Intersil ICL3245CB 1 microamp, 3v to 5.5v, 1mbps, rs-232 transceivers with enhanced automatic powerdown Datasheet

ICL3225, ICL3227, ICL3245
®
Data Sheet
June 2003
1 Microamp, +3V to +5.5V, 1Mbps, RS-232
Transceivers with Enhanced Automatic
Powerdown
The Intersil ICL32XX devices are 3.0V to 5.5V powered
RS-232 transmitters/receivers which meet ElA/TIA-232 and
V.28/V.24 specifications, even at VCC = 3.0V. Targeted
applications are PDAs, Palmtops, and notebook and laptop
computers where the low operational, and even lower
standby, power consumption is critical. Efficient on-chip
charge pumps, coupled with manual and enhanced
automatic powerdown functions, reduce the standby supply
current to a 1µA trickle. Small footprint packaging, and the
use of small, low value capacitors ensure board space
savings as well. Data rates greater than 1Mbps are
guaranteed at worst case load conditions. This family is fully
compatible with 3.3V only systems, mixed 3.3V and 5.0V
systems, and 5.0V only systems.
The ICL3245 is a 3 driver, 5 receiver device that provides a
complete serial port suitable for laptop or notebook
computers. It also includes a noninverting always-active
receiver for “wake-up” capability.
These devices, feature an enhanced automatic
powerdown function which powers down the on-chip powersupply and driver circuits. This occurs when all receiver and
transmitter inputs detect no signal transitions for a period of
30s. These devices power back up, automatically, whenever
they sense a transition on any transmitter or receiver input.
Table 1 summarizes the features of the device represented
by this data sheet, while Application Note AN9863
summarizes the features of each device comprising the
ICL32XX 3V family.
FN4878.4
Features
• ±15kV ESD Protected (Human Body Model)
• Manual and Enhanced Automatic Powerdown Features
• Drop in Replacements for MAX3225, MAX3227,
MAX3245
• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V
• Latch-Up Free
• On-Chip Voltage Converters Require Only Four External
0.1µF Capacitors
• Guaranteed Mouse Driveability (ICL3245)
• “Ready to Transmit” Indicator Output (ICL3225, ICL3227)
• Receiver Hysteresis For Improved Noise Immunity
• Guaranteed Minimum Data Rate . . . . . . . . . . . . . . 1Mbps
• Low Skew at Transmitter/Receiver Input Trip Points. . . 10ns
• Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . 24V/µs
• Wide Power Supply Range . . . . . . . Single +3V to +5.5V
• Low Supply Current in Powerdown State. . . . . . . . . . .1µA
Applications
• Any System Requiring RS-232 Communication Ports
- Battery Powered, Hand-Held, and Portable Equipment
- Laptop Computers, Notebooks, Palmtops
- Modems, Printers and other Peripherals
- Digital Cameras
- Cellular/Mobile Phones
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
NO. OF NO. OF
Tx.
Rx.
NO. OF
MONITOR Rx.
(ROUTB)
DATA
RATE
(kbps)
Rx. ENABLE
FUNCTION?
READY
OUTPUT?
MANUAL
POWERDOWN?
ENHANCED
AUTOMATIC
POWERDOWN
FUNCTION?
ICL3225
2
2
0
1000
No
Yes
Yes
Yes
ICL3227
1
1
0
1000
No
Yes
Yes
Yes
ICL3245
3
5
1
1000
No
No
Yes
Yes
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2003. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ICL3225, ICL3227, ICL3245
Pinout
Ordering Information
(NOTE 1)
PART NO.
TEMP.
RANGE (°C)
PACKAGE
ICL3225 (PDIP, SSOP)
TOP VIEW
PKG.
DWG. #
ICL3225CA
0 to 70
20 Ld SSOP
M20.209
ICL3225IA
-40 to 85
20 Ld SSOP
M20.209
READY 1
C1+ 2
19 VCC
3
18 GND
V+
ICL3225CP
0 to 70
20 Ld PDIP
E20.3
ICL3227CA
0 to 70
16 Ld SSOP
C1- 4
17 T1OUT
M16.209
C2+ 5
16 R1IN
C2- 6
15 R1OUT
ICL3227IA
-40 to 85
16 Ld SSOP
M16.209
ICL3245CA
0 to 70
28 Ld SSOP
M28.209
ICL3245IA
-40 to 85
28 Ld SSOP
M28.209
ICL3245CB
0 to 70
28 Ld SOIC
M28.3
ICL3245IB
-40 to 85
28 Ld SOIC
M28.3
ICL3245CV
0 to 70
28 Ld TSSOP
M28.173
ICL3245IV
-40 to 85
28 Ld TSSOP
M28.173
V- 7
13 T1IN
R2IN 9
12 T2IN
11 INVALID
ICL3227 (SSOP)
TOP VIEW
READY 1
1. Most surface mount devices are available on tape and reel; add
“-T” to suffix.
15 VCC
3
14 GND
V+
C1- 4
13 T1OUT
C2+ 5
12 FORCEON
C2- 6
11 T1IN
R1IN 8
ICL3245 (SOIC, SSOP, TSSOP)
TOP VIEW
C2+ 1
28 C1+
C2- 2
27 V+
3
26 VCC
R1IN 4
25 GND
R2IN 5
24 C1-
R3IN 6
23 FORCEON
R4IN 7
22 FORCEOFF
R5IN 8
21 INVALID
T1OUT 9
20 R2OUTB
T2OUT 10
19 R1OUT
T3OUT 11
18 R2OUT
T3IN 12
17 R3OUT
T2IN 13
16 R4OUT
T1IN 14
15 R5OUT
16 FORCEOFF
C1+ 2
V- 7
V-
14 FORCEON
T2OUT 8
R2OUT 10
NOTE:
2
20 FORCEOFF
10 INVALID
9 R1OUT
ICL3225, ICL3227, ICL3245
Pin Descriptions
PIN
VCC
FUNCTION
System power supply input (3.0V to 5.5V).
