TI CD74HCT161 High-speed cmos logic presettable counter Datasheet

[ /Title
(CD74
HC161
,
CD74
HCT16
1,
CD74
HC163
,
CD74
HCT16
3)
/Subject
(High
Speed
CMOS
Logic
Presettable
Counte
rs)
/Autho
r ()
/Keywords
(High
Speed
CMOS
Logic
Presettable
Counte
rs,
High
Speed
The CD54HCT161 is obsolete
and no longer is supplied.
CD54/74HC161, CD54/74HCT161,
CD54/74HC163, CD54/74HCT163
Data sheet acquired from Harris Semiconductor
SCHS154D
High-Speed CMOS Logic
Presettable Counters
February 1998 - Revised October 2003
Features
Two count enables, PE and TE, in each counter are
provided for n-bit cascading. In all counters reset action
occurs regardless of the level of the SPE, PE and TE inputs
(and the clock input, CP, in the ’HC161 and ’HCT161
types).
• ’HC161, ’HCT161 4-Bit Binary Counter,
Asynchronous Reset
• ’HC163, ’HCT163 4-Bit Binary Counter,
Synchronous Reset
If a decade counter is preset to an illegal state or assumes
an illegal state when power is applied, it will return to the
normal sequence in one count as shown in state diagram.
• Synchronous Counting and Loading
• Two Count Enable Inputs for n-Bit Cascading
The look-ahead carry feature simplifies serial cascading of
the counters. Both count enable inputs (PE and TE) must
be high to count. The TE input is gated with the Q outputs
of all four stages so that at the maximum count the terminal
count (TC) output goes high for one clock period. This TC
pulse is used to enable the next cascaded stage.
• Look-Ahead Carry for High-Speed Counting
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55oC to 125oC
• Balanced Propagation Delay and Transition Times
Ordering Information
• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
PART NUMBER
TEMP. RANGE
(oC)
PACKAGE
CD54HC161F3A
-55 to 125
16 Ld CERDIP
CD54HC163F3A
-55 to 125
16 Ld CERDIP
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
CD54HCT163F3A
-55 to 125
16 Ld CERDIP
CD74HC161E
-55 to 125
16 Ld PDIP
CD74HC161M
-55 to 125
16 Ld SOIC
CD74HC161MT
-55 to 125
16 Ld SOIC
Description
CD74HC161M96
-55 to 125
16 Ld SOIC
The ’HC161, ’HCT161, ’HC163, and ’HCT163 are
presettable synchronous counters that feature look-ahead
carry logic for use in high-speed counting applications. The
’HC161 and ’HCT161 are asynchronous reset decade and
binary counters, respectively; the ’HC163 and ’HCT163
devices are decade and binary counters, respectively, that
are reset synchronously with the clock. Counting and
parallel presetting are both accomplished synchronously
with the negative-to-positive transition of the clock.
CD74HC163E
-55 to 125
16 Ld PDIP
CD74HC163M
-55 to 125
16 Ld SOIC
CD74HC163MT
-55 to 125
16 Ld SOIC
CD74HC163M96
-55 to 125
16 Ld SOIC
CD74HCT161E
-55 to 125
16 Ld PDIP
CD74HCT161M
-55 to 125
16 Ld SOIC
A low level on the synchronous parallel enable input, SPE,
disables counting operation and allows data at the P0 to P3
inputs to be loaded into the counter (provided that the
setup and hold requirements for SPE are met).
CD74HCT161MT
-55 to 125
16 Ld SOIC
CD74HCT161M96
-55 to 125
16 Ld SOIC
CD74HCT163E
-55 to 125
16 Ld PDIP
CD74HCT163M
-55 to 125
16 Ld SOIC
CD74HCT163MT
-55 to 125
16 Ld SOIC
CD74HCT163M96
-55 to 125
16 Ld SOIC
All counters are reset with a low level on the Master Reset
input, MR. In the ’HC163 and ’HCT163 counters
(synchronous reset types), the requirements for setup and
hold time with respect to the clock must be met.
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel. The suffix T denotes a small-quantity reel of
250.
