CALMIRCO CM3018 Micropower, 150ma low noise cmos regulator with fast response Datasheet

PRELIMINARY
CM3018
Micropower, 150mA Low Noise CMOS Regulator
with Fast Response
Features
Product Description
•
The CM3018 is a very low dropout, low noise regulator
that delivers up to 150mA of load current at a fixed output voltage.
Available with 1.5V, 1.8V, 2.5V, 2.6V, 2.8V, 2.85V,
2.9V, 3.0V, 3.1V or 3.3V outputs
Fast (60µs) VOUT response when enabled
Ultra low noise (35µV rms typ.)
Delivers up to 150mA output current
Very low dropout (150mV at 150mA)
Low quiescent operating current (110µA)
Stable with low-ESR ceramic capacitors
“Zero” disable mode current consumption
Thermal overload protection
Foldback overload current protection
-40°C to +85°C temperature operation
Available in a 5-pin SOT23 and 5-bump Chip Scale
Packages (CSP)
Lead-free versions available
•
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•
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•
•
•
•
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•
•
Applications
•
Wireless handsets, PDAs, MP3 players, digital
cameras
PCs and notebooks
Graphics cards, set-top boxes
Compact Flash memory cards
Battery-powered devices
PC cards
•
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Simplified Electrical Schematic
VIN
VOUT
EN
VIN
VOUT
OUT
EN
+
1µF
-
The CM3018 is fully protected, offering both overload
current limiting and high temperature thermal shutdown.
All versions of the CM3018 are now available with
optional lead-free finishing.
CM3018
CIN
An optional bypass pin is provided for further improvement of noise performance and to maximize the power
supply ripple rejection.
The CM3018 is available in a tiny 5 lead SOT-23 package or a 5-bump CSP and is ideal for space critical
applications. The CSP version of the CM3018 incorporates OptiGuardTM technology to provide increased reliability at assembly.
Typical Application Circuit
+
A dedicated control input (EN, Active High) provides
power-up sequencing flexibility. When this input is
taken low, the regulator is disabled. In this state, the
supply current will drop to near zero. An internal discharge MOSFET resistance (300Ω) will force the output to ground whenever the device is disabled.
+
BYP
COUT
BYP
GND
CBYP
+
VREF
-
1µF
10nF
GND
1x
GND
© 2004 California Micro Devices Corp. All rights reserved.
07/29/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
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1
PRELIMINARY
CM3018
Pin / Bump Descriptions
PIN / BUMP DESCRIPTIONS
SOT23-5
PIN
CSP
BUMP
NAME
1
C3
VIN
2
B2
GND
3
A1
EN
4
A3
BYP
This pin is connected to the internal voltage reference of the regulator. An external
bypass capacitor CBYP of 10nF is recommended to improve the noise performance
and to maximize the power supply ripple rejection.
5
C1
VOUT
The regulator voltage output used to power the load. A nominal output capacitor of 1µF
is sufficient to minimize any transient disturbances under normal operating conditions.
Additional output capacitance can be used to further improve transient load response.
DESCRIPTION
The input power supply for the regulator. If this input is within a few inches of the main
supply filter, a capacitor may not be necessary. Otherwise an input filter capacitor of
approximately 1µF will ensure adequate filtering.
The negative reference for all voltages.
A logic input control to enable the regulator output. When EN is asserted (logic high), it
allows output regulation to commence. When EN is deasserted (logic low), the regulator pass transistor is forced into a high impedance mode, and an internal discharge
resistance (300Ω) is applied to the output.
Package / Ordering Information
SOT23-5 Package
PACKAGE / PINOUT DIAGRAM
Top View
1
GND
2
EN
3
5
VOUT
4
BYP
ENxx
VIN
5-pin SOT23
Note: This drawing is not to scale.
SOT-23 PART NUMBERING INFORMATION
SOT23-5
PKG.