V+
Internally generated positive transmitter supply (+5.5V).
V-
Internally generated negative transmitter supply (-5.5V).
GND
Ground connection.
C1+
External capacitor (voltage doubler) is connected to this lead.
C1-
External capacitor (voltage doubler) is connected to this lead.
C2+
External capacitor (voltage inverter) is connected to this lead.
C2-
External capacitor (voltage inverter) is connected to this lead.
TIN
TTL/CMOS compatible transmitter Inputs.
TOUT
RS-232 level (nominally ±5.5V) transmitter outputs.
RIN
RS-232 compatible receiver inputs.
ROUT
TTL/CMOS level receiver outputs.
ROUTB
TTL/CMOS level, noninverting, always enabled receiver outputs.
INVALID
Active low output that indicates if no valid RS-232 levels are present on any receiver input.
READY
Active high output that indicates when the ICL32XXE is ready to transmit (i.e., V- ≤ -4V)
FORCEOFF Active low to shut down transmitters and on-chip power supply. This overrides any automatic circuitry and FORCEON (see Table 2).
FORCEON
Active high input to override automatic powerdown circuitry thereby keeping transmitters active. (FORCEOFF must be high).
Typical Operating Circuits
ICL3225
+3.3V
C1
0.1µF
C2
0.1µF
T1IN
T2IN
TTL/CMOS
LOGIC LEVELS
R1OUT
R2OUT
+
0.1µF
2
+
4
5
+
6
C1+
19
VCC
C1C2+
C2-
3
+ C3
0.1µF
V- 7
C4
0.1µF
+
V+
T1
13
17
T2
12
8
15
16
R1
5kΩ
R2
5kΩ
10
9
1
READY
14
FORCEOFF
INVALID
FORCEON
GND
18
3
20
11
T1OUT
T2OUT
R1IN
RS-232
LEVELS
R2IN
VCC
TO POWER
CONTROL LOGIC
ICL3225, ICL3227, ICL3245
Typical Operating Circuits
(Continued)
ICL3227
+3.3V
+
15
0.1µF
2
+
4
C1
0.1µF
C1+
3
VCC
V+
C15
C2+
+
6
C2-
C2
0.1µF
T1IN
V- 7
T1
13
9
R1OUT
C4
+ 0.1µF
11
TTL/CMOS
LOGIC LEVELS
+ C3
0.1µF
T1OUT
8
5kΩ
R1
1
R1IN
READY
16
VCC
FORCEOFF
12
RS-232
LEVELS
INVALID
FORCEON
GND
10
TO POWER
CONTROL LOGIC
14
ICL3245
+3.3V
+
26
0.1µF
28
C1
0.1µF
+
C2
0.1µF
C11
C2+
+
2
C2-
C1+
27
VCC
VT1
14
+
V+
24
3
C3
0.1µF
C4
0.1µF
+
9
T1IN
T1OUT
T2
13
10
T2IN
T2OUT
T3
12
RS-232
LEVELS
11
T3IN
T3OUT
20
R2OUTB
TTL/CMOS
LOGIC LEVELS
19
4
R1OUT
R1IN
R1
5kΩ
18
5
R2OUT
R2IN
R2
5kΩ
17
6
R3OUT
R3IN
R3
5kΩ
16
7
R4OUT
R4IN
R4
5kΩ
R5
5kΩ
15
8
R5OUT
R5IN
23
FORCEON
VCC
TO POWER
CONTROL LOGIC
22
FORCEOFF
21
INVALID
GND
25
4
RS-232
LEVELS
ICL3225, ICL3227, ICL3245
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
V- to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V
Input Voltages
TIN, FORCEOFF, FORCEON . . . . . . . . . . . . . . . . . . -0.3V to 6V
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V
ROUT, INVALID, READY . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical, Note 2)
θJA (oC/W)
20 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
80
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
75
16 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
145
20 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
135
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
100
28 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . .
125
Moisture Sensitivity (see Technical Brief TB363)
All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(SOIC, SSOP, TSSOP - Lead Tips Only)
Operating Conditions
Temperature Range
ICL32XXC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
ICL32XXI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
2. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified.
