−70 dB @
1.0 kHz), it naturally shields the downstream electronics against
choppy power lines.
Additionally, thermal shutdown and short−circuit protection
provide the final product with a high degree of ruggedness.
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MARKING
DIAGRAMS
8
Micro8
DM SUFFIX
CASE 846A
XXX
AYW
1
1
NCP6
23yy
ALYW
QFN6, 3X3
MN SUFFIX
CASE 488AE
1
Features
• Very Low Quiescent Current 170 A (ON, no load), 100 nA
XXX
yy
A
L
Y
W
(OFF, no load)
• Very Low Dropout Voltage, Typical Value is 137 mV at an Output
Current of 100 mA
• Very Low Noise with External Bypass Capacitor (10 nF),
•
•
•
•
•
•
•
•
Typically 25 Vrms over 100 Hz to 100 kHz
Internal Thermal Shutdown
Extremely Tight Line Regulation Typically −90 dB
Ripple Rejection −70 dB @ 1.0 kHz
Line Transient Response: 1.0 mV for Vin = 3.0 V
Extremely Tight Load Regulation, Typically 20 mV at Iout = 150 mA
Multiple Output Voltages Available
Logic Level ON/OFF Control (TTL−CMOS Compatible)
ESR can vary from 0 to 3.0 = Specific Device Code
= Voltage Option
= Assembly Location
= Wafer Lot
= Year
= Work Week
PIN CONNECTIONS
Bypass
1
8
VOUT
NC
2
7
GND
NC
3
6
GND
ON/OFF
4
5
VIN
Micro8
(Top View)
Applications
• All Portable Systems, Battery Powered Systems, Cellular
Telephones, Radio Control Systems, Toys and Low Voltage Systems
VIN
1
6
ON/OFF
GND
2
5
GND
VOUT
3
4
Bypass
QFN6
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information on page 12 of
this data sheet.
 Semiconductor Components Industries, LLC, 2004
August, 2004 − Rev. 0
1
Publication Order Number:
NCP623/D
NCP623
VIN
On/Off
Thermal
Shutdown
ON/OFF
Band Gap
Reference
Bypass
VOUT
* Current Limit
* Antisaturation
* Protection
GND
GND
Figure 1. NCP623 Block Diagram
MAXIMUM RATINGS
Rating
Power Supply Voltage
Power Dissipation and Thermal Resistance
Maximum Power Dissipation
Case 488AE (QFN6, 3x3) MN Suffix
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Case 846A (Micro8) DM Suffix
Thermal Resistance, Junction−to−Air
Thermal Resistance, Junction−to−Case
Operating Ambient Temperature Range
Maximum Junction Temperature
Storage Temperature Range
ESD Protection − Human Body Model
Machine Model
Symbol
Value
Unit
Vin
12
V
PD
Internally Limited
W
°C/W
RJA
RJC
161
19
RJA
RJC
240
105
TA
−40 to +85
°C
TJmax
150
°C
Tstg
−60 to +150
°C
VESD
2000
200
V
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
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NCP623
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA = −40°C to +85°C, Max TJ = 150°C)
Characteristics
Symbol
Min
Typ
Max
Unit
Input Voltage Range
VON/OFF
0
−
Vin
V
ON/OFF Input Current (All versions)
VON/OFF = 2.4 V
ION/OFF
−
2.5
−
ON/OFF Input Voltages (All versions)
Logic “0”, i.e. OFF State
Logic “1”, i.e. ON State
VON/OFF
−
2.2
−
−
0.3
−
−
0.1
2.0
−
170
200
−
900
1400
175
210
−
3.23
3.92
4.90
3.3
4.0
5.0
3.37
4.08
5.1
3.18
3.86
4.83
3.3
4.0
5.0
3.42
4.14
5.17
−
2.0
10
−
−
−
8.0
15
20
25
35
45
−
−
−
30
137
180
90
230
260
Ripple Rejection (All versions)
Vin = Vout + 1.0 V, Vpp = 1.0 V, f = 1.0 kHz, Iout = 60 mA
60
70
−
Line Transient Response
Vin = Vout + 1.0 V to Vout + 4.0 V, Iout = 60 mA, d(Vin)/dt = 15 mV/s