Pins
5
5
5
5
5
5
5
5
Output Voltage
1.5V
1.8V
2.5V
2.8V
2.9V
3.0V
3.1V
3.3V
Package
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
Standard Finish
Ordering Part
Part Marking
Number1
CM3018-15ST
EA15
CM3018-18ST
EA18
CM3018-25ST
EA25
CM3018-28ST
EA28
CM3018-29ST
EA29
CM3018-30ST
EA30
CM3018-31ST
EA31
CM3018-33ST
EA33
Lead-free Finish
Ordering Part
Part Marking
Number1
CM3018-15SO
EG15
CM3018-18SO
EG18
CM3018-25SO
EG25
CM3018-28SO
EG28
CM3018-29SO
EG29
CM3018-30SO
EG30
CM3018-31SO
EG31
CM3018-33SO
EG33
© 2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
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07/29/04
PRELIMINARY
CM3018
Package / Ordering Information (Cont’d)
Chip Scale Package
PACKAGE / PINOUT DIAGRAM
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
BOTTOM VIEW
(Bumps Up View)
1 2 3
VOUT
A
VIN
C1
C3
B
nn
GND
B2
Pin "A1"
Marking
C
EN
BYP
A1
A3
A1
CM3018
CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
Package
Ordering Part
Number1
CSP
CM3018-15CS
1.8V
CSP
CM3018-18CS
MB
CM3018-18CP
MB
2.5V
CSP
CM3018-25CS
MC
CM3018-25CP
MC
5
2.6V
CSP
CM3018-26CS
MD
CM3018-26CP
MD
5
2.8V
CSP
CM3018-28CS
ME
CM3018-28CP
ME
5
2.85V
CSP
CM3018-2JCS
MF
CM3018-2JCP
MF
5
2.9V
CSP
CM3018-29CS
MG
CM3018-29CP
MG
5
3.0V
CSP
CM3018-30CS
MH
CM3018-30CP
MH
5
3.1V
CSP
CM3018-31CS
MJ
CM3018-31CP
MJ
3.3V
CSP
CM3018-33CS
MK
CM3018-33CP
MK
CSP
BUMPS
Output Voltage
5
1.5V
5
5
5
Part Marking
Ordering Part
Number1
Part Marking
MA
CM3018-15CP
MA
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2004 California Micro Devices Corp. All rights reserved.
07/29/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
3
PRELIMINARY
CM3018
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
+2000
V
[GND - 0.6] to [+6.0]
[GND - 0.6] to [VIN + 0.6]
[GND - 0.6] to [VIN + 0.6]
V
V
V
Storage Temperature Range
-65 to +150
°C
Operating Temperature Range
Ambient
Junction
-40 to +85
0 to +130
°C
°C
Power Dissipation (Notes 1,2)
Internally Limited
W
ESD Protection (HBM)
Pin Voltages
VIN (pin 1)
EN (pin 3)
VOUT (pin 5)
Note 1: The CM3018 contains a thermal overload circuit that automatically disables the device thereby preventing excessive junction temperature. For example, a SOT23-5 packaged device mounted on a typical multi-layer board with a moderate heat
spreading copper area (2 square inches) will allow up to 0.315W to be safely dissipated, maintaining a safe operating temperature. Please consult with factory for thermal evaluation assistance.
Note 2: Consult CAMD Technical Support to obtain detailed power dissipation information for the CM3018 packaged in the SOT23
and CSP packages.
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
VIN
2.7 to 5.5
V
Ambient Operating Temperature Range
-40 to +85
°C
Load Current
0 to +150
mA
1 ±20%
µF
COUT
© 2004 California Micro Devices Corp. All rights reserved.
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430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
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07/29/04
PRELIMINARY
CM3018
Specifications (continued)
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL
VOUT
VOUTRT
PARAMETER
CONDITIONS
MIN
MAX
UNITS
Regulator Output Voltage
TA = 25°C;
0mA < ILOAD < 150mA; VIN-VOUT = 1V
-1%
+1%
V
0°C < TA < 125°C;
0mA < ILOAD < 150mA; VIN-VOUT = 1V
-2%
+2%
V
-40°C < TA < 125°C;
0mA < ILOAD < 150mA; VIN-VOUT = 1V
-3%
+3%
V
Regulator Response Time
RDROPOUT Dropout Resistance
TYP
No Load; COUT = 1µf Ceramic Cap
60
0mA < ILOAD < 150mA
1
µs
Ω
1.3
VR LOAD
Load Regulation
VIN-VOUT = 1V; 10mA < ILOAD < 150mA
.25
%
VR LINE
Line Regulation
3.3V < VIN < 4.3V; ILOAD = 5mA
0.15
%/V
400
mA
ILIM
Overload Current Limit
ISC
Short Circuit Current Limit
VOUT < 1V
200
mA
Discharge Resistance
EN tied to ground; VIN = 3.0V
300
Ω
Ground Current
with EN tied to VIN; ILOAD = 0mA:
100
200
µA
with EN tied to VIN; ILOAD = 150mA:
110
250
µA
with EN tied to GND (Disable Mode):
0.1
10
µA
0.8
1.2
V
RDISCH
IGND
VIH
Enable High Threshold
Regulator enabled
VIL
Enable Low Threshold
Regulator shutdown
IEN
Enable Input Current
VEN > 0.8V
0.7
V
.01
µA
Shutdown Temperature
150
°C
THYST
Thermal Hysteresis
15
°C
PSRR
Ripple Rejection
ƒ = 120Hz; VIN − VOUT = 1V;
ILOAD= 100µA; COUT = 1µF Ceramic;
CBYP = 10nF
60
dB
Output Noise
300Hz-100kHz; COUT = 10µF Ceramic;
CBYP = 10nF
35
µVrms
TDISABLE
eN
0.4
Note 1: Electrical operating characteristics are guaranteed over standard operating conditions unless otherwise noted.