Typicals are at TA = 25oC
Electrical Specifications
TEMP
(oC)
MIN
TYP
MAX
UNITS
All RIN Open, FORCEON = GND, FORCEOFF = VCC
25
-
1.0
10
µA
Supply Current, Powerdown
FORCEOFF = GND
Supply Current,
Automatic Powerdown Disabled
All Outputs Unloaded,
FORCEON =
FORCEOFF = VCC
PARAMETER
TEST CONDITIONS
DC CHARACTERISTICS
Supply Current, Automatic
Powerdown
25
-
1.0
10
µA
ICL3245, VCC = 3.0V
25
-
0.3
1.0
mA
ICL322X, VCC = 3.15V
25
-
0.3
1.0
mA
LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold Low
TIN, FORCEON, FORCEOFF
Full
-
-
0.8
V
Input Logic Threshold High
TIN, FORCEON,
FORCEOFF
VCC = 3.3V
Full
2.0
-
-
V
VCC = 5.0V
Full
2.4
-
-
V
Transmitter Input Hysteresis
25
-
0.5
-
V
TIN, FORCEON, FORCEOFF
Full
-
±0.01
±1.0
µA
Output Leakage Current
FORCEOFF = GND
Full
-
±0.05
±10
µA
Output Voltage Low
IOUT = 1.6mA
Full
-
-
0.4
V
Output Voltage High
IOUT = -1.0mA
Full
-
V
Input Leakage Current
VCC -0.6 VCC -0.1
RECEIVER INPUTS
Input Voltage Range
Full
-25
-
25
V
Input Threshold Low
VCC = 3.3V
25
0.6
1.2
-
V
VCC = 5.0V
25
0.8
1.5
-
V
Input Threshold High
VCC = 3.3V
25
-
1.5
2.4
V
25
-
1.8
2.4
V
Input Hysteresis
VCC = 5.0V
25
-
0.5
-
V
Input Resistance
25
3
5
7
kΩ
5
ICL3225, ICL3227, ICL3245
Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified.
Typicals are at TA = 25oC (Continued)
Electrical Specifications
PARAMETER
TEST CONDITIONS
TEMP
(oC)
MIN
TYP
MAX
UNITS
-
V
TRANSMITTER OUTPUTS
Output Voltage Swing
All Transmitter Outputs Loaded with 3kΩ to Ground
Full
±5.0
±5.4
Output Resistance
VCC = V+ = V- = 0V, Transmitter Output = ±2V
Full
300
10M
-
Ω
Full
-
±35
±60
mA
VOUT = ±12V, VCC = 0V or 3V to 5.5V
Automatic Powerdown or FORCEOFF = GND
Full
-
-
±25
µA
T1IN = T2IN = GND, T3IN = VCC, T3OUT Loaded with
3kΩ to GND, T1OUT and T2OUT Loaded with 2.5mA
Each
Full
±5
-
-
V
Output Short-Circuit Current
Output Leakage Current
MOUSE DRIVEABILITY
Transmitter Output Voltage
(See Figure 11)
ENHANCED AUTOMATIC POWERDOWN (FORCEON = GND, FORCEOFF = VCC)
Receiver Input Thresholds to
INVALID High
See Figure 6
Full
-2.7
-
2.7
V
Receiver Input Thresholds to
INVALID Low
See Figure 6
Full
-0.3
-
0.3
V
INVALID, READY Output Voltage
Low
IOUT = 1.6mA
Full
-
-
0.4
V
INVALID, READY Output Voltage
High
IOUT = -1.0mA
Full
VCC-0.6
-
-
V
Receiver Positive or Negative
Threshold to INVALID High Delay
(tINVH)
25
-
1
-
µs
Receiver Positive or Negative
Threshold to INVALID Low Delay
(tINVL)
25
-
30
-
µs
Receiver or Transmitter Edge to
Transmitters Enabled Delay (tWU)
Note 3
25
-
100
-
µs
Receiver or Transmitter Edge to
Transmitters Disabled Delay
(tAUTOPWDN)
Note 3
Full
15
30
60
sec
CL = 1000pF
Full
250
-
-
kbps
VCC = 3V to 4.5V, CL = 250pF
Full
1000
-
-
kbps
VCC = 4.5V to 5.5V,
CL = 1000pF
Full
1000
-
-
kbps
tPHL
25
-
0.15
-
µs
tPLH
25
-
0.15
-
µs
TIMING CHARACTERISTICS
Maximum Data Rate
RL = 3kΩ, One
Transmitter Switching
Receiver Propagation Delay
Receiver Input to
Receiver Output, CL =
150pF
Receiver Output Enable Time
Normal Operation
25
-
200
-
ns
Receiver Output Disable Time
Normal Operation
25
-
200
-
ns
Transmitter Skew
tPHL - tPLH (Note 4)
25
-
25
-
ns
Receiver Skew
tPHL - tPLH (Note 4)
25
-
50
-
ns
Transition Region Slew Rate
VCC = 3.3V, RL = 3kΩ to 7kΩ, Measured from 3V to -3V
or -3V to 3V, CL = 150pF to 1000pF
25
24
-
150
V/µs
Human Body Model
25
-
±15
-
kV
IEC1000-4-2 Contact Discharge
25
-
±8
-
kV
IEC1000-4-2 Air Gap Discharge
25
-
>±8
-
kV
Human Body Model
25
-
±2.5
-
kV
ESD PERFORMANCE
RS-232 Pins (TOUT, RIN)
All Other Pins
NOTES:
3. An “edge” is defined as a transition through the transmitter or receiver input thresholds.
4. Skews are measured at the receiver input switching points (1.4V).
6
ICL3225, ICL3227, ICL3245
Detailed Description
These ICL32XX interface ICs operate from a single +3V to
+5.5V supply, guarantee a 1Mbps minimum data rate,
require only four small external 0.1µF capacitors, feature low
power consumption, and meet all ElA RS-232C and V.28
specifications. The circuit is divided into three sections: The
charge pump, the transmitters, and the receivers.
Charge-Pump
Intersil’s new ICL32XX family utilizes regulated on-chip dual
charge pumps as voltage doublers, and voltage inverters to
generate ±5.5V transmitter supplies from a VCC supply as
low as 3.0V. This allows these devices to maintain RS-232
compliant output levels over the ±10% tolerance range of
3.3V powered systems. The efficient on-chip power supplies
require only four small, external 0.1µF capacitors for the
voltage doubler and inverter functions at VCC = 3.3V. See
the “Capacitor Selection” section, and Table 3 for capacitor
recommendations for other operating conditions. The charge
pumps operate discontinuously (i.e., they turn off as soon as
the V+ and V- supplies are pumped up to the nominal
values), resulting in significant power savings.
receivers’ Schmitt trigger input stage uses hysteresis to
increase noise immunity and decrease errors due to slow
input signal transitions.
