LIGITEK LMD5711-2F9UG-XX-PF Dot matrix digit led display (1.2inch) Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
DOT MATRIX DIGIT LED DISPLAY (1.2Inch)
Pb
Lead-Free Parts
LMD5711/2F9UG-XX-PF
DATA SHEET
DOC. NO
:
QW0905- LMD5711/2F9UG-XX-PF
REV.
:
A
DATE
: 22 - Feb. - 2007
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/8
PART NO. LMD5711/2F9UG-XX-PF
Package Dimensions
8.1
(0.32")
22.6(0.89")
31.7
(1.25")
4.57*6=27.42
(1.08")
0.2
4.57*4=
18.28(0.72")
ψ3.0(0.118")
LMD5711/2F9UG-XX-PF
LIGITEK
3.25±0.5
ψ0.51
TYP
2.0*8=16(0.63")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
22.86
(0.9")
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PART NO. LMD5711/2F9UG-XX-PF
Page 2/8
Internal Circuit Diagram
LMD5711F9UG-XX-PF
COLUMN
1
2
3
4
5
1
2
13
12
10
1
2
3
4
5
1
2
13
12
10
ROW PIN
1 16
2 15
3 17
4 14
5
8
6
5
7
6
LMD5712F9UG-XX-PF
COLUMN
ROW PIN
1 16
2 15
3 17
4 14
5
8
6
5
7
6
3,4,7,9,11,18PIN NC
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PART NO. LMD5711/2F9UG-XX-PF
Page 3/8
Electrical Connection
PIN NO.
LMD5711F9UG-XX-PF
PIN NO.
LMD5712F9UG-XX-PF
1
Cathode Column 1 (Green)
1
Anode Column 1 (Green)
2
Cathode Column 2 (Green)
2
Anode Column 2 (Green)
3
NO CONNECT
3
NO CONNECT
4
NO CONNECT
4
NO CONNECT
5
Anode Row 6
5
Cathode Row 6
6
Anode Row 7
6
Cathode Row 7
7
NO CONNECT
7
NO CONNECT
8
Anode Row 5
8
Cathode Row 5
9
NO CONNECT
9
NO CONNECT
10
Cathode Column 5 (Green)
10
Anode Column 5 (Green)
11
NO CONNECT
11
NO CONNECT
12
Cathode Column 4 (Green)
12
Anode Column 4 (Green)
13
Cathode Column 3 (Green)
13
Anode Column 3 (Green)
14
Anode Row 4
14
Cathode Row 4
15
Anode Row 2
15
Cathode Row 2
16
Anode Row 1
16
Cathode Row 1
17
Anode Row 3
17
Cathode Row 3
18
NO CONNECT
18
NO CONNECT
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LMD5711/2F9UG-XX-PF
Page 4/8
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
9UG
Forward Current
IF
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
60
mA
Power Dissipation
PD
75
mW
Ir
10
μA
Electrostatic Discharge( * )
ESD
2000
V
Operating Temperature
Topr
-25 ~ +85
℃
Storage Temperature
Tstg
-25 ~ +85
℃
Reverse Current @5V
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Part Selection And Application Information(Ratings at 25℃)
Electrical
common
λD △λ
Vf(v)
Iv(mcd)
IV-M
cathode
(nm) (nm)
Material Emitted or anode
Min. Typ. Max. Min. Typ.
CHIP
PART NO
LMD5711F9UG-XX-PF
AlGaInP
Green
Common
Cathode
Green
Common
Anode
574
20
1.7
2.1
2.6
8.5 15.25
2:1
LMD5712F9UG-XX-PF
AlGaInP
574
20
1.7
2.1
Note : 1.The forward voltage data did not including ± 0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
2.6
8.5 15.25
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LMD5711/2F9UG-XX-PF
Page 5/8
Test Condition For Each Parameter
Symbol
Unit
Test Condition
Forward Voltage Per Chip
Vf
volt
If=20mA
Luminous Intensity Per Chip
Iv
mcd
If=10mA
Dominant Wavelength
λD
nm
If=20mA
Spectral Line Half-Width
△λ
nm
If=20mA
Ir
μA
Vr=5V
Parameter
Reverse Current Any Chip
Luminous Intensity Matching Ratio
IV-M
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LMD5711/2F9UG-XX-PF
Page 6/8
Typical Electro-Optical Characteristics Curve
9UG CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0
1.0
2.0
3.0
4.0
1.0
5.0
10
Fig.4 Relative Intensity vs. Temperature
1.2
Relative Intensity @20mA
Normalize @25℃
Forward Voltage@20mA
Normaliz @25℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
Relative Intensity @20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
550
600
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
500
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
650
100
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LMD5711/2F9UG-XX-PF
Page 7/8
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350 ° C Max
Soldering Time:3 Seconds Max(One time only)
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260 °C
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260° C
Temp(°C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LMD5711/2F9UG-XX-PF
Page 8/8
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
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