TI MAX208INT 5-v multichannel rs-232 line driver/receiver with -15-kv esd protection Datasheet

± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006
D ESD Protection for RS-232 I/O Pins
D
D
D
D
D
D
D
DB, DW, OR NT PACKAGE
(TOP VIEW)
− ±15 kV − Human-Body Model (HBM)
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates at 5-V VCC Supply
Four Drivers and Four Receivers
Operates up to 120 kbit/s
External Capacitors . . . 4 × 0.1 µF
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Applications
− Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
DOUT2
DOUT1
RIN2
ROUT2
DIN1
ROUT1
RIN1
GND
VCC
C1+
V+
C1−
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
DOUT3
RIN3
ROUT3
DIN4
DOUT4
DIN3
DIN2
ROUT4
RIN4
V−
C2−
C2+
description/ordering information
The MAX208 device consists of four line drivers, four line receivers, and a dual charge-pump circuit with
±15-kV HBM ESD protection pin to pin (serial-port connection pins, including GND). The device meets the
requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication
controller and the serial-port connector. The charge pump and four small external capacitors allow operation
from a single 5-V supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/µs
driver output slew rate.
ORDERING INFORMATION
PDIP (NT)
0°C
0
C to 70
70°C
C
SOIC (DW)
SSOP (DB)
PDIP (NT)
–40°C
–40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOIC (DW)
SSOP (DB)
Tube of 15
MAX208CNT
Tube of 25
MAX208CDW
Reel of 2000
MAX208CDWR
Tube of 60
MAX208CDB
Reel of 2000
MAX208CDBR
Tube of 15
MAX208INT
Tube of 25
MAX208IDW
Reel of 2000
MAX208IDWR
Tube of 60
MAX208IDB
Reel of 2000
MAX208IDBR
TOP-SIDE
MARKING
MAX208CNT
MAX208C
MA208C
MAX208INT
MAX208I
MB208I
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2006, Texas Instruments Incorporated
!"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($%
%$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',(
$(%$2 #++ )#!#"($(!%-
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006
FUNCTION TABLES
EACH DRIVER
INPUT
DIN
OUTPUT
DOUT
L
H
H
L
H = high level, L = low
level
EACH RECEIVER
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
H = high level, L = low
level, Open = input
disconnected
or
connected driver off
logic diagram (positive logic)
5
2
DIN1
DOUT1
18
TTL/CMOS
Inputs
1
DIN2
DOUT2
19
24
DIN3
DOUT3
21
20
DIN4
DOUT4
6
7
ROUT1
RIN1
4
3
ROUT2
TTL/CMOS
Outputs
RIN2
22
RS-232
Inputs
23
ROUT3
RIN3
17
ROUT4
2
RS-232
Outputs
POST OFFICE BOX 655303
16
RIN4
• DALLAS, TEXAS 75265
± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Positive charge pump voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC − 0.3 V to 14 V
Negative charge pump voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –14 V to 0.3 V
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
Input voltage range, VI: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V+ + 0.3 V
Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30 V
Output voltage range, VO: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V− − 0.3 V to V+ + 0.3 V
Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V
Short-circuit duration: DOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Package thermal impedance, θJA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
(see Notes 2 and 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W
(see Notes 2 and 4): NT package . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-3.