The ICL3245 inverting receivers disable during forced
(manual) powerdown, but not during automatic powerdown
(see Table 2). Conversely, the monitor receiver remains
active even during manual powerdown making it extremely
useful for Ring Indicator monitoring. Standard receivers
driving powered down peripherals must be disabled to
prevent current flow through the peripheral’s protection
diodes (see Figures 2 and 3). This renders them useless for
wake up functions, but the corresponding monitor receiver
can be dedicated to this task as shown in Figure 3.
VCC
RXOUT
RXIN
-25V ≤ VRIN ≤ +25V
5kΩ
GND
FIGURE 1. INVERTING RECEIVER CONNECTIONS
VCC
VCC
Transmitters
The transmitters are proprietary, low dropout, inverting
drivers that translate TTL/CMOS inputs to EIA/TIA-232
output levels. Coupled with the on-chip ±5.5V supplies,
these transmitters deliver true RS-232 levels over a wide
range of single supply system voltages.
Transmitter outputs disable and assume a high impedance
state when the device enters the powerdown mode (see
Table 2). These outputs may be driven to ±12V when
disabled.
All devices guarantee a 1Mbps data rate for full load
conditions (3kΩ and 250pF), VCC ≥ 3.0V, with one
transmitter operating at full speed. Under more typical
conditions of VCC ≥ 3.3V, RL = 3kΩ, and CL = 250pF, one
transmitter easily operates at 1.4Mbps. Transmitter skew is
extremely low on these devices, and is specified at the
receiver input trip points (1.4V), rather than the arbitrary 0V
crossing point typical of other RS-232 families.
Transmitter inputs float if left unconnected, and may cause
ICC increases. Connect unused inputs to GND for the best
performance.
GND ≤ VROUT ≤ VCC
CURRENT
FLOW
VCC
VOUT = VCC
Rx
POWERED
DOWN
UART
Tx
SHDN = GND
GND
OLD
RS-232 CHIP
FIGURE 2. POWER DRAIN THROUGH POWERED DOWN
PERIPHERAL
VCC
TRANSITION
DETECTOR
TO
WAKE-UP
LOGIC
ICL3245
VCC
Receivers
R2OUTB
All the ICL32XX devices contain standard inverting
receivers, but only the ICL3245 receivers can three-state,
via the FORCEOFF control line. Additionally, the ICL3245
includes a noninverting (monitor) receiver (denoted by the
ROUTB label) that is always active, regardless of the state of
any control lines. Both receiver types convert RS-232
signals to CMOS output levels and accept inputs up to ±25V
while presenting the required 3kΩ to 7kΩ input impedance
(see Figure 1) even if the power is off (VCC = 0V). The
7
RX
POWERED
DOWN
UART
VOUT = HI-Z
R2OUT
TX
R2IN
T1IN
T1OUT
FORCEOFF = GND
FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN
ICL3225, ICL3227, ICL3245
TABLE 2. POWERDOWN LOGIC TRUTH TABLE
RCVR OR
XMTR
EDGE
WITHIN
30s?
(NOTE 5)
FORCEOFF FORCEON TRANSMITTER RECEIVER
ROUTB
INPUT
INPUT
OUTPUTS
OUTPUTS OUTPUTS
RS-232
LEVEL
PRESENT
AT
RECEIVER
INPUT?
INVALID
OUTPUT
MODE OF OPERATION
ICL3225, ICL3227
NO
H
H
Active
Active
N.A.
No
L
NO
H
H
Active
Active
N.A.
Yes
H
YES
H
L
Active
Active
N.A.
No
L
YES
H
L
Active
Active
N.A.
Yes
H
NO
H
L
High-Z
Active
N.A.
No
L
NO
H
L
High-Z
Active
N.A.
Yes
H
X
L
X
High-Z
Active
N.A.
No
L
X
L
X
High-Z
Active
N.A.
Yes
H
Normal Operation (Enhanced
Auto Powerdown Disabled)
Normal Operation (Enhanced
Auto Powerdown Enabled)
Powerdown Due to Enhanced
Auto Powerdown Logic
Manual Powerdown
ICL322X - INVALID DRIVING FORCEON AND FORCEOFF (EMULATES AUTOMATIC POWERDOWN)
X
NOTE 6
NOTE 6
Active
Active
N.A.
Yes
H
Normal Operation
X
NOTE 6
NOTE 6
High-Z
Active
N.A.