−
1.0
−
CONTROL ELECTRICAL CHARACTERISTICS
A
V
CURRENTS PARAMETERS
Current Consumption in OFF State (All versions)
OFF Mode Current: Vin = Vout + 1.0 V, Iout = 0 mA
IQOFF
Current Consumption in ON State (All versions)
ON Mode Sat Current: Vin = Vout + 1.0 V, Iout = 0 mA
IQON
Current Consumption in Saturation ON State (All versions)
ON Mode Sat Current: Vin = Vout − 0.5 V, Iout = 0 mA
IQSAT
Current Limit Vin = Vout + 1.0 V, (All versions)
Output Short−circuited (Note 1)
IMAX
Vin = Vout + 1.0 V, TA = 25°C, 1.0 mA < Iout < 150 mA
3.3 Suffix
4.0 Suffix
5.0 Suffix
Vout
Vin = Vout + 1.0 V, −40°C < TA < 85°C
3.3 Suffix
4.0 Suffix
5.0 Suffix
Vout
A
A
A
mA
V
V
LINE AND LOAD REGULATION, DROPOUT VOLTAGES
Line Regulation (All versions)
Vout + 1.0 V < Vin < 12 V, Iout = 60 mA
Regline
Load Regulation (All versions)
Regload
Vin = Vout + 1.0 V
Iout = 1.0 to 60 mA
Iout = 1.0 to 100 mA
Iout = 1.0 to 150 mA
Dropout Voltage (All versions)
mV
mV
Vin − Vout
Iout = 10 mA
Iout = 100 mA
Iout = 150 mA
mV
DYNAMIC PARAMETERS
dB
Output Noise Voltage (All versions)
Cout = 1.0 µF, Iout = 60 mA, f = 100 Hz to 100 kHz
Cbypass = 10 nF
Cbypass = 1.0 nF
Cbypass = 0 nF
mV
µVrms
VRMS
Output Noise Density
Cout = 1.0 µF, Iout = 60 mA, f = 1.0 kHz
−
−
−
25
40
65
−
−
−
−
230
−
−
−
40
1.1
−
−
nV/ √Hz
VN
Output Rise Time (All versions)
Cout = 1.0 µF, Iout = 30 mA, VON/OFF = 0 to 2.4 V
1% of ON/OFF Signal to 99% of Nominal Output Voltage
Without Bypass Capacitor
With Cbypass = 10 nF
tr
µs
ms
THERMAL SHUTDOWN
Thermal Shutdown (All versions)
−
150
−
1. Iout (Output Current) is the measured current when the output voltage drops below 0.3 V with respect to Vout at Iout = 30 mA.
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3
°C
NCP623
DEFINITIONS
Maximum Package Power Dissipation − The maximum
package power dissipation is the power dissipation level at
which the junction temperature reaches its maximum value
i.e. 125°C. The junction temperature is rising while the
difference between the input power (VCC X ICC) and the
output power (Vout X Iout) is increasing.
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation, maximum load
current or maximum input voltage (see Application Hints:
Protection).
The maximum power dissipation supported by the device
is a lot increased when using appropriate application design.
Mounting pad configuration on the PCB, the board material
and also the ambient temperature are affected the rate of
temperature rise. It means that when the IC has good thermal
conductivity through PCB, the junction temperature will be
“low” even if the power dissipation is great.
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power dissipation by
subtracting the output power from the input power. All
variables are then well known: power dissipation, thermal
shutdown temperature (150°C for NCP623) and ambient
temperature.
Load Regulation − The change in output voltage for a
change in load current at constant chip temperature.
Dropout Voltage − The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential), dropout voltage is affected
by junction temperature, load current and minimum input
supply requirements.
