SY MMSZ5235B Surface mount zener diode Datasheet

MMSZ5221B-MMSZ5260B
Surface mount zener diode
FEATURES
z
z
z
Planar die construction.
500mW power dissipation.
General purpose, medium current.
z
Ideally suited for automated assembly processes.
APPLICATIONS
z
Zener diode.
z
Ultra-small surface mount package.
SOD-123
ORDERING INFORMATION
Type No.
MMSZ5221B-MMSZ5359B
Marking
Package Code
See table 2
SOD-123
MAXIMUM RATING @ Ta=25℃ unless otherwise specified
Characteristic
Symbol
Value
Unit
VF
0.9
V
Power Dissipation
Pd
500
mW
Thermal resistance,junction to ambient air
RθjA
350
℃/W
Junction temperature
Tj
150
℃
Storage temperature range
Tstg
-65-150
℃
Forward Voltage
@ IF=10mA
Notes: 1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2.
2. Tested with pulses, Tp ≤1.0ms.
www.shunyegroup.com.cn
ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified
Type
Type
Number
Code
Zener Voltage Range
Vz@IZT
Test
Maximum Zener
Maximum Reverse
Current
Impedance
Leakage Current
IZT
Nom(V)
Min(V)
Max(V)
mA
ZZT@IZT
ZZK@IZK=0.25mA
Ω
IR
@VR
μA
V
MMSZ5221B
C1
2.4
2.28
2.52
20
30
1200
100
1.0
MMSZ5223B
C3
2.7
2.57
2.84
20
30
1300
75
1.0
MMSZ5225B
C5
3.0
2.85
3.15
20
30
1600
50
1.0
MMSZ5226B
G1
3.3
3.14
3.47
20
28
1600
25
1.0
MMSZ5227B
G2
3.6
3.42
3.78
20
24
1700
15
1.0
MMSZ5228B
G3
3.9
3.71
4.10
20
23
1900
10
1.0
MMSZ5229B
G4
4.3
4.09
4.52
20
22
2000
5.0
1.0
MMSZ5230B
G5
4.7
4.47
4.94
20
19
1900
5.0
2.0
MMSZ5231B
E1
5.1
4.85
5.36
20
17
1600
5.0
2.0
MMSZ5232B
E2
5.6
5.32
5.88
20
11
1600
5.0
3.0
MMSZ5233B
E3
6.0
5.70
6.30
20
7
1600
5.0
3.5
MMSZ5234B
E4
6.2
5.89
6.51
20
7
1000
5.0
4.0
MMSZ5235B
E5
6.8
6.46
7.14
20
5
750
3.0
5.0
MMSZ5236B
F1
7.5
7.13
7.88
20
6
500
3.0
6.0
MMSZ5237B
F2
8.2
7.79
8.61
20
8
500
3.0
6.5
MMSZ5238B
F3
8.7
8.27
9.14
20
8
600
3.0
6.5
MMSZ5239B
F4
9.1
8.65
9.56
20
10
600
3.0
7.0
MMSZ5240B
F5
10
9.50
10.50
20
17
600
3.0
8.0
MMSZ5241B
H1
11
10.45
11.55
20
22
600
2.0
8.4
MMSZ5242B
H2
12
11.40
12.60
20
30
600
1.0
9.1
MMSZ5243B
H3
13
12.35
13.65
9.5
13
600
0.5
9.9
MMSZ5245B
H5
15
14.25
15.75
8.5
16
600
0.1
11
MMSZ5246B
J1
16
15.20
16.80
7.8
17
600
0.1
12
MMSZ5248B
J3
18
17.10
18.90
7.0
21
600
0.1
14
MMSZ5250B
J5
20
19.00
21.00
6.2
25
600
0.1
15
MMSZ5251B
K1
22
20.90
23.10
5.6
29
600
0.1
17
MMSZ5252B
K2
24
22.80
25.20
5.2
33
600
0.1
18
MMSZ5254B
K4
27
25.65
28.35
5.0
41
600
0.1
21
MMSZ5255B
K5
28
26.60
29.40
4.5
44
600
0.1
21
MMSZ5256B
M1
30
28.50
31.5
4.2
49
600
0.1
23
MMSZ5257B
M2
33
31.35
34.65
3.8
58
700
0.1
25
MMSZ5258B
M3
36
34.20
37.80
3.4
70
700
0.1
27
MMSZ5259B
M4
39
37.05
40.95
3.2
80
800
0.1
30
MMSZ5260B
M5
43
40.85
45.15
3.0
93
900
0.1
33
www.shunyegroup.com.cn
TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified
PACKAGE OUTLINE
Plastic surface mounted package
SOD-123
SOD-123
K
B
C
A
D
H
E
Dim
Min
Max
A
1.4
1.8
B
2.55
2.85
C
1.15 Typical
D
0.5
0.6
E
0.3
0.4
H
0.02
0.10
J
J
K
0.1 Typical
3.55
3.85
All Dimensions in mm
SOLDERING FOOTPRINT
PACKAGE
INFORMATION
Device
Package
Shipping
MMSZ5221B-MMSZ5260B
SOD-123
3000/Tape&Reel
www.shunyegroup.com.cn
Similar pages