No
L
Forced Auto Powerdown
Normal Operation (Enhanced
Auto Powerdown Disabled)
ICL3245
NO
H
H
Active
Active
Active
No
L
NO
H
H
Active
Active
Active
Yes
H
YES
H
L
Active
Active
Active
No
L
YES
H
L
Active
Active
Active
Yes
H
NO
H
L
High-Z
Active
Active
No
L
NO
H
L
High-Z
Active
Active
Yes
H
X
L
X
High-Z
High-Z
Active
No
L
X
L
X
High-Z
High-Z
Active
Yes
H
Normal Operation (Enhanced
Auto Powerdown Enabled)
Powerdown Due to Enhanced
Auto Powerdown Logic
Manual Powerdown
ICL3245 - INVALID DRIVING FORCEON AND FORCEOFF (EMULATES AUTOMATIC POWERDOWN)
X
NOTE 6
NOTE 6
Active
Active
Active
Yes
H
Normal Operation
X
NOTE 6
NOTE 6
High-Z
High-Z
Active
No
L
Forced Auto Powerdown
NOTES:
5. Applies only to the ICL3245.
6. Input is connected to INVALID Output.
Powerdown Functionality
This 3V family of RS-232 interface devices requires a
nominal supply current of 0.3mA during normal operation
(not in powerdown mode). This is considerably less than the
5mA to 11mA current required of 5V RS-232 devices. The
already low current requirement drops significantly when the
device enters powerdown mode. In powerdown, supply
current drops to 1µA, because the on-chip charge pump
turns off (V+ collapses to VCC, V- collapses to GND), and
the transmitter outputs three-state. Inverting receiver outputs
may or may not disable in powerdown; refer to Table 2 for
details. This micro-power mode makes these devices ideal
for battery powered and portable applications.
Software Controlled (Manual) Powerdown
These three devices allow the user to force the IC into the
low power, standby state, and utilize a two pin approach
8
where the FORCEON and FORCEOFF inputs determine the
IC’s mode. For always enabled operation, FORCEON and
FORCEOFF are both strapped high. To switch between
active and powerdown modes, under logic or software
control, only the FORCEOFF input need be driven. The
FORCEON state isn’t critical, as FORCEOFF dominates
over FORCEON. Nevertheless, if strictly manual control over
powerdown is desired, the user must strap FORCEON high
to disable the enhanced automatic powerdown circuitry.
ICL3245 inverting (standard) receiver outputs also disable
when the device is in powerdown, thereby eliminating the
possible current path through a shutdown peripheral’s input
protection diode (see Figures 2 and 3).
Connecting FORCEOFF and FORCEON together disables
the enhanced automatic powerdown feature, enabling them
to function as a manual SHUTDOWN input (see Figure 4).
ICL3225, ICL3227, ICL3245
floating (but pulled to GND by the internal receiver pull down
resistors), the INVALID logic detects the invalid levels and
drives the output low. The power management logic then uses
this indicator to power down the interface block. Reconnecting
the cable restores valid levels at the receiver inputs, INVALID
switches high, and the power management logic wakes up the
interface block. INVALID can also be used to indicate the DTR
or RING INDICATOR signal, as long as the other receiver
inputs are floating, or driven to GND (as in the case of a
powered down driver).
FORCEOFF
PWR
MGT
LOGIC
FORCEON
INVALID
ICL32XX
I/O
UART
CPU
VALID RS-232 LEVEL - INVALID = 1
2.7V
INDETERMINATE
FIGURE 4. CONNECTIONS FOR MANUAL POWERDOWN
WHEN NO VALID RECEIVER SIGNALS ARE
PRESENT
0.3V
INVALID LEVEL - INVALID = 0
-0.3V
With any of the above control schemes, the time required to
exit powerdown, and resume transmission is only 100µs.
When using both manual and enhanced automatic powerdown
(FORCEON = 0), the ICL32XX won’t power up from manual
powerdown until both FORCEOFF and FORCEON are driven
high, or until a transition occurs on a receiver or transmitter
input. Figure 5 illustrates a circuit for ensuring that the ICL32XX
powers up as soon as FORCEOFF switches high. The rising
edge of the Master Powerdown signal forces the device to
power up, and the ICL32XX returns to enhanced automatic
powerdown mode an RC time constant after this rising edge.
The time constant isn’t critical, because the ICL32XX remains
powered up for 30 seconds after the FORCEON falling edge,
even if there are no signal transitions. This gives slow-to-wake
systems (e.g., a mouse) plenty of time to start transmitting, and
as long as it starts transmitting within 30 seconds both systems
remain enabled.
POWER
MANAGEMENT
UNIT
MASTER POWERDOWN LINE
0.1µF
FORCEOFF
1MΩ
FORCEON
INDETERMINATE
-2.7V
VALID RS-232 LEVEL - INVALID = 1
FIGURE 6. DEFINITION OF VALID RS-232 RECEIVER LEVELS
Enhanced Automatic Powerdown
Even greater power savings is available by using these
devices which feature an enhanced automatic powerdown
function. When the enhanced powerdown logic determines
that no transitions have occurred on any of the transmitter
nor receiver inputs for 30 seconds, the charge pump and
transmitters powerdown, thereby reducing supply current to
1µA. The ICL32XX automatically powers back up whenever
it detects a transition on one of these inputs. This automatic
powerdown feature provides additional system power
savings without changes to the existing operating system.
Enhanced automatic powerdown operates when the
FORCEON input is low, and the FORCEOFF input is high.
Tying FORCEON high disables automatic powerdown, but
manual powerdown is always available via the overriding
FORCEOFF input. Table 2 summarizes the enhanced
automatic powerdown functionality.