Output Noise Voltage − The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
Maximum Power Dissipation − The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current − Current which is used to operate the
regulator chip and is not delivered to the load.
Line Regulation − The change in input voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Line Transient Response − Typical over− and
undershoot response when input voltage is excited with a
given slope.
Thermal Protection − Internal thermal shutdown
circuitry is provided to protect the integrated circuit in the
event that the maximum junction temperature is exceeded.
When activated, typically 150°C, the regulator turns off.
This feature is provided to prevent catastrophic failures from
accidental overheating.
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NCP623
APPLICATION HINTS
Input Decoupling − As with any regulator, it is necessary
to reduce the dynamic impedance of the supply rail that
feeds the component. A 1.0 F capacitor either ceramic or
tantalum is recommended and should be connected close to
the NCP623 package. Higher values will correspondingly
improve the overall line transient response.
Output Decoupling − Due to a novel concept, the
NCP623 is a stable component and does not require any
Equivalent Series Resistance (ESR) neither a minimum
output current. Capacitors exhibiting ESRs ranging from a
few m up to 3.0 can thus safely be used. The minimum
decoupling value is 1.0 F and can be augmented to fulfill
stringent load transient requirements. The regulator accepts
ceramic chip capacitors as well as tantalum devices.
Noise Performances − Unlike other LDOs, the NCP623
is a true low−noise regulator. With a 10 nF bypass capacitor,
it typically reaches the incredible level of 25 VRMS overall
noise between 100 Hz and 100 kHz. To give maximum
insight on noise specifications, ON Semiconductor includes
spectral density graphics as well as noise dependency versus
bypass capacitor.
The bypass capacitor impacts the start−up phase of the
NCP623 as depicted by the data−sheet curves. A typical
1.0 ms settling time is achieved with a 10 nF bypass
capacitor. However, due to its low−noise architecture, the
NCP623 can operate without bypass and thus offers a typical
20 s start−up phase. In that case, the typical output noise
stays lower than 65 VRMS between 100 Hz − 100 kHz.
Protections − The NCP623 hosts several protections,
conferring natural ruggedness and reliability to the products
implementing the component. The output current is
internally limited to a minimum of 175 mA while
temperature shutdown occurs if the die heats up beyond
150°C. These value lets you assess the maximum
differential voltage the device can sustain at a given output
current before its protections come into play.
The maximum dissipation the package can handle is given
by:
If a 150 mA output current is needed, the ground current
is extracted from the data−sheet curves: 6.5 mA @ 150 mA.
For a NCP623NW28R2 (2.8 V), the maximum input voltage
will then be 6.48 V, a rather comfortable margin.
Typical Application − The following figure portraits the
typical application for the NCP623 where both input/output
decoupling capacitors appear.
C1
10 nF
On/Off
6
C3
1.0 F
5
4
C2
1.0 F
NCP623
1
2
3
Input
Output
Figure 2. A Typical NCP623 Application with
Recommended Capacitor Values (QFN6)
Output
Input
8
C2
1.0 F
6
5
C3
1.0 F
NCP623
1
C1
10 nF
7
2
3
NC NC
4
On/Off
T
– T
A
P max Jmax
R
JA
If TJmax is internally limited to 150°C, then the NCP623 can
dissipate up to 595 mW @ 25°C.
The power dissipated by the NCP623 can be calculated
from the following formula:
Figure 3. A Typical NCP623 Application with
Recommended Capacitor Values (Micro8)
Ptot V I
(I ) V Vout I out
in gnd out
in
or
Vin max Ptot Vout I out
I
I out
gnd
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NCP623
At power−on, C4 is discharged. When the control logic
sends its wake−up signal by going to a high level, the PNP
base is momentarily tied to ground. The PNP switch closes
and immediately charges the bypass capacitor C1 toward its
operating value. After a few s, the PNP opens and becomes
totally transparent to the regulator.
