MCNIX MX27C256TC-90 256k-bit [32k x 8] cmos eprom Datasheet

MX27C256
256K-BIT [32K x 8] CMOS EPROM
FEATURES
•
•
•
•
•
•
32K x 8 organization
Single +5V power supply
+12.5V programming voltage
Fast access time: 45/55/70/90/100/120/150 ns
Totally static operation
Completely TTL compatible
• Operating current: 30mA
• Standby current: 100uA
• Package type:
- 28 pin plastic DIP
- 32 pin PLCC
- 28 pin 8 x 13.4mm TSOP(I)
GENERAL DESCRIPTION
The MX27C256 is a 5V only, 256K-bit, One-Time
Programmable Read Only Memory. It is organized as
32K by 8 bits, operates from a single + 5volt supply, has
a static standby mode, and features fast single address
location programming. All programming signals are TTL
levels, requiring a single pulse. For programming from
outside the system, existing EPROM programmers
may be used. The MX27C256 supports intelligent fast
programming algorithm which can result in programming time of less than ten seconds.
PIN CONFIGURATIONS
BLOCK DIAGRAM
PDIP
A6
32
30
29
A9
A4
A11
A2
NC
9
25
MX27C256
OE
A1
A10
A0
CE
21
20
Q4
Q3
17
Q6
22
23
24
25
26
27
28
1
2
3
4
5
6
7
P/N: PM0203
MX27C256
.
.
.
.
.
.
.
.
VCC
GND
Y-DECODER
X-DECODER
.
.
.
.
.
.
.
.
Y-SELECT
256K BIT
CELL
MAXTRIX
VPP
PIN DESCRIPTION
8 x 13.4mm 28-TSOP(I)
OE
A11
A9
A8
A13
A14
VCC
VPP
A12
A7
A6
A5
A4
A3
Q0~Q7
Q5
13
14
NC
Q0
A0~A14
ADDRESS
INPUTS
Q7
NC
OUTPUT
BUFFERS
A8
A5
A3
CONTROL
LOGIC
CE
OE
A13
1
A14
VCC
VPP
A12
4
NC
5
GND
VCC
A14
A13
A8
A9
A11
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
Q2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Q1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
A7
PLCC
MX27C256
VPP
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
This EPROM is packaged in industry standard 28 pin
dual-in-line packages, 32 lead PLCC, and 28 lead
TSOP(I) packages.
21
20
19
18
17
16
15
14
13
12
11
10
9
8
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
1
SYMBOL
PIN NAME
A0~A14
Address Input
Q0~Q7
Data Input/Output
CE
Chip Enable Input
OE
Output Enable Input
VPP
Program Supply Voltage
NC
No Internal Connection
VCC
Power Supply Pin (+5V)
GND
Ground Pin
REV. 5.6, AUG. 26, 2003
MX27C256
FUNCTIONAL DESCRIPTION
AUTO IDENTIFY MODE
THE PROGRAMMING OF THE MX27C256
The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of
automatically matching the device to be programmed
with its corresponding programming algorithm. This
mode is functional in the 25°C ± 5°C ambient
temperature range that is required when programming
the MX27C256.
When the MX27C256 is delivered, or it is erased, the
chip has all 256K bits in the "ONE" or HIGH state.
"ZEROs" are loaded into the MX27C256 through the
procedure of programming.
For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.
VCC must be applied simultaneously or before VPP, and
removed simultaneously or after VPP. When
programming an MXIC EPROM, a 0.1uF capacitor is
required across VPP and ground to suppress spurious
voltage transients which may damage the device.
To activate this mode, the programming equipment
must force 12.0 ± 0.5 (VH) on address line A9 of the
device. Two identifier bytes may then be sequenced
from the device outputs by toggling address line A0 from
VIL to VIH. All other address lines must be held at VIL
during auto identify mode.
FAST PROGRAMMING
Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For the
MX27C256, these two identifier bytes are given in the
Mode Select Table. All identifiers for manufacturer and
device codes will possess odd parity, with the MSB (Q7)
defined as the parity bit.