recommended operating conditions (see Note 5 and Figure 4)
Supply voltage
VIH
VIL
Driver high-level input voltage
DIN
Driver low-level input voltage
DIN
Driver input voltage
DIN
VI
Receiver input voltage
TA
Operating free-air temperature
MAX208C
MAX208I
MIN
NOM
MAX
4.5
5
5.5
2
UNIT
V
V
0.8
0
5.5
−30
30
0
70
−40
85
V
V
°C
NOTE 5: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 5 and Figure 4)
PARAMETER
ICC
Supply current
TEST CONDITIONS
No load,
VCC = 5 V,
TA = 25°C
MIN
TYP
MAX
11
20
UNIT
mA
NOTE 5: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 5 and Figure 4)
PARAMETER
TEST CONDITIONS
MIN
TYP
VOH
VOL
High-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = GND
5
9
Low-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = VCC
−5
−9
IIH
IIL
High-level input current
Low-level input current
VI = VCC
VI at 0 V
IOS†
Short-circuit output current
VCC = 5.5 V,
VO = 0 V
MAX
UNIT
V
V
µA
15
200
−15
−200
µA
±10
±60
mA
ro
Output resistance
VCC, V+, and V− = 0 V,
VO = ±2 V
300
W
† Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 5: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 5 and Figure 4)
PARAMETER
TEST CONDITIONS
MIN
TYP†
MAX
UNIT
Maximum data rate
CL = 50 to 1000 pF,
One DOUT switching,
RL = 3 kΩ to 7 kΩ,
See Figure 1
tPLH (D)
Propagation delay time,
low- to high-level output
CL = 2500 pF,
All drivers loaded,
RL = 3 kΩ,
See Figure 1
2
µs
tPHL (D)
Propagation delay time,
high- to low-level output
CL = 2500 pF,
All drivers loaded,
RL = 3 kΩ,
See Figure 1
2
µs
tsk(p)
Pulse skew§
CL = 150 pF to 2500 pF,
See Figure 2
RL = 3 kΩ to 7 kΩ,
300
ns
SR(tr)
Slew rate, transition region
(see Figure 1)
CL = 50 pF to 2500 pF,
VCC = 5 V
RL = 3 kΩ to 7 kΩ,
120
3
kbit/s
6
30
V/µs
TYP
UNIT
±15
kV
† All typical values are at VCC = 5 V, and TA = 25°C.
§ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 5: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
ESD protection
PIN
DOUT, RIN
4
TEST CONDITIONS
Human-Body Model
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 5 and Figure 4)
PARAMETER
TEST CONDITIONS
VOH
VOL
High-level output voltage
VIT+
VIT−
Positive-going input threshold voltage
Vhys
ri
Input hysteresis (VIT+ − VIT−)
MIN
IOH = −1 mA
IOL = 1.6 mA
Low-level output voltage
Negative-going input threshold voltage
Input resistance
TYP
MAX
UNIT
3.5
VCC = 5 V, TA = 25°C
VCC = 5 V, TA = 25°C
VCC = 5 V
VI = ±3 V to ±25 V,
V
1.7
VCC = 5 V,
TA = 25°C
0.4
V
2.4
V
0.8
1.2
0.2
0.5
1
V
V
3
5
7
kW
NOTE 5: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 5 and Figure 3)
PARAMETER
TEST CONDITIONS
tPLH (R)
tPHL (R)
Propagation delay time, low- to high-level output
tsk(p)
Pulse skew‡
CL= 150 pF
Propagation delay time, high- to low-level output
MIN
TYP†
MAX
0.5
10
µs
0.5
10
µs
300
UNIT
ns
† All typical values are at VCC = 5 V, and TA = 25°C.
‡ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 5: Test conditions are C1−C4 = 0.1 µF, at VCC = 5 V ± 0.5 V.
PARAMETER MEASUREMENT INFORMATION
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50 Ω
RL
1.5 V
0V
tPHL (D)
CL
(see Note A)
Output
tPLH (D)
3V
−3 V
TEST CIRCUIT
SR(tr) +
t
PHL (D)
6V
or t
3V
−3 V
VOH
VOL
VOLTAGE WAVEFORMS
PLH (D)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006
PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPHL (D)
tPLH (D)
VOH
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
Input
3V
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
CL
(see Note A)
tPHL (R)
tPLH (R)
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006
APPLICATION INFORMATION
DOUT2
DOUT1
1
24
2
23
DOUT3
RIN3
5 kΩ
RIN2
3
22
5 kΩ
ROUT2
5V
4
400 kΩ
21
5V
20
400 kΩ
DIN1
ROUT1
ROUT3
5
DIN4
DOUT4
5V
400 kΩ
6
19
DIN3
5V
400 kΩ
RIN1
GND
+
18
7
DIN2
5 kΩ
8
17
16
0.1 µF
−
5 kΩ
9
0.1 µF
6.3V
V−
+
10
11
0.1 µF
6.3V
C1+
C2−
15
−
V+
−
+
12
C2+
C1−
+
14
+
−
RIN4
0.1 µF
16V
VCC
−
ROUT4
0.1 µF
16 V
13
NOTES: A. Resistor values shown are nominal.