This circuit improves the response time of the regulator
which drops from 1.0 ms down to 30 s. The value of C4
needs to be tweaked in order to avoid any bypass capacitor
overload during the wake−up transient.
NCP623 Wake−up Improvement − In portable
applications, an immediate response to an enable signal is
vital. If noise is not of concern, the NCP623 without a bypass
capacitor settles in nearly 20 s and typically delivers
65 VRMS between 100 Hz and 100 kHz.
In ultra low−noise systems, the designer needs a 10 nF
bypass capacitor to decrease the noise down to 25VRMS
between 100 Hz and 100 kHz. With the addition of the 10 nF
capacitor, the wake−up time expands up to 1.0 ms as shown
on the data−sheet curves. If an immediate response is
wanted, following figure’s circuit gives a solution to charge
the bypass capacitor with the enable signal without
degrading the noise response of the NCP623.
Input
Output
C4
470 pF
C1
10 nF
MMBT2902LT1
Q1
8
R2
220 k
On/Off
+
6
5
C2
1.0 F
6
5
NCP623
1
4
7
2
3
+
4
On/Off
+
C3
1.0 F
C2
+ 1.0 F
NCP623
1
2
R2
220 k
C1
10 nF
3
MMBT2902LT1
Q1
Input
C4
470 pF
Output
Figure 5. A PNP Transistor Drives the
Bypass Pin when Enable Goes High (Micro8)
Figure 4. A PNP Transistor Drives the
Bypass Pin when Enable Goes High (QFN6)
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C3
1.0 F
NCP623
NCP623 Without
Wake−up Improvement
(Typical Response)
1 ms
NCP623 With
Wake−up Improvement
(Typical Response)
30 s
Figure 6. NCP623 Wake−up Improvement with Small PNP Transistor
area which reaches a typical noise level of 26 VRMS
(100 Hz to 100 kHz) at Iout = 60 mA.
The PNP being wired upon the bypass pin, it shall not
degrade the noise response of the NCP623. Figure 7
confirms the good behavior of the integrated circuit in this
350
Vin = 3.8 V
Vout = 2.8 V
Co = 1.0 F
Iout = 60 mA
Tamb = 25°C
nV/sqrt (Hz)
300
250
200
Cbyp = 10 nF
150
100
50
Output Noise = 26 Vrms C =
10 nF @ 100 Hz − 100 kHz
0
100
1,000
10,000
100,000
1,000,000
Frequency (Hz)
Figure 7. Noise Density of the NCP623 with a 10 nF
Bypass Capacitor and a Wake−up Improvement Network
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NCP623
TYPICAL PERFORMANCE CHARACTERISTICS
Ground Current Performances
2.1
GROUND CURRENT (mA)
GROUND CURRENT (mA)
7.0
Vin = 3.8 V
Vout = 2.8 V
CO = 1.0 mF
Tamb = 25°C
6.0
5.0
4.0
3.0
2.0
2.05
Vin = 3.8 V
Vout = 2.8 V
CO = 1.0 F
Iout = 60 mA
2.0
1.95
1.9
1.85
1.0
0
0
20
40
60
80
100 120 140 160 180 200
1.8
−40
−20
0
20
40
60
80
OUTPUT CURRENT (mA)
AMBIENT TEMPERATURE (°C)
Figure 8. Ground Current versus Output Current
Figure 9. Ground Current versus Ambient
Temperature
QUIESCENT CURRENT ON MODE (A)
Line Transient Response and Output Voltage
200
190
Y1
180
170
160
Vin = 3.8 to 7.0 V
Y1 = 1.0 mV/div
Y2 = 1.0 V/div
X = 1.0 ms
Iout = 60 mA
Tamb = 25°C
150
140
130
120
110
100
−40