© 2004 California Micro Devices Corp. All rights reserved.
07/29/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
5
PRELIMINARY
CM3018
Performance Information
Typical Noise Characteristics
Curves shown for CM3018-33, 3.3V output unless noted otherwise
Power Supply Ripple Rejection
Power Supply Ripple Rejection
80
70
100uA
60
1mA
50
40
10mA
30
Vin = 4.3V, Vout = 3.3V
Cout = 10uF cer.
Cbyp = 10nF
20
10
150mA
Ripple Rejecttion [dB]
Ripple Rejecttion [dB]
80
70
60
100uA
50
150mA
40
30
Vin = 4.3V, Vout = 3.3V
Cout = 1uF cer.
Cbyp = 10nF
20
10
0
1mA
10mA
0
10
100
1000
10000
Frequency [Hz]
100000
10
100
1000
10000
Frequency [Hz]
100000
Power Supply Ripple Rejection
Ripple Rejecttion [dB]
80
70
60
100uA
50
40
1mA
30
Vin = 4.3V, Vout = 3.3V
Cout = 1uF cer.
NO Byp cap
20
10
10mA
150mA
0
10
100
1000
10000
Frequency [Hz]
100000
Noise Performance
Noise Performance
1.E-05
Voltage [V]
Voltage [V]
1.E-05
1.E-06
1.E-07
1.E-08
100
Vin = 4.8V, Vout = 3.3V
Cout = 1uF cer.
Cbyp = 10nF
100uA load
1000
10000
100000
1.E-06
1.E-07
Vin = 4.8V Vout = 3.3V
Cout = 10uF cer.
Cbyp = 10nF
100uA load
1.E-08
100
frequency [Hz]
1000
10000
100000
frequency [Hz]
© 2004 California Micro Devices Corp. All rights reserved.
6
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▲ Fax: 408.263.7846
▲
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07/29/04
PRELIMINARY
CM3018
Performance Information (cont’d)
Typical DC Characteristics (nominal conditions unless otherwise specified)
Curves shown for CM3018-33, 3.3V output unless noted otherwise
Ground Current vs. Input (5mA Load)
Ground Current vs. Load (VIN = 5V)
150
Ground Current [uA]
GROUND CURRENT [uA]
150
100
50
125
100
75
50
25
0
0
0
1
2
3
4
INPUT VOLTAGE [V]
5
0
6
Load Regulation (VIN = 5V)
DROPOUT VOLTAGE [mV]
200
3.35
3.30
3.25
150
100
50
3.20
0
0
100
200
300
0
LOAD CURRENT [mA]
50
100
150
200
LOAD CURRENT [mA]
Line Regulation (5mA Load)
Foldback Current Limiting (VIN = 3.8V)
4.0
3.7
3.5
OUTPUT VOLTAGE [V]
OOUTPUT VOLTAGE [V]
200
Dropout Voltage vs. Load Current (VOUT = 3.25V)
3.40
OUTPUT VOLTAGE [V
50
100
150
Load Current [mA]
3.3
3.1
2.9
2.7
3.0
2.0
1.0
0.0
2.5
2.5
3.0
3.5
4.0
4.5
5.0
INPUT VOLTAGE [V]
5.5
6.0
0
100
200
300
400
500
LOAD CURRENT [mA]
© 2004 California Micro Devices Corp. All rights reserved.
07/29/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
7
PRELIMINARY
CM3018
Performance Information (cont’d)
Typical Transient Characteristics (nominal conditions unless specified otherwise)
Curves shown for CM3018-33, 3.3V output unless noted otherwise
Load transient (10% to 100%) Step Response
Enable Response (CBYP = 10nF)
EN
Line Transient (1Vpp) Step Response
Disable Response (CBYP = 10nF)
EN
VOUT
VOUT
NO Load
COUT = 1uF Cer.
NO Load
COUT = 1uF Cer.
© 2004 California Micro Devices Corp. All rights reserved.
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430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
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07/29/04
PRELIMINARY
CM3018
Performance Information (cont’d)
Typical Thermal Characteristics
TJUNC = TAMB + PD ∗ (θJC) + PD ∗ (θCA)
Ground Current vs. Temperature
(VIN=5V)
100
GROUND CURRENT [uA]
The overall junction to ambient thermal resistance (θJA)
for device power dissipation (PD) consists primarily of
two paths in series. The first path is the junction to the
case (θJC) which is defined by the package style, and
the second path is case to ambient (θCA) thermal resistance which is dependent on board layout. The final
operating junction temperature for any set of conditions
can be estimated by the following thermal equation:
= TAMB + PD ∗ (θJA)
80
60
40
20
0
0
SOT-23 Package Considerations
25
50
75
100
125
o
TEMPERATURE [ C]
When the SOT23 version of the CM3018 is mounted
on a double-sided printed circuit board with two square
inches of copper allocated for "heat spreading", the
resulting θJA is 175°C/W.
