Rohm BA6424AFS Silicon monolithic integrated circuit Datasheet

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STRUCTURE
Silicon Monolithic Integrated Circuit
PRODUCT SERIES
Single-Phase Full-Wave Motor Pre-Driver for Fan
TYPE
BA6424AFS
FEATURES
Lock detection, Automatic restart circuit
〇ABSOLUTE MAXIMUM RATINGS
Symbol
Limit
Unit
Supply voltage
Vcc
30
V
Power dissipation
Pd
812.5*
mW
Topr
-40~+100
℃
Parameter
Operating temperature
Tstg
-55~+150
℃
Output current
Iomax
1.0**
A
Output voltage
VOUT
30
V
AL signal output voltage
VAL
30
V
FG signal output voltage
VFG
30
V
Tjmax
150
Junction temperature
*
To use at temperature above Ta=25℃ reduce 6.5mW/℃.
(On 70.0mm×70.0mm×1.6mm glass epoxy board)
** This value is not to be over Pd.
℃
Storage temperature
〇OPERATING CONDITIONS
Parameter
Symbol
Operating supply voltage range
Vcc
Limit
6.0~28.0
Hall input voltage range
VH
2.5~Vcc
*This product is not designed for production against radioactive rays.
*This document may be strategic data subject to COCOM regulations.
REV. D
Unit
V
V
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〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25℃,Vcc=12V)
Parameter
Circuit current
Charge current of capacitor
for lock detection
Discharge current of capacitor
for lock detection
Charge-discharge current ratio
of capacitor for lock detection
Clamp voltage of capacitor
for lock detection
Comparison voltage of
capacitor for lock detection
Output voltage L
Output voltage H
AL terminal voltage L
AL terminal leak current
FG terminal voltage L
FG terminal leak current
Hall input - output offset voltage
Hall input - FG offset voltage
Icc
Min.
2.7
Limit
Typ.
5.4
Max.
8.1
ILDC
1.55
3.10
ILDD
0.33
rCD
Symbol
Unit
Conditions
mA
At output OFF
4.65
μA
VLD=1.8V
0.66
0.99
μA
VLD=1.8V
3.0
4.7
6.4
-
VLDCL
2.00
2.48
3.00
V
VLDCP
0.70
0.99
1.30
V
VOL
-
0.8
1.2
V
VOH
-
0.9
1.4
V
VALL
IALL
VFGL
IFGL
VOFS
VFGOFS
-20
-45
0.1
0
0.1
0
0
-25
0.3
10
0.3
10
20
-5
V
μA
V
μA
mV
mV
REV. D
rCD=ILDC/ILDD
Io=200mA
Io=-200mA
Voltage between output
and Vcc
IAL=10mA
VAL=30V
IFG=10mA
VFG=30V
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〇PACKAGE OUTLINES
6.6±0.2
9
0.3Min.
6.2±0.3
1.5±0.1
4.4±0.2
0.11
16
6424AFS
1
8
0.15±0.1
Lot No.
0.8
0.1
0.36±0.1
SSOP-A16 (UNIT:mm)
〇BLOCK DIAGRAM
LD
〇Terminal name
REG
7
LOCK
DETECTION
AND
AUTO
RESTART
+
-
+
-
Pin No.
REG
AL
6
1 GND
Vcc
AMP
4
H+
9
HALL
AMP
+
-
OUT2
LOGIC
AMP
3
14
H10
OUT1
TSD
FG
5
REV. D
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Terminal
name
GND
N.C.
OUT2
Vcc
FG
AL
LD
N.C.
H+
HN.C.
N.C.
N.C.
OUT1
N.C.
N.C.
4/4
〇CAUTIONS ON USE
1) Absolute maximum ratings
An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break
down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated
values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An
external direction diode can be added.
3) Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a capacitor
between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have no problem
before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are reduced at low
temperatures)
4) GND potential
The potential of GND pin must be minimum potential in all operating conditions. Also ensure that all terminals except GND terminal
do not fall below GND voltage including transient characteristics. However, it is possible that the motor output terminal may deflect
below GND because of influence by back electromotive force of motor. Malfunction may possibly occur depending on use condition,
environment, and property of individual motor. Please make fully confirmation that no problem is found on operation of IC.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error
or if pins are shorted together.
7) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.
9) Thermal shut down circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175℃(typ.) and has a hysteresis width
of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not
continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed.
10) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always
discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing it from a
jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution
when transporting or storing the IC.
11) GND wiring pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single
ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large
currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external
components, either.
12) Capacitor between output and GND
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible that
the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output and GND
below 100uF.
13) IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is
applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes mutual
interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner where parasitic
element is actuated.
REV. D
Notice
Notes
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Examples of application circuits, circuit constants and any other information contained herein
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R1120A
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