−20
0
20
40
60
80
dVin = 3.2 V
100
TEMPERATURE (°C)
Figure 10. Quiescent Current versus Temperature
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Figure 11. Line Transient Response
Y2
NCP623
TYPICAL PERFORMANCE CHARACTERISTICS
Load Transient Response versus Load Current Slope
Y1
Y2
Vin = 3.8 V
Y1 = 100 mV/div
Y2 = 20 mV/div
X = 200 s/div
Tamb = 25°C
Vin = 3.8 V
Y1 = 50 mA/div
Y2 = 20 mV/div
X = 20 s
Tamb = 25°C
Y1
Y2
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Figure 12. Iout = 3.0 mA to 150 mA
Figure 13. ISlope = 100 mA/s (Large Scale)
Iout = 3.0 mA to 150 mA
Y1
Y1
Vin = 3.8 V
Y1 = 50 mA/div
Y2 = 20 mV/div
X = 100 s
Tamb = 25°C
Y2
Vin = 3.8 V
Y1 = 50 mA/div
Y2 = 20 mV/div
X = 200 s
Tamb = 25°C
Y2
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Y1: OUTPUT CURRENT, Y2: OUTPUT VOLTAGE
Figure 14. ISlope = 6.0 mA/s (Large Scale)
Iout = 3.0 mA to 150 mA
Figure 15. ISlope = 2.0 mA/s (Large Scale)
Iout = 3.0 mA to 150 mA
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NCP623
TYPICAL PERFORMANCE CHARACTERISTICS
Noise Performances
350
70
250
3.3 nF
200
60
RMS NOISE (A)
0 nF
300
nV/Hz
Vin = 3.8 V
Vout = 2.8 V
CO = 1.0 F
Iout = 60 mA
Tamb = 23°C
Cbyp = 10 nF
150
100
Vn = 65 Vrms @ Cbypass = 0
Vn = 30 Vrms @ Cbypass = 3.3 nF
Vn = 25 Vrms @ Cbypass = 10 nF
0 over 100 Hz to 100 kHz
100,000
100
1000
10,000
FREQUENCY (Hz)
50
50
40
30
Vin = 3.8 V
Vout = 2.8 V
CO = 1.0 F
Iout = 60 mA
Tamb = 25°C
20
10
0
1,000,000
Figure 16. Noise Density versus Bypass
Capacitor
0
1.0
2.0
3.0 4.0 5.0 6.0 7.0
BYPASS CAPACITOR (nF)
8.0
9.0
10
Figure 17. RMS Noise versus Bypass Capacitor
(100 Hz − 100 kHz)
Settling Time Performances
1200
Vin = 3.8 V
Vout = 2.8 V
CO = 1.0 F
Iout = 60 mA
Tamb = 25°C
SETTLINE TIME (A)
1000
800
600
200 s/div
500 mV/div
Cbyp = 10 nF
400
200
0
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
Vin = 3.8 V
Vout = 2.8 V
Cout = 1.0 F
Iout = 50 mA
Tamb = 25°C
10
BYPASS CAPACITOR (nF)
Figure 18. Output Voltage Settling Time versus
Bypass Capacitor
100 s/div
500 mV/div
Cbyp = 3.3 nF
Figure 19. Output Voltage Settling Shape
Cbypass = 10 nF
Vin = 3.8 V
Vout = 2.8 V
Cout = 1.0 F
Iout = 50 mA
Tamb = 25°C
10 s/div
500 mV/div
Cbyp = 0 nF
Figure 20. Output Voltage Settling Shape
Cbypass = 3.3 nF
Vin = 3.8 V
Vout = 2.8 V
Cout = 1.0 F
Iout = 50 mA
Tamb = 25°C
Figure 21. Output Voltage Settling Shape without
Bypass Capacitor
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NCP623
TYPICAL PERFORMANCE CHARACTERISTICS
250
250
200
200
150 mA
85°C
150
100 mA
DROPOUT (mV)
DROPOUT (mV)
Dropout Voltage
25°C
−40°C
100
150
60 mA
100
50
0
50
10
100
60
10 mA
0
−40
150
−20
0
20
40
60
80
100
IO (mA)
TEMPERATURE (°C)
Figure 22. Dropout Voltage versus Iout
Figure 23. Dropout Voltage versus Temperature
Output Voltage
2.860
2.805
1 mA
2.840
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