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
1
CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163
Pinout
CD54HC161, CD54HCT161, CD54HC163, CD54HCT163
(CERDIP)
CD74HC161, CD74HCT161, CD74HC163, CD74HCT163
(PDIP, SOIC)
TOP VIEW
MR 1
16 VCC
CP 2
15 TC
P0 3
14 Q0
P1 4
13 Q1
P2 5
12 Q2
P3 6
11 Q3
PE 7
10 TE
9 SPE
GND 8
Functional Diagram
P0
3
SPE
CP
MR
PE
TE
P1
4
P2
5
P3
6
9
14
2
13
1
12
7
11
10
15
2
Q0
Q1
Q2
Q3
TC
CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163
MODE SELECT - FUNCTION TABLE FOR ’HC161 AND ’HCT161
INPUTS
OPERATING MODE
OUTPUTS
MR
CP
PE
TE
SPE
Pn
Qn
TC
Reset (Clear)
L
X
X
X
X
X
L
L
Parallel Load
H
↑
X
X
l
l
L
L
H
↑
X
X
l
h
H
(Note 1)
Count
H
↑
h
h
h (Note 3)
X
Count
(Note 1)
Inhibit
H
X
I (Note 2)
X
h (Note 3)
X
qn
(Note 1)
H
X
X
I (Note 2)
h (Note 3)
X
qn
L
MODE SELECT - FUNCTION TABLE FOR ’HC163 AND ’HCT163
INPUTS
OPERATING MODE
OUTPUTS
MR
CP
PE
TE
SPE
Pn
Qn
TC
Reset (Clear)
l
↑
X
X
X
X
L
L
Parallel Load
h (Note 3)
↑
X
X
l
l
L
L
h (Note 3)
↑
X
X
l
h
H
(Note 1)
Count
h (Note 3)
↑
h
h
h (Note 3)
X
Count
(Note 1)
Inhibit
h (Note 3)
X
I (Note 2)
X
h (Note 3)
X
qn
(Note 1)
h (Note 3)
X
X
I (Note 2)
h (Note 3)
X
qn
L
H = High voltage level steady state; L = Low voltage level steady state; h = High voltage level one setup time prior to the Low-to-High clock
transition; l = Low voltage level one setup time prior to the Low-to-High clock transition; X = Don’t Care; q = Lower case letters indicate the
state of the referenced output prior to the Low-to-High clock transition; ↑ = Low-to-High clock transition.
NOTES:
1. The TC output is High when TE is High and the counter is at Terminal Count (HHHH for HC/HCT161 and ’HC/HCT163).
2. The High-to-Low transition of PE or TE on the ’HC/HCT161 and the ’HC/HCT163 should only occur while CP is HIGH for conventional
operation.
3. The Low-to-High transition of SPE on the ’HC/HCT161 and SPE or MR on the ’HC/HCT163 should only occur while CP is HIGH for
conventional operation.
3
CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, IO
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Thermal Resistance (Typical, Note 4)
θJA (oC/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .
67
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .
73
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
4. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
VIH
-
-
2
1.5
-
-
1.5
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
-
1.5
-
V
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
II
VCC or
GND
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-
-
-
-
-
-
-
-
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
-
-
-
-
-
-
-
-
-
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
-
6
-
-
±0.1
-
±1
-
±1
µA
4
CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
ICC
VCC or
GND
0
6
-
-
8
-
80
-
160
µA
High Level Input
Voltage
VIH
-
-
4.5 to
5.5
2
-
-
2
-
2
-
V
Low Level Input
Voltage
VIL
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
High Level Output
Voltage
CMOS Loads
VOH
VIH or VIL
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
±0.1
-
±1
-
±1
µA
PARAMETER
Quiescent Device
Current
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
II
VCC and
GND
0
5.5
-
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
∆ICC
(Note 5)
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
NOTE:
5. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
P0 - P3
0.25
PE
0.65
CP
1.05
MR
0.8
SPE
0.5
TE
1.05
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g.,
360µA max at 25oC.