B. Non-polarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
Figure 4. Typical Operating Circuit and Capacitor Values
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006
APPLICATION INFORMATION
capacitor selection
The capacitor type used for C1−C4 is not critical for proper operation. The MAX208 requires 0.1-µF capacitors,
although capacitors up to 10 µF can be used without harm. Ceramic dielectrics are suggested for the 0.1-µF
capacitors. When using the minimum recommended capacitor values, ensure that the capacitance value does
not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2)
nominal value. The capacitors’ effective series resistance (ESR), which usually rises at low temperatures,
influences the amount of ripple on V+ and V−.
Use larger capacitors (up to 10 µF) to reduce the output impedance at V+ and V−.
Bypass VCC to ground with at least 0.1 µF. In applications sensitive to power-supply noise generated by the
charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump
capacitors (C1−C4).
ESD protection
TI MAX208 devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of ±15 kV when powered down.
ESD test conditions
ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for
a reliability report that documents test setup, methodology, and results.
Human-Body Model (HBM)
The HBM of ESD testing is shown in Figure 5, while Figure 6 shows the current waveform that is generated
during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage
of concern and subsequently discharged into the DUT through a 1.5-kΩ resistor.
RD
1.5 kΩ
VHBM
+
−
CS
100 pF
DUT
Figure 5. HBM ESD Test Circuit
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
± SLLS596B − OCTOBER 2003 − REVISED JUNE 2006
APPLICATION INFORMATION
1.5
VHBM = 2 kV
DUT = 10 V, 1-Ω Zener Diode
I DUT − A
1.0
0.5
0.0
0
50
100
150
200
Time − ns
Figure 6. Typical HBM Current Waveform
Machine Model (MM)
The MM ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the
MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of
manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC
board assembly, the MM test no longer is as pertinent to the RS-232 pins.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
MAX208CDB
ACTIVE
SSOP
DB
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208CDBG4
ACTIVE
SSOP
DB
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208CDBR
ACTIVE
SSOP
DB
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208CDBRG4
ACTIVE
SSOP
DB
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208CDW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208CDWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208CDWR
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208CDWRE4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208CNT
PREVIEW
PDIP
NT
24
15
TBD
Call TI
MAX208IDB
ACTIVE
SSOP
DB
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208IDBE4
ACTIVE
SSOP
DB
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208IDBR
ACTIVE
SSOP
DB
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208IDBRE4
ACTIVE
SSOP
DB
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208IDW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208IDWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208IDWR
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208IDWRE4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX208INT
PREVIEW
PDIP
NT
24
15
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2006
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDI004 – OCTOBER 1994
NT (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
PINS **
A
24
28
A MAX
1.260
(32,04)
1.425
(36,20)
A MIN
1.230
(31,24)
1.385
(35,18)
B MAX
0.310
(7,87)
0.315
(8,00)
B MIN
0.290
(7,37)
0.295
(7,49)
DIM
24
13
0.280 (7,11)
0.250 (6,35)
1
12
0.070 (1,78) MAX
B
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0°– 15°
0.010 (0,25) M
0.010 (0,25) NOM
4040050 / B 04/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power Wireless www.ti.com/lpw
Mailing Address:
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2006, Texas Instruments Incorporated
Similar pages