Production specification Surface mount switching diode BAS116 FEATURES Pb z Low leakage current applications. z Medium speed switching times. z Surface mount package ideally suited for automatic Lead-free Insertion. APPLICATIONS z High speed switching application. SOT-23 ORDERING INFORMATION Type No. Marking Package Code BAS116 JV SOT-23 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Characteristic Symbol Limits Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Reverse Voltage VRRM VRWM VR 85 V RMS Reverse Voltage VR(RMS) 60 V Forward Continuous Current IFM 215 mA Repetitive Peak Forward Current IFRM 500 mA Non-Repetitive Peak Forward Surge Current @t=1.0μs @t=1.0ms @t=1.0s IFSM Power Dissipation Pd 250 mW Thermal Resistance Junction to Ambient Air RθJA 500 ℃/W Operating Junction Temperature Range Tj 150 ℃ Storage Temperature Range TSTG -65 to +150 ℃ C031 Rev.A 4.0 1.0 0.5 A www.gmicroelec.com 1 Production specification Surface mount switching diode BAS116 ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified Characteristic Symbol Min Typ MAX UNIT Test Condition Reverse Breakdown Voltage V(BR)R 85 - - V IR= 100μA V IF=1mA IF=10mA IF=50mA IF=150mA Forward Voltage VFM - - 0.9 1.0 1.1 1.25 Reverse Leakage Current IR - - 5.0 80 nA VR=75V VR=75V,Tj=150℃ Junction Capacitance Cj - 2 - pF VR=0V,f=1.0MHz Reverse Recovery Time trr - - 3 ns IF=IR=10mAIrr=0.1*IR TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified C031 Rev.A www.gmicroelec.com 2 Production specification Surface mount switching diode BAS116 PACKAGE OUTLINE Plastic surface mounted package SOT-23 SOT-23 A E K B J D G Dim Min Max A 2.70 3.10 B 1.10 1.50 C 1.0 Typical D 0.4 Typical E 0.35 0.48 G 1.80 2.00 H 0.02 0.1 J H C K 0.1 Typical 2.20 2.60 All Dimensions in mm SOLDERING FOOTPRINT 0.95 0.95 2.00 0.90 0.80 Unit : mm PACKAGE INFORMATION Device Package Shipping BAS116 SOT-23 3000/Tape&Reel C031 Rev.A www.gmicroelec.com 3