ICL32XX
FORCEOFF
FIGURE 5. CIRCUIT TO ENSURE IMMEDIATE POWER UP
WHEN EXITING FORCED POWERDOWN
T_IN
EDGE
DETECT
S
INVALID Output
The INVALID output always indicates (see Table 2) whether or
not 30µs have elapsed with invalid RS-232 signals (see Figures
6 and 8) persisting on all of the receiver inputs, giving the user
an easy way to determine when the interface block should
power down. Invalid receiver levels occur whenever the driving
peripheral’s outputs are shut off (powered down) or when the
RS-232 interface cable is disconnected. In the case of a
disconnected interface cable where all the receiver inputs are
9
30s
TIMER
R_IN
AUTOSHDN
R
EDGE
DETECT
FORCEON
FIGURE 7. ENHANCED AUTOMATIC POWERDOWN LOGIC
ICL3225, ICL3227, ICL3245
RECEIVER
INPUTS
} INVALID
REGION
TRANSMITTER
INPUTS
TRANSMITTER
OUTPUTS
tINVH
INVALID
OUTPUT
tINVL
tAUTOPWDN
tAUTOPWDN
tWU
tWU
READY
OUTPUT
V+
VCC
0
V-
FIGURE 8. ENHANCED AUTOMATIC POWERDOWN, INVALID AND READY TIMING DIAGRAMS
The time to recover from automatic powerdown mode is
typically 100µs.
INVALID
The INVALID output signal switches low to indicate that
invalid levels have persisted on all of the receiver inputs for
more than 30µs (see Figure 8), but this has no direct effect
on the state of the ICL32XX (see the next sections for
methods of utilizing INVALID to power down the device).
INVALID switches high 1µs after detecting a valid RS-232
level on a receiver input. INVALID operates in all modes
(forced or automatic powerdown, or forced on), so it is also
useful for systems employing manual powerdown circuitry.
FORCEOFF
another computer via a detachable cable. Detaching the
cable allows the internal receiver pull-down resistors to pull
the inputs to GND (an invalid RS-232 level), causing the
30µs timer to time-out and drive the IC into powerdown.
Reconnecting the cable restores valid levels, causing the IC
to power back up.
FORCEON
Figure 7 illustrates the enhanced powerdown control logic.
Note that once the ICL32XX enters powerdown (manually or
automatically), the 30 second timer remains timed out (set),
keeping the ICL32XX powered down until FORCEON
transitions high, or until a transition occurs on a receiver or
transmitter input.
ICL32XX
I/O
UART
CPU
Emulating Standard Automatic Powerdown
If enhanced automatic powerdown isn’t desired, the user can
implement the standard automatic powerdown feature
(mimics the function on the ICL3221/ICL3223/ICL3243) by
connecting the INVALID output to the FORCEON and
FORCEOFF inputs, as shown in Figure 9. After 30µs of
invalid receiver levels, INVALID switches low and drives the
ICL32XX into a forced powerdown condition. INVALID
switches high as soon as a receiver input senses a valid RS232 level, forcing the ICL32XX to power on. See the
“INVALID DRIVING FORCEON AND FORCEOFF” section
of Table 2 for an operational summary. This operational
mode is perfect for handheld devices that communicate with
10
FIGURE 9. CONNECTIONS FOR AUTOMATIC POWERDOWN
WHEN NO VALID RECEIVER SIGNALS ARE
PRESENT
Hybrid Automatic Powerdown Options
For devices which communicate only through a detachable
cable, connecting INVALID to FORCEOFF (with FORCEON
= 0) may be a desirable configuration. While the cable is
attached INVALID and FORCEOFF remain high, so the
enhanced automatic powerdown logic powers down the RS232 device whenever there is 30 seconds of inactivity on the
ICL3225, ICL3227, ICL3245
receiver and transmitter inputs. Detaching the cable allows
the receiver inputs to drop to an invalid level (GND), so
INVALID switches low and forces the RS-232 device to
power down. The ICL32XX remains powered down until the
cable is reconnected (INVALID = FORCEOFF = 1) and a
transition occurs on a receiver or transmitter input (see
Figure 7). For immediate power up when the cable is
reattached, connect FORCEON to FORCEOFF through a
network similar to that shown in Figure 5.
Transmitter Outputs when Exiting
Powerdown
Figure 10 shows the response of two transmitter outputs
when exiting powerdown mode. As they activate, the two
transmitter outputs properly go to opposite RS-232 levels,
with no glitching, ringing, nor undesirable transients. Each
transmitter is loaded with 3kΩ in parallel with 2500pF. Note
that the transmitters enable only when the magnitude of the
supplies exceed approximately 3V.
Ready Output (ICL3225 and ICL3227 Only)
The Ready output indicates that the ICL322X is ready to
transmit. Ready switches low whenever the device enters
powerdown, and switches back high during power-up when
V- reaches -4V or lower.
5V/DIV.
FORCEOFF
T1
VCC = +3.3V
C1 - C4 = 0.1µF
Capacitor Selection
When using minimum required capacitor values, make sure
that capacitor values do not degrade excessively with
temperature. If in doubt, use capacitors with a larger nominal
value. The capacitor’s equivalent series resistance (ESR)
usually rises at low temperatures and it influences the
amount of ripple on V+ and V-.
TABLE 3. REQUIRED CAPACITOR VALUES
VCC (V)
C1 (µF)
C2, C3, C4 (µF)
3.0 to 3.6
0.1
0.1
4.5 to 5.5
0.047
0.33
3.0 to 5.5
0.1
0.47
Power Supply Decoupling
In most circumstances a 0.1µF bypass capacitor is
adequate. In applications that are particularly sensitive to
power supply noise, decouple VCC to ground with a
capacitor of the same value as the charge-pump capacitor C1.
Connect the bypass capacitor as close as possible to the IC.
Operation Down to 2.7V
ICL32XXE transmitter outputs meet RS-562 levels (±3.7V),
at full data rate, with VCC as low as 2.7V. RS-562 levels
typically ensure inter operability with RS-232 devices.
11
2V/DIV
T2
5V/DIV.
READY
TIME (20µs/DIV.)