The device is set up in the fast programming mode when
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and OE = VIH (Algorithm is shown in
Figure 1). The programming is achieved by applying a
single TTL low level 100us pulse to the CE input after
addresses and data line are stable. If the data is not
verified, an additional pulse is applied for a maximum of
25 pulses. This process is repeated while sequencing
through each address of the device. When the
programming mode is completed, the data in all address
is verified at VCC = VPP = 5V ± 10%.
READ MODE
The MX27C256 has two control functions, both of which
must be logically satisfied in order to obtain data at the
outputs. Chip Enable (CE) is the power control and
should be used for device selection. Output Enable
(OE) is the output control and should be used to gate
data to the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tOE after the falling edge
of OE, assuming that CE has been LOW and addresses
have been stable for at least tACC - tOE.
PROGRAM INHIBIT MODE
Programming of multiple MX27C256s in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27C256 may be common. A
TTL low-level program pulse applied to an MX27C256
CE input with VPP = 12.5 ± 0.5 V and OE HIGH will
program that MX27C256. A high-level CE input inhibits
the other MX27C256s from being programmed.
STANDBY MODE
The MX27C256 has a CMOS standby mode which
reduces the maximum Vcc current to 100 uA. It is
placed in CMOS standby when CE is at VCC ± 0.3 V.
The MX27C256 also has a TTL-standby mode which
reduces the maximum VCC current to 1.5 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.
PROGRAM VERIFY MODE
Verification should be performed on the programmed
bits to determine that they were correctly programmed.
The verification should be performed with CE and OE
at VIL, and VPP at its programming voltage.
REV.5.6, AUG. 26, 2003
P/N:PM0203
2
MX27C256
TWO-LINE OUTPUT CONTROL FUNCTION
SYSTEM CONSIDERATIONS
To accommodate multiple memory connections, a twoline control function is provided to allow for:
During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
VCC and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between Vcc and GND for each eight devices. The
location of the capacitor should be close to where the
power supply is connected to the array.
1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur.
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connected to the READ line from the system control bus.
This assures that all deselected memory devices are in
their low-power standby mode and that the output pins
are only active when data is desired from a particular
memory device.
MODE SELECT TABLE
PINS
MODE
CE
OE
A0
A9
VPP
OUTPUTS
Read
VIL
VIL
X
X
VCC
DOUT
Output Disable
VIL
VIH
X
X
VCC
High Z
Standby (TTL)
VIH
X
X
X
VCC
High Z
Standby (CMOS)
VCC±0.3V
X
X
X
VCC
High Z
Program
VIL
VIH
X
X
VPP
DIN
Program Verify
VIH
VIL
X
X
VPP
DOUT
Program Inhibit
VIH
VIH
X
X
VPP
High Z
Manufacturer Code(3)
VIL
VIL
VIL
VH
VCC
C2H
Device Code(3)
VIL
VIL
VIH
VH
VCC
10H
NOTES:
1. VH = 12.0 V ± 0.5 V
2. X = Either VIH or VIL
3. A1 - A8 = A10 - A14 = VIL (For auto select)
4. See DC Programming characteristics for VPP voltage during programming.
REV.5.6, AUG. 26, 2003
P/N:PM0203
3
MX27C256
FIGURE 1. FAST PROGRAMMING FLOW CHART
START
ADDRESS = FIRST LOCATION
VCC = 6.25V
VPP = 12.75V
X=0
PROGRAM ONE 100us PULSE
INCREMENT X
INTERACTIVE
SECTION
YES
X = 25?
NO
FAIL
VERIFY BYTE
?
PASS
NO
LAST ADDRESS
INCREMENT ADDRESS
FAIL
YES
VCC = VPP = 5.25V
VERIFY SECTION
VERIFY ALL BYTES
?
FAIL
DEVICE FAILED
PASS
DEVICE PASSED
REV.5.6, AUG. 26, 2003
P/N:PM0203
4
MX27C256
SWITCHING TEST CIRCUITS
DEVICE
UNDER
TEST
1.8K ohm
+5V
DIODES = IN3064
OR EQUIVALENT
CL
6.2K ohm
CL = 100 pF including jig capacitance(30pF for 45/55/70ns parts)
SWITCHING TEST WAVEFORMS
2.0V
2.0V
TEST POINTS
AC driving levels
0.8V
0.8V
OUTPUT
INPUT
AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade, 3.0V/0V for industrial grade.