5
CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163
Prerequisite For Switching Specifications
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
TEST
CONDITIONS
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
fMAX
-
2
6
-
-
5
-
4
-
MHz
4.5
30
-
-
24
-
20
-
MHz
6
35
-
-
28
-
24
-
MHz
2
80
-
-
100
-
120
-
ns
4.5
16
-
-
20
-
24
-
ns
6
14
-
-
17
-
20
-
ns
HC TYPES
Maximum CP Frequency
(Note 6)
CP Width (Low)
MR Pulse Width (161)
Setup Time, Pn to CP
Setup Time, PE or TE to CP
Setup Time, SPE to CP
Setup Time, MR to CP (163)
Hold Time, PN to CP
Hold Time, TE or PE to CP
Hold Time, SPE to CP
Recovery Time, MR to CP (161)
tW(L)
tW
tSU
tSU
tSU
tSU
tH
tH
tH
tREC
-
-
-
-
-
-
-
-
-
-
2
100
-
-
125
-
150
-
ns
4.5
20
-
-
25
-
30
-
ns
6
17
-
-
21
-
26
-
ns
2
60
-
-
75
-
90
-
ns
4.5
12
-
-
15
-
18
-
ns
6
10
-
-
13
-
15
-
ns
2
50
-
-
65
-
75
-
ns
4.5
10
-
-
13
-
15
-
ns
6
9
-
-
11
-
13
-
ns
2
60
-
-
75
-
90
-
ns
4.5
12
-
-
15
-
18
-
ns
6
10
-
-
13
-
15
-
ns
2
65
-
-
80
-
100
-
ns
4.5
13
-
-
16
-
20
-
ns
6
11
-
-
14
-
17
-
ns
2
3
-
-
3
-
3
-
ns
4.5
3
-
-
3
-
3
-
ns
6
3
-
-
3
-
3
-
ns
2
0
-
-
0
-
0
-
ns
4.5
0
-
-
0
-
0
-
ns
6
0
-
-
0
-
0
-
ns
2
0
-
-
0
-
0
-
ns
4.5
0
-
-
0
-
0
-
ns
6
0
-
-
0
-
0
-
ns
2
75
-
-
95
-
110
-
ns
4.5
15
-
-
19
-
22
-
ns
6
13
-
-
16
-
19
-
ns
6
CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163
Prerequisite For Switching Specifications
(Continued)
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
TEST
CONDITIONS
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
Maximum CP Frequency
fMAX
-
4.5
30
-
-
24
-
20
-
MHz
CP Width (Low) (Note 6)
tW(L)
-
4.5
16
-
-
20
-
24
-
ns
MR Pulse Width (161)
tW
-
4.5
20
-
-
25
-
30
-
ns
Setup Time, Pn to CP
tSU
-
4.5
10
-
-
13
-
15
-
ns
Setup Time, PE or TE to CP
tSU
-
4.5
13
-
-
16
-
20
-
ns
Setup Time, SPE to CP
tSU
-
4.5
12
-
-
15
-
18
-
ns
Setup Time, MR to CP (163)
tSU
-
4.5
13
-
-
16
-
20
-
ns
Hold Time, PN to CP
tH
-
4.5
5
-
-
5
-
5
-
ns
Hold Time, TE or PE to CP
tH
-
4.5
3
-
-
3
-
3
-
ns
Hold Time, SPE to CP
tH
-
4.5
3
-
-
3
-
3
-
ns
tREC
-
4.5
15
-
-
19
-
22
-
ns
PARAMETER
HCT TYPES
Recovery Time, MR to CP (161)
NOTE:
6. Applies to non-cascaded operation only. With cascaded counters clock to terminal count propagation delays, count enables (PE or TE)to-clock setup times, and count enables (PE or TE)-to-clock hold times determine maximum clock frequency. For example with these HC
devices:
1
1