FIGURE 10. TRANSMITTER OUTPUTS WHEN EXITING
POWERDOWN
Mouse Driveability
The ICL3245 is specifically designed to power a serial mouse
while operating from low voltage supplies. Figure 11 shows the
transmitter output voltages under increasing load current. The
on-chip switching regulator ensures the transmitters will supply
at least ±5V during worst case conditions (15mA for paralleled
V+ transmitters, 7.3mA for single V- transmitter).
6
TRANSMITTER OUTPUT VOLTAGE (V)
The charge pumps require 0.1µF capacitors for 3.3V
operation. For other supply voltages refer to Table 3 for
capacitor values. Do not use values smaller than those listed
in Table 3. Increasing the capacitor values (by a factor of 2)
reduces ripple on the transmitter outputs and slightly
reduces power consumption. C2, C3, and C4 can be
increased without increasing C1’s value, however, do not
increase C1 without also increasing C2, C3, and C4 to
maintain the proper ratios (C1 to the other capacitors).
5
VOUT+
4
VCC = 3.0V
3
2
T1
1
VOUT+
0
T2
-1
ICL3245
-2
VCC
-3
VOUT -
T3
VOUT -
-4
-5
-6
0
1
2
3
4
5
6
7
8
9
10
LOAD CURRENT PER TRANSMITTER (mA)
FIGURE 11. TRANSMITTER OUTPUT VOLTAGE vs LOAD
CURRENT (PER TRANSMITTER, i.e., DOUBLE
CURRENT AXIS FOR TOTAL VOUT+ CURRENT)
ICL3225, ICL3227, ICL3245
High Data Rates
The ICL32XX maintain the RS-232 ±5V minimum transmitter
output voltages even at high data rates. Figure 12 details a
transmitter loopback test circuit, and Figure 13 illustrates the
loopback test result at 250kbps. For this test, all transmitters
were simultaneously driving RS-232 loads in parallel with
1000pF, at 250kbps. Figure 14 shows the loopback results
for a single transmitter driving 250pF and an RS-232 load at
1Mbps. The static transmitters were also loaded with an
RS-232 receiver.
VCC
T1IN
T1OUT
R1OUT
+
0.1µF
5V/DIV.
VCC = +3.3V
C1 - C4 = 0.1µF
+
VCC
C1+
V+
C1
C1-
+
C3
ICL32XX
+
V-
C2+
C2
C4
+
C2TIN
TOUT
RIN
ROUT
FORCEON
VCC
CL
0.5µs/DIV.
FIGURE 14. LOOPBACK TEST AT 1Mbps (CL = 250pF)
Interconnection with 3V and 5V Logic
The ICL32XXE directly interfaces with 5V CMOS and TTL
logic families. Nevertheless, with the ICL32XX at 3.3V, and
the logic supply at 5V, AC, HC, and CD4000 outputs can
drive ICL32XX inputs, but ICL32XX outputs do not reach the
minimum VIH for these logic families. See Table 4 for more
information.
5K
TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS
SUPPLY VOLTAGES
FORCEOFF
FIGURE 12. TRANSMITTER LOOPBACK TEST CIRCUIT
5V/DIV.
T1IN
T1OUT
R1OUT
VCC = +3.3V
C1 - C4 = 0.1µF
2µs/DIV.
FIGURE 13. LOOPBACK TEST AT 250kbps (CL = 1000pF)
12
VCC
SYSTEM
POWER-SUPPLY SUPPLY
VOLTAGE
VOLTAGE
(V)
(V)
3.3
3.3
5
5
5
3.3
COMPATIBILITY
Compatible with all CMOS
families.
Compatible with all TTL and
CMOS logic families.
Compatible with ACT and HCT
CMOS, and with TTL. ICL32XX
outputs are incompatible with AC,
HC, and CD4000 CMOS inputs.
ICL3225, ICL3227, ICL3245
Typical Performance Curves
VCC = 3.3V, TA = 25oC
110
4
90
VOUT+
SLEW RATE (V/µs)
TRANSMITTER OUTPUT VOLTAGE (V)
6
2
1 TRANSMITTER AT 1Mbps
OTHER TRANSMITTERS AT 30kbps
0
-2
VOUT -
+SLEW
70
50
-SLEW
30
-4
10
-6
0
1000
2000
3000
4000
0
5000
0
1000
LOAD CAPACITANCE (pF)
FIGURE 15. TRANSMITTER OUTPUT VOLTAGE vs LOAD
CAPACITANCE
3000
4000
5000
FIGURE 16. SLEW RATE vs LOAD CAPACITANCE
90
90
ICL3227
ICL3225
1Mbps
80
80
1Mbps
70
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
2000
LOAD CAPACITANCE (pF)
60
50
40
250kbps
30
70
60
50
250kbps
40
120kbps
30
120kbps
20
20
10
10
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
FIGURE 17. SUPPLY CURRENT vs LOAD CAPACITANCE
WHEN TRANSMITTING DATA
13
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
FIGURE 18. SUPPLY CURRENT vs LOAD CAPACITANCE
WHEN TRANSMITTING DATA
ICL3225, ICL3227, ICL3245
Typical Performance Curves
VCC = 3.3V, TA = 25oC (Continued)
90
3.5
1Mbps
ICL3245
NO LOAD
ALL OUTPUTS STATIC
80
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
3.0
70
60
50
250kbps
40
30
120kbps
20
10
0
2.5
2.0
1.5
1.0
0.5
2000
1000
3000
4000
5000
LOAD CAPACITANCE (pF)
FIGURE 19. SUPPLY CURRENT vs LOAD CAPACITANCE
WHEN TRANSMITTING DATA
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP)
GND
TRANSISTOR COUNT
ICL3225: 937
ICL3227: 825
ICL3245: 1109
PROCESS
Si Gate CMOS
14
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