TJUNC = TAMB + PD ∗ (θJA)
= 70°C + 315mW ∗ (175°C/W)
= 70°C + 57.75°C = 127.75°C
Thermal characteristics were measured using a double
sided board with two square inches of copper area
connected to the GND pins for “heat spreading”.
50
40
OUTPUT CHANGE [mV]
Based on a maximum power dissipation of 320mW
(Load x VIN-VOUT = 150mA x 2.2V) with an ambient of
70°C the resulting junction temperature will be:
Output Voltage Change vs. Temperature
(VIN=5V, 1mA Load)
30
20
10
0
-10
-20
-30
-40
-50
-50
-25
0
25
50
75
TEMPERATURE [oC]
100 125
Measurements showing performance up to a junction
temperature of 125°C were performed under light load
conditions (1mA). This allows the ambient temperature
to be representative of the internal junction temperature.
Note: The use of multi-layer board construction with
separate ground and power planes will further enhance
the overall thermal performance. In the event of no
copper area being dedicated for heat spreading, a
multi-layer board construction using only the minimum
size pad layout will typically provide the CM3018 in a
SOT23 package with an overall θJA of 175°C/W, which
allows up to 450mW to be dissipated safely.
Please consult CAMD Technical Support for assistance
with thermal analysis of the CM3018 with respect to a
specific application.
© 2004 California Micro Devices Corp. All rights reserved.
07/29/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
9
PRELIMINARY
CM3018
Mechanical Details
SOT23 Mechanical Specifications
Dimensions for CM3018 devices packaged in 5-pin
SOT23 packages are presented below.
Mechanical Package Diagrams
TOP VIEW
For complete information on the SOT23 package, see
the California Micro Devices SOT23 Package Information document.
e1
e
5
4
PACKAGE DIMENSIONS
Package
SOT23 (JEDEC name is MO-178)
Pins
Dimensions
E1 E
2
3
5
Millimeters
Inches
Min
Max
Min
Max
A
--
1.45
--
0.057
A1
0.00
0.15
0.000
0.006
b
0.30
0.50
0.012
0.020
c
0.08
0.22
0.003
0.009
D
2.75
3.05
0.108
0.120
E
2.60
3.00
0.102
0.118
E1
1.45
1.75
0.057
0.069
e
0.95 BSC
0.0374 BSC
e1
1.90 BSC
0.0748 BSC
L
0.60 REF
# per tape
and reel
1
b
SIDE VIEW
D
A
A1
END VIEW
0.0236 REF
3000 pieces
c
Controlling dimension: inches
L1
Package Dimensions for SOT23-5.
© 2004 California Micro Devices Corp. All rights reserved.
10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
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07/29/04
PRELIMINARY
CM3018
Mechanical Details
CSP Mechanical Specifications
CM3018CS/CP devices are packaged in a custom
Chip Scale Package (CSP) with OptiGuardTM coating.
Dimensions are presented below. For complete information on CSP packaging, see the California Micro
Devices CSP Package Information document.
Mechanical Package Diagrams
BOTTOM VIEW
OptiGuardTM
Coating
A1
C1
PACKAGE DIMENSIONS
Custom CSP
Bumps
5
Millimeters
Dim
Nom
B
A
Inches
Max
Min
Nom
A1
0.961 1.006 1.051 0.0378 0.0396 0.0414
A2
1.418 1.463 1.508 0.0558 0.0576 0.0594
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.203 0.253 0.303 0.0080 0.0100 0.0119
C2
0.247 0.297 0.347 0.0097 0.0117 0.0136
D1
0.600 0.670 0.739 0.0236 0.0264 0.0291
D2
0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
1 2 3
Max
C2
Min
C
A2
Package
B4
B3
B2
B1
D1
D2
0.30 DIA.
63/37 Sn/Pb
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Custom 5-Bump Chip Scale Package
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART
NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM3018
1.463 X 1.006 X 0.670
1.67 X 1.17 X 0.730
8mm
178mm (7")
3500
4mm
4mm
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Po
Top
Cover
Tape
Ao
W
Bo
Ko
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
Center Lines
of Cavity
P1
User Direction of Feed
Figure 1. Tape and Reel Mechanical Data
© 2004 California Micro Devices Corp. All rights reserved.
07/29/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
11
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