f MAX (CP) = ----------------------------------------------------------------------------------------------------------------------------------------------------- = ----------------------------- ≈ 21MHz ( min )
CP-to-TC prop. delay + TE-to-CP setup + TE-to-CP Hold 37 + 10 + 0
Switching Specifications
CL = 50pF, Input tr, tf = 6ns
-40oC TO
85oC
25oC
PARAMETER
SYMBOL
TEST
CONDITIONS
tPHL, tPLH
CL = 50pF
-55oC TO
125oC
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
185
-
230
-
280
ns
4.5
-
-
37
-
46
-
56
ns
CL = 15pF
5
-
15
-
-
-
-
-
ns
CL = 50pF
6
-
-
31
-
39
-
48
ns
CL = 50pF
2
-
-
185
-
230
-
280
ns
4.5
-
-
37
-
46
-
56
ns
CL = 15pF
5
-
15
-
-
-
-
-
ns
CL = 50pF
6
-
-
31
-
39
-
48
ns
CL = 50pF
2
-
-
120
-
150
-
180
ns
4.5
-
-
24
-
30
-
36
ns
CL = 15pF
5
-
9
-
-
-
-
-
ns
CL = 50pF
6
-
-
20
-
26
-
31
ns
HC TYPES
Propagation Delay
CP to TC
CP to Qn
TE to TC
tPHL, tPLH
tPHL, tPLH
7
CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163
Switching Specifications
CL = 50pF, Input tr, tf = 6ns (Continued)
-40oC TO
85oC
25oC
PARAMETER
MR to Qn (161)
MR to TC (161)
Output Transition Time
-55oC TO
125oC
SYMBOL
TEST
CONDITIONS
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tPHL
CL = 50pF
2
-
-
210
-
265
-
315
ns
4.5
-
-
42
-
53
-
63
ns
CL = 15pF
5
-
18
-
-
-
-
-
ns
CL = 50pF
6
-
-
36
-
45
-
54
ns
CL = 50pF
2
-
-
210
-
265
-
315
ns
4.5
-
-
42
-
53
-
63
ns
CL = 50pF
6
-
-
36
-
45
-
54
ns
CL = 50pF
2
-
-
75
-
95
-
110
ns
4.5
-
-
15
-
19
-
22
ns
6
-
-
13
-
16
-
19
ns
tPHL
tTHL, tTLH
Power Dissipation Capacitance
(Notes 7, 8)
CPD
-
5
-
60
-
-
-
-
-
pF
Input Capacitance
CIN
CL = 50pF
-
10
-
10
-
10
-
10
pF
tPHL, tPLH
CL = 50pF
4.5
-
-
42
-
53
-
63
ns
CL = 15pF
5
-
18
-
-
-
-
-
ns
CL = 50pF
4.5
-
-
39
-
49
-
59
ns
CL = 15pF
5
-
16
-
-
-
-
-
ns
CL = 50pF
4.5
-
-
32
-
40
-
48
ns
CL = 15pF
5
-
13
-
-
-
-
-
ns
CL = 50pF
4.5
-
-
50
-
63
-
75
ns
CL = 15pF
5
-
21
-
-
-
-
-
ns
HCT TYPES
Propagation Delay
CP to TC
CP to Qn
TE to TC
MR to Qn (161)
tPHL, tPLH
tPHL, tPLH
tPHL
MR to TC (161)
tPHL
CL = 50pF
4.5
-
-
50
-
63
-
75
ns
Output Transition Time
tTHL, tTLH
CL = 50pF
4.5
-
-
15
-
19
-
22
ns
Power Dissipation Capacitance
(Notes 7, 8)
CPD
-
5
-
63
-
-
-
-
-
pF
Input Capacitance
CIN
CL = 50pF
-
10
-
10
-
10
-
10
pF
NOTES:
7. CPD is used to determine the dynamic power consumption, per package.
8. PD = CPD VCC2 fi + ∑(CL VCC2 fO) where fi = Input Frequency, fO = Output Frequency, CL = Output Load Capacitance, VCC = Supply
Voltage.