Input pulse rise and fall times are < 10ns.
1.5V
AC driving levels
1.5V
TEST POINTS
OUTPUT
INPUT
AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade.
Input pulse rise and fall times are < 10ns.
(2) For MX27C256-45, MX27C256-55, MX27C256-70.
REV.5.6, AUG. 26, 2003
P/N:PM0203
5
MX27C256
ABSOLUTE MAXIMUM RATINGS
RATING
VALUE
Ambient Operating Temperature
-40oC to 85oC
Storage Temperature
-65oC to 125oC
Applied Input Voltage
-0.5V to 7.0V
Applied Output Voltage
-0.5V to VCC + 0.5V
VCC to Ground Potential
-0.5V to 7.0V
A9 & Vpp
-0.5V to 13.5V
NOTICE:
Stresses greater than those listed under ABSOLUTE
MAXIMUM RATINGS may cause permanent damage to the
device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for
extended period may affect reliability.
NOTICE:
Specifications contained within the following tables are subject to change.
DC/AC Operating Conditions for Read Operation
MX27C256
-45
Operating
Commercial 0°C to 70°C
Temperature
Industrial
Vcc Power Supply
-55
0°C to 70°C
-70
-90
0°C to 70°C
-10
0°C to 70°C
-12
0°C to 70°C
-15
0°C to 70°C
0°C to 70°C
-45°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C
-40°C to 85°C -40°C to 85°C -40°C to 85°C
5V ± 10%
5V ±10%
5V ± 10%
5V ± 10%
5V ± 10%
5V ± 10%
5V ± 10%
DC CHARACTERISTICS
SYMBOL
PARAMETER
VOH
Output High Voltage
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
MIN.
MAX.
UNIT
CONDITIONS
V
IOH = -0.4mA
0.4
V
IOL = 2.1mA
2.0
VCC + 0.5
V
Input Low Voltage
-0.3
0.8
V
ILI
Input Leakage Current
-10
10
uA
VIN = 0 to 5.5V
ILO
Output Leakage Current
-10
10
uA
VOUT = 0 to 5.5V
ICC3
VCC Power-Down Current
100
uA
CE = VCC ± 0.3V
ICC2
VCC Standby Current
1.5
mA
CE = VIH
ICC1
VCC Active Current
30
mA
CE = VIL, f=5MHz, Iout =0mA
IPP
VPP Supply Current Read
10
uA
CE = OE = VIL, VPP = 5.5V
2.4
CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only)
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
CONDITIONS
CIN
Input Capacitance
8
12
pF
VIN = 0V
COUT
Output Capacitance
8
12
pF
VOUT = 0V
VPP
VPP Capacitance
18
25
pF
VPP = 0V
REV.5.6, AUG. 26, 2003
P/N:PM0203
6
MX27C256
AC CHARACTERISTICS
27C256-45
27C256-55
27C256-70
27C256-90
MIN.
MIN.
MIN.
MIN.
SYMBOL
PARAMETER
MAX.
MAX.
MAX.
MAX. UNIT CONDITIONS
tACC
Address to Output Delay
45
55
70
90
ns
CE = OE = VIL
tCE
Chip Enable to Output Delay
45
55
70
90
ns
OE = VIL
tOE
Output Enable to Output
22
30
35
40
ns
CE = VIL
25
ns
Delay
tDF
OE High to Output Float,
0
16
0
20
0
20
0
or CE High to Output Float
tOH
Output Hold from Address,
0
0
0
0
27C256-10
27C256-12
27C256-15
ns
CE or OE which ever occurred
first
SYMBOL
PARAMETER
MIN.
MAX.
tACC
Address to Output Delay
100
tCE
Chip Enable to Output Delay
tOE
Output Enable to Output
MIN.
MAX.
MIN.
MAX.