SUPPLY VOLTAGE (V)
FIGURE 20. SUPPLY CURRENT vs SUPPLY VOLTAGE
6.0
ICL3225, ICL3227, ICL3245
Dual-In-Line Plastic Packages (PDIP)
N
E20.3 (JEDEC MS-001-AD ISSUE D)
E1
INDEX
AREA
1 2 3
20 LEAD DUAL-IN-LINE PLASTIC PACKAGE
N/2
INCHES
-B-
SYMBOL
-AD
E
BASE
PLANE
-C-
A2
SEATING
PLANE
A
L
D1
e
B1
D1
eA
A1
eC
B
0.010 (0.25) M
C
L
C A B S
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English
and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
15
MILLIMETERS
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.55
1.77
8
C
0.008
0.014
0.204
0.355
-
D
0.980
1.060
24.89
26.9
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
6
eB
-
0.430
-
10.92
7
L
0.115
0.150
2.93
3.81
4
N
20
20
9
Rev. 0 12/93
ICL3225, ICL3227, ICL3245
Small Outline Plastic Packages (SSOP)
N
M16.209 (JEDEC MO-150-AC ISSUE B)
INDEX
AREA
0.25(0.010) M
H
B M
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
E
1
2
INCHES
GAUGE
PLANE
-B-
SYMBOL
3
L
0.25
0.010
SEATING PLANE
-A-
A
D
-C-
µα
e
B
0.25(0.010) M
A2
A1
C
0.10(0.004)
C A M
B S
MAX
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
16
MAX
NOTES
A
-
0.078
-
2.00
-
0.002
-
0.05
-
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.233
0.255
5.90
6.50
3
E
0.197
0.220
5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
8o
0o
α
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
MIN
A1
N
NOTES:
MILLIMETERS
MIN
16
0o
16
7
8o
Rev. 2
3/95
ICL3225, ICL3227, ICL3245
Shrink Small Outline Plastic Packages (SSOP)
M20.209 (JEDEC MO-150-AE ISSUE B)
N
20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
H
0.25(0.010) M
B M
INCHES
E
-B1
2
3
0.25
0.010
SEATING PLANE
-A-
SYMBOL
GAUGE
PLANE
A
D
-C-
α
e
C
0.10(0.004)
C A M
B S
MILLIMETERS
MIN
MAX
NOTES
A
0.068
0.078
1.73
1.99
0.002
0.008’
0.05
0.21
A2
0.066
0.070’
1.68
1.78
B
0.010’
0.015
0.25
0.38
C
0.004
0.008
0.09
0.20’
D
0.278
0.289
7.07
7.33
3
E
0.205
0.212
5.20’
5.38
4
0.026 BSC
0.301
0.311
7.65
7.90’
L
0.025
0.037
0.63
0.95
8 deg.
0 deg.
N
20
0 deg.
9
0.65 BSC
H
α
NOTES:
MAX
A1
e
A2
A1
B
0.25(0.010) M
L
MIN
6
20
7
8 deg.
Rev. 3 11/02
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess
of “B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
17
ICL3225, ICL3227, ICL3245
Thin Shrink Small Outline Plastic Packages (TSSOP)
N
M28.173
INDEX
AREA
E
0.25(0.010) M
2
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
E1
GAUGE
PLANE
-B1
B M
INCHES
3
L
0.05(0.002)
-A-
A
D
-C-
α
e
A2
A1
b
0.10(0.004) M
0.25
0.010
SEATING PLANE
c
0.10(0.004)
C A M
B S
NOTES:
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.051
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.378
0.386
9.60
9.80
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
E
0.246
L
0.0177
N
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AE, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
18
MILLIMETERS
α
0.65 BSC
0.256
6.25
0.0295
0.45
28
0o
-
0.75
6
28
8o
0o
-
6.50
7
8o
Rev. 0 6/98
ICL3225, ICL3227, ICL3245
Small Outline Plastic Packages (SOIC)
M28.3 (JEDEC MS-013-AE ISSUE C)
N
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
SYMBOL
-B-
1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
19
MILLIMETERS
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.6969
0.7125
17.70
18.10
3
E
0.2914
0.2992
7.40
7.60
4
0.05 BSC
10.00
h
0.01
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
8o
0o
28
0o
10.65
-
0.394
N
0.419
1.27 BSC
H
α
NOTES:
MAX
A1
e
µα
MIN
28
-
7
8o
Rev. 0 12/93
ICL3225, ICL3227, ICL3245
Shrink Small Outline Plastic Packages (SSOP)
N
M28.209 (JEDEC MO-150-AH ISSUE B)
INDEX
AREA
0.25(0.010) M
H
B M
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
E
1
2
INCHES
GAUGE
PLANE
-B-
SYMBOL
3
L
0.25
0.010
SEATING PLANE
-A-
A
D
-C-
µα
e
A2
A1
B
C
0.10(0.004)
0.25(0.010) M
C A M
B S
MAX
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
MIN
MAX
NOTES
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.390
0.413
9.90
10.50
3
E
0.197
0.220
5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
8o
0o
N
NOTES:
MILLIMETERS
MIN
α
28
0o
28
7
8o
Rev. 1 3/95
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch)
per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B”
dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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20
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