Microsemi APT2X41DC60J Isotopâ® sic diode power module Datasheet

APT2X41DC60J
APT2X40DC60J
ISOTOP® SiC Diode
Power Module
2
2
3
1
4
VRRM = 600V
IF = 40A @ TC = 100°C
Application
3
•
•
•
•
Uninterruptible Power Supply (UPS)
Induction heating
Welding equipment
High speed rectifiers
Features
Anti-Parallel
Anti-Parallel
1
APT2X60DC120J
APT2X40DC60J
•
4
Parallel
Parallel
APT2X41DC60J
APT2X61DC120J
3
2
•
•
•
SiC Schottky Diode
- Zero reverse recovery
- Zero forward recovery
- Temperature Independent switching behavior
- Positive temperature coefficient on VF
ISOTOP® Package (SOT-227)
Very low stray inductance
High level of integration
Benefits
4
1
ISOTOP®
•
•
•
•
•
•
Outstanding performance at high frequency operation
Low losses
Low noise switching
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
RoHS Compliant
Symbol
VR
VRRM
IF(AV)
IFSM
Parameter
Maximum DC reverse Voltage
Maximum Peak Repetitive Reverse Voltage
Maximum Average Forward Current Duty cycle = 50%
Non-Repetitive Forward Surge Current
10 µs
TC = 100°C
TC = 25°C
Max ratings
Unit
600
V
40
500
A
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
www.microsemi.com
1–3
APT2X41_40DC60J – Rev 0 February, 2009
Absolute maximum ratings (per leg)
APT2X41DC60J
APT2X40DC60J
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics (per leg)
Symbol Characteristic
Test Conditions
VF
Diode Forward Voltage
IRM
Maximum Reverse Leakage Current
QC
Total Capacitive Charge
C
Total Capacitance
Min
Tj = 25°C
IF = 40A
Tj = 175°C
Tj = 25°C
VR = 600V
Tj = 175°C
IF = 40A, VR = 300V
di/dt =1200A/µs
f = 1MHz, VR = 200V
f = 1MHz, VR = 400V
Typ
1.6
2
200
400
Max
1.8
2.4
800
4000
Unit
V
µA
56
nC
260
200
pF
Thermal and package characteristics (per leg)
Symbol
RthJC
RthJA
VISOL
TJ,TSTG
TL
Torque
Wt
Characteristic
Junction to Case Thermal resistance
Junction to Ambient (Diode)
Min
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
2500
-55
Storage Temperature Range
Max Lead Temp for Soldering:0.063” from case for 10 sec
Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine)
Package Weight
Typ
Max
0.7
20
Unit
°C/W
V
175
300
1.5
29.2
°C
N.m
g
SOT-227 (ISOTOP®) Package Outline
11.8 (.463)
12.2 (.480)
31.5 (1.240)
31.7 (1.248)
r = 4.0 (.157)
(2 places)
8.9 (.350)
9.6 (.378)
Hex Nut M4
(4 places)
W=4.1 (.161)
W=4.3 (.169)
H=4.8 (.187)
H=4.9 (.193)
(4 places)
25.2 (0.992)
0.75 (.030) 12.6 (.496) 25.4 (1.000)
0.85 (.033) 12.8 (.504)
4.0 (.157)
4.2 (.165)
(2 places)
1.95 (.077)
2.14 (.084)
3.3 (.129)
3.6 (.143)
14.9 (.587)
15.1 (.594)
3
30.1 (1.185)
30.3 (1.193)
4
* Emitter terminals are shorted
internally. Current handling
capability is equal for either
Emitter terminal.
38.0 (1.496)
38.2 (1.504)
2
1
Dimensions in Millimeters and (Inches)
www.microsemi.com
2–3
APT2X41_40DC60J – Rev 0 February, 2009
7.8 (.307)
8.2 (.322)
APT2X41DC60J
APT2X40DC60J
Typical Diode Performance Curve
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
Thermal Impedance (°C/W)
0.8
0.7
0.9
0.6
0.7
0.5
0.4
0.5
0.3
0.3
0.2
0.1
0.1
0.05
Single Pulse
0
0.00001
0.0001
0.001
0.01
0.1
1
10
Rectangular Pulse Duration (Seconds)
Reverse Characteristics
Forward Characteristics
80
800
60
IR Reverse Current (µA)
IF Forward Current (A)
TJ=25°C
TJ=75°C
TJ=175°C
40
TJ=125°C
20
700
600
0.5
1
1.5
2
2.5
3
TJ=125°C
500
TJ=75°C
400
300
200
TJ=25°C
100
0
0
TJ=175°C
3.5
0
200
300
400
500
600
700
800
VR Reverse Voltage (V)
VF Forward Voltage (V)
Capacitance vs.Reverse Voltage
1600
C, Capacitance (pF)
1400
1200
1000
800
600
400
200
1
10
100
VR Reverse Voltage
1000
ISOTOP® is a registered trademark of ST Microelectronics NV
Microsemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103
5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262
and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
www.microsemi.com
3–3
APT2X41_40DC60J – Rev 0 February, 2009
0
Similar pages