UNIT
CONDITIONS
120
150
ns
CE = OE = VIL
100
120
150
ns
OE = VIL
45
50
55
ns
CE = VIL
50
ns
Delay
tDF
OE High to Output Float,
0
30
0
35
0
or CE High to Output Float
tOH
Output Hold from Address,
0
0
0
ns
CE or OE which ever occurred
first
DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL
PARAMETER
VOH
Output High Voltage
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
MIN.
MAX.
UNIT
CONDITIONS
V
IOH = -0.40mA
0.4
V
IOL = 2.1mA
2.0
VCC + 0.5
V
Input Low Voltage
-0.3
0.8
V
ILI
Input Leakage Current
-10
10
uA
VH
A9 Auto Select Voltage
11.5
12.5
V
ICC3
VCC Supply Current(Program & Verify)
40
mA
IPP2
VPP Supply Current(Program)
30
mA
VCC1
Fast Programming Supply Voltage
6.00
6.50
V
VPP1
Fast Programming Voltage
12.5
13.0
V
2.4
VIN = 0 to 5.5V
CE = VIL, OE = VIH
REV.5.6, AUG. 26, 2003
P/N:PM0203
7
MX27C256
AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL
PARAMETER
MIN.
tAS
Address Setup Time
2.0
us
tOES
OE Setup Time
2.0
us
tDS
Data Setup Time
2.0
us
tAH
Address Hold Time
0
us
tDH
Data Hold Time
2.0
us
tDFP
Output Enable to Output Float Delay
tVPS
VPP Setup Time
2.0
us
tVCS
VCC Setup Time
2.0
us
tOE
Data Valid from OE
tPW
PGM Program Pulse Width
0
95
MAX.
130
UNIT
CONDITIONS
ns
150
ns
105
us
REV.5.6, AUG. 26, 2003
P/N:PM0203
8
MX27C256
WAVEFORMS
READ CYCLE
ADDRESS
INPUTS
DATA ADDRESS
tACC
CE
tCE
OE
tDF
DATA
OUT
VALID DATA
tOE
tOH
FAST PROGRAMMING ALGORITHM WAVEFORM
PROGRAM
PROGRAM VERIFY
VIH
Addresses
VIL
DATA
tAH
Hi-z
tAS
DATA OUT VALID
DATA IN STABLE
tDS
tDFP
tDH
VPP1
VPP
VCC
tVPS
VCC1
VCC
tVCS
VCC
VIH
CE
VIL
tOES
tPW
OE
tOE
Max
VIH
VIL
REV.5.6, AUG. 26, 2003
P/N:PM0203
9
MX27C256
ORDERING INFORMATION
PLASTIC PACKAGE
PART NO.
ACCESS TIME(ns)
OPERATING
STANDBY
OPERATING
CURRENT MAX.(mA)
CURRENT MAX.(uA)
TEMPERATURE
PACKAGE
MX27C256PC-45
45
30
100
0°C to 70°C
MX27C256QC-45
45
30
100
0°C to 70°C
28 Pin DIP
32 Pin PLCC
MX27C256TC-45
45
30
100
0°C to 70°C
28 Pin TSOP(I)
MX27C256PC-55
55
30
100
0°C to 70°C
28 Pin DIP
MX27C256QC-55
55
30
100
0°C to 70°C
32 Pin PLCC
MX27C256TC-55
55
30
100
0°C to 70°C
28 Pin TSOP(I)
MX27C256PC-70
70
30
100
0°C to 70°C
28 Pin DIP
MX27C256QC-70
70
30
100
0°C to 70°C
32 Pin PLCC
MX27C256TC-70
70
30
100
0°C to 70°C
28 Pin TSOP(I)
MX27C256PC-90
90
30
100
0°C to 70°C
28 Pin DIP
MX27C256QC-90
90
30
100
0°C to 70°C
32 Pin PLCC
MX27C256TC-90
90
30
100
0°C to 70°C
28 Pin TSOP(I)
MX27C256PC-10
100
30
100
0°C to 70°C
28 Pin DIP
MX27C256QC-10
100
30
100
0°C to 70°C
32 Pin PLCC
MX27C256TC-10
100
30
100
0°C to 70°C
28 Pin TSOP(I)
MX27C256PC-12
120
30
100
0°C to 70°C
28 Pin DIP
MX27C256QC-12
120
30
100
0°C to 70°C
