ON NSDEMP11XV6T5G Common anode quad array switching diode Datasheet

NSDEMP11XV6T1,
NSDEMP11XV6T5
Common Anode Quad
Array Switching Diode
These Common Anode Epitaxial Planar QUAD Diodes are
designed for use in ultra high speed switching applications. The
NSDEMP11XV6T1 device is housed in the SOT−563 package which
is designed for low power surface mount applications, where board
space is at a premium.
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(2)
(3)
(1)
Features
• Fast trr
• Low CD
• These are Pb−Free Devices
(4)
(5)
(6)
MAXIMUM RATINGS (TA = 25°C)
Rating
Reverse Voltage
Peak Reverse Voltage
Forward Current
Peak Forward Current
Peak Forward Surge Current
Symbol
Value
Unit
VR
80
Vdc
VRM
80
Vdc
IF
100
mAdc
1
IFM
300
mAdc
IFSM
(Note 1)
2.0
Adc
Symbol
Max
Unit
PD
357
(Note 2)
2.9
(Note 2)
mW
SOT−563
CASE 463A
PLASTIC
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Total Device Dissipation
TA = 25°C
MARKING DIAGRAM
Derate above 25°C
Thermal Resistance, Junction-to-Ambient
RqJA
350
(Note 2)
°C/W
Characteristic
(Both Junctions Heated)
Symbol
Max
Unit
PD
500
(Note 2)
4.0
(Note 2)
mW
Total Device Dissipation
TA = 25°C
Derate above 25°C
Thermal Resistance, Junction-to-Ambient
Junction and Storage Temperature
RqJA
TJ, Tstg
May, 2006 − Rev. 3
P9 = Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
mW/°C
250
(Note 2)
°C/W
−55 to
+150
°C
ORDERING INFORMATION
Device
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. t = 1 mS
2. FR−4 @ Minimum Pad
© Semiconductor Components Industries, LLC, 2006
P9 M G
G
mW/°C
1
NSDEMP11XV6T1
Package
Shipping †
SOT−563* 4000/Tape & Reel
NSDEMP11XV6T1G SOT−563* 4000/Tape & Reel
NSDEMP11XV6T5
SOT−563* 8000/Tape & Reel
NSDEMP11XV6T5G SOT−563* 8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*This package is inherently Pb−Free.
Publication Order Number:
NSDEMP11XV6T1/D
NSDEMP11XV6T1, NSDEMP11XV6T5
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic
Symbol
Condition
Min
Max
Unit
Reverse Voltage Leakage Current
IR
VR = 70 V
−
0.1
mAdc
Forward Voltage
VF
IF = 100 mA
−
1.2
Vdc
Reverse Breakdown Voltage
VR
IR = 100 mA
0
−
Vdc
Diode Capacitance
CD
VR = 6.0 V, f = 1.0 MHz
−
3.5
pF
trr (Note 3)
IF = 5.0 mA, VR = 6.0 V, RL = 100 W, Irr = 0.1 IR
−
4.0
ns
Reverse Recovery Time
3. trr Test Circuit for NSDEMP11XV6T1 in Figure 4.
TYPICAL ELECTRICAL CHARACTERISTICS
10
IR , REVERSE CURRENT (μA)
TA = 85°C
10
TA = −40°C
1.0
0.1
TA = 25°C
0.2
0.4
0.6
0.8
1.0
VF, FORWARD VOLTAGE (VOLTS)
TA = 125°C
1.0
TA = 85°C
0.1
TA = 55°C
0.01
0.001
1.2
TA = 150°C
TA = 25°C
0
10
Figure 1. Forward Voltage
50
20
30
40
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Reverse Current
1.75
CD, DIODE CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
100
1.5
1.25
1.0
0.75
0
2
4
6
8
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Diode Capacitance
tr
tp
t
IF
trr
t
10%
A
RL
Irr = 0.1 IR
90%
VR
tp = 2 ms
tr = 0.35 ns
INPUT PULSE
RECOVERY TIME EQUIVALENT TEST CIRCUIT
Figure 4. Reverse Recovery Time Test Circuit for the NSDEMP11XV6T1
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2
IF = 5.0 mA
VR = 6 V
RL = 100 W
OUTPUT PULSE
NSDEMP11XV6T1, NSDEMP11XV6T5
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A−01
ISSUE F
D
−X−
6
1
e
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
A
L
5
4
2
3
E
−Y−
HE
b 65 PL
0.08 (0.003)
DIM
A
b
C
D
E
e
L
HE
C
M
X Y
MILLIMETERS
MIN
NOM MAX
0.50
0.55
0.60
0.17
0.22
0.27
0.08
0.12
0.18
1.50
1.60
1.70
1.10
1.20
1.30
0.5 BSC
0.10
0.20
0.30
1.50
1.60
1.70
INCHES
NOM MAX
0.021 0.023
0.009 0.011
0.005 0.007
0.062 0.066
0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN
0.020
0.007
0.003
0.059
0.043
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NSDEMP11XV6T1/D
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