TOSHIBA TC74HCT273AF

TC74HCT273AP/AF
TOSHIBA CMOS Digital Integrated Circuit
Silicon Monolithic
TC74HCT273AP,TC74HCT273AF
Octal D-Type Flip Flop with Clear
The TC74HCT273A is a high speed CMOS OCTAL D-TYPE
FLIP FLOP fabricated with silicon gate C2MOS technology.
It achieves the high speed operation similar to equivalent
LSTTL while maintaining the CMOS low power dissipation.
Their inputs are compatible with TTL, NMOS, and CMOS
output voltage levels.
Information signals applied to D inputs are transferred to the
Q outputs on the positive going edge of the clock pulse.
When the CLR input is held “L”, the Q outputs are at a low
logic level independent of the other inputs.
All inputs are equipped with protection circuits against static
discharge or transient excess voltage.
TC74HCT273AP
TC74HCT273AF
Features
•
High speed: fmax = 90 MHz (typ.) at VCC = 5 V
•
Low power dissipation: ICC = 4 μA (max) at Ta = 25°C
•
Compatible with TTL outputs: VIH = 2.0 V (min)
•
Wide interfacing ability: LSTTL, NMOS, CMOS
•
Output drive capability: 10 LSTTL loads
•
•
Symmetrical output impedance: |IOH| = IOL = 4 mA (min)
∼ tpHL
Balanced propagation delays: tpLH −
•
Pin and function compatible with 74LS273
VIL = 0.8 V (max)
Weight
DIP20-P-300-2.54A
SOP20-P-300-1.27A
: 1.30 g (typ.)
: 0.22 g (typ.)
Pin Assignment
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TC74HCT273AP/AF
IEC Logic Symbol
Truth Table
Inputs
Output
Function
CLR
D
CK
Q
L
X
X
L
Clear
H
L
L
⎯
H
H
H
⎯
H
X
Qn
No Change
X: Don’t care
System Diagram
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Absolute Maximum Ratings (Note 1)
Characteristics
Supply voltage range
Symbol
Rating
Unit
VCC
−0.5~7
V
VIN
−0.5~VCC + 0.5
V
VOUT
−0.5~VCC + 0.5
V
Input diode current
IIK
±20
mA
Output diode current
IOK
±20
mA
DC output current
IOUT
±25
mA
DC VCC/ground current
ICC
±50
mA
Power dissipation
PD
500 (DIP) (Note 2)/180 (SOP)
mW
Storage temperature
Tstg
−65~150
°C
DC input voltage
DC output voltage
Note 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or
even destruction.
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 2: 500 mW in the range of Ta = −40~65°C. From Ta = 65 to 85°C a derating factor of −10 mW/°C shall be
applied until 300 mW.
Operating Ranges (Note)
Characteristics
Supply voltage
Input voltage
Symbol
Rating
Unit
VCC
4.5~5.5
V
VIN
0~VCC
V
VOUT
0~VCC
V
Operating temperature
Topr
−40~85
°C
Input rise and fall time
tr, tf
0~500
ns
Output voltage
Note:
The operating ranges must be maintained to ensure the normal operation of the device.
Unused inputs must be tied to either VCC or GND.
Electrical Characteristics
DC Characteristics
Ta = 25°C
Test Condition
Characteristics
Symbol
Ta = −40~85°C
VCC
(V)
Min
Typ.
Max
Min
Max
Unit
High-level input
voltage
VIH
⎯
4.5~
5.5
2.0
⎯
⎯
2.0
⎯
V
Low-level input
voltage
VIL
⎯
4.5~
5.5
⎯
⎯
0.8
⎯
0.8
V
High-level output
voltage
VOH
IOH = −20 μA
VIN
= VIH or
IOH = −4 mA
VIL
4.5
4.4
4.5
⎯
4.4
⎯
4.5
4.18
4.31
⎯
4.13
⎯
Low-level output
voltage
VOL
IOL = 20 μA
VIN
= VIH or
IOL = 4 mA
VIL
4.5
⎯
0.0
0.1
⎯
0.1
4.5
⎯
0.17
0.26
⎯
0.33
VIN = VCC or GND
5.5
⎯
⎯
±0.1
⎯
±1.0
μA
VIN = VCC or GND
5.5
⎯
⎯
4.0
⎯
40.0
μA
5.5
⎯
⎯
2.0
⎯
2.9
mA
Input leakage
current
Quiescent supply
current
IIN
ICC
IC
Per input: VIN = 0.5 V or 2.4 V
Other input: VCC or GND
3
V
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Timing Requirements (input: tr = tf = 6 ns)
Characteristics
Symbol
Minimum pulse width
tW (L)
(CK)
tW (H)
Minimum pulse width
Limit
Limit
4.5
⎯
15
19
5.5
⎯
14
17
4.5
⎯
15
19
5.5
⎯
14
17
4.5
⎯
10
13
5.5
⎯
10
13
4.5
⎯
5
6
5.5
⎯
10
13
4.5
⎯
10
13
5.5
⎯
9
12
4.5
⎯
30
24
5.5
⎯
35
28
Test Condition
Min
Typ.
Max
Unit
⎯
⎯
4
8
ns
⎯
⎯
15
25
ns
⎯
⎯
18
28
ns
⎯
40
90
⎯
MHz
⎯
Minimum set-up time
ts
⎯
Minimum hold time
th
⎯
trem
⎯
f
⎯
( CLR )
Clock frequency
Unit
Typ.
⎯
Minimum removal time
Ta =
−40
~85°C
VCC (V)
tW (L)
( CLR )
Ta = 25°C
Test Condition
ns
ns
ns
ns
ns
MHz
AC Characteristics (CL = 15 pF, VCC = 5 V, Ta = 25°C, input: tr = tf = 6 ns)
Characteristics
Output transition time
Symbol
tTLH
tTHL
Propagation delay time
tpLH
(CK-Q)
tpHL
Propagation delay time
tpHL
( CLR -Q)
tpHL
Maximum clock frequency
fmax
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AC Characteristics (CL = 50 pF, input: tr = tf = 6 ns)
Ta = 25°C
Test Condition
Characteristics
Output transition time
Symbol
tTLH
tTHL
Propagation delay
time
tpLH
(CK-Q)
tpHL
Propagation delay
time
tpLH
( CLR -Q)
tpHL
Maximum clock
frequency
fmax
Input capacitance
CIN
Power dissipation
capacitance
CPD
Note:
(Note)
Ta = −40~85°C
Unit
VCC
(V)
Min
Typ.
Max
Min
Max
4.5
⎯
9
15
⎯
19
5.5
⎯
8
14
⎯
18
4.5
⎯
19
30
⎯
38
5.5
⎯
17
27
⎯
34
4.5
⎯
22
32
⎯
40
5.5
⎯
18
29
⎯
36
4.5
30
71
⎯
24
⎯
5.5
35
81
⎯
28
⎯
⎯
⎯
5
10
⎯
10
pF
⎯
⎯
29
⎯
⎯
⎯
pF
⎯
⎯
⎯
⎯
ns
ns
ns
MHz
CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating
current consumption without load.
Average operating current can be obtained by the equation:
ICC (opr) = CPD・VCC・fIN + ICC/8 (per flip flop)
And the total CPD when n pcs. of flip flop operate can be gained by the following equation:
CPD (total) = 18 + 11・n
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Package Dimensions
Weight: 1.30 g (typ.)
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Package Dimensions
Weight: 0.22 g (typ.)
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TC74HCT273AP/AF
RESTRICTIONS ON PRODUCT USE
20070701-EN GENERAL
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
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document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
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