32 Pin PLCC
MX27C256TC-12
120
30
100
0°C to 70°C
28 Pin TSOP(I)
MX27C256PC-15
150
30
100
0°C to 70°C
28 Pin DIP
MX27C256QC-15
150
30
100
0°C to 70°C
32 Pin PLCC
MX27C256TC-15
150
30
100
0°C to 70°C
28 Pin TSOP(I)
MX27C256PI-45
45
30
100
-40°C to 85°C
28 Pin DIP
MX27C256QI-45
45
30
100
-40°C to 85°C
32 Pin PLCC
MX27C256TI-45
45
30
100
-40°C to 85°C
28 Pin TSOP(I)
MX27C256PI-55
55
30
100
-40°C to 85°C
28 Pin DIP
MX27C256QI-55
55
30
100
-40°C to 85°C
32 Pin PLCC
MX27C256TI-55
55
30
100
-40°C to 85°C
28 Pin TSOP(I)
MX27C256PI-70
70
30
100
-40°C to 85°C
28 Pin DIP
MX27C256QI-70
70
30
100
-40°C to 85°C
32 Pin PLCC
MX27C256TI-70
70
30
100
-40°C to 85°C
28 Pin TSOP(I)
MX27C256PI-90
90
30
100
-40°C to 85°C
28 Pin DIP
MX27C256QI-90
90
30
100
-40°C to 85°C
32 Pin PLCC
MX27C256TI-90
90
30
100
-40°C to 85°C
28 Pin TSOP(I)
MX27C256PI-10
100
30
100
-40°C to 85°C
28 Pin DIP
MX27C256QI-10
100
30
100
-40°C to 85°C
32 Pin PLCC
MX27C256TI-10
100
30
100
-40°C to 85°C
28 Pin TSOP(I)
MX27C256PI-12
120
30
100
-40°C to 85°C
28 Pin DIP
MX27C256QI-12
120
30
100
-40°C to 85°C
32 Pin PLCC
MX27C256TI-12
120
30
100
-40°C to 85°C
28 Pin TSOP(I)
MX27C256PI-15
150
30
100
-40°C to 85°C
28 Pin DIP
MX27C256QI-15
150
30
100
-40°C to 85°C
32 Pin PLCC
MX27C256TI-15
150
30
100
-40°C to 85°C
28 Pin TSOP(I)
REV.5.6, AUG. 26, 2003
P/N:PM0203
10
MX27C256
PACKAGE INFORMATION
REV.5.6, AUG. 26, 2003
P/N:PM0203
11
MX27C256
REV.5.6, AUG. 26, 2003
P/N:PM0203
12
MX27C256
REV.5.6, AUG. 26, 2003
P/N:PM0203
13
MX27C256
REVISION HISTORY
Revision No. Description
5.0
1) Reduce operating current from 40mA to 30mA.
2) Add 28-TSOP(I) and 28-SOP packages offering.
3) Eliminate Interactive Programming Mode.
5.1
1) IPP1 100uA ----> 10uA
5.2
Cancel ceramic DIP package type
5.3
Remove 28-pin SOP Package
Package Information format changed
5.4
Remove "ultraviolet erasable" wording
5.5
To modify Package Information
5.6
To modify 32-PLCC package information
A1: from 0.50mm(0.020 inch)/nom. to 0.58mm(0.023 inch)/nom.
from 0.66mm(0.026 inch)/nom. to 0.81mm(0.032 inch)/nom.
Page
Date
6/16/1997
P1,2,10,12
P1,10
P11~13
P1
P11~13
P12
7/17/1997
FEB/25/2000
SEP/19/2001
APR/24/2002
NOV/19/2002
AUG/26/2003
REV.5.6, AUG. 26, 2003
P/N:PM0203
14
MX27C256
MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-6688
FAX:+886-3-563-2888
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TEL:+32-2-456-8020
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TEL:+65-348-8385
FAX:+65-348-8096
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TEL:+1-408-453-8088
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