2.800
2.795
60 mA
2.790
100 mA
2.785
150 mA
2.780
2.820
2.800
−40°C
25°C
2.780
85°C
2.760
2.775
2.770
−40
2.740
−20
0
20
40
60
80
0
100
20
40
60
80
100
120
140
TEMPERATURE (°C)
OUTPUT CURRENT (mA)
Figure 24. Output Voltage versus Temperature
Figure 25. Output Voltage versus Iout
160
Ripple Rejection Performances
0
0
−10
Vin = 3.8 V
Vout = 2.8 V
CO = 1.0 F
Iout = 60 mA
Tamb = 25°C
(dB)
−30
−40
−40
(dB)
−20
Vin = 3.8 V
Vout = 2.8 V
CO = 1.0 F
Iout = 60 mA
Tamb = 25°C
−20
−50
−60
−60
−80
−70
−80
−100
−90
−100
−120
100
1000
10,000
100,000
10
100
1000
10,000
100,000 1,000,000
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 26. Ripple Rejection versus Frequency with
10 nF Bypass Capacitor
Figure 27. Ripple Rejection versus Frequency
without Bypass Capacitor
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NCP623
ORDERING INFORMATION
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ÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁ
Device
Version
NCP623DM−3.3R2
3.3 V
NCP623DM−4.0R2
4.0 V
NCP623DM−5.0R2
5.0 V
NCP623MN−3.3R2
3.3 V
NCP623MN−4.0R2
4.0 V
NCP623MN−5.0R2
5.0 V
Package
Shipping†
Micro8
4000 Tape & Reel
QFN6, 3x3
3000 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
12
NCP623
PACKAGE DIMENSIONS
Micro8
DM SUFFIX
CASE 846A−02
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.
−A−
−B−
K
PIN 1 ID
G
D 8 PL
0.08 (0.003)
M
T B
S
A
S
SEATING
−T− PLANE
0.038 (0.0015)
C
H
L
J
http://onsemi.com
13
DIM
A
B
C
D
G
H
J
K
L
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
−−−
1.10
0.25
0.40
0.65 BSC
0.05
0.15
0.13
0.23
4.75
5.05
0.40
0.70
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
−−−
0.043
0.010
0.016
0.026 BSC
0.002
0.006
0.005
0.009
0.187
0.199
0.016
0.028
NCP623
PACKAGE DIMENSIONS
6 PIN QFN, 3x3
MN SUFFIX
CASE 488AE−01
ISSUE O
D
6X
B
PIN ONE
IDENTIFICATION
6X
K
L
Ç
Ç
Ç
Ç
Ç
Ç
6
E
6X
2X
0.15 C
1
4
0.15 C
2X
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
b
TOP VIEW
D2
e
3
NOTE 3
0.10 C A B
E2
0.05 C
BOTTOM VIEW
0.10 C
6X
0.08 C
SEATING
PLANE
A1
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
ÇÇ
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
2.25
2.55
3.00 BSC
1.55
1.85
0.65 BSC
0.20
−−−
0.30
0.50
A
(A3)
C
SIDE VIEW
2.45
0.964
ÇÇÇ
ÇÇ
ÇÇÇ
ÇÇ
3.31
0.130
0.63
0.025
Ç
ÇÇ
ÇÇ
ÇÇÇ
ÇÇ
Exposed Pad
SMD Defined
1.700
0.685
0.35
0.014
0.65
0.025
Micro8 is a trademark of International Rectifier.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
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Order Literature: http://www.onsemi.com/litorder
Japan: ON Semiconductor, Japan Customer Focus Center
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Phone: 81−3−5773−3850
http://onsemi.com
14
For additional information, please contact your
local Sales Representative.
NCP623/D
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