8
CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163
Timing Diagram
MASTER RESET (161)
(ASYNCHRONOUS)
MASTER RESET (163)
(SYNCHRONOUS)
SPE
P0
PRESET
DATA
INPUTS
P1
P2
P3
CP (161)
CP (163)
COUNT
ENABLES
PE
TE
Q0
Q1
OUTPUTS
Q2
Q3
TC
12
RESET
13
14
15
0
COUNT
PRESET
Sequence illustrated on waveforms:
1. Reset outputs to zero.
2. Preset to binary twelve.
3. Count to thirteen, fourteen, fifteen, zero, one, and two.
4. Inhibit.
9
1
2
INHIBIT
CD54/74HC161, CD54/74HCT161, CD54/74HC163, CD54/74HCT163
Test Circuits and Waveforms
tWL + tWH =
tfCL
trCL
50%
10%
10%
tf = 6ns
tr = 6ns
tTLH
1.3V
10%
INVERTING
OUTPUT
tPHL
FIGURE 3. HC TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
tPLH
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
trCL
tfCL
VCC
tfCL
GND
1.3V
0.3V
GND
tH(H)
tH(L)
VCC
DATA
INPUT
3V
2.7V
CLOCK
INPUT
50%
tH(H)
tTLH
90%
tPLH
10%
GND
tTHL
90%
50%
10%
90%
3V
2.7V
1.3V
0.3V
GND
tTHL
trCL
tWH
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
INPUT
INVERTING
OUTPUT
GND
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
VCC
90%
50%
10%
1.3V
1.3V
tWL
tf = 6ns
tPHL
1.3V
0.3V
0.3V
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
INPUT
2.7V
tWH
tr = 6ns
DATA
INPUT
50%
tH(L)
3V
1.3V
1.3V
1.3V
GND
tSU(H)
tSU(H)
tSU(L)
tTLH
90%
OUTPUT
tTHL
90%
50%
10%
tTLH
90%
1.3V
OUTPUT
tREM
3V
SET, RESET
OR PRESET
GND
tTHL
1.3V
10%
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
tPHL
1.3V
GND
IC
CL
50pF
GND
90%
tPLH
50%
IC
tSU(L)
tPHL
tPLH
I
fCL
3V
GND
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
tREM
VCC
SET, RESET
OR PRESET
tfCL = 6ns
CLOCK
50%
50%
tWL
CLOCK
INPUT
tWL + tWH =
trCL = 6ns
VCC
90%
CLOCK
I
fCL
CL
50pF
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
10
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD54HC161F
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HC161F3A
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
1
TBD
A42 SNPB
N / A for Pkg Type
TBD
Call TI
TBD
A42 SNPB
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
CD54HC163F3A
ACTIVE
CDIP
J
16
CD54HCT161F3A
OBSOLETE
CDIP
J
16
CD54HCT163F
ACTIVE
CDIP
J
16
CD54HCT163F3A
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
CD74HC161E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC161EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC161M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC161M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC161M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC161M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC161ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC161MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC161MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC161MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC161MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC163E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC163EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC163M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC163M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC163M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC163M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC163ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC163MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC163MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC163MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
1
Addendum-Page 1
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD74HC163MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT161E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT161EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT161M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT161M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT161M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT161M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT161ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT161MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT161MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT161MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT161MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT163E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT163EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT163M
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT163M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT163M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT163M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT163ME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT163MG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT163MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT163MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT163MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
Lead/Ball Finish
MSL Peak Temp (3)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2008
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD74HC161M96
D
16
SITE 27
330
16
6.5
10.3
2.1
8
16
Q1
CD74HC163M96
D
16
SITE 27
330
16
6.5
10.3
2.1
8
16
Q1
CD74HCT161M96
D
16
SITE 27
330
16
6.5
10.3
2.1
8
16
Q1
CD74HCT163M96
D
16
SITE 27
330
16
6.5
10.3
2.1
8
16
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2008
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
CD74HC161M96
D
16
SITE 27
342.9
345.9
28.58
CD74HC163M96
D
16
SITE 27
342.9
345.9
28.58
CD74HCT161M96
D
16
SITE 27
342.9
345.9
28.58
CD74HCT163M96
D
16
SITE 27
342.9
345.9
28.58
Pack Materials-Page 2
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